CN108620764A - Low temperature solder connects with soldering paste and preparation method - Google Patents
Low temperature solder connects with soldering paste and preparation method Download PDFInfo
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- CN108620764A CN108620764A CN201710183759.1A CN201710183759A CN108620764A CN 108620764 A CN108620764 A CN 108620764A CN 201710183759 A CN201710183759 A CN 201710183759A CN 108620764 A CN108620764 A CN 108620764A
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- soldering paste
- indium
- tin
- alloy
- bismuth
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
- B23K35/3603—Halide salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of low temperature solders to connect with soldering paste, the welding temperature of soldering paste is less than or equal to 180 DEG C, soldering paste includes solder and scaling powder, according to the total weight percent meter of soldering paste, wherein solder is 60 80%, and scaling powder is 20 40%, and solder is the metal powder that fusing point is less than 180 DEG C, metal powder includes at least one of monometallic powder and alloy powder, includes by weight in scaling powder：Auxiliary agent 40 50%, alcohol analog assistant 45 50% and the halogen salt assitant 5 10% that organic amine is composed with amino alcohol.The present invention has viscosity appropriate and rheological characteristic, is easily coated in the position for needing to connect, and lotion is stablized, free settling is not layered, the corrosion resistance of soldered fitting is strong, and the air-isolation in welding, avoid the aluminium of removing oxide layer by air oxygen secondary oxidation or react with vapor；The scaling powder of the overwhelming majority can be evaporated or be distilled, and avoid corrosion of the residual flux to aluminium foil and chip, especially suitable for aluminum antenna is welded with chip pin when pasting chip on the welding of RFID aluminum antennas or aluminum antenna.
Description
Technical field
It connects the invention belongs to solder and is welded with soldering paste and its preparing technical field, more particularly to a kind of low temperature refined lead that is used for
With soldering paste, especially suitable for aluminum antenna is welded with chip pin when pasting chip on the welding of RFID aluminum antennas or aluminum antenna.
Background technology
Soldering be the common methods of the connection of aluminium-aluminium, Solder for Al-Cu Joint Welding connection are generally divided into electronics manufacturing engineering solder brazing and
Two class of solder：Using 450 DEG C of brazing temperature as boundary, the technique higher than this temperature is known as solder brazing, then less than this temperature
Referred to as solder, wherein solder brazing since technological temperature is higher, used in electronics, the certain products of electric appliance Joining Technology in have compared with
Big limitation；The brazing temperature of solder is low, and brazing process is smaller to the heat affecting of product.Especially suitable for electronics, electric appliance
The connection of a little products.Soldering paste is modulated by scaling powder and soldering alloyed metal powder, is common solder-scaling powder combination.
In FPC (printed wiring board) and RFID (high frequency identification) high frequency antenna field, layer where circuit is aluminium and its alloy,
But aluminium and aluminum alloy surface cover one layer of fine and close oxidation film, very stable and more difficult removal, therefore, how to make aluminium and aluminium alloy and
Carried out between other metal devices efficiently, reliable connection, be obstacle larger on soldering processes.
Especially in RFID industrial fields, the bridging connection of high frequency aluminium foil antenna is printed using stamping riveting or silver paste,
Bending resistance, electrical property reliability, the weatherability of product can not ensure always.Make presently more than 90% RFID label antenna
It is manufactured with aluminium foil, the high frequency aluminum antenna or hyperfrequency aluminum antenna of either RFID are when pasting chip all using incorgruous
Conducting resinl (ACP glue) connects chip and antenna, and the impedance of this connection type can not ensure, especially in the bad border of high temperature and humidity
Lower to be easy failure, finished product label therefore do not grow by service life, cannot be satisfied such as the art work, the anti-fake of collectibles, bank card, identity
Long-term, the highly reliable use occasions such as card.
Traditional aluminium, aluminium foil welding need to weld in very high temperature and using dedicated scaling powder and dedicated welding wire
It connects.The non-metallic substrate for making antenna is deformed, melted or burnt out by the high temperature of welding, and current semiconductor chip can not also be born
The high temperature of welding.Although having some welding wires that can weld aluminium at slightly lower temperature under the cooperation of other solder flux, simultaneously
Be not suitable for the welding between RFID aluminium foils and aluminium foil, aluminium foil and chip.
