CN106392381A - High-quality soldering paste - Google Patents
High-quality soldering paste Download PDFInfo
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- CN106392381A CN106392381A CN201610945036.6A CN201610945036A CN106392381A CN 106392381 A CN106392381 A CN 106392381A CN 201610945036 A CN201610945036 A CN 201610945036A CN 106392381 A CN106392381 A CN 106392381A
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- parts
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
Abstract
The invention discloses a high-quality soldering paste, and belongs to the technical field of scaling powder. The high-quality soldering paste is particularly composed of soldering alloy micro powder and scaling powder, and the weight ratio of the soldering alloy micro powder to the scaling powder is (5.5-6):1; the soldering alloy micro powder is tin-silver-copper alloy micro powder; and the scaling powder is prepared from a solvent, an active agent, a film-forming agent, a surface active agent, a stabilizer and a corrosion inhibitor. According to the high-quality soldering paste, after the soldering alloy micro powder and the scaling powder are proportioned according to the appropriate mass part, the soldering paste cannot generate unhealthy phenomena such as hard skin membrane, caking and viscosity changes at the medium placemat time before the reflow soldering manufacturing process, the everlasting viscosity stability is guaranteed, the surface of a soldered object is free of vestigial solid bodies, washing is not needed, phenomena of joined soldering and short circuits after welding are avoided, the soldering pass rate of precision components and parts can be guaranteed, and the high-quality soldering paste is suitable for single-face circuit boards or copper plating and nickel plating circuit boards which are difficult to solder.
Description
Technical field
The invention belongs to scaling powder technical field is and in particular to a kind of high-quality solder(ing) paste.
Background technology
With the development of electronic science and technology, surface mounting technology is in Electronic Assemblies in occupation of more and more important work
With, and solder(ing) paste is accompanied by a kind of solder that surface mounting technology arises at the historic moment, and is also extremely important auxiliary in surface mount
Help material.Solder(ing) paste is jointly to be mixed by scaling powder and glass putty, is first about to solder(ing) paste and smears be printed onto circuit board during use
(PCB) on, then it is downloaded to slotting for electronic building brick on substrate, in processing procedure, substrate passes through reflow soldering, by reflow soldering heating for dissolving
Method, carry out the welding of assembly pin.Wherein the glass putty in solder(ing) paste is the main substance of welding, its shape, granularity, uniformly
The impact to solder(ing) paste such as degree and surface oxidation degree is very big, adds lead element to improve welding performance in traditional glass putty, but
In recent years, require to suppress the use of lead from the viewpoint of environmental pressure it is therefore desirable to a kind of exploitation performance of preparation is good, no dirty
The new glass putty of dye；Scaling powder in solder(ing) paste can remove solder and the oxide by weldering product surface, so that metal surface is reached
The purpose of necessary cleannes, thus improve welding performance it is ensured that electronic devices and components（As electric capacity, resistance, diode,
PCB）During assembling, welding sequence is smoothed out.Both collocation eventually affect welding and the use quality of electronic product.
After glass putty in existing solder(ing) paste and scaling powder mixing, during preserving use, in glass putty and scaling powder
Activating agent easily reacts, and leads to the viscosity of solder(ing) paste to change, and solder(ing) paste superficial layer expands and hardening, and overall viscosity exists
Through variation or disappearance viscosity after a period of time；Drawbacks described above causes the printing of substrate, the wettability of glass putty becomes extremely low,
The problems such as printing is bad, wet performance is bad often has generation.Additionally, reducing with continuing to optimize of electronic device, the drawing of element
Pin spacing constantly reduces, from common 0.6mm about be gradually reduced to below 0.3mm, so can increase welding difficulty, existing
Most solder(ing) paste performances cannot meet above-mentioned welding condition, leads to welding percent of pass not high.
Content of the invention
The present invention is intended to provide a kind of high-quality solder(ing) paste, welding quality can be lifted well.
