JPS5424811A - Copper alloy for lead conductor of semiconductor device - Google Patents
Copper alloy for lead conductor of semiconductor deviceInfo
- Publication number
- JPS5424811A JPS5424811A JP9003777A JP9003777A JPS5424811A JP S5424811 A JPS5424811 A JP S5424811A JP 9003777 A JP9003777 A JP 9003777A JP 9003777 A JP9003777 A JP 9003777A JP S5424811 A JPS5424811 A JP S5424811A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- copper alloy
- lead conductor
- copper
- deacidified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Conductive Materials (AREA)
Abstract
PURPOSE: To prepare a copper alloy having improved heat resistance without lowering the excellent conductivity, and useful as a lead conductor of a semiconductor device in place of phosphor-deacidified copper, by adding 0.003 W 0.010π of Sn to oxygen-free copper.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9003777A JPS6034615B2 (en) | 1977-07-27 | 1977-07-27 | Copper alloy for leads of semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9003777A JPS6034615B2 (en) | 1977-07-27 | 1977-07-27 | Copper alloy for leads of semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5424811A true JPS5424811A (en) | 1979-02-24 |
JPS6034615B2 JPS6034615B2 (en) | 1985-08-09 |
Family
ID=13987447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9003777A Expired JPS6034615B2 (en) | 1977-07-27 | 1977-07-27 | Copper alloy for leads of semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6034615B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5768061A (en) * | 1980-10-15 | 1982-04-26 | Furukawa Electric Co Ltd:The | Lead material for semiconductor device |
JPS58147142A (en) * | 1982-02-26 | 1983-09-01 | Furukawa Electric Co Ltd:The | Cu alloy for lead wire material of semiconductor device |
JPS6199646A (en) * | 1984-10-20 | 1986-05-17 | Tanaka Denshi Kogyo Kk | Copper wire for bonding of semiconductor device |
JPS63241129A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPS63241130A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPS63241128A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPS63312936A (en) * | 1987-06-17 | 1988-12-21 | Hitachi Cable Ltd | Copper alloy material for semiconductor lead frame and its production |
JPH02232327A (en) * | 1989-03-06 | 1990-09-14 | Nippon Mining Co Ltd | High conductivity copper alloy having excellent workability and heat resistance |
US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62110910A (en) * | 1985-11-01 | 1987-05-22 | Toyobo Co Ltd | High-strength and high-toughness polyamide fiber |
-
1977
- 1977-07-27 JP JP9003777A patent/JPS6034615B2/en not_active Expired
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6332854B2 (en) * | 1980-10-15 | 1988-07-01 | Furukawa Electric Co Ltd | |
JPS5768061A (en) * | 1980-10-15 | 1982-04-26 | Furukawa Electric Co Ltd:The | Lead material for semiconductor device |
JPH0253502B2 (en) * | 1982-02-26 | 1990-11-16 | Furukawa Electric Co Ltd | |
JPS58147142A (en) * | 1982-02-26 | 1983-09-01 | Furukawa Electric Co Ltd:The | Cu alloy for lead wire material of semiconductor device |
JPS6199646A (en) * | 1984-10-20 | 1986-05-17 | Tanaka Denshi Kogyo Kk | Copper wire for bonding of semiconductor device |
JPS63312936A (en) * | 1987-06-17 | 1988-12-21 | Hitachi Cable Ltd | Copper alloy material for semiconductor lead frame and its production |
JPS63241129A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPS63241130A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPS63241128A (en) * | 1988-01-08 | 1988-10-06 | Furukawa Electric Co Ltd:The | Copper alloy for lead material of semiconductor apparatus |
JPH02232327A (en) * | 1989-03-06 | 1990-09-14 | Nippon Mining Co Ltd | High conductivity copper alloy having excellent workability and heat resistance |
US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5830389A (en) * | 1990-02-09 | 1998-11-03 | Toranaga Technologies, Inc. | Electrically conductive compositions and methods for the preparation and use thereof |
US5853622A (en) * | 1990-02-09 | 1998-12-29 | Ormet Corporation | Transient liquid phase sintering conductive adhesives |
Also Published As
Publication number | Publication date |
---|---|
JPS6034615B2 (en) | 1985-08-09 |
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