The solder of the prior art connects with soldering paste, and brazing temperature is higher than 450 DEG C, belongs to solder brazing field.It is led in solder
Solder stick and scaling powder are mainly used in domain, are connect there is no low temperature (100-180 DEG C) solder and are used soldering paste.
In order to solve the needs of RFID aluminum antennas welding and chip attachment, the present inventor is actively subject to research and innovation, to
Prestige, which is founded a kind of low temperature solder and connect, uses soldering paste.
Invention content
The invention mainly solves the technical problem of providing a kind of low temperature solders to connect with soldering paste, and scaling powder of the invention is
The thick liquid that a kind of activity is high, deoxidation film ability is strong, volatility haloid therein first can be in the oxide layer of aluminium foil
It generates spot corrosion and breaks epoxidation aluminium protective layer, alumina layer is then dissolved by the auxiliary agent that organic amine and amino alcohol are composed；Help weldering
Soldering paste after agent is tuned into solder metal powders is easily coated on the position for needing to connect with viscosity appropriate and rheological characteristic,
Stablize with lotion, sedimentation layering, the strong feature of the corrosion resistance of soldered fitting is not susceptible to during storage, while welding
Middle air-isolation, avoid the aluminium of removing oxide layer by air oxygen secondary oxidation or react with vapor；The overwhelming majority
Scaling powder includes haloid, evaporates or distils when welding, avoids corruption of the residual flux to antenna aluminium foil and chip
Erosion, especially suitable for aluminum antenna is welded with chip pin when pasting chip on the welding of RFID aluminum antennas and aluminum antenna.
In order to solve the above technical problems, one aspect of the present invention is：
The present invention provides a kind of low temperature solders to connect with soldering paste, and the welding temperature of the soldering paste is less than or equal to 180 DEG C, institute
It includes solder and scaling powder to state soldering paste, according to the total weight percent meter of soldering paste, wherein the solder is 60-80%, it is described to help
Solder flux is 20-40%, and the solder is that fusing point is less than 180 DEG C of metal powder, the metal powder include monometallic powder and
At least one of alloy powder includes by weight in the scaling powder：The auxiliary agent 40- that organic amine is composed with amino alcohol
50%, alcohol analog assistant 45-50% and halogen salt assitant 5-10%.
It further says, the halogen salt assitant is for fluorine-containing haloid, the haloid containing chlorine and containing in borofluoride
It is at least one.
It further says, the halogen salt assitant is ammonium fluoride, ammonium acid fluoride, ammonium fluoroborate, stannous fluoboric acid, zinc chloride
At least one of with zinc ammonium chloride.
It further says, the soldering paste is the paste of the solder and scaling powder allotment.
It further says, the soldering paste further includes corrosion inhibiter, and accounts for the 0-2% of the soldering paste total weight.
It further says, the monometallic powder is selected from least one of bismuth, indium and gallium, and the alloy powder is selected from
At least one of powder made of at least two alloys in tin, bismuth, silver, zinc, indium and gallium, the monometallic powder and described
The diameter of alloy powder is all 20-30 μm.
It further says, the metal powder includes the raw material of following weight ratio：The zinc 0-9%, the silver 0-10%,
The tin 0-78%, the indium 0-98%, the bismuth 0-67% and the gallium 0-12%.
It further says, for the fusing point of the alloy powder between 80-178 DEG C, the alloy powder is sn-bi alloy, tin
Bismuth silver alloy, tin indium kirsite, tin indium bismuth alloy, tin indium bismuth silver alloy, tin-indium alloy, tin indium bismuth alloy, tin bismuth indium kirsite,
Indium silver alloy or indium gallium alloy.
