CN102909493A - Soldering flux - Google Patents
Soldering flux Download PDFInfo
- Publication number
- CN102909493A CN102909493A CN2012104684010A CN201210468401A CN102909493A CN 102909493 A CN102909493 A CN 102909493A CN 2012104684010 A CN2012104684010 A CN 2012104684010A CN 201210468401 A CN201210468401 A CN 201210468401A CN 102909493 A CN102909493 A CN 102909493A
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- China
- Prior art keywords
- soldering flux
- agent
- acid
- rosin
- water
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Abstract
The invention discloses a soldering flux, which contains rosin, an organic acid activator, a surface active agent, a film-forming agent, a defoaming agent, a stabilizer, a corrosion inhibitor, a thixotropic agent, a hydrazine hydroxy carboxylic acid compound and an organic solvent. The soldering flux disclosed by the invention is simple in manufacturing process and has strong wetting power for lead-free solders; by using the soldering flux, solders are uniformly spread, and residues generated after welding are soluble in water; and after the soldering flux is cleaned with water, a printed board is high in insulating resistance. In addition, the soldering flux disclosed by the invention is non-toxic, and has no pungent smell, therefore, the soldering flux is safe in use; the soldering flux basically does not contain VOC (volatile organic compound) substances, therefore, the soldering flux meets the requirements of environmental protection; and the soldering flux is difficult to burn.
Description
Technical field
The present invention relates to a kind of scaling powder.
Background technology
Chinese patent CN101695794A discloses a kind of halogen-free tin-bismuth-copper soldering cream and preparation method thereof.Its soldering paste is the 82.5Sn-17Bi-0.5Cu alloyed powder of homogeneous chemical composition with tin bismuth copper alloy, and soldering paste is not with halogen-containing in the scaling powder, and welding temperature is lower, is conducive to reduce the fire damage to electronic devices and components.But consider its limitation aspect conductive and heat-conductive, should not be used for the encapsulation field that solder joint density is large, the solder joint volume is little.
Summary of the invention
The present invention provides a kind of scaling powder for solving the problems of the technologies described above.
To achieve these goals, the present invention adopts following technical scheme.
A kind of scaling powder, contain by weight percentage:
Rosin 12～22%, rosin are the composition of Foral and water-white rosin;
The mixture 3～4% of glutaric acid and o-fluorobenzoic acid is as the organic acid for activating agent;
APES or octyl phenol polyoxy ether 0.7～0.9% are as surfactant;
Amino-acid ester 0.2～0.6% is as film forming agent;
Octanol 0.1～0.5% is as defoamer;
The Pyrogentisinic Acid 0.25～0.35%, as stabilizing agent;
BTA 0.3～0.5% is as corrosion inhibiter;
Rilanit special 3～4% is as thixotropic agent;
Hydrazine class hydroxy carboxylic acid compound 12%;
Surplus: ethylene glycol, as organic solvent.
Beneficial effect of the present invention: manufacture craft is simple, and is strong to the lead-free solder wetting power, and scolder is sprawled evenly, postwelding residue water soluble, and after water cleaned, the printed board insulaion resistance was high.In addition, the present invention is nontoxic, has no irritating odor, and uses safety, does not substantially contain the VOC material, meets environmental requirement, and nonflammable.
The specific embodiment
The invention will be further described below in conjunction with embodiment.
Embodiment 1:
A kind of scaling powder, contain by weight percentage:
Rosin 12%, rosin are the composition of Foral and water-white rosin;
The mixture 3% of glutaric acid and o-fluorobenzoic acid is as the organic acid for activating agent;
APES 0.7% is as surfactant;
Amino-acid ester 0.2% is as film forming agent;
Octanol 0.1% is as defoamer;
The Pyrogentisinic Acid 0.25%, as stabilizing agent;
BTA 0.3% is as corrosion inhibiter;
Rilanit special 3% is as thixotropic agent;
Hydrazine class hydroxy carboxylic acid compound 12%;
Surplus: ethylene glycol, as organic solvent.
Embodiment 2:
A kind of scaling powder, contain by weight percentage:
Rosin 22%, rosin are the composition of Foral and water-white rosin;
The mixture 4% of glutaric acid and o-fluorobenzoic acid is as the organic acid for activating agent;
Octyl phenol polyoxy ether 0.9% is as surfactant;
Amino-acid ester 0.6% is as film forming agent;
Octanol 0.5% is as defoamer;
The Pyrogentisinic Acid 0.35%, as stabilizing agent;
BTA 0.5% is as corrosion inhibiter;
Rilanit special 4% is as thixotropic agent;
Hydrazine class hydroxy carboxylic acid compound 12%;
Surplus: ethylene glycol, as organic solvent.
The preparation method of above-mentioned two embodiment is:
(1) organic acid for activating agent and rosin are added in the organic solvent, be heated to 35 ℃ and stir;
(2) add corrosion inhibiter, surfactant, thixotropic agent, insulation and stirring make it dissolving;
(3) add film forming agent, defoamer, stabilizing agent and hydrazine class hydroxy carboxylic acid compound, make it the nature cooling after the dissolving.
