CN109509571B - Tin-based alloy and copper strip composite material and preparation method thereof - Google Patents
Tin-based alloy and copper strip composite material and preparation method thereof Download PDFInfo
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- CN109509571B CN109509571B CN201811377524.7A CN201811377524A CN109509571B CN 109509571 B CN109509571 B CN 109509571B CN 201811377524 A CN201811377524 A CN 201811377524A CN 109509571 B CN109509571 B CN 109509571B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 138
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 134
- 239000010949 copper Substances 0.000 title claims abstract description 134
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 239000000956 alloy Substances 0.000 title claims abstract description 98
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 93
- 239000002131 composite material Substances 0.000 title claims abstract description 66
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 229910052718 tin Inorganic materials 0.000 claims abstract description 127
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000011162 core material Substances 0.000 claims abstract description 10
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000007711 solidification Methods 0.000 claims abstract description 7
- 230000008023 solidification Effects 0.000 claims abstract description 7
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 239000011135 tin Substances 0.000 claims description 121
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- 229910000846 In alloy Inorganic materials 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 10
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 10
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 8
- 229910001152 Bi alloy Inorganic materials 0.000 claims description 7
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 7
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 7
- 239000002140 antimony alloy Substances 0.000 claims description 7
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 7
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 7
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 7
- 229910052787 antimony Inorganic materials 0.000 claims description 6
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 238000002791 soaking Methods 0.000 claims description 5
- 239000000843 powder Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 230000037303 wrinkles Effects 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims 3
- 229910006913 SnSb Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000004907 flux Effects 0.000 abstract description 21
- 238000005476 soldering Methods 0.000 abstract description 21
- 238000005219 brazing Methods 0.000 abstract description 20
- 239000002184 metal Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 7
- 239000000945 filler Substances 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- 238000013329 compounding Methods 0.000 abstract description 3
- 230000006698 induction Effects 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 33
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 5
- OLXNZDBHNLWCNK-UHFFFAOYSA-N [Pb].[Sn].[Ag] Chemical compound [Pb].[Sn].[Ag] OLXNZDBHNLWCNK-UHFFFAOYSA-N 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000011133 lead Substances 0.000 description 4
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical class OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 238000010923 batch production Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009210 therapy by ultrasound Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009675 coating thickness measurement Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/002—Auxiliary arrangements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/002—Soldering by means of induction heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Coating With Molten Metal (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, belonging to the field of nonferrous metal high-frequency brazing processing. The tin-based alloy and copper strip composite material consists of a core material and a coating wrapped on the surface of the core material, wherein the core material is a copper strip, the coating is a tin-based alloy, and the thickness of a single-side coating is 20-100 mu m. The preparation method adopts a high-frequency brazing principle to realize the formation of a compact tin-based alloy material coating on the surface of the copper strip, and comprises the steps of pre-arranging the soldering flux on the surface of the copper strip, compounding the copper strip and the brazing filler metal, high-frequency induction rapid brazing, air cooling solidification, strip packaging around a shaft and the like. The tin-based alloy and copper strip composite material prepared by the method has the characteristics of no missing welding and tin nodule defects, good conductivity, strong weldability, good corrosion resistance, good oxidation resistance, firm plating layer and the like, is mainly used in the electronic industry fields of electronic components, hybrid integrated circuits, solar photovoltaic components and the like, and has wide market prospect.
Description
Technical Field
The invention relates to a tin-based alloy and copper strip composite material and a preparation method thereof, in particular to a tin-based alloy flat copper wire and a preparation method thereof, which are mainly used in the electronic industry fields of electronic components, hybrid integrated circuits, solar photovoltaic modules and the like and belong to the field of high-frequency brazing processing of nonferrous metals.
Background
With the continuous development of miniaturization and miniaturization of mechanical and electronic equipment, copper leads with excellent performance and current carrying capacity, high transmission speed, good heat dissipation and low price are gradually widely applied. Compared with a pure tin-plated copper wire, the tin-plated copper-based alloy copper-strip composite material has larger current carrying capacity, higher reliability, better oxidation resistance and corrosion resistance, and is widely applied in key fields of national defense electronic industry and the like.