It further says, the sn-bi alloy includes the raw material of following weight ratio：Tin 40-44% and bismuth 56-60%；It is described
Tin-indium alloy includes the raw material of following weight ratio：Tin 46-50% and indium 50-54%；The tin bismuth silver alloy includes following weight
The raw material of ratio：Tin 38-43%, bismuth 56-60% and silver 1-2%；The tin indium bismuth alloy includes the raw material of following weight ratio：Tin
17-21%, indium 23-25% and bismuth 56-58%；The tin bismuth indium kirsite includes the raw material of following weight ratio：Tin 8-13%, indium
22-27%, bismuth 57-60% and zinc 3-5%；The indium silver alloy includes the raw material of following weight ratio：Indium 90-92% and silver 8-
10%；The indium gallium alloy includes the raw material of following weight ratio：Indium 88-91% and gallium 9-12%.
Further say, the organic amine be ethanol amine, triethanolamine, triethylene tetramine, isopropanolamine, diglycolamine,
At least one of dihydroxy ethyl methylamine and cyclohexylamine；The amino alcohol is 2-amino-2-methyl-1-propanol, 2- amino -2- second
Base -1,3-PD, 2- dimethylamino -2- methyl-1s-at least one of propyl alcohol and 2- amino-2-methyl -1,3- propyl alcohol.
Further say, the alcohol analog assistant be propylene glycol, isopropanol, normal propyl alcohol, n-butanol, polyethylene glycol, ethylene glycol,
At least one of ethyl alcohol and glycerine.
It further says, when the low temperature solder cream is pasting chip on RFID aluminum antenna welding soldering paste or aluminum antenna
Aluminum antenna and chip pin welding soldering paste.
The present invention also provides a kind of low temperature solders to connect the preparation method with soldering paste, in accordance with the following steps into
Row：
Step 1：Alcohol analog assistant is added in reaction kettle according to the ratio and is stirred, is sufficiently mixed；
Step 2：The auxiliary agent for being according to the ratio composed organic amine and amino alcohol is added in reaction kettle together with alcohol analog assistant
It is stirred；
Step 3：Halogen salt assitant is added in reaction kettle according to the ratio and is sufficiently stirred；
Step 4：Solder is added in reaction kettle according to the ratio and stirs to get semi-finished product soldering paste together with above-mentioned other components；
Step 5：Semi-finished product soldering paste vacuum degasing machine deaeration after being sufficiently mixed is to get finished product soldering paste；
Step 6：Finished product soldering paste, which is filled to filling and sealing machine in needle tubing, uses poly-bag vacuum sealing spare.
The beneficial effects of the invention are as follows：The scaling powder of the present invention is the viscous fluid that a kind of activity is high, deoxidation film ability is strong
Body, first, volatility haloid therein can generate spot corrosion in the oxide layer of aluminium foil, break epoxidation aluminium protective layer, then by
The compounding scaling powder of organic amine and amino alcohol dissolves alumina layer；Soldering paste after being tuned into due to scaling powder and solder metal powders,
With viscosity appropriate and rheological characteristic, it is easily coated on the position for needing to connect, there is lotion to stablize, is not easy to send out during storage
Raw sedimentation layering, the strong feature of the corrosion resistance of soldered fitting；The air-isolation in welding simultaneously, avoids the aluminium of removing oxide layer
By in air oxygen secondary oxidation or react with vapor；
More preferably, the boiling point for the azeotropic mixture that the compound auxiliary of organic amine and amino alcohol is formed is near or below the weldering of soldering paste
Jointing temp, and completely or partially volatilize in heating welding process, and because volatilization, distillation or the decomposition temperature of haloid are close
Or the welding temperature less than soldering paste, in the welding process halide ion penetrate, destroy the oxide layer of aluminium, be not engaged in the halogen of reaction
Plain salt is volatilized, distils or is decomposed as heating is welded；I.e. most scaling powders includes that haloid steams when welding
Hair or distillation, avoid corrosion of the residual flux to antenna aluminium foil and chip；
It will be further appreciated that since the welding temperature of soldering paste is less than or equal to 180 DEG C, and solder is that fusing point is less than 180 DEG C
Metal powder, welding temperature can be down to 100 DEG C hereinafter, it is achieved that low-temperature welding, it is entirely avoided aluminium foil antenna
Non-metallic substrate deformation, the risk melting or burn out, especially suitable on the welding of RFID aluminum antennas or aluminum antenna when pasting chip
Aluminum antenna is welded with chip pin.
