JPS56152992A - Tin-lead alloy plated lead wire - Google Patents

Tin-lead alloy plated lead wire

Info

Publication number
JPS56152992A
JPS56152992A JP5692280A JP5692280A JPS56152992A JP S56152992 A JPS56152992 A JP S56152992A JP 5692280 A JP5692280 A JP 5692280A JP 5692280 A JP5692280 A JP 5692280A JP S56152992 A JPS56152992 A JP S56152992A
Authority
JP
Japan
Prior art keywords
lead
tin
plating layer
lead alloy
semibright
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5692280A
Other languages
Japanese (ja)
Other versions
JPS6233317B2 (en
Inventor
Osamu Yoshioka
Sadao Nagayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP5692280A priority Critical patent/JPS56152992A/en
Publication of JPS56152992A publication Critical patent/JPS56152992A/en
Publication of JPS6233317B2 publication Critical patent/JPS6233317B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Insulated Conductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To obtain a lead wire which does not cause cracking of plating layers during working such as bending by forming a dull electric tin-lead alloy plating layer on a metallic conductor, and further forming a semibright electric tin-lead alloy plating layer thereon.
CONSTITUTION: This relates to the tin-lead alloy plated lead wire used for parts for electronic apparatus, wherein the thickness of the semibright electric tin-lead alloy plating layer is kept at 0.5W12μ and the total thiciness of this and the dull electric tin-lead alloy plating at 4W20μ. The composition of the semibright electric tin-lead plating layer is set at 1W30wt% lead and the balance thin. The lead wire obtained by this does not cause sticking of the lead wires to themselves despite receiving of heat treatment and has superior discoloration resistance.
COPYRIGHT: (C)1981,JPO&Japio
JP5692280A 1980-04-28 1980-04-28 Tin-lead alloy plated lead wire Granted JPS56152992A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5692280A JPS56152992A (en) 1980-04-28 1980-04-28 Tin-lead alloy plated lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5692280A JPS56152992A (en) 1980-04-28 1980-04-28 Tin-lead alloy plated lead wire

Publications (2)

Publication Number Publication Date
JPS56152992A true JPS56152992A (en) 1981-11-26
JPS6233317B2 JPS6233317B2 (en) 1987-07-20

Family

ID=13040977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5692280A Granted JPS56152992A (en) 1980-04-28 1980-04-28 Tin-lead alloy plated lead wire

Country Status (1)

Country Link
JP (1) JPS56152992A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02270987A (en) * 1989-04-11 1990-11-06 Nippon Mining Co Ltd Reflow solder plating material

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604524A (en) * 1983-06-22 1985-01-11 Ajinomoto Co Inc Latent curing agent for epoxy resin

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604524A (en) * 1983-06-22 1985-01-11 Ajinomoto Co Inc Latent curing agent for epoxy resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02270987A (en) * 1989-04-11 1990-11-06 Nippon Mining Co Ltd Reflow solder plating material

Also Published As

Publication number Publication date
JPS6233317B2 (en) 1987-07-20

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