The tin-copper strip composite material prepared by single tin plating on the copper strip is easy to form copper-tin alloy during processing, the uniformity is difficult to control, the thickness and the weldability of a plating layer are difficult to guarantee, and tin whisker defects are easy to occur during long-term service, so that the use requirements of a high-reliability hybrid integrated circuit or an electronic component can not be met.
At present, three methods of chemical plating, electroplating and hot dipping commonly used for preparing a tin-copper strip composite material are not easy to control the alloy components of a coating on the surface of a copper strip, the uniformity and consistency of the thickness of the coating are difficult to ensure, particularly, the hot dipping causes the defects of copper strip discoloration, copper leakage, tin nodule, tin slag and the like, can reduce the weldability of a welding flux and influence the characteristics of the copper strip, and simultaneously, the three methods have certain environmental pollution.
Disclosure of Invention
The invention mainly aims to provide a tin-based alloy and copper strip composite material, which has scientific component design and reasonable proportion and can be popularized and applied to the electronic industry fields of electronic components, hybrid integrated circuits, solar photovoltaic modules and the like.
A tin-based alloy and copper strip composite material, in particular to a tin-based alloy flat copper wire, which consists of a core material and a coating layer wrapped on the surface of the core material, wherein the core material is a copper strip or flat copper wire, the coating layer is a tin-based alloy, and the thickness of a single-side coating layer is 20-100 mu m.
The copper strip is made of oxygen-free copper, and the purity of the oxygen-free copper is higher than 99.99 w%.
The tin-based alloy mainly comprises a tin-indium alloy, a tin-bismuth alloy, a tin-lead-silver alloy, a tin-silver-copper alloy and a tin-antimony alloy, wherein the tin-indium alloy comprises tin and indium in percentage by weight; 45-50% of tin and 50-55% of indium; the weight percentage of tin and bismuth in the tin-bismuth alloy is as follows; 50-70% of tin and 30-50% of bismuth; the weight percentages of tin, lead and silver in the tin-lead-silver alloy are as follows; 60-64% of tin, 35-37% of lead and 1-3% of silver; the weight percentage of tin and silver in the tin-silver alloy is as follows; 97-95% of tin and 3-5% of silver; the weight percentages of tin, silver and copper in the tin-silver-copper alloy are as follows; 97-95% of tin, 2.8-4% of silver and 0.2-1% of copper; the weight percentage of tin and antimony in the tin-antimony alloy is as follows; 90-95% of tin and 5-10% of antimony.
According to the tin-based alloy and copper strip composite material, the coating alloy comprises a plurality of tin-based alloys, generally SnIn52, SnBi58, SnPbBi43-14, SnPbAg36-2, SnAg4, SnAgCu3-0.5, SnSb5 and other alloy materials, so that copper can be effectively inhibited from being dissolved in tin, the utilization rate of tin is improved, and the weldability is greatly improved; the melting point range of the alloy coating is 118-260 ℃, the brazing temperature range is 150-280 ℃, and the use requirements of electronic components on tin-based alloy and copper strip composite materials with different temperatures and performances can be met.
The invention also aims to provide a preparation method of the tin-based alloy and copper strip composite material, which comprises the steps of presetting the soldering flux on the surface of a copper strip, compounding the copper strip and the soldering flux, high-frequency induction rapid soldering, air cooling solidification, strip packaging around a shaft and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
the preparation method of the tin-based alloy and copper strip composite material adopts a method of presetting scaling powder on the surface of a copper-based strip, compounding a copper strip and a brazing filler metal, high-frequency induction rapid brazing, air cooling solidification and strip packaging around a shaft, and comprises the following steps:
(1) selecting a copper strip and two tin-based alloy strips, wherein the thickness of the tin-based alloy strips is the thickness of a required coating, and the width of the tin-based alloy strips is the same as that of the copper strip;
(2) firstly, drawing the copper strip in the step (1) through acetone, soaking, heating and ultrasonically treating, and drying by hot air; then drawing the copper strip to pass through a stainless steel groove filled with liquid medium-activity soldering flux at a constant speed;
(3) respectively attaching two tin-based alloy strips to a copper strip from top to bottom, passing through a pair of rollers, and limiting the strip direction by a movable clamping groove to enable the two tin-based alloy strips to be tightly attached to the copper strip, wherein the surfaces of the tin-based alloy strips are flat without wrinkles and bulges;
(4) horizontally passing the composite strip obtained in the step (3) through a red copper high-frequency welding ring of a high-frequency welding machine;
(5) after air cooling and solidification are carried out on the composite strip obtained in the step (4), winding and rewinding are carried out, and the composite strip can be prepared;
(6) and (6) tightly winding and packaging the composite strip obtained in the step (5) by adopting a single wire and a single disc.