Above description is only the general introduction of technical solution of the present invention, in order to better understand the technical means of the present invention,
And can be implemented in accordance with the contents of the specification, it is described in detail as after with presently preferred embodiments of the present invention below.
Specific implementation mode
Illustrate that the specific implementation mode of the present invention, those skilled in the art can be by these below by way of particular specific embodiment
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, that is, under the scope of without departing substantially from disclosed, different modification and change can be given.
Embodiment：A kind of low temperature solder connects with soldering paste, and the welding temperature of the soldering paste is less than or equal to 180 DEG C, the weldering
Cream includes solder and scaling powder, according to the total weight percent meter of soldering paste, wherein the solder is 60-80%, the scaling powder
For 20-40%, the solder is the metal powder that fusing point is less than 180 DEG C, and the metal powder includes monometallic powder and alloy
At least one of powder includes by weight in the scaling powder：The auxiliary agent 40- that organic amine is composed with amino alcohol
50%, alcohol analog assistant 45-50% and halogen salt assitant 5-10%.
One embodiment of the soldering paste is：Solder is 79%, and the scaling powder is 21%；Another implementation of the soldering paste
It is 60% that example, which is solder, and the scaling powder is 40%；It is 70% that the another embodiment of the soldering paste, which is solder, and the scaling powder is
30%.
One embodiment of the scaling powder is：Auxiliary agent 40%, the alcohol analog assistant that organic amine is composed with amino alcohol
50% and halogen salt assitant 10%；Another embodiment of the scaling powder is：The auxiliary agent that organic amine is composed with amino alcohol
50%, alcohol analog assistant 45% and halogen salt assitant 5%；Another embodiment of the scaling powder is：Organic amine and amino alcohol group
Auxiliary agent 45%, alcohol analog assistant 48% and halogen salt assitant 7% made of conjunction.
The halogen salt assitant is fluorine-containing haloid, the haloid containing chlorine and at least one of containing borofluoride.
Preferably, the halogen salt assitant is ammonium fluoride, ammonium acid fluoride, ammonium fluoroborate, stannous fluoboric acid, zinc chloride and chlorine
Change at least one of zinc ammonium.
One embodiment of the halogen salt assitant is：The halogen salt assitant includes the raw material of following weight proportion：
Ammonium fluoride 40% and ammonium fluoroborate 60%.
The soldering paste is the paste of the solder and scaling powder allotment.
The soldering paste further includes corrosion inhibiter, and accounts for the 0-2% of the soldering paste total weight.
The monometallic powder is selected from least one of bismuth, indium and gallium, the alloy powder be selected from tin, bismuth, silver, zinc,
At least one of powder made of at least two alloy moltens in indium and gallium, the monometallic powder and the alloy powder
Diameter be all 20-30 μm.
The metal powder includes the raw material of following weight ratio：The zinc 0-9%, the silver 0-10%, the tin 0-
78%, the indium 0-98%, the bismuth 0-67% and the gallium 0-12%.
Preferably, for the fusing point of the alloy powder between 80-178 DEG C, the alloy powder is sn-bi alloy, tin bismuth silver
Alloy, tin indium kirsite, tin indium bismuth alloy, tin indium bismuth silver alloy, tin-indium alloy, tin indium bismuth alloy, tin bismuth indium kirsite, indium silver
Alloy or indium gallium alloy.
Preferably, the sn-bi alloy includes the raw material of following weight ratio：Tin 40-44% and bismuth 56-60%；
The tin-indium alloy includes the raw material of following weight ratio：Tin 46-50% and indium 50-54%；
The tin bismuth silver alloy includes the raw material of following weight ratio：Tin 38-43%, bismuth 56-60% and silver 1-2%；
The tin indium bismuth alloy includes the raw material of following weight ratio：Tin 17-21%, indium 23-25% and bismuth 56-58%；
The tin bismuth indium kirsite includes the raw material of following weight ratio：Tin 8-13%, indium 22-27%, bismuth 57-60% and zinc
3-5%；
The indium silver alloy includes the raw material of following weight ratio：Indium 90-92% and silver 8-10%；
The indium gallium alloy includes the raw material of following weight ratio：Indium 88-91% and gallium 9-12%.