The present invention is achieved through the following technical solutions：
A kind of high-quality solder(ing) paste, is made up of soldering alloy micro mist and scaling powder, and both weight is than for 5.5 ~ 6:1；Described weldering
Tin alloy micro mist is tin-silver-copper alloy powder；Described scaling powder is made up of the material of following weight portion：75 ~ 80 parts of solvents, 15 ~
20 parts of activating agents, 7 ~ 10 parts of film forming agents, 1 ~ 2 part of surfactant, 2 ~ 3 parts of stabilizers, 0.5 ~ 1.5 part of corrosion inhibiter.
Further, it is also added with nickel, antimony, bismuth, indium, at least one metal unit in cobalt in described soldering alloy micro mist
Element, the gross mass percentage that it adds in alloy powder is 0.01 ~ 0.3%.
Further, in described soldering alloy micro mist silver in alloy powder add gross mass percentage be 0.15 ~
0.25%, the gross mass percentage that copper adds in alloy powder is 0.3 ~ 1.3%.
Further, in described soldering alloy micro mist, 89 ~ 92% particle size is 30 ~ 40 μm, and 3 ~ 5% particle size is
40 ~ 60 μm, 3 ~ 8% particle size is 10 ~ 30 μm.
Further, described solvent is by the material composition of following weight portion：60 ~ 70 parts of absolute ethyl alcohols, 10 ~ 15 parts the third three
Alcohol, 8 ~ 12 parts of butyl glycol ethers；Described activating agent is by the material composition of following weight portion：50 ~ 60 parts of anhydrous citric acids, 8 ~ 10 parts
Sodium Polyacrylate, 10 ~ 15 parts of neopelexes, 6 ~ 8 parts of Lauxites.
Further, described film forming agent is by the material composition of following weight portion：30 ~ 40 parts of hercolyn Ds, 5 ~ 8 parts sweet
Oil epoxy resin, 6 ~ 10 parts of novolac epoxy resins；Described surfactant is by the material composition of following weight portion：20 ~ 30 parts of fat
Fat alcohol polyethenoxy ether sodium sulfate, 10 ~ 15 parts of fatty glycerides, 6 ~ 10 parts of lauryl sodium sulfate.
Further, described stabilizer is by the material composition of following weight portion：2 ~ 4 parts of barium succinates, 5 ~ 10 parts of dihydro pyrroles
Pyridine, 1 ~ 3 part of stearic acid sodium, 6 ~ 8 parts of phenol；Described corrosion inhibiter is BTA.
Further, the preparation method of described scaling powder is：Weigh corresponding solvent, activating agent, film forming agent, surface-active
Agent, stabilizer and corrosion inhibiter composition, then common mixing is put in closed reactor, and heating keeping temperature is 38 ~ 42 DEG C, with
After 420 ~ 460 revs/min of rotating speed stirs 1 ~ 1.5h, finally naturally cool to normal temperature again, filtering off undissolved precipitated impurities is
Can.
Further, the preparation method of described solder(ing) paste be by soldering alloy micro mist and flux ingredients by weight 5.5 ~
6:1 common mixing is put in mixer, is stirred with 500 ~ 600 revs/min of rotating speed.
The present invention has the advantages that：
（1）Abandoned the interpolation of lead element in the soldering alloy micro mist of the unique preparation of the present invention, protected Environmental security, with tin-
Ag-Cu alloy micro mist is main substance, and cooperation with the addition of the compositions such as nickel, antimony, bismuth, indium, cobalt, improves welding performance well,
The strict grain graininess size controlling entirety and ratio, so that solder(ing) paste is not easily blocked template, is less prone to again and subsides simultaneously
Phenomenon, and viscosity, the uniformity moderate it is ensured that good printing performance.
（2）The scaling powder of the unique preparation of the present invention, using absolute ethyl alcohol, glycerine, butyl glycol ether mixing as solvent, has
Have good dissolubility, the moderate boiling point after preparation, both do not resulted in solder(ing) paste drying too fast, and do not exist bonding and residual
Problem；Mixed as activating agent using anhydrous citric acid, Sodium Polyacrylate, neopelex, Lauxite, have less
Angle of wetting, good to the wetability of base material, autgmentability is high, enhances the welding performance of scaling powder；With hercolyn D, glycerine
Epoxy resin, novolac epoxy resin mix as film forming agent, can improve traditional single use rosin composition and easily occur solder(ing) paste to divide
The problem of layer, and improve film forming characteristics；Mixed as stabilizer using barium succinate, dihydropyridine, stearic acid sodium, phenol, can
Prevent the lipid aggregate in film forming agent, play more preferable filming function in welding process beneficial to it, can guarantee that scaling powder is whole again
The stability of body.