In the step (1), the copper strip is an oxygen-free copper strip, and the purity of the copper strip is higher than 99.99 w%. The width of the copper strip is 1-20mm, and the thickness is 0.2-1 mm.
In the step (2), the heating temperature is 50 ℃; and (3) drawing the copper strip to pass through a stainless steel groove filled with liquid medium-activity soldering flux at a constant speed of 5-50 m/min.
The medium-activity soldering flux is a cleaning-free and residue-free soldering flux, and the soldering flux mainly comprises 15% of isopropanol, 10% of glycerol, 1% of ethylene glycol monobutyl ether, 5% of hydrogenated rosin, 0.5% of glycerol and the balance of water, wherein the weight percentage of the soldering flux is isopropanol, the weight percentage of glycerol is ethylene glycol monobutyl ether, the weight percentage of brominated salicylic acid is 1%, and the weight percentage of glycerol is glycerol, the weight percentage of ethylene glycol monobutyl ether is glycerol, the weight percentage of the brominated salicylic acid is 1%, the weight percentage of hydrogenated rosin is 5%, and the weight percentage of glycerol is 0.5%.
In the step (3), the gap between the pair of rollers is 0.02-0.05mm smaller than the sum of the thicknesses of the two tin-based alloy strips and the copper strip, and the tin-based alloy strips and the copper strip pass through the rollers after being compounded, wherein the traction speed is 5-50 m/min.
In the step (4), the composite strip rapidly and horizontally passes through a red copper high-frequency welding ring of a high-frequency welding machine, the traction speed is 5-50 m/min, and the current frequency is 50-100 KHz.
In the step (5), the composite strip is subjected to wind condensation solidification, and then is wound up and rewound on an upper shaft, wherein the traction speed is 5-50 m/min. In the whole preparation process, the traction speed of the copper strip is 5-50 m/min.
The preparation method of the invention adopts a high-frequency welding mode, utilizes the skin effect and the proximity effect of high-frequency current, can heat the copper strip in a short time, melts the tin-based alloy, generates metallurgical bonding of the tin-based alloy and the surface of the copper strip, forms a compact reaction interface, and obtains the composite conductive material with uniform and consistent coating thickness and firm and reliable bonding. And the process is simple, does not cause environmental pollution and can be used for batch production.
The invention has the advantages that:
1. according to the tin-based alloy and copper strip composite material, the coating is made of a plurality of optional tin-based alloys, the melting point range of the alloy coating is 118-260 ℃, the brazing temperature range of the coating is 150-280 ℃, and the tin-based alloy and copper strip composite material is more suitable for connecting various electronic products such as electronic components, hybrid integrated circuits and solar photovoltaic modules.
2. The tin-based alloy and copper strip composite material has the advantages of good weldability, corrosion resistance, oxidation resistance, firm plating layer and the like.
3. The composite material is prepared by adopting a high-frequency brazing principle, a compact tin-based alloy material coating can be quickly formed on the surface of the copper strip, and the composite material is more environment-friendly compared with preparation methods of electroplating, chemical plating and hot dipping.
4. In the brazing process, the used moderate-activity soldering flux is a cleaning-free and residue-free soldering flux, can realize activity at 120 ℃, and is suitable for brazing at a plurality of temperature sections. In the brazing process, oxides on the surfaces of the copper strip and the brazing filler metal can be effectively and quickly removed to form a protective layer, re-oxidation is avoided, and meanwhile, a plated layer after brazing is bright in luster and free of residues.
4. The preparation method of the tin-based alloy and copper strip composite material is simple and is beneficial to batch production.
Drawings
FIG. 1 is a cross-sectional view of a tin-based alloy and copper strip composite of the present invention.
