CN108620764B - Soldering paste for low-temperature soldering and preparation method thereof - Google Patents
Soldering paste for low-temperature soldering and preparation method thereof Download PDFInfo
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- CN108620764B CN108620764B CN201710183759.1A CN201710183759A CN108620764B CN 108620764 B CN108620764 B CN 108620764B CN 201710183759 A CN201710183759 A CN 201710183759A CN 108620764 B CN108620764 B CN 108620764B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
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- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering paste for low-temperature soft soldering, wherein the soldering temperature of the soldering paste is less than or equal to 180 ℃, the soldering paste comprises solder and soldering flux, the solder is 60-80% and the soldering flux is 20-40% according to the total weight percentage of the soldering paste, the solder is metal powder with the melting point lower than 180 ℃, the metal powder comprises at least one of single metal powder and alloy powder, and the soldering flux comprises the following components in percentage by weight: 40-50% of assistant formed by combining organic amine and amino alcohol, 45-50% of alcohol assistant and 5-10% of halogen salt assistant. The invention has proper viscosity and rheological property, is easy to coat on the parts needing to be connected, has stable paste body, is not easy to settle and delaminate, has strong corrosion resistance of a soldered joint, isolates air during welding, and avoids the secondary oxidation of aluminum with an oxide layer removed by oxygen in the air or the reaction with water vapor; the vast majority of soldering flux can evaporate or sublimate, avoids remaining the corruption of soldering flux to aluminium foil and chip, and aluminium antenna and chip pin welding when specially adapted RFID aluminium antenna welding or paste dress chip on the aluminium antenna.
Description
Technical Field
The invention belongs to the technical field of soldering paste for soft soldering and preparation thereof, and particularly relates to soldering paste for low-temperature soft lead soldering, which is particularly suitable for soldering an RFID aluminum antenna or soldering an aluminum antenna and a chip pin when a chip is attached to the aluminum antenna.
Background
Brazing is a common method for connecting aluminum and copper in electronic technology, and is generally divided into brazing and soldering: the brazing temperature of 450 ℃ is taken as a boundary, the process higher than the temperature is called brazing, and the process lower than the temperature is called soldering, wherein the brazing has larger limitation in the connecting process of certain products of electronics and electrical appliances due to the higher process temperature; the soldering temperature of soldering is low, and the heat influence on the product in the soldering process is small. It is especially suitable for connecting some products of electronic and electric appliances. The soldering paste is prepared by mixing soldering flux and solder alloy powder, and is a common solder-soldering flux combination.
In the fields of FPC (printed circuit board) and RFID (high frequency identification) high-frequency antenna, the layer where the circuit is located is aluminum and aluminum alloy, but a layer of compact oxide film is covered on the surface of the aluminum and the aluminum alloy, so that the aluminum and the aluminum alloy are very stable and difficult to remove, and therefore how to efficiently and reliably connect the aluminum and the aluminum alloy with other metal devices is a great obstacle in the brazing process.
Particularly in the field of RFID industry, the bridging connection of a high-frequency aluminum foil antenna adopts stamping riveting or silver paste printing, and the bending resistance, the electrical property reliability and the weather resistance of a product can not be ensured all the time. At present, more than 90% of RFID tag antennas are manufactured by using aluminum foils, and regardless of whether the high-frequency aluminum antennas or the ultrahigh-frequency aluminum antennas of the RFID are all connected with the chip and the antennas by adopting anisotropic conductive adhesive (ACP adhesive) when the chip is mounted, the impedance of the connection mode cannot be ensured, the connection mode is easy to lose efficacy particularly in a high-temperature and high-humidity environment, and the finished tags have short service life and cannot meet the requirements of long-term and high-reliability use occasions such as anti-counterfeiting of artworks and collection products, bank cards, identity cards and the like.
