JPS5656745A - Composite lead wire and its production - Google Patents

Composite lead wire and its production

Info

Publication number
JPS5656745A
JPS5656745A JP13165079A JP13165079A JPS5656745A JP S5656745 A JPS5656745 A JP S5656745A JP 13165079 A JP13165079 A JP 13165079A JP 13165079 A JP13165079 A JP 13165079A JP S5656745 A JPS5656745 A JP S5656745A
Authority
JP
Japan
Prior art keywords
conductor
coated
lead wire
layer
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13165079A
Other languages
Japanese (ja)
Inventor
Shoji Shiga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Original Assignee
FURUKAWA KINZOKU KOGYO KK
Furukawa Metals Co Ltd
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURUKAWA KINZOKU KOGYO KK, Furukawa Metals Co Ltd, Furukawa Electric Co Ltd filed Critical FURUKAWA KINZOKU KOGYO KK
Priority to JP13165079A priority Critical patent/JPS5656745A/en
Publication of JPS5656745A publication Critical patent/JPS5656745A/en
Pending legal-status Critical Current

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  • Wire Processing (AREA)

Abstract

PURPOSE: To improve corrosion resistance and heat resistance without degradation in solderability and electric connectability by forming the protecting layer of the outermost layer of a conductor by the Ag-Sn alloy of specific composition through Ag-Sn mutual diffusion.
CONSTITUTION: This composite lead wire consists in forming a protecting layer 2 comprising Ag-3W30wt% Sn alloy on the outermost layer of a conductor 1. It is equally well to provide an intermediate layer 3 of Ni etc. on the surface of the conductor 1. In order to produce this lead wire, Ni or the like is coated by, for example, electroplating, on the conductor 1 of copper or the like or is not coated and Ag is coated. Thence, Sn is coated thereon, after which the conductor is heated to cause mutual diffusion of Ag and Sn, whereby the Ag-Sn alloy protecting layer is formed. The thickness of the coating layer of Ag and Sn is selected according to need, but unless the Sn amount is made within the above-described range with respect to the Ag amount, heat resistance and corrosion resistance degrade considerably.
COPYRIGHT: (C)1981,JPO&Japio
JP13165079A 1979-10-12 1979-10-12 Composite lead wire and its production Pending JPS5656745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13165079A JPS5656745A (en) 1979-10-12 1979-10-12 Composite lead wire and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13165079A JPS5656745A (en) 1979-10-12 1979-10-12 Composite lead wire and its production

Publications (1)

Publication Number Publication Date
JPS5656745A true JPS5656745A (en) 1981-05-18

Family

ID=15063009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13165079A Pending JPS5656745A (en) 1979-10-12 1979-10-12 Composite lead wire and its production

Country Status (1)

Country Link
JP (1) JPS5656745A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008050054A (en) * 2006-08-28 2008-03-06 Japan Crown Cork Co Ltd Cap for paper carton
US10056342B2 (en) 2011-12-26 2018-08-21 Fujitsu Limited Electronic component and electronic device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008050054A (en) * 2006-08-28 2008-03-06 Japan Crown Cork Co Ltd Cap for paper carton
US10056342B2 (en) 2011-12-26 2018-08-21 Fujitsu Limited Electronic component and electronic device
US10062658B2 (en) 2011-12-26 2018-08-28 Fujitsu Limited Electronic component and electronic device

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