Description of the main reference numbers:
1 copper strip 2 tin base alloy
Detailed Description
The tin-based alloy and copper strip composite material and the preparation method thereof according to the present invention will be further described with reference to the specific processing and preparation examples.
As shown in figure 1, the core material of the tin-based alloy and copper strip composite material is a copper strip 1, the material is oxygen-free copper, the purity is higher than 99.99 percent, the alloy material coated on the surface of the copper strip 1 is a tin-based alloy 2, and the thickness of a single-side coating of the tin-based alloy and copper strip composite material is 20-100 mu m. The tin-based alloy mainly comprises tin-indium alloy, tin-bismuth alloy, tin-lead-silver alloy, tin-silver-copper alloy and tin-antimony alloy.
The tin-based alloy and copper strip composite material in the following embodiment is prepared by the following method, and specifically comprises the following steps:
the method comprises the following steps: selecting one oxygen-free copper belt with a clean surface, wherein the purity is higher than 99.99 w%; two tin-based alloy strips without oil on the surface have the thickness of the needed single-side coating and the width is consistent with that of the copper strip.
Step two: firstly, the copper strip selected in the step one is pulled to pass through an acetone solution, soaking, heating and ultrasonic treatment are carried out, deoiling and cleaning are completed, and then hot air drying is carried out. And then drawing the copper strip to pass through a stainless steel groove filled with liquid medium-activity soldering flux at a constant speed of 5-50 m/min. The medium active soldering flux is a cleaning-free and residue-free soldering flux, and the main components of the soldering flux are isopropanol, glycerol, ethylene glycol monobutyl ether, brominated salicylic acid, hydrogenated rosin, glycerol and water, and the weight percentage ratio of the soldering flux is 15: 10: 1: 1: 5: 0.5: and the balance.
Step three: and selecting a tin-based alloy strip selected in the step one and a copper strip obtained in the step two, respectively pasting the copper strip on the two brazing filler metal strips, passing through a pair of rollers with proper gaps, limiting the direction of the strips by a movable clamping groove, and controlling the traction speed to be 5-50 m/min.
Step four: and (4) enabling the composite strip obtained in the step three to rapidly and horizontally pass through a red copper high-frequency welding ring of a high-frequency welding machine, wherein the traction speed is 5-50 m/min, and the current frequency is 50-100 KHz.
Step five: and D, solidifying the composite strip obtained in the fourth step by wind, and then taking up, rewinding and upper-winding to prepare the composite strip, wherein the traction speed is 5-50 m/min.
Step six: and D, tightly winding and packaging the composite strip obtained in the fifth step by adopting a single wire and a single disc.
The invention relates to a tin-based alloy and copper strip composite material, which is prepared by adopting a high-frequency brazing principle to form a compact tin-based alloy material coating on the surface of a copper strip, and the main preparation method comprises the following steps: the preparation method is simple in process and suitable for batch production of various tin-based alloy and copper strip composite materials.
Example 1
Preparing a composite material of a tin-based alloy and a copper strip, wherein the copper strip is selected to be oxygen-free copper, the tin-based alloy is a tin-indium alloy, and the weight percentage of tin and indium is as follows; 48% of tin and 52% of indium.
The tin-based alloy and copper strip composite material is prepared by the following method, and specifically comprises the following steps:
the method comprises the following steps: selecting one oxygen-free copper belt (the thickness is 0.3mm, the width is 2.5mm) with a clean surface, wherein the purity is higher than 99.99 w%; two tin-indium alloy strips without oil on the surfaces, wherein the weight percentage of tin and indium is as follows; 48% of tin and 52% of indium; the thickness of the tin-indium alloy strip is 0.05mm, and the width of the tin-indium alloy strip is consistent with that of the copper strip.
Step two: firstly, the copper strip selected in the step one is pulled to pass through acetone, and then soaking, heating (the temperature of the acetone is 50 ℃) and ultrasonic treatment are carried out, and then hot air drying is carried out. And then drawing the copper strip brazing filler metal to pass through a stainless steel groove filled with the liquid medium-activity scaling powder at a constant speed, wherein the drawing speed is 50 m/min. The medium active soldering flux is a cleaning-free and residue-free soldering flux, and the main components of the soldering flux are isopropanol, glycerol, ethylene glycol monobutyl ether, brominated salicylic acid, hydrogenated rosin, glycerol and water, and the weight percentage ratio of the soldering flux is 15: 10: 1: 1: 5: 0.5: and the balance.