Although above-mentioned the specific embodiment of the present invention is described; but be not limiting the scope of the invention; one of ordinary skill in the art should be understood that; on the basis of technical scheme of the present invention, those skilled in the art do not need to pay various modifications that creative work can make or distortion still in protection scope of the present invention.
Claims (1)
1. a scaling powder is characterized in that, contains by weight percentage:
Rosin 12～22%, rosin are the composition of Foral and water-white rosin;
The mixture 3～4% of glutaric acid and o-fluorobenzoic acid is as the organic acid for activating agent;
APES or octyl phenol polyoxy ether 0.7～0.9% are as surfactant;
Amino-acid ester 0.2～0.6% is as film forming agent;
Octanol 0.1～0.5% is as defoamer;
The Pyrogentisinic Acid 0.25～0.35%, as stabilizing agent;
BTA 0.3～0.5% is as corrosion inhibiter;
Rilanit special 3～4% is as thixotropic agent;
Hydrazine class hydroxy carboxylic acid compound 12%;
Surplus: ethylene glycol, as organic solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104684010A CN102909493A (en) | 2012-11-20 | 2012-11-20 | Soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104684010A CN102909493A (en) | 2012-11-20 | 2012-11-20 | Soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102909493A true CN102909493A (en) | 2013-02-06 |
Family
ID=47608201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104684010A Pending CN102909493A (en) | 2012-11-20 | 2012-11-20 | Soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102909493A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979319A (en) * | 2015-06-16 | 2015-10-14 | 江苏师范大学 | Memory solder joint realizing interconnection of 3D packaging chips |
| CN106392380A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | No-clean flux high in welding passing rate |
| CN107150190A (en) * | 2017-07-20 | 2017-09-12 | 合肥安力电力工程有限公司 | A kind of New Flux and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| CN108188616A (en) * | 2017-12-30 | 2018-06-22 | 刘滨 | A kind of preparation method of environment-protective halogen-free scaling powder |
| CN111906472A (en) * | 2020-08-10 | 2020-11-10 | 云南锡业锡材有限公司 | Solder wire soldering flux capable of reducing splashing and preparation method thereof |
Citations (8)
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|---|---|---|---|---|
| US5064480A (en) * | 1989-08-04 | 1991-11-12 | Quantum Materials, Inc. | Water washable soldering paste |
| JPH08118070A (en) * | 1994-10-27 | 1996-05-14 | Asahi Chem Res Lab Ltd | Water-soluble flux |
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101412170A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free soldering tin paste |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
| CN102166689A (en) * | 2011-03-30 | 2011-08-31 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102233495A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Water-soluble flux for lead-free solder |
| CN102554489A (en) * | 2011-12-28 | 2012-07-11 | 宁波圣之岛焊锡材料有限公司 | Low-rosin halogen and lead-free solder paste and preparation method thereof |
-
2012
- 2012-11-20 CN CN2012104684010A patent/CN102909493A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5064480A (en) * | 1989-08-04 | 1991-11-12 | Quantum Materials, Inc. | Water washable soldering paste |
| JPH08118070A (en) * | 1994-10-27 | 1996-05-14 | Asahi Chem Res Lab Ltd | Water-soluble flux |
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101412170A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free soldering tin paste |
| CN102233495A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Water-soluble flux for lead-free solder |
| CN102059471A (en) * | 2010-12-29 | 2011-05-18 | 厦门大学 | Soldering paste of Sn-Bi-Cu self-packed composite powder and preparation method thereof |
| CN102166689A (en) * | 2011-03-30 | 2011-08-31 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102554489A (en) * | 2011-12-28 | 2012-07-11 | 宁波圣之岛焊锡材料有限公司 | Low-rosin halogen and lead-free solder paste and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 刘文胜，黄国基，等: "助焊剂的研究及发展趋势", 《粉末冶金材料科学与工程》, vol. 15, no. 2, 30 April 2010 (2010-04-30) * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979319A (en) * | 2015-06-16 | 2015-10-14 | 江苏师范大学 | Memory solder joint realizing interconnection of 3D packaging chips |
| CN104979319B (en) * | 2015-06-16 | 2018-11-16 | 江苏师范大学 | A kind of memory solder joint for realizing 3D encapsulation chip interconnection |
| CN106392380A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | No-clean flux high in welding passing rate |
| CN107150190A (en) * | 2017-07-20 | 2017-09-12 | 合肥安力电力工程有限公司 | A kind of New Flux and preparation method thereof |
| CN107891232A (en) * | 2017-12-06 | 2018-04-10 | 江苏广昇新材料有限公司 | A kind of lead-free and halogen-free weld-aiding cream and preparation method thereof |
| CN107891232B (en) * | 2017-12-06 | 2020-03-17 | 江苏广昇新材料有限公司 | Lead-free halogen-free soldering paste and preparation method thereof |
| CN108188616A (en) * | 2017-12-30 | 2018-06-22 | 刘滨 | A kind of preparation method of environment-protective halogen-free scaling powder |
| CN111906472A (en) * | 2020-08-10 | 2020-11-10 | 云南锡业锡材有限公司 | Solder wire soldering flux capable of reducing splashing and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130206 |