JPS53138954A - Metallic solder - Google Patents

Metallic solder

Info

Publication number
JPS53138954A
JPS53138954A JP5412177A JP5412177A JPS53138954A JP S53138954 A JPS53138954 A JP S53138954A JP 5412177 A JP5412177 A JP 5412177A JP 5412177 A JP5412177 A JP 5412177A JP S53138954 A JPS53138954 A JP S53138954A
Authority
JP
Japan
Prior art keywords
metallic solder
soldering
solder
furthermore
stainless steel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5412177A
Other languages
Japanese (ja)
Other versions
JPS6238079B2 (en
Inventor
Ichikazu Kasai
Tsuyoshi Kitabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP5412177A priority Critical patent/JPS53138954A/en
Publication of JPS53138954A publication Critical patent/JPS53138954A/en
Publication of JPS6238079B2 publication Critical patent/JPS6238079B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Ceramic Products (AREA)

Abstract

PURPOSE:The white metallic solder having excellent corrosion resistance and suitable for the soldering of stainless steel, etc., which is obtained by adding Ni and Cr to the soldering material consisting of Sn and Cu as the main components and, furthermore, by adding the specified elements.
JP5412177A 1977-05-11 1977-05-11 Metallic solder Granted JPS53138954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5412177A JPS53138954A (en) 1977-05-11 1977-05-11 Metallic solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5412177A JPS53138954A (en) 1977-05-11 1977-05-11 Metallic solder

Publications (2)

Publication Number Publication Date
JPS53138954A true JPS53138954A (en) 1978-12-04
JPS6238079B2 JPS6238079B2 (en) 1987-08-15

Family

ID=12961759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5412177A Granted JPS53138954A (en) 1977-05-11 1977-05-11 Metallic solder

Country Status (1)

Country Link
JP (1) JPS53138954A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023732A1 (en) * 2006-08-23 2010-01-14 東京ブレイズ株式会社 High pressure-resistant compact heat exchanger, hydrogen storage container, and manufacturing method thereof
WO2015079845A1 (en) * 2013-11-29 2015-06-04 株式会社村田製作所 Method for generating intermetallic compound, and method for connecting articles to be connected by using intermetallic compound
CN106514044A (en) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 Copper-based brazing paste

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326088A (en) * 1999-03-16 2000-11-28 Nippon Sheet Glass Co Ltd Lead-free solder
CN103567662B (en) * 2013-11-05 2015-12-09 中国航空工业集团公司北京航空材料研究院 A kind of iron-based solder obtaining high tenacity soldered fitting

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023732A1 (en) * 2006-08-23 2010-01-14 東京ブレイズ株式会社 High pressure-resistant compact heat exchanger, hydrogen storage container, and manufacturing method thereof
WO2015079845A1 (en) * 2013-11-29 2015-06-04 株式会社村田製作所 Method for generating intermetallic compound, and method for connecting articles to be connected by using intermetallic compound
CN106514044A (en) * 2016-11-30 2017-03-22 安徽华众焊业有限公司 Copper-based brazing paste

Also Published As

Publication number Publication date
JPS6238079B2 (en) 1987-08-15

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