Step three: and (3) selecting a tin-based alloy strip selected in the step one and a copper strip obtained in the step two, respectively attaching the two brazing filler metal strips to the copper strip from top to bottom, passing through a pair of rollers with proper gaps (the gap is 0.05mm smaller than the sum of the thicknesses of the two tin-based alloy strips and the copper strip), limiting the strip direction by a movable clamping groove, and controlling the traction speed to be 50 m/min.
Step four: and (4) enabling the composite strip obtained in the third step to quickly and horizontally pass through a red copper high-frequency welding ring of a high-frequency welding machine, wherein the traction speed is 50m/min, and the current frequency is 50 KHz.
Step five: and (4) after the composite strip obtained in the fourth step is solidified by wind, taking up and re-winding the composite strip for upper shaft, thus preparing the composite strip, wherein the traction speed is 50 m/min.
Step six: and D, tightly winding and packaging the composite strip obtained in the fifth step by adopting a single wire and a single disc.
Example 2
The composite material of the tin-based alloy and the copper strip is characterized in that the copper strip is selected to be oxygen-free copper, the tin-based alloy is tin-bismuth alloy, and the weight percentage of tin and bismuth is as follows; 42% of tin and 58% of bismuth; the thickness of the tin-bismuth alloy strip is 0.1 mm.
The traction speed is 30m/min, and the current frequency is 60 KHz. The rest was the same as in example 1.
Example 3
Selecting a copper strip as oxygen-free copper, and selecting a tin-based alloy as a tin-lead-silver alloy, wherein the weight percentages of tin, lead and silver are as follows; 62% of tin, 36% of lead and 2% of silver; the thickness of the tin-lead-silver alloy strip is 0.02 mm.
The traction speed is 15m/min, and the current frequency is 60 KHz. The rest was the same as in example 1.
Example 4
The composite material of the tin-based alloy and the copper strip is characterized in that the copper strip is selected to be oxygen-free copper, the tin-based alloy is tin-silver alloy, and the weight percentage of tin and silver is as follows; 96% of tin and 4% of silver; the thickness of the tin-indium alloy strip is 0.03 mm.
The traction speed is 10m/min, and the current frequency is 100 KHz. The rest was the same as in example 1.
Example 5
Selecting a copper strip as oxygen-free copper, and selecting a tin-based alloy as a tin-silver-copper alloy, wherein the weight percentages of tin, silver and copper are as follows; 96.5% of tin, 3% of silver and 0.5% of copper; the thickness of the tin-silver-copper alloy strip is 0.03 mm.
The traction speed is 10m/min, and the current frequency is 100 KHz.
Example 6
Selecting a copper strip as oxygen-free copper, and selecting a tin-based alloy as a tin-antimony alloy, wherein the weight percentage of tin and antimony is; 95% of tin and 5% of antimony; the thickness of the tin-antimony alloy strip is 0.08 mm.
The traction speed is 5m/min, and the current frequency is 100 KHz. The rest was the same as in example 1.
The tin-based alloy and copper strip composites prepared in examples 1-6 were subjected to coating thickness measurement, melting temperature, and brazing temperature, and the results are shown in table 1.
TABLE 1 test Performance of tin-based alloy and copper strip composites prepared in examples 1-6
The tin-based alloy and copper strip composite material prepared by the method has the characteristics of no solder leakage and tin nodule defects, good conductivity, strong weldability, good corrosion resistance, good oxidation resistance, firm plating layer and the like, is mainly used in the electronic industry fields of electronic components, hybrid integrated circuits, solar photovoltaic components and the like, and has wide market prospect.
In the above embodiments, only some embodiments of the tin-based alloy and copper strip composite material and the preparation method thereof are mentioned, and in the above technical solution of the present invention: the components of the coating can be freely selected within the specified ranges, and are not listed here, so the technical solutions included in the above description should be regarded as illustrative rather than limiting the scope of the present invention.
