JPS56152992A - Tin-lead alloy plated lead wire - Google Patents
Tin-lead alloy plated lead wireInfo
- Publication number
- JPS56152992A JPS56152992A JP5692280A JP5692280A JPS56152992A JP S56152992 A JPS56152992 A JP S56152992A JP 5692280 A JP5692280 A JP 5692280A JP 5692280 A JP5692280 A JP 5692280A JP S56152992 A JPS56152992 A JP S56152992A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tin
- plating layer
- lead alloy
- semibright
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Non-Insulated Conductors (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE: To obtain a lead wire which does not cause cracking of plating layers during working such as bending by forming a dull electric tin-lead alloy plating layer on a metallic conductor, and further forming a semibright electric tin-lead alloy plating layer thereon.
CONSTITUTION: This relates to the tin-lead alloy plated lead wire used for parts for electronic apparatus, wherein the thickness of the semibright electric tin-lead alloy plating layer is kept at 0.5W12μ and the total thiciness of this and the dull electric tin-lead alloy plating at 4W20μ. The composition of the semibright electric tin-lead plating layer is set at 1W30wt% lead and the balance thin. The lead wire obtained by this does not cause sticking of the lead wires to themselves despite receiving of heat treatment and has superior discoloration resistance.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5692280A JPS56152992A (en) | 1980-04-28 | 1980-04-28 | Tin-lead alloy plated lead wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5692280A JPS56152992A (en) | 1980-04-28 | 1980-04-28 | Tin-lead alloy plated lead wire |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56152992A true JPS56152992A (en) | 1981-11-26 |
JPS6233317B2 JPS6233317B2 (en) | 1987-07-20 |
Family
ID=13040977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5692280A Granted JPS56152992A (en) | 1980-04-28 | 1980-04-28 | Tin-lead alloy plated lead wire |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56152992A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02270987A (en) * | 1989-04-11 | 1990-11-06 | Nippon Mining Co Ltd | Reflow solder plating material |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604524A (en) * | 1983-06-22 | 1985-01-11 | Ajinomoto Co Inc | Latent curing agent for epoxy resin |
-
1980
- 1980-04-28 JP JP5692280A patent/JPS56152992A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS604524A (en) * | 1983-06-22 | 1985-01-11 | Ajinomoto Co Inc | Latent curing agent for epoxy resin |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02270987A (en) * | 1989-04-11 | 1990-11-06 | Nippon Mining Co Ltd | Reflow solder plating material |
Also Published As
Publication number | Publication date |
---|---|
JPS6233317B2 (en) | 1987-07-20 |
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