The traditional welding of aluminum materials and aluminum foils needs to be carried out at high temperature by using special scaling powder and special welding wires. The high temperature of soldering will deform, melt or burn out the non-metallic substrate of the antenna, and the current semiconductor chip cannot bear the high temperature of soldering. Although some welding wires can weld aluminum at a slightly lower temperature with other fluxes, the welding wires are not suitable for welding between an aluminum foil and an aluminum foil of the RFID and between the aluminum foil and a chip.
The soldering paste for soft soldering in the prior art has the soldering temperature higher than 450 ℃, and belongs to the field of brazing. In the field of soldering, mainly a solder wire and a soldering flux are used, and a soldering paste for low-temperature (100-.
In order to solve the requirements of the RFID aluminum antenna welding and the chip mounting, the inventor of the present invention actively researches and innovates to create a solder paste for low temperature soldering.
Disclosure of Invention
The invention mainly solves the technical problem of providing the soldering paste for low-temperature soldering, the soldering flux is viscous liquid with high activity and strong oxide film removing capability, firstly, volatile halogen salt in the soldering flux can generate pitting corrosion on an oxide layer of an aluminum foil to damage an aluminum oxide protective layer, and then an auxiliary agent formed by combining organic amine and amino alcohol is used for dissolving the aluminum oxide layer; the soldering paste prepared by mixing the soldering flux and the solder metal powder has proper viscosity and rheological property, is easy to coat on parts needing to be connected, has the characteristics of stable paste body, difficult sedimentation and delamination in the storage process and strong corrosion resistance of a soldered joint, and simultaneously isolates air in welding to avoid secondary oxidation of aluminum for removing an oxide layer by oxygen in the air or reaction with water vapor; most of the soldering flux comprises halogen salt, is evaporated or sublimated during welding, avoids the corrosion of the residual soldering flux on an antenna aluminum foil and a chip, and is particularly suitable for the welding of an RFID aluminum antenna and the welding of the aluminum antenna and a chip pin during the chip mounting on the aluminum antenna.
In order to solve the technical problems, the invention adopts a technical scheme that:
the invention provides a soldering paste for low-temperature soldering, wherein the soldering temperature of the soldering paste is less than or equal to 180 ℃, the soldering paste comprises solder and soldering flux, the soldering paste comprises 60-80% of the solder and 20-40% of the soldering flux by total weight percentage, the solder is metal powder with the melting point lower than 180 ℃, the metal powder comprises at least one of single metal powder and alloy powder, and the soldering flux comprises the following components in percentage by weight: 40-50% of assistant formed by combining organic amine and amino alcohol, 45-50% of alcohol assistant and 5-10% of halogen salt assistant.
The halogen salt auxiliary agent is at least one of fluorine-containing halogen salt, chlorine-containing halogen salt and fluorine-containing borate.
Further, the halogen salt assistant is at least one of ammonium fluoride, ammonium bifluoride, ammonium fluoroborate, stannous fluoroborate, zinc chloride and ammonium zinc chloride.
Further, the solder paste is a paste prepared by mixing the solder and the soldering flux.
Furthermore, the solder paste also comprises a corrosion inhibitor, and the corrosion inhibitor accounts for 0-2% of the total weight of the solder paste.
Further, the single metal powder is selected from at least one of bismuth, indium and gallium, the alloy powder is selected from at least one of powders made of at least two alloys of tin, bismuth, silver, zinc, indium and gallium, and the diameters of the single metal powder and the alloy powder are both 20-30 μm.
Further, the metal powder comprises the following raw materials in percentage by weight: 0-9% of zinc, 0-10% of silver, 0-78% of tin, 0-98% of indium, 0-67% of bismuth and 0-12% of gallium.
Furthermore, the melting point of the alloy powder is between 80 and 178 ℃, and the alloy powder is a tin-bismuth alloy, a tin-bismuth-silver alloy, a tin-indium-zinc alloy, a tin-indium-bismuth-silver alloy, a tin-indium-bismuth alloy, a tin-bismuth-indium-zinc alloy, an indium-silver alloy or an indium-gallium alloy.