The embodiment of the alloy powder is：
The sn-bi alloy includes the raw material of following weight ratio：Tin 40% and bismuth 60%；
The tin-indium alloy includes the raw material of following weight ratio：Tin 50% and indium 50%；
The tin bismuth silver alloy includes the raw material of following weight ratio：Tin 40%, bismuth 58% and silver 2%；
The tin indium bismuth alloy includes the raw material of following weight ratio：Tin 19%, indium 23% and bismuth 58%；
The tin bismuth indium kirsite includes the raw material of following weight ratio：Tin 10%, indium 25%, bismuth 60% and zinc 5%；
The indium silver alloy includes the raw material of following weight ratio：Indium 90% and silver 10%；
The indium gallium alloy includes the raw material of following weight ratio：Indium 88% and gallium 12%.
The organic amine is ethanol amine, triethanolamine, triethylene tetramine, isopropanolamine, diglycolamine, dihydroxy ethyl methylamine
At least one of with cyclohexylamine；The amino alcohol is 2-amino-2-methyl-1-propanol, 2- amino -2- ethyls -1,3- the third two
Alcohol, 2- dimethylamino -2- methyl-1s-at least one of propyl alcohol and 2- amino-2-methyl -1,3- propyl alcohol.
The one embodiment for the auxiliary agent that the organic amine and amino alcohol are composed is：Organic amine and amino alcohol are composed
Auxiliary agent include following weight ratio raw material：Ethanol amine 20%, isopropanolamine 25%, triethanolamine 5%, diglycolamine
10%, 2-amino-2-methyl-1-propanol 20%, 2-amino-2-ethyl-1,3-propanediol 10% and amino-2-methyl -1 2-,
3- propyl alcohol 10%.
In the present embodiment, the alcohol analog assistant be propylene glycol, isopropanol, normal propyl alcohol, n-butanol, polyethylene glycol, ethylene glycol,
At least one of ethyl alcohol and glycerine.
One embodiment of the alcohol analog assistant is：Alcohol analog assistant includes the raw material of following weight ratio：Isopropanol 25%,
Normal propyl alcohol 20%, polyethylene glycol 45% and propylene glycol 10%.
The boiling point for the auxiliary agent that the organic amine is composed with amino alcohol is less than the welding temperature of soldering paste, and the organic amine
Can be organic amine modifier, the amino alcohol can be amino alcohol modifier.
Aluminum antenna and core when the low temperature solder cream is pasting chip on RFID aluminum antenna welding soldering paste or aluminum antenna
Piece pin welding soldering paste.
The present invention also provides a kind of low temperature solders to connect the preparation method with soldering paste, in accordance with the following steps into
Row：
Step 1：Alcohol analog assistant is added in reaction kettle according to the ratio and is stirred, is sufficiently mixed；
Step 2：The auxiliary agent for being according to the ratio composed organic amine and amino alcohol is added in reaction kettle together with alcohol analog assistant
It is stirred；
Step 3：Halogen salt assitant is added in reaction kettle according to the ratio and is sufficiently stirred；
Step 4：Solder is added in reaction kettle according to the ratio and stirs to get semi-finished product soldering paste together with above-mentioned other components；
Step 5：Semi-finished product soldering paste vacuum degasing machine deaeration after being sufficiently mixed is to get finished product soldering paste；
Step 6：Finished product soldering paste, which is filled to filling and sealing machine in needle tubing, uses poly-bag vacuum sealing spare.