（3）The present invention presses soldering alloy micro mist and scaling powder after suitable proportion by weight, and the solder(ing) paste made is returning
Middle standing time before fluid welding manufacture process will not occur the bad phenomenon such as sclerderm film, caking, viscosity B coefficent it is ensured that holding
Long viscosity stability, and the surface noresidue solids of welded article, need not clean, and no join weldering, the phenomenon of no short circuit after welding
Occur, can guarantee that the welding percent of pass of precision components it is adaptable to the single-sided circuit board that is difficult to solder to or copper facing, nickel plating circuit again
Plate.
Specific embodiment
Embodiment 1
A kind of high-quality solder(ing) paste, is made up of soldering alloy micro mist and scaling powder, and both weight is than for 6:1；Described scolding tin closes
Golden micro mist is tin-silver-copper alloy powder；Described scaling powder is made up of the material of following weight portion：80 parts of solvents, 20 parts of activity
Agent, 10 parts of film forming agents, 2 parts of surfactants, 3 parts of stabilizers, 1.5 parts of corrosion inhibiter.
Further, nickel, antimony and bismuth element have been also added with it in described soldering alloy micro mist, it adds in alloy powder
Gross mass percentage is 0.3%.
Further, the gross mass percentage that in described soldering alloy micro mist, silver adds in alloy powder is 0.25%, copper
The gross mass percentage adding in alloy powder is 1.3%.
Further, in described soldering alloy micro mist, 92% particle size is 30 ~ 40 μm, and 5% particle size is 40 ~ 60
μm, 3% particle size is 10 ~ 30 μm.
Further, described solvent is by the material composition of following weight portion：70 parts of absolute ethyl alcohols, 15 parts of glycerine, 12 parts
Butyl glycol ether；Described activating agent is by the material composition of following weight portion：60 parts of anhydrous citric acids, 10 parts of Sodium Polyacrylates, 15
Part neopelex, 8 parts of Lauxites.
Further, described film forming agent is by the material composition of following weight portion：40 parts of hercolyn Ds, 8 parts of glycerine rings
Oxygen tree fat, 10 parts of novolac epoxy resins；Described surfactant is by the material composition of following weight portion：30 parts of fatty alcohol polyoxy second
Alkene ether sodium sulfate, 15 parts of fatty glycerides, 10 parts of lauryl sodium sulfate.
Further, described stabilizer is by the material composition of following weight portion：4 parts of barium succinates, 10 parts of dihydropyridines, 3
Part stearic acid sodium, 8 parts of phenol；Described corrosion inhibiter is BTA.
Further, the preparation method of described scaling powder is：Weigh corresponding solvent, activating agent, film forming agent, surface-active
Agent, stabilizer and corrosion inhibiter composition, then common mixing is put in closed reactor, and heating keeping temperature is 42 DEG C, with 460
Rev/min rotating speed stirring 1.5h after, finally naturally cool to normal temperature again, filter off undissolved precipitated impurities.
Further, the preparation method of described solder(ing) paste is by soldering alloy micro mist and flux ingredients by weight 6:1
Common mixing is put in mixer, is stirred with 600 revs/min of rotating speed.
Embodiment 2
A kind of high-quality solder(ing) paste, is made up of soldering alloy micro mist and scaling powder, and both weight is than for 5.8:1；Described scolding tin
Alloy powder is tin-silver-copper alloy powder；Described scaling powder is made up of the material of following weight portion：77 parts of solvents, 18 parts of activity
Agent, 8 parts of film forming agents, 2 parts of surfactants, 2 parts of stabilizers, 1 part of corrosion inhibiter.
Further, nickel, antimony, bismuth, indium and cobalt element have been also added with it in described soldering alloy micro mist, it is in alloy powder
The gross mass percentage adding is 0.2%.
Further, the gross mass percentage that in described soldering alloy micro mist, silver adds in alloy powder is 0.2%, copper
The gross mass percentage adding in alloy powder is 0.7%.