Further, the tin-bismuth alloy comprises the following raw materials in percentage by weight: 40-44% of tin and 56-60% of bismuth; the tin-indium alloy comprises the following raw materials in percentage by weight: 46-50% of tin and 50-54% of indium; the tin-bismuth-silver alloy comprises the following raw materials in percentage by weight: 38-43% of tin, 56-60% of bismuth and 1-2% of silver; the tin-indium-bismuth alloy comprises the following raw materials in percentage by weight: 17-21% of tin, 23-25% of indium and 56-58% of bismuth; the tin-bismuth-indium-zinc alloy comprises the following raw materials in percentage by weight: 8-13% of tin, 22-27% of indium, 57-60% of bismuth and 3-5% of zinc; the indium-silver alloy comprises the following raw materials in percentage by weight: 90-92% of indium and 8-10% of silver; the indium-gallium alloy comprises the following raw materials in percentage by weight: 88-91% of indium and 9-12% of gallium.
Further, the organic amine is at least one of ethanolamine, triethanolamine, triethylene tetramine, isopropanolamine, diglycolamine, dihydroxyethylmethylamine and cyclohexylamine; the amino alcohol is at least one of 2-amino-2-methyl-1-propanol, 2-amino-2-ethyl-1, 3-propanediol, 2-dimethylamino-2-methyl-1-propanol and 2-amino-2-methyl-1, 3-propanediol.
Further, the alcohol auxiliary agent is at least one of propylene glycol, isopropanol, n-propanol, n-butanol, polyethylene glycol, ethylene glycol, ethanol and glycerol.
Furthermore, the low-temperature soldering paste is soldering paste for welding the RFID aluminum antenna or soldering paste for welding the aluminum antenna and the chip pin when the chip is attached to the aluminum antenna.
The invention also provides a preparation method of the soldering paste for low-temperature soldering, which comprises the following steps:
the method comprises the following steps: adding the alcohol auxiliary agent into a reaction kettle according to the proportion, stirring and fully mixing;
step two: adding an auxiliary agent formed by combining organic amine and amino alcohol into a reaction kettle according to a ratio, and stirring and mixing the auxiliary agent and the alcohol auxiliary agent together;
step three: adding the halogen salt auxiliary agent into a reaction kettle according to the proportion and fully stirring;
step four: adding the solder into the reaction kettle according to the proportion, and stirring the solder and the other components together to obtain semi-finished soldering paste;
step five: defoaming the fully mixed semi-finished soldering paste by using a vacuum defoaming machine to obtain a finished soldering paste;
step six: filling the finished product of soldering paste into the needle tube by using a filling and sealing machine, and sealing the needle tube by using a plastic bag in vacuum for later use.
The invention has the beneficial effects that: the soldering flux is a viscous liquid with high activity and strong oxide film removing capability, firstly, volatile halogen salt in the soldering flux can generate pitting corrosion on an oxide layer of an aluminum foil to break an aluminum oxide protective layer, and then the aluminum oxide layer is dissolved by the compound soldering flux of organic amine and amino alcohol; the soldering paste prepared by the soldering flux and the solder metal powder has proper viscosity and rheological property, is easy to coat on parts needing to be connected, and has the characteristics of stable paste body, difficult sedimentation and delamination in the storage process and strong corrosion resistance of a soldered joint; meanwhile, air is isolated in welding, so that the aluminum with the oxide layer removed is prevented from being secondarily oxidized by oxygen in the air or reacting with water vapor;
more preferably, the boiling point of the azeotrope formed by the compounding auxiliary agent of the organic amine and the amino alcohol is close to or lower than the soldering temperature of the soldering paste, and the azeotrope is totally or partially volatilized in the heating soldering process, and because the volatilization, sublimation or decomposition temperature of the halogen salt is close to or lower than the soldering temperature of the soldering paste, the halogen ions penetrate and damage the oxide layer of the aluminum in the soldering process, and the halogen salt which does not participate in the reaction volatilizes, sublimates or decomposes along with the heating soldering; most of the soldering flux including halogen salt is evaporated or sublimated during soldering, so that the corrosion of residual soldering flux on the antenna aluminum foil and the chip is avoided;
more particularly, the welding temperature of the soldering paste is less than or equal to 180 ℃, the welding flux is metal powder with the melting point lower than 180 ℃, and the welding temperature can be lower than 100 ℃, so that low-temperature welding is realized, the risk of deformation, melting or burning of a non-metal substrate of the aluminum foil antenna is completely avoided, and the aluminum foil antenna is particularly suitable for welding the RFID aluminum antenna or welding the aluminum antenna and a chip pin when a chip is attached to the aluminum antenna.
