CN101670503A - Halogen-free water-based and wash-free welding fluid - Google Patents
Halogen-free water-based and wash-free welding fluid Download PDFInfo
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- CN101670503A CN101670503A CN200910192991A CN200910192991A CN101670503A CN 101670503 A CN101670503 A CN 101670503A CN 200910192991 A CN200910192991 A CN 200910192991A CN 200910192991 A CN200910192991 A CN 200910192991A CN 101670503 A CN101670503 A CN 101670503A
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Abstract
The invention relates to a halogen-free water-based and wash-free welding fluid. By weight percentage, the welding fluid consists of 2.0% to 3.7% of organic acids, 0.1% to 0.5% of surface active agent, 1.5% to 5.0% of esters wetting agent, 2.0% to 15.0% of ether cosolvent, 0.05% to 1.0% of antioxidant, 0.03% to 0.5% of defoamer, and the balance of deionized water. The welding fluid of the invention has scientific design and reasonable preparation and has the advantages of halogen-free, excellent welding property, wash-free, high isolating resistance, no VOC material existing by using deionizedwater as solvent, environmental protection, noninflammable and inexplosive properties.
Description
Technical field
Product of the present invention relates to a kind of field of electronic materials, more particularly a kind of halogen-free water-based and wash-free welding fluid.
Technical background
At present, the tin soldering liquid that uses in electronics DIP industry all adopts lower boiling alcohols such as ethanol, methyl alcohol, isopropyl alcohol to make solvent carrier, the volatile organic compounds of these pure generics (VOC), these organic gases have certain toxicity, be dispersed in the air and can pollute, belong to the material of forbidding gradually according to environmental requirement.Moreover these alcohols all are combustible materials, and fire hazardous in the use brings inevitable hidden danger to safety in production.Organic alcohols is an important chemical material in addition, and a large amount of vaporing away is a kind of waste as solvent carrier, and replacing VOC with deionized water is the development trend of tin soldering liquid.
No-clean scaling powder is a kind of novel solder flux that the needs with electronics industry development and environmental protection produce.It never uses CFC class cleaning solvent to reduce aspect the environmental pollution and solves the cleaning difficulty brought because of areolar, the assembling of high density components and parts and the compatible problem aspect between components and parts and the cleaning agent has great importance separating.Since the end of the nineties, no-clean scaling powder in electronics industry electronic devices and components and the welding of printed board produce in extensive use.But, along with the electronics applications scope of high density, lightweight, microminiaturization, high performance enlarges day by day, applied environment is complicated day by day, and is more and more higher to the reliability of products requirement, correspondingly has higher requirement aspect the reliability for no-clean scaling powder.
Summary of the invention
In order to observe Montreal and each national legislations of environmental protection, scientific and technical personnel must reduce early until the consumption of eliminating CFC, and welding procedure of seeking to replace and cleaning technique.For SMT and FPT assembly, exempting from washing is the ideal operation scheme that people dream of.If can realize and very reliable, then in the program of electronics packaging technology, can save a procedure, thereby reduce investment, reduce cost of labor and material cost.Specifically, its benefit shows: at first, exempt many difficult problems of environmental protection; Secondly, exempt from " not having corrosion " characteristic of washing soldering paste, can reduce the many difficult problems that cause owing to residual welding slag to greatest extent; At last, can avoid such as between components and parts and the cleaning solvent or the many difficult problems such as compatibility between components and parts and the water for cleaning.
Must possess following condition as no-clean scaling powder: (1) postwelding residue is minimum; (2) the postwelding residue keeps inertia and does not have corrosion under temperature, humidity; (3) the postwelding residue should have high insulating resistance value.
Though common in the market no-clean scaling powder solids content is low, during preparation the corrosivity of its active component is reduced to minimum, can not gets rid of fully and leave the dielectric residue in the postwelding printed board.Insulation degradation and corrosion phenomenon can take place between circuit in the circuit board of working under the therefore long hectic fever condition under electric field action.The objective of the invention is deficiency, provide a kind of and make carrier, do not contain the halogen-free water-based and wash-free welding fluid of VOC with aqueous solvent at last no-clean scaling powder existence.This scaling powder is the shortcoming of the good welding performance prior art that also can overcome not only, and it uses more compliance with environmental protection requirements.
