JPS5759369A - Conductor coated heat resisting silver - Google Patents

Conductor coated heat resisting silver

Info

Publication number
JPS5759369A
JPS5759369A JP13463080A JP13463080A JPS5759369A JP S5759369 A JPS5759369 A JP S5759369A JP 13463080 A JP13463080 A JP 13463080A JP 13463080 A JP13463080 A JP 13463080A JP S5759369 A JPS5759369 A JP S5759369A
Authority
JP
Japan
Prior art keywords
alloy
copper
lower metal
thickness
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13463080A
Other languages
Japanese (ja)
Inventor
Ryozo Yamagishi
Osamu Yoshioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP13463080A priority Critical patent/JPS5759369A/en
Publication of JPS5759369A publication Critical patent/JPS5759369A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

PURPOSE:To improve adhesion of a silver coated film after the thermal deterioration in an oxide atmosphere by providing the silver coated layer via a lower metal layer of Ni alloy or Co alloy having a specified thickness on a substrate comprising copper or copper alloy. CONSTITUTION:The lower metal layer 2 of the Ni alloy or Co alloy with a thickness of 0.2-4mu is provided on the substrate 1 of copper or copper alloy. The silver coated layer 3 is further provided thereon. The amount of Ni or Co in the alloy of the lower metal layer 2 is in the range of 20-98wt%. It is recommended that one or more metals whose diffusing speed is faster than that of Ni are included in the alloy other than Ni or Co. For example, the lower metal layer 2 with the thickness of about 1mu is provided on a hoop shaped copper stripe 1 by Cu-Ni alloy plating, the silver coated layer 3 with the thickness of about 1mu is provided thereon by Ag plating, and a lead frame for a semiconductor is formed.
JP13463080A 1980-09-26 1980-09-26 Conductor coated heat resisting silver Pending JPS5759369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13463080A JPS5759369A (en) 1980-09-26 1980-09-26 Conductor coated heat resisting silver

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13463080A JPS5759369A (en) 1980-09-26 1980-09-26 Conductor coated heat resisting silver

Publications (1)

Publication Number Publication Date
JPS5759369A true JPS5759369A (en) 1982-04-09

Family

ID=15132858

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13463080A Pending JPS5759369A (en) 1980-09-26 1980-09-26 Conductor coated heat resisting silver

Country Status (1)

Country Link
JP (1) JPS5759369A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6460907A (en) * 1987-09-01 1989-03-08 Furukawa Electric Co Ltd Conductor for extra-thin winding
JPH01306574A (en) * 1988-06-06 1989-12-11 Furukawa Electric Co Ltd:The Sn or sn alloy clad material
JPH0221508A (en) * 1988-07-08 1990-01-24 Furukawa Electric Co Ltd:The Conductor for minute wire winding
JPH02301573A (en) * 1989-05-15 1990-12-13 Furukawa Electric Co Ltd:The Sn or sn alloy coated material
EP2453491A1 (en) * 2009-07-10 2012-05-16 Furukawa Electric Co., Ltd. Lead frame for optical semiconductor device, manufacturing method of lead frame for optical semiconductor device, and optical semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6460907A (en) * 1987-09-01 1989-03-08 Furukawa Electric Co Ltd Conductor for extra-thin winding
JPH01306574A (en) * 1988-06-06 1989-12-11 Furukawa Electric Co Ltd:The Sn or sn alloy clad material
JPH0221508A (en) * 1988-07-08 1990-01-24 Furukawa Electric Co Ltd:The Conductor for minute wire winding
JPH02301573A (en) * 1989-05-15 1990-12-13 Furukawa Electric Co Ltd:The Sn or sn alloy coated material
EP2453491A1 (en) * 2009-07-10 2012-05-16 Furukawa Electric Co., Ltd. Lead frame for optical semiconductor device, manufacturing method of lead frame for optical semiconductor device, and optical semiconductor device
EP2453491A4 (en) * 2009-07-10 2014-01-08 Furukawa Electric Co Ltd Lead frame for optical semiconductor device, manufacturing method of lead frame for optical semiconductor device, and optical semiconductor device

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