JPS5424811A - Copper alloy for lead conductor of semiconductor device - Google Patents

Copper alloy for lead conductor of semiconductor device

Info

Publication number
JPS5424811A
JPS5424811A JP9003777A JP9003777A JPS5424811A JP S5424811 A JPS5424811 A JP S5424811A JP 9003777 A JP9003777 A JP 9003777A JP 9003777 A JP9003777 A JP 9003777A JP S5424811 A JPS5424811 A JP S5424811A
Authority
JP
Japan
Prior art keywords
semiconductor device
copper alloy
lead conductor
copper
deacidified
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9003777A
Other languages
Japanese (ja)
Other versions
JPS6034615B2 (en
Inventor
Koji Noguchi
Juichi Usami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP9003777A priority Critical patent/JPS6034615B2/en
Publication of JPS5424811A publication Critical patent/JPS5424811A/en
Publication of JPS6034615B2 publication Critical patent/JPS6034615B2/en
Expired legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To prepare a copper alloy having improved heat resistance without lowering the excellent conductivity, and useful as a lead conductor of a semiconductor device in place of phosphor-deacidified copper, by adding 0.003 W 0.010π of Sn to oxygen-free copper.
COPYRIGHT: (C)1979,JPO&Japio
JP9003777A 1977-07-27 1977-07-27 Copper alloy for leads of semiconductor equipment Expired JPS6034615B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9003777A JPS6034615B2 (en) 1977-07-27 1977-07-27 Copper alloy for leads of semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9003777A JPS6034615B2 (en) 1977-07-27 1977-07-27 Copper alloy for leads of semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5424811A true JPS5424811A (en) 1979-02-24
JPS6034615B2 JPS6034615B2 (en) 1985-08-09

Family

ID=13987447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9003777A Expired JPS6034615B2 (en) 1977-07-27 1977-07-27 Copper alloy for leads of semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6034615B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5768061A (en) * 1980-10-15 1982-04-26 Furukawa Electric Co Ltd:The Lead material for semiconductor device
JPS58147142A (en) * 1982-02-26 1983-09-01 Furukawa Electric Co Ltd:The Cu alloy for lead wire material of semiconductor device
JPS6199646A (en) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk Copper wire for bonding of semiconductor device
JPS63241129A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPS63241130A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPS63241128A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPS63312936A (en) * 1987-06-17 1988-12-21 Hitachi Cable Ltd Copper alloy material for semiconductor lead frame and its production
JPH02232327A (en) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd High conductivity copper alloy having excellent workability and heat resistance
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62110910A (en) * 1985-11-01 1987-05-22 Toyobo Co Ltd High-strength and high-toughness polyamide fiber

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332854B2 (en) * 1980-10-15 1988-07-01 Furukawa Electric Co Ltd
JPS5768061A (en) * 1980-10-15 1982-04-26 Furukawa Electric Co Ltd:The Lead material for semiconductor device
JPH0253502B2 (en) * 1982-02-26 1990-11-16 Furukawa Electric Co Ltd
JPS58147142A (en) * 1982-02-26 1983-09-01 Furukawa Electric Co Ltd:The Cu alloy for lead wire material of semiconductor device
JPS6199646A (en) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk Copper wire for bonding of semiconductor device
JPS63312936A (en) * 1987-06-17 1988-12-21 Hitachi Cable Ltd Copper alloy material for semiconductor lead frame and its production
JPS63241129A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPS63241130A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPS63241128A (en) * 1988-01-08 1988-10-06 Furukawa Electric Co Ltd:The Copper alloy for lead material of semiconductor apparatus
JPH02232327A (en) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd High conductivity copper alloy having excellent workability and heat resistance
US5376403A (en) * 1990-02-09 1994-12-27 Capote; Miguel A. Electrically conductive compositions and methods for the preparation and use thereof
US5830389A (en) * 1990-02-09 1998-11-03 Toranaga Technologies, Inc. Electrically conductive compositions and methods for the preparation and use thereof
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives

Also Published As

Publication number Publication date
JPS6034615B2 (en) 1985-08-09

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