The present invention is a kind of halogen-free water-based and wash-free welding fluid, and its component and percetage by weight content are:
Organic acid 2.0～3.7%
Surfactant 0.1～0.5%
Ester class wetting agent 1.5～5.0%
Ethers cosolvent 2.0～15.0%
Antioxidant 0.05～1.0%
Defoamer 0.03～0.5%
All the other are deionized water.
Described organic acid is two kinds or multiple mixing in malonic acid, succinic acid, adipic acid, glutaric acid, salicylic acid, citric acid, the malic acid, as the activator of this scaling powder.
The main effect of activator is the oxide of place to go pad and solder surface under welding temperature in the scaling powder, thereby improves the wetability between scolder and the pad.Research emphasis for solder flux is to seek high activity, the activator of low-corrosiveness at present.Traditional activator is the organic amine salt of halogen acids, and this is very disadvantageous to lead-free solder.Organic acid esters, amides compound be the character gentleness at normal temperatures, can resolve into highly active acid under the high temperature fast and form the emphasis of studying into people under catalyst action.
It is active that this type of activator that the present invention selects for use has enough helping to weld, and fine removing oxide can decompose under welding temperature, and distillation or volatilization make the noresidue of pcb board postwelding plate face, do not have and corrode.
Described ester class wetting agent is two kinds or multiple mixing in amino-acid ester, ethyl acetate, dimethyl succinate, diethyl succinate, dimethyl glutarate, dimethyl adipate, the dihexyl adipate.These ester classes can play wetting action in welding process, also can reach simultaneously to remove the oxide effect, can freely volatilize under welding temperature, and postwelding plate face does not have residual.
Described ethers cosolvent is one or more mixing in diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, the propylene glycol monomethyl ether.The principal element that influences wetability is the level of activity of flux, just should select suitable cosolvent and control its consumption so will improve its wetability.Should consider following some to choice of Solvent: 1) boiling point, the boiling point of solvent should be moderate, and boiling point is too low, and solvent volatilizees easily, the soldering paste fast drying of being prepared, the operating period is short.2) Shi Yi viscosity, the viscosity of general monohydric alcohol is lower, and the viscosity of solvent is low, and then the viscosity of the solder flux of being prepared is also low, and the solder flux of soldering paste adapted needs certain viscosity, to satisfy the requirement of soldering paste viscosity.3) contain polar group, contain in the solvent-the OH hydrophilic radical is many more, and the activity of solder flux can obtain performance more, and the big more polarity of solvent of molecular weight that contains hydrophobic grouping R-is more little, and the activity of solder flux is poor more.
The solid composition that the present invention uses the ether cosolvent can accelerate in the tin soldering liquid in right amount dissolves, and the clean degree of solder side is strong more in the process of welding.
For obtaining the bubble-free scaling powder of transparent and stable, the present invention also adds and uses defoamer, defoamer is selected from polyoxyethyl propyl glycerin ether, dimethicone, the polymethyl siloxane one or more, and wherein the molecular weight of polyoxyethyl propyl glycerin ether and polymethyl siloxane is 1000～2000.
Adopt water as solvent, the surface tension of water is big, adds an amount of surfactant and can reduce surface tension, strengthens wetting power, improves the solderability of tin soldering liquid, and surfactant is not volatile, and dosage of surfactant is generally at 0.10-0.50%.Described surfactant can be non-ionic surface active agent TX-10 (OPEO), OP-10 (isooctylphenol APEO).
Scaling powder of the present invention can add antioxidant 0.05-1.0%, selects BTA or triethanolamine for use.It can play the effect of protection solder side oxidation once again.
Product of the present invention requires the material in the tin soldering liquid prescription water-soluble or water-soluble under the help of cosolvent owing to adopt water as solvent.Because all substances are all water-soluble in the prescription, require tin soldering liquid, the postwelding residue seldom even does not have residue, not so descends because of residue suction causing electrical insulation capability.In order to reach the purpose that reduces residue, the activator that the present invention selects for use, wetting agent, cosolvent, additive all design under welding temperature volatilization or distillation is fallen, postwelding plate face residue seldom, the postwelding insulaion resistance reaches the Unite States Standard requirement.Be amber transparency liquid under the scaling powder normality of the present invention, in the production use, its sprawl manufacturability good, help the weldering effect excellent, the rate of spread reaches 84% during its unleaded soldering paste welding, can compare favourably with some highly corrosive scaling powders.Postwelding and non-corrosiveness, residual quantity is atomic, and general service can avoid cleaning.