The foregoing is a summary of the present invention, and in order to provide a clear understanding of the technical means of the present invention and to be implemented in accordance with the present specification, the following is a detailed description of the preferred embodiments of the present invention.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and the present invention will be described in detail with reference to the accompanying drawings. The invention may be embodied in other different forms, i.e. it is capable of various modifications and changes without departing from the scope of the invention as disclosed.
Example (b): a soldering paste for low-temperature soldering, the soldering temperature of the soldering paste is less than or equal to 180 ℃, the soldering paste comprises solder and soldering flux, according to the total weight percentage of the soldering paste, the solder is 60-80%, the soldering flux is 20-40%, the solder is metal powder with the melting point lower than 180 ℃, the metal powder comprises at least one of single metal powder and alloy powder, and the soldering flux comprises the following components in percentage by weight: 40-50% of assistant formed by combining organic amine and amino alcohol, 45-50% of alcohol assistant and 5-10% of halogen salt assistant.
One embodiment of the solder paste is: 79% of solder and 21% of soldering flux; another embodiment of the solder paste is 60% solder and 40% flux; yet another embodiment of the solder paste is 70% solder and 30% flux.
One embodiment of the soldering flux is as follows: 40% of assistant formed by combining organic amine and amino alcohol, 50% of alcohol assistant and 10% of halogen salt assistant; another embodiment of the flux is: 50% of an auxiliary agent formed by combining organic amine and amino alcohol, 45% of an alcohol auxiliary agent and 5% of a halogen salt auxiliary agent; yet another embodiment of the flux is: 45% of assistant formed by combining organic amine and amino alcohol, 48% of alcohol assistant and 7% of halogen salt assistant.
The halogen salt auxiliary agent is at least one of fluorine-containing halogen salt, chlorine-containing halogen salt and fluorine-containing borate.
Preferably, the halogen salt assistant is at least one of ammonium fluoride, ammonium bifluoride, ammonium fluoroborate, stannous fluoroborate, zinc chloride and ammonium zinc chloride.
One example of the halogen salt adjuvant is: the halogen salt auxiliary agent comprises the following raw materials in parts by weight: 40% of ammonium fluoride and 60% of ammonium fluoroborate.
The soldering paste is a paste prepared by the solder and the soldering flux.
The soldering paste also comprises a corrosion inhibitor, and the corrosion inhibitor accounts for 0-2% of the total weight of the soldering paste.
The single metal powder is selected from at least one of bismuth, indium and gallium, the alloy powder is selected from at least one of powder prepared by melting at least two alloys of tin, bismuth, silver, zinc, indium and gallium, and the diameters of the single metal powder and the alloy powder are both 20-30 μm.
The metal powder comprises the following raw materials in percentage by weight: 0-9% of zinc, 0-10% of silver, 0-78% of tin, 0-98% of indium, 0-67% of bismuth and 0-12% of gallium.
