JPH0221508A - Conductor for minute wire winding - Google Patents

Abstract

PURPOSE:To improve the soldering property and the solder-resisting fusion property by using copper or a copper alloy as a core material, and covering the core material with Ni, and furthermore, with Ag or Cu in a specific thickness respectively. CONSTITUTION:In a conductor with the wire diameter less than 0.05mm, copper or a copper alloy is used as a core material, over which Ni is spread at the thickness 0.05 to 20mum, and furthermore, Ag or Cu is spread at the thickness 0.05 to 1.5mum thereover. In this case, when the thickness of the Ni coverage membrane is less than 0.05mum, the effect to the solder-resisting fusion property is little, and when it exceeds 2.0mum, the wiredrawing process property is reduced making difficult to apply the wiredrawing to a conductor with the diameter less than 0.05mm, merely increasing the cost without giving the effect any more. And when the membrane thickness of the Ag or Cu coverage is less than 0.05mum, the effect to the solder wetting property and the wiredrawing property is reduced, and when it exceeds 1.5mum, the solder wetting property and the wiredrawing property can not be improved, merely increasing the cost. Consequently, the solder-resisting fusion property, the solder wetting property, and the wiredrawing property can be improved only in such a way.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a conductor for ultra-fine windings that is excellent in resistance to solder thinning and solder wetting.

[Conventional technology]

Conventionally, winding wires use copper or copper alloy wire as a conductor and coat the wire with enamel. When used, the enamel film on the terminal is removed and soldering is performed. The diameter of such winding wires has also been reduced to 0.0.
5. Demand for the following ultra-fine winding wires is increasing, and it is expected that the diameter will continue to become smaller.

When it comes to ultra-fine windings with a diameter of 0.058 or less, it becomes difficult to peel off the enamel film, and in order to automate terminal processing, ultra-fine windings are now soldered directly onto the enamel film.

[Problem to be solved by the invention]

When soldering directly onto the enamel film, the soldering temperature is quite high because the enamel is removed by the solder. However, in the case of ultra-fine winding wire or ultra-fine winding wire with a wire diameter of 0.05# or less, the surface area/volume ratio per unit length is quite large, and the conductor becomes thinner during the soldering process, causing the conductor to break away from the soldered part. It happens all too often. Moreover, even if it does not break, the reliability after soldering is considerably poor.

[Means for Solving the Problems] In view of this, as a result of various studies, the present invention has been developed to provide a so-called solder melt resistant material that has good solderability and almost no thinning of the conductor even when soldered directly onto the enamel film. We have developed an excellent ultra-fine winding conductor.

That is, the present invention provides a conductor with a wire diameter of 0.058 or less,
Copper or copper alloy wire is used as the core material, and Ni is added on top of it from 0.05 to
Coated with a thickness of 2゜0μm and further coated with Ag or CU.
It is characterized by being coated with a thickness of 0.05 to 1.5 μm.

[For production]

The conductor of the present invention has a core made of copper or copper alloy wire, and N
By coating i with a thickness of 0.05 to 2.0μ7n, the solder melting resistance of the conductor is improved, and on top of that, Ag or C
Solder wettability and wire drawability are improved by coating u with a thickness of 0.05 to 1.5 μm. However, in the present invention, the thickness of the Ni film is 0.05 to 2°0μ.
m, Ag or CLI film thickness from 0.05 to 1.5 μm
The reason for this limitation is as follows.

The Ni coating increases the solder melting resistance, and the reason why the thickness of the Ni coating is set to 0.05 to 2.0 μm is that if it is less than 0.05 μm, the effect on the solder melting resistance is small, and if it exceeds 2.0 μm, the effect on the solder melting resistance is small. This is because the wire drawability deteriorates, making it difficult to wire-draw a conductor with a wire diameter of 0.05 m or less, and no further effect can be expected, and the cost simply increases.