Claims (5)
1. A tin-based alloy and copper strip composite material is characterized in that: the copper-clad plate is composed of a core material and a cladding layer wrapped on the surface of the core material, wherein the core material is a copper strip, the cladding layer is a tin-based alloy, and the thickness of the single-side cladding layer is 20-100 micrometers; the copper strip is made of oxygen-free copper, and the purity of the oxygen-free copper is higher than 99.99 w%; the tin-based alloy is a tin-indium alloy, a tin-bismuth alloy, a tin-silver-copper alloy or a tin-antimony alloy; the weight percentage of tin and indium in the tin-indium alloy is 45-50% of tin and 50-55% of indium; the weight percentages of tin and bismuth in the tin-bismuth alloy are 50-70% of tin and 30-50% of bismuth; the weight percentage of tin and silver in the tin-silver alloy is 97-95% of tin and 3-5% of silver; the weight percentages of tin, silver and copper in the tin-silver-copper alloy are 97-95% of tin, 2.8-4% of silver and 0.2-1% of copper; the weight percentage of tin and antimony in the tin-antimony alloy is that tin is 90-95%, and antimony is 5-10%;
the preparation method of the composite material comprises the following steps:
(1) selecting a copper strip and two tin-based alloy strips, wherein the thickness of the tin-based alloy strips is the thickness of a required coating, and the width of the tin-based alloy strips is the same as that of the copper strip;
(2) firstly, drawing the copper strip in the step (1) through acetone, soaking, heating and ultrasonically treating, and drying by hot air; then drawing the copper strip to pass through a stainless steel groove containing liquid medium-activity scaling powder at a constant speed; two tin-based alloy strips are tightly attached to the copper strip, and the surfaces of the tin-based alloy strips are flat without wrinkles and bulges;
(3) respectively attaching two tin-based alloy strips to copper strips up and down, passing through a pair of rollers, and limiting the directions of the strips by a movable clamping groove;
(4) horizontally passing the composite strip obtained in the step (3) through a red copper high-frequency welding ring of a high-frequency welding machine;
(5) after air cooling and solidification are carried out on the composite strip obtained in the step (4), a take-up and rewinding upper shaft is carried out, and then the composite strip can be prepared;
(6) and (6) tightly winding and packaging the composite strip obtained in the step (5) by adopting a single wire and a single disc.
2. The tin-based alloy and copper strip composite material of claim 1, wherein: the tin-based alloy is SnIn52, SnBi58, SnAg4, Sn-3Ag-0.5Cu or SnSb 5.
3. The method of making a tin-based alloy and copper strip composite as claimed in claim 1 or 2, comprising the steps of:
(1) selecting a copper strip and two tin-based alloy strips, wherein the thickness of the tin-based alloy strip is the thickness of a required coating, and the width of the tin-based alloy strip is the same as that of the copper strip;
(2) firstly, drawing the copper strip in the step (1) through acetone, soaking, heating and ultrasonically treating, and drying by hot air; then drawing the copper strip to pass through a stainless steel groove containing liquid medium-activity scaling powder at a constant speed; two tin-based alloy strips are tightly attached to the copper strip, and the surfaces of the tin-based alloy strips are smooth and have no wrinkles or bulges;
(3) respectively attaching two tin-based alloy strips to copper strips up and down, passing through a pair of rollers, and limiting the directions of the strips by a movable clamping groove;
(4) horizontally passing the composite strip obtained in the step (3) through a red copper high-frequency welding ring of a high-frequency welding machine;
(5) after air cooling and solidification are carried out on the composite strip obtained in the step (4), a take-up and rewinding upper shaft is carried out, and then the composite strip can be prepared;
(6) and (6) tightly winding and packaging the composite strip obtained in the step (5) by adopting a single wire and a single disc.
4. The method of claim 3, wherein the tin-based alloy and copper strip composite material comprises: in the whole preparation process, the traction speed of the copper strip is 5-50 m/min.
5. The method for preparing the tin-based alloy and copper strip composite material as claimed in claim 3, wherein the method comprises the following steps: the current frequency of the red copper high-frequency welding ring of the high-frequency welding machine is 50-100 KHz.
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