Preferably, the melting point of the alloy powder is between 80 and 178 ℃, and the alloy powder is a tin-bismuth alloy, a tin-bismuth-silver alloy, a tin-indium-zinc alloy, a tin-indium-bismuth-silver alloy, a tin-indium alloy, a tin-bismuth alloy, a tin-bismuth-indium-zinc alloy, an indium-silver alloy or an indium-gallium alloy.
Preferably, the tin-bismuth alloy comprises the following raw materials in percentage by weight: 40-44% of tin and 56-60% of bismuth;
the tin-indium alloy comprises the following raw materials in percentage by weight: 46-50% of tin and 50-54% of indium;
the tin-bismuth-silver alloy comprises the following raw materials in percentage by weight: 38-43% of tin, 56-60% of bismuth and 1-2% of silver;
the tin-indium-bismuth alloy comprises the following raw materials in percentage by weight: 17-21% of tin, 23-25% of indium and 56-58% of bismuth;
the tin-bismuth-indium-zinc alloy comprises the following raw materials in percentage by weight: 8-13% of tin, 22-27% of indium, 57-60% of bismuth and 3-5% of zinc;
the indium-silver alloy comprises the following raw materials in percentage by weight: 90-92% of indium and 8-10% of silver;
the indium-gallium alloy comprises the following raw materials in percentage by weight: 88-91% of indium and 9-12% of gallium.
Examples of the alloy powder are:
the tin-bismuth alloy comprises the following raw materials in percentage by weight: 40% of tin and 60% of bismuth;
the tin-indium alloy comprises the following raw materials in percentage by weight: 50% of tin and 50% of indium;
the tin-bismuth-silver alloy comprises the following raw materials in percentage by weight: 40% of tin, 58% of bismuth and 2% of silver;
the tin-indium-bismuth alloy comprises the following raw materials in percentage by weight: 19% of tin, 23% of indium and 58% of bismuth;
the tin-bismuth-indium-zinc alloy comprises the following raw materials in percentage by weight: 10% of tin, 25% of indium, 60% of bismuth and 5% of zinc;
the indium-silver alloy comprises the following raw materials in percentage by weight: 90% of indium and 10% of silver;
the indium-gallium alloy comprises the following raw materials in percentage by weight: 88% indium and 12% gallium.
The organic amine is at least one of ethanolamine, triethanolamine, triethylene tetramine, isopropanolamine, diglycolamine, dihydroxyethylmethylamine and cyclohexylamine; the amino alcohol is at least one of 2-amino-2-methyl-1-propanol, 2-amino-2-ethyl-1, 3-propanediol, 2-dimethylamino-2-methyl-1-propanol and 2-amino-2-methyl-1, 3-propanediol.
An example of the adjuvant comprising the combination of the organic amine and the amino alcohol is: the assistant formed by combining organic amine and amino alcohol comprises the following raw materials in percentage by weight: ethanolamine 20%, isopropanolamine 25%, triethanolamine 5%, diglycolamine 10%, 2-amino-2-methyl-1-propanol 20%, 2-amino-2-ethyl-1, 3-propanediol 10%, and 2-amino-2-methyl-1, 3-propanediol 10%.
In this embodiment, the alcohol auxiliary agent is at least one of propylene glycol, isopropyl alcohol, n-propyl alcohol, n-butyl alcohol, polyethylene glycol, ethylene glycol, ethanol, and glycerol.
One example of the alcohol auxiliary agent is: the alcohol auxiliary agent comprises the following raw materials in percentage by weight: 25% of isopropanol, 20% of n-propanol, 45% of polyethylene glycol and 10% of propylene glycol.
The boiling point of the assistant formed by combining the organic amine and the amino alcohol is lower than the soldering temperature of the soldering paste, the organic amine can be an organic amine modified product, and the amino alcohol can be an amino alcohol modified product.
The low-temperature soldering paste is soldering paste for welding the RFID aluminum antenna or soldering paste for welding the aluminum antenna and the chip pin when the chip is attached to the aluminum antenna.