The working principle and working process of the present invention：
The scaling powder of the present invention is the thick liquid that a kind of activity is high, deoxidation film ability is strong, volatility therein first
Haloid can generate spot corrosion in the oxide layer of aluminium foil and break epoxidation aluminium protective layer, then combined by organic amine and amino alcohol and
At auxiliary agent dissolve alumina layer；Scaling powder and solder metal powders be tuned into after soldering paste, there is viscosity appropriate and rheological characteristic,
It is easily coated on the position for needing to connect, there is lotion stabilization, sedimentation layering is not susceptible to during storage, soldered fitting resists
The strong feature of corrosivity, while the air-isolation in welding avoid the aluminium of removing oxide layer by the oxygen secondary oxidation in air
Or it is reacted with vapor；The scaling powder of the overwhelming majority includes haloid, evaporates or distils when welding, avoids residual and help
Corrosion of the solder flux to antenna aluminium foil and chip, especially suitable for RFID aluminum antennas welding and aluminum antenna on pasting chip when aluminum antenna
It is welded with chip pin.
Example the above is only the implementation of the present invention, not thereby example the above is only the implementation of the present invention, not because
The scope of the claims of this limitation present invention, it is every using equivalent structure made by present specification, directly or indirectly transport
Used in other related technical areas, it is included within the scope of the present invention.
Claims (10)
1. a kind of low temperature solder connects with soldering paste, it is characterised in that：The welding temperature of the soldering paste is described less than or equal to 180 DEG C
Soldering paste includes solder and scaling powder, according to the total weight percent meter of soldering paste, wherein the solder is 60-80%, it is described to help weldering
Agent is 20-40%, and the solder is the metal powder that fusing point is less than 180 DEG C, and the metal powder includes monometallic powder and conjunction
At least one of bronze end includes by weight in the scaling powder：The auxiliary agent 40- that organic amine is composed with amino alcohol
50%, alcohol analog assistant 45-50% and halogen salt assitant 5-10%.
2. low temperature solder according to claim 1 connects with soldering paste, it is characterised in that：The halogen salt assitant is fluorine-containing
Haloid, the haloid containing chlorine and at least one of containing borofluoride.
3. low temperature solder according to claim 1 connects with soldering paste, it is characterised in that：The soldering paste further includes corrosion inhibiter,
And account for the 0-2% of the soldering paste total weight.
4. low temperature solder according to claim 1 connects with soldering paste, it is characterised in that：The monometallic powder be selected from bismuth,
At least one of indium and gallium, powder made of at least two alloys of the alloy powder in tin, bismuth, silver, zinc, indium and gallium
The diameter of at least one of end, the monometallic powder and the alloy powder is all 20-30 μm.
5. low temperature solder according to claim 4 connects with soldering paste, it is characterised in that：The metal powder includes following heavy
Measure the raw material of ratio：The zinc 0-9%, the silver 0-10%, the tin 0-78%, the indium 0-98%, the bismuth 0-67% and
The gallium 0-12%.
6. low temperature solder according to claim 4 connects with soldering paste, it is characterised in that：The fusing point of the alloy powder exists
Between 80-178 DEG C, the alloy powder is sn-bi alloy, tin bismuth silver alloy, tin indium kirsite, tin indium bismuth alloy, tin indium bismuth silver
Alloy, tin-indium alloy, tin indium bismuth alloy, tin bismuth indium kirsite, indium silver alloy or indium gallium alloy.
7. low temperature solder according to claim 6 connects with soldering paste, it is characterised in that：The sn-bi alloy includes following heavy
Measure the raw material of ratio：Tin 40-44% and bismuth 56-60%；The tin-indium alloy includes the raw material of following weight ratio：Tin 46-50% and
Indium 50-54%；The tin bismuth silver alloy includes the raw material of following weight ratio：Tin 38-43%, bismuth 56-60% and silver 1-2%；Institute
State the raw material that tin indium bismuth alloy includes following weight ratio：Tin 17-21%, indium 23-25% and bismuth 56-58%；The tin bismuth indium zinc
Alloy includes the raw material of following weight ratio：Tin 8-13%, indium 22-27%, bismuth 57-60% and zinc 3-5%；The indium silver alloy packet
Include the raw material of following weight ratio：Indium 90-92% and silver 8-10%；The indium gallium alloy includes the raw material of following weight ratio：Indium 88-
91% and gallium 9-12%.
