GB1414289A - Copper material and uses thereof - Google Patents
Copper material and uses thereofInfo
- Publication number
- GB1414289A GB1414289A GB1433274A GB1433274A GB1414289A GB 1414289 A GB1414289 A GB 1414289A GB 1433274 A GB1433274 A GB 1433274A GB 1433274 A GB1433274 A GB 1433274A GB 1414289 A GB1414289 A GB 1414289A
- Authority
- GB
- United Kingdom
- Prior art keywords
- alloy
- copper
- april
- manufacture
- chill
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Continuous Casting (AREA)
- Mold Materials And Core Materials (AREA)
- Laminated Bodies (AREA)
- Molds, Cores, And Manufacturing Methods Thereof (AREA)
Abstract
1414289 Copper alloy WIELAND-WERKE AG 1 April 1974 [13 April 1973] 14332/74 Heading C7A A copper box alloy of composition 0.005 to 0.08% Cr 0.005 to 0.04% P Cu balance having a Brinell hardness of at least 120 kp/mm<SP>2</SP>, an electrical and thermal conductivity of at least 80% I.A.C.S. and a softening temperature higher than 350‹C. The alloy may be prepared from phosphorus deoxidized copper, may be cast into a chill mould and cold worked to the required hardness. It may be used in the manufacture of internal combustion engine radiators, chill moulds and may be clad with stainless steel for use in the manufacture of cooking utensils.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2318662A DE2318662C2 (en) | 1973-04-13 | 1973-04-13 | Use of a copper material |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1414289A true GB1414289A (en) | 1975-11-19 |
Family
ID=5877952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1433274A Expired GB1414289A (en) | 1973-04-13 | 1974-04-01 | Copper material and uses thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS508729A (en) |
BE (1) | BE813124A (en) |
DE (1) | DE2318662C2 (en) |
FR (1) | FR2225532A1 (en) |
GB (1) | GB1414289A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2181742A (en) * | 1985-09-13 | 1987-04-29 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4377424A (en) * | 1980-05-26 | 1983-03-22 | Chuetsu Metal Works Co., Ltd. | Mold of precipitation hardenable copper alloy for continuous casting mold |
JPS60238432A (en) * | 1984-12-27 | 1985-11-27 | Mitsubishi Metal Corp | Cu alloy for continuous casting mold |
-
1973
- 1973-04-13 DE DE2318662A patent/DE2318662C2/en not_active Expired
-
1974
- 1974-03-29 FR FR7411528A patent/FR2225532A1/fr not_active Withdrawn
- 1974-04-01 BE BE1005840A patent/BE813124A/en unknown
- 1974-04-01 GB GB1433274A patent/GB1414289A/en not_active Expired
- 1974-04-10 JP JP4164374A patent/JPS508729A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2181742A (en) * | 1985-09-13 | 1987-04-29 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
US4749548A (en) * | 1985-09-13 | 1988-06-07 | Mitsubishi Kinzoku Kabushiki Kaisha | Copper alloy lead material for use in semiconductor device |
GB2181742B (en) * | 1985-09-13 | 1990-05-23 | Mitsubishi Metal Corp | Copper alloy lead material for use in semiconductor device |
US5306465A (en) * | 1992-11-04 | 1994-04-26 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US5370840A (en) * | 1992-11-04 | 1994-12-06 | Olin Corporation | Copper alloy having high strength and high electrical conductivity |
US5486244A (en) * | 1992-11-04 | 1996-01-23 | Olin Corporation | Process for improving the bend formability of copper alloys |
US5601665A (en) * | 1992-11-04 | 1997-02-11 | Olin Corporation | Process for improving the bend formability of copper alloys |
Also Published As
Publication number | Publication date |
---|---|
JPS508729A (en) | 1975-01-29 |
FR2225532A1 (en) | 1974-11-08 |
DE2318662C2 (en) | 1975-03-20 |
BE813124A (en) | 1974-07-31 |
DE2318662B1 (en) | 1974-08-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |