CN101564805A - Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste - Google Patents
Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste Download PDFInfo
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Abstract
The invention relates to a novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste, belonging to the field of unleaded solder soldering flux. The invention aims at providing a soldering flux suitable for the low-silver SnAgCu unleaded soldering paste. The soldering flux comprises the following components: 5.0-13.0% of activator, 32.0-41.0% of solvent, 0.8-5.0% of corrosion inhibitors, 1.0-6.0% of thixotropic agent, 2.0 -9.0% of paste forming agent, 0.3-2.5% of stabilizer, 0.5-5.0% of surfactant and 35.0-48.0% of modified rosin. The activator is the compound of a plurality of organic acids, has wide boiling point distribution space, can achieve good activation effect in the whole soldering process, can be mostly volatilized, sublimated or decomposed at the brazing temperature and ensures no corrosion after the soldering. The soldering flux has the advantages of no halogen content, good soldering aiding property, few and hard-film-shaped residuals after the soldering, high insulation resistance, and the like.
Description
Technical field
The invention belongs to the lead-free solder soldering fluid field, be specifically related to a kind of scaling powder, especially be applicable to the scaling powder that low-silver SnAgCu unleaded soldering paste is used.
Background technology
In recent years, the unleaded requirement of Electronic Packaging and surface installation technique has promoted the fast development of lead-free brazing research work.Among numerous lead-free brazings that are studied, the SnAgCu solder is owing to have better comprehensive performance, and is regarded as one of substitute of comparatively ideal SnPb solder.But because the fusion temperature scope of low-silver SnAgCu unleaded brazing filler metal alloy is bigger, fusing point is high and depart from eutectic point, and brazing temperature is raise, and solder reflow process is proposed bigger challenge.Therefore, no lead solder is also had higher requirement to the performance of scaling powder.Need the reappraise variation of chemical composition under higher technological temperature of soldering paste is as volatilization of scaling powder etc.In order to dwindle the gap with external product, be badly in need of developing the lead-free solder paste of superior performance, environmental protection, and the scaling powder of development and lead-free brazing coupling also just becomes inevitable requirement.
Because the welding temperature of lead-free brazing is than tin-lead solder height, and the former wettability is also relatively poor relatively, therefore, is applicable to that at present the scaling powder of tin-lead solder can't satisfy the welding requirements of lead-free brazing.Select suitable scaling powder can improve the brazing property of solder.Except having the performance that conventional scaling powder should possess, unleaded brazing flux also has different requirements to activation temperature, oxidation resistance, activity intensity and heat endurance etc.For lead-free brazing, require scaling powder with its coupling to have better non-oxidizability, stronger active and higher heat endurance.In a word, scaling powder must bear whole reflow welding process fully.
At present, domesticly be applicable to that low-silver SnAgCu unleaded soldering paste is less with the research of scaling powder, the present invention is exactly the needs at low-silver SnAgCu unleaded soldering paste preparation, the plain no-clean scaling powder of the colophony type non-halide of development of new.
Summary of the invention
The objective of the invention is to solve existing technical problem, provide a kind of help the weldering functional, antioxygenic property is strong, heat endurance is high, the free from corrosion low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder of postwelding.
Low-silver SnAgCu unleaded soldering paste provided by the present invention with the composition and the quality percentage composition thereof of novel environment-friendly scaling powder is:
Activator 5.0-13.0%
Solvent 32.0-41.0%
Corrosion inhibiter 0.8-5.0%
Thixotropic agent 1.0-6.0%
Paste making agent 2.0-9.0%
Stabilizing agent 0.3-2.5%
Surfactant 0.5-5.0%
Modified rosin 35.0-48.0%
Wherein, described activator is an organic acid, is selected from dicarboxylic acids, tricarboxylic acid or carboxylic acid, can be the two or more mixing in the same class acid, also can be the two or more mixing in the inhomogeneity acid; Described dicarboxylic acids is succinic acid, glutaric acid, adipic acid, maleic acid, itaconic acid, and described tricarboxylic acid is a citric acid, and described carboxylic acid is the two or more mixing in DL-malic acid, the salicylic acid.Activator is the soul of scaling powder.The selected activator of the present invention has enough abilities of removing brazing metal and solder surface film oxide, in whole brazing process performance activation, plays a part crucial to improving wetability.Simultaneously, activator is determining the corrosive nature of scaling powder and residue thereof again.Activator among the present invention can most ofly volatilize, distil or decompose under brazing temperature, makes the organic acid residue of printed circuit board (PCB) postwelding few, does not have corrosion.