The invention also provides a preparation method of the soldering paste for low-temperature soldering, which comprises the following steps:
the method comprises the following steps: adding the alcohol auxiliary agent into a reaction kettle according to the proportion, stirring and fully mixing;
step two: adding an auxiliary agent formed by combining organic amine and amino alcohol into a reaction kettle according to a ratio, and stirring and mixing the auxiliary agent and the alcohol auxiliary agent together;
step three: adding the halogen salt auxiliary agent into a reaction kettle according to the proportion and fully stirring;
step four: adding the solder into the reaction kettle according to the proportion, and stirring the solder and the other components together to obtain semi-finished soldering paste;
step five: defoaming the fully mixed semi-finished soldering paste by using a vacuum defoaming machine to obtain a finished soldering paste;
step six: filling the finished product of soldering paste into the needle tube by using a filling and sealing machine, and sealing the needle tube by using a plastic bag in vacuum for later use.
The working principle and the working process of the invention are as follows:
the soldering flux is a viscous liquid with high activity and strong oxide film removing capability, firstly, volatile halogen salt in the viscous liquid can generate pitting corrosion on an oxide layer of an aluminum foil to damage an aluminum oxide protective layer, and then the aluminum oxide layer is dissolved by an auxiliary agent formed by combining organic amine and amino alcohol; the soldering paste prepared by mixing the soldering flux and the solder metal powder has proper viscosity and rheological property, is easy to coat on parts needing to be connected, has the characteristics of stable paste body, difficult sedimentation and delamination in the storage process and strong corrosion resistance of a soldered joint, and simultaneously isolates air in welding to avoid secondary oxidation of aluminum for removing an oxide layer by oxygen in the air or reaction with water vapor; most of the soldering flux comprises halogen salt, is evaporated or sublimated during welding, avoids the corrosion of the residual soldering flux on an antenna aluminum foil and a chip, and is particularly suitable for the welding of an RFID aluminum antenna and the welding of the aluminum antenna and a chip pin during the chip mounting on the aluminum antenna.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (7)
1. A solder paste for low-temperature soldering, characterized in that: the soldering temperature of the soldering paste is less than or equal to 180 ℃, the soldering paste comprises solder and soldering flux, the solder accounts for 60-80% of the total weight of the soldering paste, the soldering flux accounts for 20-40%, the solder is metal powder with a melting point lower than 180 ℃, the metal powder comprises single metal powder, or the metal powder comprises single metal powder and alloy powder, and the soldering flux comprises the following components in percentage by weight: 40-50% of assistant formed by organic amine and amino alcohol, 45-50% of alcohol assistant and 5-10% of halogen salt assistant;
the soldering paste also comprises a corrosion inhibitor, and accounts for 0-2% of the total weight of the soldering paste;
the single metal powder is selected from at least one of bismuth, indium and gallium;
the diameters of the single metal powder and the alloy powder are both 20-30 μm;
the melting point of the alloy powder is between 80 and 178 ℃;
the alloy powder is a tin-bismuth alloy, a tin-bismuth-silver alloy, a tin-indium-zinc alloy, a tin-indium-bismuth-silver alloy, a tin-indium-bismuth alloy, a tin-bismuth-indium-zinc alloy, an indium-silver alloy or an indium-gallium alloy;
the boiling point of an azeotrope formed by the compounding auxiliary agent of the organic amine and the amino alcohol is close to or lower than the soldering temperature of the soldering paste.
2. The solder paste for low-temperature soldering according to claim 1, wherein: the halogen salt auxiliary agent is at least one of fluorine-containing halogen salt, chlorine-containing halogen salt and fluorine-containing borate.
3. The solder paste for low-temperature soldering according to claim 1, wherein: the metal powder comprises the following raw materials in percentage by weight: 0-9% of zinc, 0-10% of silver, 0-78% of tin, 0-98% of indium, 0-67% of bismuth and 0-12% of gallium.
