JPS52128825A - Copper alloy for lead material - Google Patents
Copper alloy for lead materialInfo
- Publication number
- JPS52128825A JPS52128825A JP4617376A JP4617376A JPS52128825A JP S52128825 A JPS52128825 A JP S52128825A JP 4617376 A JP4617376 A JP 4617376A JP 4617376 A JP4617376 A JP 4617376A JP S52128825 A JPS52128825 A JP S52128825A
- Authority
- JP
- Japan
- Prior art keywords
- lead material
- copper alloy
- resistance
- copper
- superior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To obtain the Cu alloy suitable for electronic parts and lead material for apparatus, and superior in the heat resistance, bending resistance, corrosion resistance and soldering ability by adding jointly Cr,Sn,Ni,etc. to the copper.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4617376A JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4617376A JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52128825A true JPS52128825A (en) | 1977-10-28 |
| JPS5821019B2 JPS5821019B2 (en) | 1983-04-26 |
Family
ID=12739623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4617376A Expired JPS5821019B2 (en) | 1976-04-22 | 1976-04-22 | Copper alloy for lead material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5821019B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS54104596A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| CN107723502A (en) * | 2017-11-28 | 2018-02-23 | 徐高杰 | A kind of electromagnetism propels device with high-precision V-type copper section bar |
| CN107937751A (en) * | 2017-11-28 | 2018-04-20 | 徐高杰 | A kind of electromagnetism propels device copper alloy bar |
| CN110004322A (en) * | 2018-01-05 | 2019-07-12 | 比亚迪股份有限公司 | A kind of copper-based microcrystallizing alloy and preparation method thereof and a kind of electronic product |
-
1976
- 1976-04-22 JP JP4617376A patent/JPS5821019B2/en not_active Expired
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS6342415B2 (en) * | 1978-01-25 | 1988-08-23 | Tokyo Shibaura Electric Co | |
| JPS54104596A (en) * | 1978-02-03 | 1979-08-16 | Nippon Mining Co | Copper alloy for lead frame |
| JPS5654376B2 (en) * | 1978-02-03 | 1981-12-25 | ||
| CN107723502A (en) * | 2017-11-28 | 2018-02-23 | 徐高杰 | A kind of electromagnetism propels device with high-precision V-type copper section bar |
| CN107937751A (en) * | 2017-11-28 | 2018-04-20 | 徐高杰 | A kind of electromagnetism propels device copper alloy bar |
| CN110004322A (en) * | 2018-01-05 | 2019-07-12 | 比亚迪股份有限公司 | A kind of copper-based microcrystallizing alloy and preparation method thereof and a kind of electronic product |
| CN110004322B (en) * | 2018-01-05 | 2021-05-14 | 比亚迪股份有限公司 | Copper-based microcrystalline alloy, preparation method thereof and electronic product |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5821019B2 (en) | 1983-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS52123923A (en) | Cu alloy for lead | |
| JPS5424811A (en) | Copper alloy for lead conductor of semiconductor device | |
| JPS52128825A (en) | Copper alloy for lead material | |
| JPS57108235A (en) | Copper alloy for lead frame | |
| JPS5481777A (en) | Lead frame structure with intermediate layer | |
| JPS52103316A (en) | Heat-resisting copper alloy having excellent electrical conductivity a nd thermal conductivity | |
| JPS5333909A (en) | Aluminium alloy with excellent machinability and corrosion resistance | |
| JPS53138954A (en) | Metallic solder | |
| JPS53103926A (en) | Copper alloy for electric conductor of stable contact resistance and its manufacture | |
| JPS5326223A (en) | Work hardening copper alloy | |
| JPS5319131A (en) | Cu alloy for base material of composite electric contact | |
| JPS51138522A (en) | Solderable copper alloy having high electric conductivity | |
| JPS53113216A (en) | High magnetic permeable amorphous alloy excellent in corrosion resistance | |
| JPS52107227A (en) | Heat resisting cu alloy with excellent electro- and heat conductivity | |
| JPS5337513A (en) | Anti-corrosion material for chloroprence manufacturing plant | |
| JPS5344410A (en) | Sintered alloy superior in wear resistance | |
| JPS5334623A (en) | Heat resisting copper alloy of high strength | |
| JPS52114520A (en) | Free cutting ni-cu alloy | |
| JPS5215415A (en) | Alloys with high damping capacity | |
| JPS5579849A (en) | Copper alloy with superior corrosion resistance and solderability | |
| JPS57169048A (en) | High strength copper alloy with high electric conductivity | |
| JPS5224909A (en) | Aluminium alloy conductor coated by metal of a different kind | |
| JPS52128822A (en) | Preparation of steel sheet for porcelain enameling by continuous annealing | |
| JPS55104447A (en) | High temperature softening resistant copper alloy | |
| JPS5794538A (en) | Cu alloy having high heat resistance and high conductivity |