Described solvent is an organic solvent, is the mixing of at least a alcohols and at least a ethers; Described alcohol is selected from glycerine, ethylene glycol, diethylene glycol (DEG), 2-ethyl-1,3 hexylene glycol; Described ether is selected from glycol monoethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol list octyl ether.Solvent is the carrier of scaling powder, and each component of scaling powder is dissolved in the solvent, forms uniform sticky attitude.The selected organic solvent of the present invention has suitable boiling point, neither can too fastly evaporate, and can help the dry forming of postwelding diaphragm again.And selected organic solvent has certain viscosity, is convenient to print and the adhesion of element.
Described corrosion inhibiter is the organic amine corrosion inhibiter, one or both mixing in triethylamine, the triethanolamine.Corrosion inhibiter can be used as auxiliary activity agent and acidity regulator and carries out compositely, is used to reduce the corrosion of scaling powder to printed circuit board (PCB).
Described thixotropic agent is a rilanit special.The effect of adding thixotropic agent is to provide appropriate rheological property to soldering paste, and guarantees the stability of soldering paste rheological property.
Described paste making agent is a cetomacrogol 1000, one or more mixing of Macrogol 2000 or the two stearic amides of second two supports.The effect of paste making agent is to strengthen the ability that rosin colloidal sol becomes sticky paste.
Described stabilizing agent is a paraffin.Stabilizing agent can keep the sticky stability of scaling powder in the soldering paste storing process, layering can not occur.
Described surfactant is one or more mixing in OPEO, isooctylphenol APEO or the NPE.Surfactant can promote the dissolving of various components in the scaling powder, can reduce the interfacial tension of scolder and printed circuit board surface, and collaborative scaling powder improves and helps the weldering performance.
Described modified rosin is one or more mixing in newtrex, Foral, perhydrogenated rosin, water-white rosin, rosin KE-604 or the leadless rosin.Rosin itself is a kind of weak acid, can play the certain activity effect in scaling powder.The selected modified rosin of the present invention has higher softening point, is difficult for crystallization, and non-oxidizability is strong, and acid number is lower, and Stability Analysis of Structures, and these advantages all impel the scaling powder of being prepared to have comparatively stable performance.Rosin only just has activity when being heated to brazing temperature, can remove the oxide-film of metal surface, increases the wettability of solder; Because rosin can be dissolved in the organic solvent, when reflow welding, after the solvent evaporation, can form thin membranoid substance, the protective money metal surface.
Compare with existing scaling powder product, low-silver SnAgCu unleaded soldering paste provided by the present invention has following characteristics with the novel environment-friendly scaling powder: 1. not halogen-containing, postwelding is residual few, compliance with environmental protection requirements; 2. at low-silver SnAgCu unleaded solder fusing temperature departure eutectic point, the interval big characteristics of crystallization temperature, the selected activator of the present invention is that multiple organic acid is composite, boiling point distribution space is big (130～337 ℃), can guarantee all to play in whole solder reflow process active function preferably; 3. because activator can most ofly volatilize, distil or decompose under brazing temperature, organic acid substance is seldom residual, guarantees that postwelding does not have corrosion; 4. the soldering paste moisture retention with scaling powder preparation provided by the present invention is good, and storage and service life are longer.
Low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder provided by the present invention can directly adopt existing scaling powder compound method preparation synthetic.
The specific embodiment
The invention will be further described below in conjunction with specific embodiments.
All adopt following method preparation among the following embodiment:
1) takes by weighing materials such as activator, solvent, corrosion inhibiter, surfactant, thixotropic agent, paste making agent, stabilizing agent and modified rosin by above-mentioned quality percentage composition proportioning;
2) mixture of modified rosin and organic solvent be not higher than after heating for dissolving becomes transparent liquid under 120 ℃ the temperature, add activator, stirring is until dissolving fully, stop heating then, when temperature drops to 100 ℃ of left and right sides, be incubated, add corrosion inhibiter, thixotropic agent, paste making agent, stabilizing agent and surfactant again, after it is fully dissolved and stirring, at room temperature leave standstill cooling,, promptly get low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder of the present invention up to being cooled to room temperature.