4. The solder paste for low-temperature soldering according to claim 1, wherein: the tin-bismuth alloy comprises the following raw materials in percentage by weight: 40-44% of tin and 56-60% of bismuth; the tin-indium alloy comprises the following raw materials in percentage by weight: 46-50% of tin and 50-54% of indium; the tin-bismuth-silver alloy comprises the following raw materials in percentage by weight: 38-43% of tin, 56-60% of bismuth and 1-2% of silver; the tin-indium-bismuth alloy comprises the following raw materials in percentage by weight: 17-21% of tin, 23-25% of indium and 56-58% of bismuth; the tin-bismuth-indium-zinc alloy comprises the following raw materials in percentage by weight: 8-13% of tin, 22-27% of indium, 57-60% of bismuth and 3-5% of zinc; the indium-silver alloy comprises the following raw materials in percentage by weight: 90-92% of indium and 8-10% of silver; the indium-gallium alloy comprises the following raw materials in percentage by weight: 88-91% of indium and 9-12% of gallium.
5. The solder paste for low-temperature soldering according to claim 1, wherein: the organic amine is at least one of ethanolamine, triethanolamine, triethylene tetramine, isopropanolamine, diglycolamine, dihydroxyethylmethylamine and cyclohexylamine; the amino alcohol is at least one of 2-amino-2-methyl-1-propanol, 2-amino-2-ethyl-1, 3-propanediol, 2-dimethylamino-2-methyl-1-propanol and 2-amino-2-methyl-1, 3-propanediol.
6. The solder paste for low-temperature soldering according to claim 1, wherein: the halogen salt auxiliary agent is at least one of ammonium fluoride, ammonium bifluoride, ammonium fluoroborate, stannous fluoroborate, zinc chloride and ammonium zinc chloride.
7. A method for producing a solder paste for low-temperature soldering according to claim 1, characterized in that: the method comprises the following steps:
the method comprises the following steps: adding the alcohol auxiliary agent into a reaction kettle according to the proportion, stirring and fully mixing;
step two: adding an auxiliary agent formed by combining organic amine and amino alcohol into a reaction kettle according to a ratio, and stirring and mixing the auxiliary agent and the alcohol auxiliary agent together;
step three: adding the halogen salt auxiliary agent into a reaction kettle according to the proportion and fully stirring;
step four: adding the solder into the reaction kettle according to the proportion, and stirring the solder and the other components together to obtain semi-finished soldering paste;
step five: defoaming the fully mixed semi-finished soldering paste by using a vacuum defoaming machine to obtain a finished soldering paste;
step six: filling the finished product of soldering paste into the needle tube by using a filling and sealing machine, and sealing the needle tube by using a plastic bag in vacuum for later use.
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| CN109509571B (en) * | 2018-11-19 | 2022-07-26 | 北京有色金属与稀土应用研究所 | Tin-based alloy and copper strip composite material and preparation method thereof |
| CN109834405B (en) * | 2019-03-22 | 2022-04-26 | 杨小荣 | Solder paste without electrochemical corrosion, preparation method and application thereof |
| CN109967811B (en) * | 2019-03-22 | 2022-04-26 | 杨小荣 | LED lamp manufactured by using aluminum foil circuit board and manufacturing method thereof |
| CN111534282A (en) * | 2019-12-16 | 2020-08-14 | 有研工程技术研究院有限公司 | Phase-change heat storage material with low melting point and high volume latent heat, and preparation method and application thereof |
| CN111037135A (en) * | 2019-12-19 | 2020-04-21 | 中国电子科技集团公司第十八研究所 | Welding method of beryllium and stainless steel and welding method of beryllium window and stainless steel window |
| CN115476015A (en) * | 2022-11-01 | 2022-12-16 | 成都科力深传感技术有限公司 | Brazing filler metal laying method |
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