JPS5547337A - Heat resisting highly conductive copper alloy - Google Patents

Heat resisting highly conductive copper alloy

Info

Publication number
JPS5547337A
JPS5547337A JP12166878A JP12166878A JPS5547337A JP S5547337 A JPS5547337 A JP S5547337A JP 12166878 A JP12166878 A JP 12166878A JP 12166878 A JP12166878 A JP 12166878A JP S5547337 A JPS5547337 A JP S5547337A
Authority
JP
Japan
Prior art keywords
alloy
strength
copper
highly conductive
heat resisting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12166878A
Other languages
Japanese (ja)
Other versions
JPS6215619B2 (en
Inventor
Hajime Sasaki
Shinichi Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP12166878A priority Critical patent/JPS5547337A/en
Publication of JPS5547337A publication Critical patent/JPS5547337A/en
Publication of JPS6215619B2 publication Critical patent/JPS6215619B2/ja
Granted legal-status Critical Current

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  • Conductive Materials (AREA)

Abstract

PURPOSE: To obtain a heat resisting highly conductive copper alloy which is improved in strength after heating with high temperature without detracting its workability, by adding extremely small quantities of P, Mg and Cr to copper.
CONSTITUTION: This alloy contains 0.004W0.07wt% of P, 0.01W0.1wt% of Mg and 0.01W0.5% or Cr, and the rest of alloy is composed of Cu. Mg and Cr are added to the alloy to increase the strength produced by deposition of P-compound. This alloy has a softening point which is higher than that of phosphorus deoxidized copper. When this alloy is used for heat exchanger, etc., therefore, the material can be reduced in thickness without producing any damage caused by reduced strength after the material is heated by brazing. When this alloy is used as a molding material for copper continuous casting utilizing its high temperature strength and conductivity, the life of mold can be improved.
COPYRIGHT: (C)1980,JPO&Japio
JP12166878A 1978-10-02 1978-10-02 Heat resisting highly conductive copper alloy Granted JPS5547337A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12166878A JPS5547337A (en) 1978-10-02 1978-10-02 Heat resisting highly conductive copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12166878A JPS5547337A (en) 1978-10-02 1978-10-02 Heat resisting highly conductive copper alloy

Publications (2)

Publication Number Publication Date
JPS5547337A true JPS5547337A (en) 1980-04-03
JPS6215619B2 JPS6215619B2 (en) 1987-04-08

Family

ID=14816931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12166878A Granted JPS5547337A (en) 1978-10-02 1978-10-02 Heat resisting highly conductive copper alloy

Country Status (1)

Country Link
JP (1) JPS5547337A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305762A (en) * 1980-05-14 1981-12-15 Olin Corporation Copper base alloy and method for obtaining same
JPS6075541A (en) * 1983-09-30 1985-04-27 Tatsuta Electric Wire & Cable Co Ltd Copper alloy with excellent heat resistance, mechanical properties, and electrical conductivity
US4710349A (en) * 1986-03-18 1987-12-01 Sumitomo Metal & Mining Co., Ltd. Highly conductive copper-based alloy
JPH0357530A (en) * 1989-07-25 1991-03-12 Nippon Mining Co Ltd Copper anode mold and copper anode manufacturing method
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal
US7416620B2 (en) 1996-08-29 2008-08-26 Luvata Oy Copper alloy and method for its manufacture
JP2010236063A (en) * 2009-03-31 2010-10-21 Kobelco & Materials Copper Tube Inc Copper alloy tube for heat exchanger

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5157628A (en) * 1974-11-18 1976-05-20 Goto Gokin Kk IMONOYODOKIGOKIN

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5157628A (en) * 1974-11-18 1976-05-20 Goto Gokin Kk IMONOYODOKIGOKIN

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4305762A (en) * 1980-05-14 1981-12-15 Olin Corporation Copper base alloy and method for obtaining same
JPS6075541A (en) * 1983-09-30 1985-04-27 Tatsuta Electric Wire & Cable Co Ltd Copper alloy with excellent heat resistance, mechanical properties, and electrical conductivity
US4710349A (en) * 1986-03-18 1987-12-01 Sumitomo Metal & Mining Co., Ltd. Highly conductive copper-based alloy
JPH0357530A (en) * 1989-07-25 1991-03-12 Nippon Mining Co Ltd Copper anode mold and copper anode manufacturing method
US7416620B2 (en) 1996-08-29 2008-08-26 Luvata Oy Copper alloy and method for its manufacture
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6689232B2 (en) 1999-06-07 2004-02-10 Waterbury Rolling Mills Inc Copper alloy
KR20030082704A (en) * 2002-04-18 2003-10-23 희성금속 주식회사 Electronic contact production method of agcu system compound metal
JP2010236063A (en) * 2009-03-31 2010-10-21 Kobelco & Materials Copper Tube Inc Copper alloy tube for heat exchanger

Also Published As

Publication number Publication date
JPS6215619B2 (en) 1987-04-08

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