The Ag or CU coating is intended to improve solder wettability and wire drawability, and the reason why the coating thickness is set to 0905 to 1.5 μm is because less than 0.05 μm has an effect on solder wettability and wire drawability. is small, and even if it exceeds 1.5 μm, no further improvement in solder wettability and wire drawability can be expected, which increases costs.

The reason why the wire diameter of the conductor was limited to 0.05M or less is as follows.

That is, when the wire diameter is larger than 0.05 NR, thinning due to soldering is hardly a problem, but when the wire diameter is 0.05 m or less, thinning due to soldering becomes a problem rapidly.

The heartwood is made of tough pitch copper (TPO), oxygen-free (OF)
It is effective to improve the strength and heat resistance by using a copper wire such as C) or a copper alloy wire such as Ag-containing copper, Sn-containing copper, or In-containing copper. Further, electroplating is suitable for Ni coating, Ag or Cu coating.

The present invention will be described below with reference to Examples.

(Example) Copper or copper alloy wire shown in Table 1 with a diameter of 0.2 m was
．． 025 rrun to obtain the desired plating thickness.
1 was electroplated, and Ag or CU was electroplated thereon. This was made into a conductor with a diameter of 0.025 m using a continuous wire drawing machine, and the surface was coated with polyurethane to make an ultrafine winding wire. In addition to examining the wire drawability of the conductor of the winding thus produced, the conductor's solder wettability and conductor melting time were measured using the winding as a test material, and the strength of the conductor on hard wood was also measured. The manufacturing costs of windings were compared.

These results are also listed in Table 1 in comparison with a conventional ultrafine winding wire using TPO, which is a conventional conductor.

Solder wettability and conductor dissolution time are 50%3n50%p
Using the testing machine shown in Fig. 1 in which the b-alloy solder bath was maintained at 380°C, the winding (2) attached to the chuck (1) was immersed in the solder bath (3), and the solder wetting time and solder wetting of the conductor were measured. The load was calculated. Immersion speed is 25m/sec, immersion depth is 1
2%, and the immersion time was 1 second. In addition, melting time is the time until the conductor melts and disappears. Good wire drawability is marked with ◎, and poor wire drawing property is marked with The highest values are represented by Q marks, the higher ones by Δ marks, and the even higher ones by X marks.

As is clear from Table 1, the conductors Nα1 to 13 of the present invention have superior solder wettability and solder wetting load, as well as longer melting time and superior melting resistance compared to the conventional conductor Nα21. .

On the other hand, the comparative conductor Nα14, which has a thin Ni coating, has no improvement in solder melting resistance.

The comparative conductor Nα15, which has a thin A7 coating, and the comparative conductor NCLiB, which has a thin Cu coating, have poor wire drawability, cracks, etc. are observed on the surface, and the solder wetting time and solder wetting load are also poor. Comparative conductor Nα16, which had a thick Ni coating, had extremely poor wire drawability, and it was difficult to draw the wire to a diameter of 0.05 mm or less.

Moreover, the cost is also considerably high. Comparative conductor Nα17 with a thick coating of /l and comparative conductor Nα with a thick coating of Cu.
In No. 19, there is no effect of improving the solder wetting time and solder wetting load by increasing the thickness of A7 and Cu, and only the cost increases. Comparative conductors No. 20, which were not coated with A3 or Cu after being coated with N1, had extremely poor solder wettability and poor wire drawability, making it impossible to draw long wires.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to obtain a conductor for ultra-fine windings that has good solderability and excellent solder melting resistance, and has significant industrial effects.

[Brief explanation of the drawing]

FIG. 1 is a sectional side view of a testing machine for testing the solderability of the conductor of the present invention. 1, chuck 2, winding 3, solder bath

Claims (1)

[Claims] (1) For conductors with a wire diameter of 0.05 mm or less, the core material is copper or copper alloy wire, and 0.05 to 2.0 mm of Ni is added on top of the core material.
It is coated to a thickness of μm, and then Ag or Cu is applied on top of it to a thickness of 0.1 μm.
An ultrafine winding conductor characterized by being coated with a thickness of 0.05 to 1.5 μm.