JPS55104447A - High temperature softening resistant copper alloy - Google Patents

High temperature softening resistant copper alloy

Info

Publication number
JPS55104447A
JPS55104447A JP1290679A JP1290679A JPS55104447A JP S55104447 A JPS55104447 A JP S55104447A JP 1290679 A JP1290679 A JP 1290679A JP 1290679 A JP1290679 A JP 1290679A JP S55104447 A JPS55104447 A JP S55104447A
Authority
JP
Japan
Prior art keywords
copper alloy
high temp
high temperature
strength
softening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1290679A
Other languages
Japanese (ja)
Inventor
Keisuke Mimura
Motohisa Miyato
Shinichi Eto
Satoru Katayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP1290679A priority Critical patent/JPS55104447A/en
Publication of JPS55104447A publication Critical patent/JPS55104447A/en
Pending legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To improve the strength and heat conductivity of a copper alloy after softening and reduce a strength lowering thereof in high temp. soldering by adding a specified amt. of Fe, P and Te and/or Se to Cu.
CONSTITUTION: A high temp. softening resistance copper alloy consisting of, by wt., Fe 0.02W0.50%, P 0.02W0.10%, Te and/or Si 0.005W0.20% in total and the balance Cu essentially. By this alloy compsn. a satisfactory strength value is obtd. after softening, and grain coarsening is controlled after high temp. working such as high temp. soldering to reduce a strength lowering of the material at a soldered portion. In addn., this alloy has superior heat conductivity and workability, so it is sutiable for use as a tube material, etc. for a heat exchanger.
COPYRIGHT: (C)1980,JPO&Japio
JP1290679A 1979-02-06 1979-02-06 High temperature softening resistant copper alloy Pending JPS55104447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1290679A JPS55104447A (en) 1979-02-06 1979-02-06 High temperature softening resistant copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1290679A JPS55104447A (en) 1979-02-06 1979-02-06 High temperature softening resistant copper alloy

Publications (1)

Publication Number Publication Date
JPS55104447A true JPS55104447A (en) 1980-08-09

Family

ID=11818394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1290679A Pending JPS55104447A (en) 1979-02-06 1979-02-06 High temperature softening resistant copper alloy

Country Status (1)

Country Link
JP (1) JPS55104447A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492602A (en) * 1983-07-13 1985-01-08 Revere Copper And Brass, Inc. Copper base alloys for automotive radiator fins, electrical connectors and commutators
JPS62218533A (en) * 1986-03-18 1987-09-25 Sumitomo Metal Mining Co Ltd High conductivity copper alloy
US7180176B2 (en) * 2001-08-23 2007-02-20 Dowa Mining Co., Ltd. Radiation plate and power semiconductor module IC package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492602A (en) * 1983-07-13 1985-01-08 Revere Copper And Brass, Inc. Copper base alloys for automotive radiator fins, electrical connectors and commutators
JPS62218533A (en) * 1986-03-18 1987-09-25 Sumitomo Metal Mining Co Ltd High conductivity copper alloy
JPH0463138B2 (en) * 1986-03-18 1992-10-08 Sumitomo Metal Mining Co
US7180176B2 (en) * 2001-08-23 2007-02-20 Dowa Mining Co., Ltd. Radiation plate and power semiconductor module IC package

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