8. low temperature solder according to claim 1 connects with soldering paste, it is characterised in that：The organic amine is ethanol amine, three
At least one of ethanol amine, triethylene tetramine, isopropanolamine, diglycolamine, dihydroxy ethyl methylamine and cyclohexylamine；The amino
Alcohol be 2-amino-2-methyl-1-propanol, 2- amino -2- ethyl -1,3- propylene glycol, 2- dimethylamino -2- methyl-1s-propyl alcohol and
At least one of 2- amino-2-methyl -1,3- propyl alcohol.
9. low temperature solder according to claim 1 connects with soldering paste, it is characterised in that：The halogen salt assitant is fluorination
At least one of ammonium, ammonium acid fluoride, ammonium fluoroborate, stannous fluoboric acid, zinc chloride and zinc ammonium chloride.
10. a kind of low temperature solder according to claim 1 connects the preparation method with soldering paste, it is characterised in that：According to such as
Lower step carries out：
Step 1：Alcohol analog assistant is added in reaction kettle according to the ratio and is stirred, is sufficiently mixed；
Step 2：The auxiliary agent that organic amine and amino alcohol are composed is added in reaction kettle together with alcohol analog assistant according to the ratio and is stirred
Mixing；
Step 3：Halogen salt assitant is added in reaction kettle according to the ratio and is sufficiently stirred；
Step 4：Solder is added in reaction kettle according to the ratio and stirs to get semi-finished product soldering paste together with above-mentioned other components；
Step 5：Semi-finished product soldering paste vacuum degasing machine deaeration after being sufficiently mixed is to get finished product soldering paste；
Step 6：Finished product soldering paste, which is filled to filling and sealing machine in needle tubing, uses poly-bag vacuum sealing spare.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710183759.1A CN108620764B (en) | 2017-03-24 | 2017-03-24 | Soldering paste for low-temperature soldering and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710183759.1A CN108620764B (en) | 2017-03-24 | 2017-03-24 | Soldering paste for low-temperature soldering and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108620764A true CN108620764A (en) | 2018-10-09 |
| CN108620764B CN108620764B (en) | 2022-03-08 |
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Cited By (7)
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| CN109509571A (en) * | 2018-11-19 | 2019-03-22 | 北京有色金属与稀土应用研究所 | A kind of kamash alloy and copper strips composite material and preparation method |
| CN109834405A (en) * | 2019-03-22 | 2019-06-04 | 杨小荣 | A kind of solder paste of no couple corrosion, preparation method and applications |
| CN109967811A (en) * | 2019-03-22 | 2019-07-05 | 杨小荣 | A kind of LED lamp and preparation method thereof with aluminium foil circuit board making |
| CN111037135A (en) * | 2019-12-19 | 2020-04-21 | 中国电子科技集团公司第十八研究所 | Welding method of beryllium and stainless steel and welding method of beryllium window and stainless steel window |
| CN111534282A (en) * | 2019-12-16 | 2020-08-14 | 有研工程技术研究院有限公司 | Phase-change heat storage material with low melting point and high volume latent heat, and preparation method and application thereof |
| CN115476015A (en) * | 2022-11-01 | 2022-12-16 | 成都科力深传感技术有限公司 | Brazing filler metal laying method |
| CN115519276A (en) * | 2022-01-10 | 2022-12-27 | 上海华庆焊材技术股份有限公司 | Adhesive for soldering paste and preparation method and application thereof |
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| CN109509571A (en) * | 2018-11-19 | 2019-03-22 | 北京有色金属与稀土应用研究所 | A kind of kamash alloy and copper strips composite material and preparation method |
| CN109834405A (en) * | 2019-03-22 | 2019-06-04 | 杨小荣 | A kind of solder paste of no couple corrosion, preparation method and applications |
| CN109967811A (en) * | 2019-03-22 | 2019-07-05 | 杨小荣 | A kind of LED lamp and preparation method thereof with aluminium foil circuit board making |
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| CN115519276A (en) * | 2022-01-10 | 2022-12-27 | 上海华庆焊材技术股份有限公司 | Adhesive for soldering paste and preparation method and application thereof |
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