Embodiment 1
The activating agent of selecting for use is succinic acid, salicylic acid and DL-malic acid, solvent is glycerine and diethylene glycol monoethyl ether, corrosion inhibiter is a triethylamine, thixotropic agent is a rilanit special, paste making agent is a cetomacrogol 1000, stabilizing agent is a paraffin, and surfactant is an OPEO, and modified rosin is newtrex and Foral; The quality percentage composition (wt%) of each component is:
Succinic acid 1.5
Salicylic acid 1.5
DL-malic acid 2.0
Glycerine 14.0
Diethylene glycol monoethyl ether 18.0
Triethylamine 0.8
Rilanit special 4.2
Cetomacrogol 1000 6.0
Paraffin 2.5
OPEO 3.5
Newtrex 24.0
Foral 22.0
Embodiment 2
The activating agent of selecting for use is glutaric acid, salicylic acid and citric acid, solvent is diethylene glycol (DEG) and diethylene glycol monobutyl ether, corrosion inhibiter is a triethanolamine, thixotropic agent is a rilanit special, paste making agent is a cetomacrogol 1000, stabilizing agent is a paraffin, and surfactant is an OPEO, and modified rosin is newtrex and water-white rosin; The quality percentage composition (wt%) of each component is:
Glutaric acid 2.0
Salicylic acid 2.5
Citric acid 3.0
Diethylene glycol (DEG) 18.0
Diethylene glycol monobutyl ether 18.0
Triethanolamine 1.5
Rilanit special 1.0
Cetomacrogol 1000 4.4
Paraffin 0.3
OPEO 1.3
Newtrex 24.0
Water-white rosin 24.0
Embodiment 3
The activating agent of selecting for use is adipic acid, succinic acid and DL-malic acid, solvent is glycerine and glycol monoethyl ether, corrosion inhibiter is triethylamine and triethanolamine, thixotropic agent is a rilanit special, paste making agent is a Macrogol 2000, stabilizing agent is a paraffin, and surfactant is the isooctylphenol APEO, and modified rosin is perhydrogenated rosin and water-white rosin; The quality percentage composition (wt%) of each component is:
Adipic acid 1.5
Succinic acid 3.0
DL-malic acid 4.5
Glycerine 16.0
Glycol monoethyl ether 20.0
Triethylamine 3.0
Triethanolamine 2.0
Rilanit special 6.0
Macrogol 2000 2.0
Paraffin 1.0
Isooctylphenol APEO 1.0
Perhydrogenated rosin 20.0
Water-white rosin 20.0
Embodiment 4
The activating agent of selecting for use is adipic acid, salicylic acid and itaconic acid, solvent is ethylene glycol and diethylene glycol list octyl ether, corrosion inhibiter is a triethanolamine, thixotropic agent is a rilanit special, paste making agent is the two stearic amides of second two supports, stabilizing agent is a paraffin, and surfactant is OPEO and NPE, and modified rosin is perhydrogenated rosin and newtrex; The quality percentage composition (wt%) of each component is:
Adipic acid 1.5
Salicylic acid 4.5
Itaconic acid 4.8
Ethylene glycol 16.0
Diethylene glycol list octyl ether 18.0
Triethanolamine 3.0
Rilanit special 4.2
The two stearic amides 3.5 of second two supports
Paraffin 1.5
OPEO 2.5
NPE 2.5
Perhydrogenated rosin 18.0
Newtrex 20.0
Embodiment 5
The activating agent of selecting for use is glutaric acid, itaconic acid and DL-malic acid, solvent is 2 ethyls-1,3 hexylene glycols and diethylene glycol monobutyl ether, corrosion inhibiter is a triethylamine, thixotropic agent is a rilanit special, and paste making agent is Macrogol 2000 and the two stearic amides of second two supports, and stabilizing agent is a paraffin, surfactant is an OPEO, and modified rosin is perhydrogenated rosin and leadless rosin FE625; The quality percentage composition (wt%) of each component is:
Glutaric acid 2.0
Itaconic acid 4.0
DL-malic acid 4.0
2 ethyls-1,3 hexylene glycol 18.0
Diethylene glycol monobutyl ether 20.0
Triethylamine 2.0
Rilanit special 3.0
Macrogol 2000 5.5
The two stearic amides 3.5 of second two supports
Paraffin 1.5
OPEO 1.5
Perhydrogenated rosin 18.0
Leadless rosin FE625 17.0
Embodiment 6