Further, in described soldering alloy micro mist, 90% particle size is 30 ~ 40 μm, and 4% particle size is 40 ~ 60
μm, 6% particle size is 10 ~ 30 μm.
Further, described solvent is by the material composition of following weight portion：65 parts of absolute ethyl alcohols, 13 parts of glycerine, 10 parts
Butyl glycol ether；Described activating agent is by the material composition of following weight portion：55 parts of anhydrous citric acids, 9 parts of Sodium Polyacrylates, 12 parts
Neopelex, 7 parts of Lauxites.
Further, described film forming agent is by the material composition of following weight portion：35 parts of hercolyn Ds, 7 parts of glycerine rings
Oxygen tree fat, 8 parts of novolac epoxy resins；Described surfactant is by the material composition of following weight portion：25 parts of fatty alcohol polyoxy second
Alkene ether sodium sulfate, 13 parts of fatty glycerides, 8 parts of lauryl sodium sulfate.
Further, described stabilizer is by the material composition of following weight portion：3 parts of barium succinates, 7 parts of dihydropyridines, 2 parts
Stearic acid sodium, 7 parts of phenol；Described corrosion inhibiter is BTA.
Further, the preparation method of described scaling powder is：Weigh corresponding solvent, activating agent, film forming agent, surface-active
Agent, stabilizer and corrosion inhibiter composition, then common mixing is put in closed reactor, and heating keeping temperature is 40 DEG C, with 450
Rev/min rotating speed stirring 1.2h after, finally naturally cool to normal temperature again, filter off undissolved precipitated impurities.
Further, the preparation method of described solder(ing) paste is by soldering alloy micro mist and flux ingredients by weight 5.8:
1 common mixing is put in mixer, is stirred with 550 revs/min of rotating speed.
Comparative example 1
This comparative example 1 compared with Example 1, the ratio of variable grain in soldering alloy micro mist is carried out conventional setting, tool
Body is that 80% particle size is 30 ~ 40 μm, and 10% particle size is 40 ~ 60 μm, and 10% particle size is 10 ~ 30 μm, except this
Outer method and step all same.
Comparative example 2
This comparative example 2 compared with Example 2, the conventional commercial of the mass parts such as unique for correspondence scaling powder use prepared is helped weldering
Agent is replaced, method and step all same in addition.
Control group
Existing commercially available solder(ing) paste.
In order to contrast effect of the present invention, carry out Welding experiment with above-mentioned five kinds of solder(ing) pastes respectively, to pin-pitch be respectively
The element of 3mm, 0.6mm, 0.3mm carries out Welding experiment, and statistics once welds percent of pass, shown in table 1 specific as follows：
Table 1
| Once weld percent of pass, 3mm（%） | Once weld percent of pass, 0.6mm（%） | Once weld percent of pass, 0.3mm（%） | |
| Embodiment 1 | 99.7 | 99.2 | 98.8 |
| Embodiment 2 | 99.8 | 99.4 | 99.0 |
| Comparative example 1 | 99.2 | 98.2 | 92.1 |
| Comparative example 2 | 99.5 | 98.0 | 93.0 |
| Control group | 99.4 | 97.6 | 88.3 |
By upper table 1 as can be seen that in the welding requiring for 3mm general precision, several solder(ing) pastes all show good welding
Characteristic, and the welding of the slightly higher required precision for 0.6mm, remaining several groups are slightly decreased compared with for the embodiment of the present invention 1,2, and
For the welding of the high-precision requirement of 0.3mm, the embodiment of the present invention 1,2 remains to keep excellent welding characteristic, and remaining each group
All occur in that largely decline phenomenon, show that solder(ing) paste welding performance of the present invention is excellent, use quality is stable, can meet not
Same welding demand.
Claims (9)
1. it is characterised in that being made up of soldering alloy micro mist and scaling powder, both weight ratios are a kind of high-quality solder(ing) paste
5.5~6:1；Described soldering alloy micro mist is tin-silver-copper alloy powder；Described scaling powder is made up of the material of following weight portion：
75 ~ 80 parts of solvents, 15 ~ 20 portions of activating agents, 7 ~ 10 parts of film forming agents, 1 ~ 2 part of surfactant, 2 ~ 3 parts of stabilizers, 0.5 ~ 1.5 part
Corrosion inhibiter.
2. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that be also added with described soldering alloy micro mist
Have at least one metallic element in nickel, antimony, bismuth, indium, cobalt, the gross mass percentage that it adds in alloy powder be 0.01 ~
0.3%.
3. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that silver is in conjunction in described soldering alloy micro mist
The gross mass percentage adding in golden micro mist is 0.15 ~ 0.25%, the gross mass percentage that copper adds in alloy powder for 0.3 ~
1.3%.
4. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that 89 ~ 92% in described soldering alloy micro mist
Particle size be 30 ~ 40 μm, 3 ~ 5% particle size is 40 ~ 60 μm, and 3 ~ 8% particle size is 10 ~ 30 μm.
5. a kind of high-quality solder(ing) paste according to claim 1 it is characterised in that described solvent by following weight portion thing
Matter forms：60 ~ 70 parts of absolute ethyl alcohols, 10 ~ 15 parts of glycerine, 8 ~ 12 parts of butyl glycol ethers；Described activating agent is by following weight portion
Material composition：50 ~ 60 parts of anhydrous citric acids, 8 ~ 10 parts of Sodium Polyacrylates, 10 ~ 15 parts of neopelexes, 6 ~ 8 parts of ureas
Urea formaldehyde.
6. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that described film forming agent is by following weight portion
Material composition：30 ~ 40 parts of hercolyn Ds, 5 ~ 8 parts of glycerol epoxy resins, 6 ~ 10 parts of novolac epoxy resins；Live in described surface
Property agent is by the material composition of following weight portion：20 ~ 30 parts of sodium sulfate of polyethenoxy ether of fatty alcohol, 10 ~ 15 parts of fatty glycerides,
6 ~ 10 parts of lauryl sodium sulfate.
7. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that described stabilizer is by following weight portion
Material composition：2 ~ 4 parts of barium succinates, 5 ~ 10 parts of dihydropyridines, 1 ~ 3 part of stearic acid sodium, 6 ~ 8 parts of phenol；Described corrosion inhibiter is benzene
And triazole.
8. a kind of high-quality solder(ing) paste according to claim 1 is it is characterised in that the preparation method of described scaling powder is：
Weigh corresponding solvent, activating agent, film forming agent, surfactant, stabilizer and corrosion inhibiter composition, then common mixing put into close
Close in reactor, heating keeping temperature is 38 ~ 42 DEG C, stir after 1 ~ 1.5h with 420 ~ 460 revs/min of rotating speed, more certainly finally
So it is cooled to normal temperature, filter off undissolved precipitated impurities.
9. a kind of high-quality solder(ing) paste according to claim 1 it is characterised in that the preparation method of described solder(ing) paste be by
Soldering alloy micro mist and flux ingredients by weight 5.5 ~ 6:1 common mixing is put in mixer, with 500 ~ 600 revs/min
Rotating speed stir.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945036.6A CN106392381A (en) | 2016-10-26 | 2016-10-26 | High-quality soldering paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610945036.6A CN106392381A (en) | 2016-10-26 | 2016-10-26 | High-quality soldering paste |
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| CN106392381A true CN106392381A (en) | 2017-02-15 |
Family
ID=58014127
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| CN201610945036.6A Pending CN106392381A (en) | 2016-10-26 | 2016-10-26 | High-quality soldering paste |
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Cited By (3)
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| CN109128568A (en) * | 2018-08-09 | 2019-01-04 | 重庆源晶电子材料有限公司 | A kind of nano-core-shell structure soldering paste and preparation method thereof |
| CN111531292A (en) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
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| CN105397329A (en) * | 2015-12-16 | 2016-03-16 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free brazing filler metal containing Nd, Re and In |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109128568A (en) * | 2018-08-09 | 2019-01-04 | 重庆源晶电子材料有限公司 | A kind of nano-core-shell structure soldering paste and preparation method thereof |
| CN111531292A (en) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN116252014B (en) * | 2023-02-11 | 2024-04-19 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
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