This product is that our research and development group is through market survey and conclusion and exploitation that the product that comprehensive DIP electron trade is now used draws after relatively.The employed product of all clients all contains the VOC material at present, and smell is very big, and is also very strong to the stimulation of human body skin pore, and the gas that is discharged pollutes also very big to surrounding enviroment, and some halide gas also have destruction to the ozonosphere in the ambient air.The aqueous solvent tin soldering liquid that we researched and developed is a kind of not quick-fried product that do not fire, because some more special food organic acid, fatty acid ester, deionized waters of product utilization mix, so in use also be not afraid of HTHP, also not being afraid of has great injury to human body.Because halogen-free low solid content is exempted to clean in scolding tin 7 liquid and do not contained the VOC material, so does not have very big smell in the product, also can not produce excitant, can not produce the destruction of polluting to the air in the environment with ozonosphere yet.So creating a fine end can for client and environment, comes the aqueous solvent tin soldering liquid.
This product is not only produced to the client and is brought security, reliability, and its serviceability is also fairly good.Such as: welding performance is strong, solder joint is bright, solder joint is full, not strong, the surface insulation of tin, surface clean degree resistive can be also high, corrosion resistance might as well.
The specific embodiment
The concrete combination of halogen-free water-based and wash-free welding fluid is embodied by following examples.
Embodiment 1:
This is a kind of halogen-free water-based and wash-free welding fluid that contains non-ionic surface active agent, and each material content percentage is:
Succinic acid: 1.20%
Glutaric acid: 0.50%
Salicylic acid: 0.50%
BTA: 0.30%
OP-10： 0.20％
Diethyl succinate: 2.00%
Dimethyl adipate: 2.00%
Diethylene glycol monobutyl ether: 5.00%
Polymethyl siloxane: 0.30%
Deionized water 88.00%.
Embodiment 2:
This is a kind of halogen-free water-based and wash-free welding fluid that contains defoamer, and each material content percentage is:
Succinic acid: 1.50%
Salicylic acid: 1.50%
Adipic acid: 0.50%
Triethylamine: 0.70%
TX-10： 0.30％
Butyl acetate: 2.00%
Amino-acid ester 1.00%
Diethylene glycol monomethyl ether: 2.00%
Diethylene glycol monobutyl ether: 1.60%
Polyoxyethyl propyl glycerin ether: 0.20%
Deionized water 88.70%.
Claims (8)
1, a kind of halogen-free water-based and wash-free welding fluid, its component and percetage by weight content are:
Organic acid 2.0～3.7%
Surfactant 0.1～0.5%
Ester class wetting agent 1.5～5.0%
Ethers cosolvent 2.0～15.0%
Antioxidant 0.05～1.0%
Defoamer 0.03～0.5%
All the other are deionized water.
2, the organic acid of halogen-free water-based and wash-free welding fluid according to claim 1 is two kinds or multiple mixing in malonic acid, succinic acid, adipic acid, glutaric acid, salicylic acid, citric acid, the malic acid.
3, the surfactant of halogen-free water-based and wash-free welding fluid according to claim 1 is a kind of among OP-10, the TX-10.
4, the ester class wetting agent of halogen-free water-based and wash-free welding fluid according to claim 1 is two kinds or multiple mixing in amino-acid ester, ethyl acetate, dimethyl succinate, diethyl succinate, dimethyl glutarate, dimethyl adipate, the dihexyl adipate.
5, the ethers cosolvent of halogen-free water-based and wash-free welding fluid according to claim 1 is one or more mixing in diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, the propylene glycol monomethyl ether.
6, the antioxidant of halogen-free water-based and wash-free welding fluid according to claim 1 is selected from BTA, the triethylamine a kind of.
7, the defoamer of halogen-free water-based and wash-free welding fluid according to claim 1 is selected from polyoxyethyl propyl glycerin ether, dimethicone, the polymethyl siloxane one or more.