The activating agent of selecting for use is succinic acid, citric acid and maleic acid, solvent is diethylene glycol (DEG) and diethylene glycol monohexyl ether, corrosion inhibiter is a triethanolamine, thixotropic agent is a rilanit special, paste making agent is a cetomacrogol 1000, stabilizing agent is a paraffin, and surfactant is an OPEO, and modified rosin is water-white rosin and leadless rosin FE625; The quality percentage composition (wt%) of each component is:
Succinic acid 3.0
Citric acid 5.0
Maleic acid 5.0
Diethylene glycol (DEG) 21.0
Diethylene glycol monohexyl ether 20.0
Triethanolamine 1.0
Rilanit special 2.0
Cetomacrogol 1000 3.5
Paraffin 1.0
OPEO 0.5
Water-white rosin 20.0
Rosin KE-604 18.0
Low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder with preparation among the embodiment 1 to embodiment 6 detects according to national standard and electron trade standard, and every index is as shown in table 1.
The prepared low-silver SnAgCu unleaded soldering paste of the table 1 the present invention performance of novel environment-friendly scaling powder
From the Performance Detection of table 1 as can be seen, low-silver SnAgCu unleaded soldering paste provided by the present invention has comparatively excellent performance with the novel environment-friendly scaling powder: 1. physical stability is good; 2. not halogen-containing; 3. non-corrosiveness (the postwelding residue is few, and is transparent hard membranoid substance); 4. help weldering property better, the rate of spread can reach more than 75%; 5. the postwelding insulaion resistance of printed panel is higher, and surpasses 10
9Ω meets the demands.
Claims (4)
1, a kind of novel environment-friendly scaling powder that is applicable to low-silver SnAgCu unleaded soldering paste is characterized in that, the quality percentage composition of its composition and each component is as follows:
Activator 5.0-13.0%
Solvent 32.0-41.0%
Corrosion inhibiter 0.8-5.0%
Thixotropic agent 1.0-6.0%
Paste making agent 2.0-9.0%
Stabilizing agent 0.3-2.5%
Surfactant 0.5-5.0%
Modified rosin 35.0-48.0%
Wherein, described activator is an organic acid, is selected from dicarboxylic acids, tricarboxylic acid or carboxylic acid, can be the two or more mixing in the same class acid, also can be the two or more mixing in the inhomogeneity acid;
Described solvent is an organic solvent, is the mixing of at least a alcohols and at least a ethers;
Described corrosion inhibiter is the organic amine corrosion inhibiter;
Described thixotropic agent is a rilanit special;
Described paste making agent is a cetomacrogol 1000, one or more mixing of Macrogol 2000 or the two stearic amides of second two supports;
Described stabilizing agent is a paraffin;
Described surfactant is one or more mixing in OPEO, isooctylphenol APEO or the NPE;
Described modified rosin is one or more mixing in newtrex, Foral, perhydrogenated rosin, water-white rosin, rosin KE-604 or the leadless rosin.
2, low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder according to claim 1, it is characterized in that, described dicarboxylic acids is succinic acid, glutaric acid, adipic acid, maleic acid, itaconic acid, described tricarboxylic acid is a citric acid, and described carboxylic acid is the two or more mixing in DL-malic acid, the salicylic acid.
3, low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder according to claim 1 is characterized in that, described alcohol is selected from glycerine, ethylene glycol, diethylene glycol (DEG), 2-ethyl-1,3 hexylene glycol; Described ether is selected from glycol monoethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol list octyl ether.
4, low-silver SnAgCu unleaded soldering paste novel environment-friendly scaling powder according to claim 1 is characterized in that, described organic amine corrosion inhibiter is one or both mixing in triethylamine, the triethanolamine.
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| CNA2009100862055A CN101564805A (en) | 2009-05-27 | 2009-05-27 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
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| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
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