8, the molecular weight of polyoxyethyl propyl glycerin ether in the defoamer of halogen-free water-based and wash-free welding fluid according to claim 7 and polymethyl siloxane is 1000～2000.
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| CN200910192991A CN101670503A (en) | 2009-10-12 | 2009-10-12 | Halogen-free water-based and wash-free welding fluid |
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| CN200910192991A CN101670503A (en) | 2009-10-12 | 2009-10-12 | Halogen-free water-based and wash-free welding fluid |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992366A (en) * | 2010-11-19 | 2011-03-30 | 东莞市普赛特电子科技有限公司 | Halogen-free water-soluble flux with weak acidity and low corrosion |
| CN102581521A (en) * | 2012-02-03 | 2012-07-18 | 深圳市兴时达科技产品有限公司 | Halogen-free, lead-free and clean-free scaling powder and preparation method thereof |
| CN103846576A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Halogen-free low-carbon environment-friendly flux |
| CN105522297A (en) * | 2016-03-04 | 2016-04-27 | 保定爱廸新能源股份有限公司 | Disposable flux and preparation method thereof |
| CN105855746A (en) * | 2016-05-13 | 2016-08-17 | 深圳市唯特偶新材料股份有限公司 | Flux for high-tensile strength photovoltaic module |
| CN105921911A (en) * | 2016-05-31 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug |
| CN107825004A (en) * | 2017-11-13 | 2018-03-23 | 烟台德邦科技有限公司 | A kind of scaling powder and its method for coating of coated solder ball |
| CN108655610A (en) * | 2018-04-17 | 2018-10-16 | 苏州捷德瑞精密机械有限公司 | A kind of mould proof scaling powder of water base washing-free antibacterial and preparation method thereof |
| CN109414787A (en) * | 2016-08-16 | 2019-03-01 | 株式会社弘辉 | Solder composition |
| CN110091093A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-temperature and lead-free tin soldering cream and preparation method thereof |
| CN114029649A (en) * | 2021-12-24 | 2022-02-11 | 南京青锐风新材料科技有限公司 | Compound solvent modified lead-free soldering paste for jet printing and preparation method thereof |
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| JPH11170086A (en) * | 1997-12-11 | 1999-06-29 | Yuho Chem Kk | Water soluble flux |
| US6955982B2 (en) * | 1999-05-10 | 2005-10-18 | International Business Machines Corporation | Flip chip C4 extension structure and process |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992366A (en) * | 2010-11-19 | 2011-03-30 | 东莞市普赛特电子科技有限公司 | Halogen-free water-soluble flux with weak acidity and low corrosion |
| CN102581521A (en) * | 2012-02-03 | 2012-07-18 | 深圳市兴时达科技产品有限公司 | Halogen-free, lead-free and clean-free scaling powder and preparation method thereof |
| CN103846576A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Halogen-free low-carbon environment-friendly flux |
| CN105522297A (en) * | 2016-03-04 | 2016-04-27 | 保定爱廸新能源股份有限公司 | Disposable flux and preparation method thereof |
| CN105855746A (en) * | 2016-05-13 | 2016-08-17 | 深圳市唯特偶新材料股份有限公司 | Flux for high-tensile strength photovoltaic module |
| CN105921911A (en) * | 2016-05-31 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | Soldering flux which generates few concaves after welding and is used for pre-formed soldering lug |
| CN109414787A (en) * | 2016-08-16 | 2019-03-01 | 株式会社弘辉 | Solder composition |
| CN107825004A (en) * | 2017-11-13 | 2018-03-23 | 烟台德邦科技有限公司 | A kind of scaling powder and its method for coating of coated solder ball |
| CN108655610A (en) * | 2018-04-17 | 2018-10-16 | 苏州捷德瑞精密机械有限公司 | A kind of mould proof scaling powder of water base washing-free antibacterial and preparation method thereof |
| CN110091093A (en) * | 2019-05-17 | 2019-08-06 | 江苏三沃电子科技有限公司 | A kind of low-temperature and lead-free tin soldering cream and preparation method thereof |
| CN114029649A (en) * | 2021-12-24 | 2022-02-11 | 南京青锐风新材料科技有限公司 | Compound solvent modified lead-free soldering paste for jet printing and preparation method thereof |
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