CN101992366A - Halogen-free water-soluble flux with weak acidity and low corrosion - Google Patents
Halogen-free water-soluble flux with weak acidity and low corrosion Download PDFInfo
- Publication number
- CN101992366A CN101992366A CN2010105497370A CN201010549737A CN101992366A CN 101992366 A CN101992366 A CN 101992366A CN 2010105497370 A CN2010105497370 A CN 2010105497370A CN 201010549737 A CN201010549737 A CN 201010549737A CN 101992366 A CN101992366 A CN 101992366A
- Authority
- CN
- China
- Prior art keywords
- halogen
- water
- soluble flux
- cosolvent
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a halogen-free water-soluble flux with weak acidity and low corrosion, which comprises the following components in percentage by weight: 3 to 8 percent of organic acid and organic amine active agent, 0.5 to 2 percent of halogen-free surfactant, 1 to 15 percent of cosolvent, and the balance of deionized water. A preparation method comprises the following steps of: weighing the organic acid and organic amine active agent, the halogen-free surfactant and the cosolvent, putting the deionized water and the organic acid active agent into a stirring kettle, uniformly stirring, sequentially adding the cosolvent and the halogen-free surfactant in the stirring process, and uniformly stirring to obtain a finished product. Compared with the conventional water-soluble flux, the halogen-free water-soluble flux has the advantages that: 1, the flux has weak acidity and low corrosion, and small damage to welding equipment and appliances, improves production efficiency and reduces production cost; and 2, the flux does not contain halogens at all, so that a printed circuit board has high electric property, high reliability and long service life and meets the halogen-free requirement after being welded, and the application field and application range of the water-soluble flux are greatly expanded.
Description
Technical field
The present invention relates to welding articles for use technical field in the electron trade, be specifically related to the little no bittern water-soluble flux of the weak corrosion of a kind of acidity.
Background technology
Electronics industry fast development at present, electronic devices and components on the circuit board all are to be welded on the circuit board, when welding electronic component, to use scaling powder, scaling powder (flux) can be removed oxide in welding process, help and promote welding process, have simultaneously prevent to reoxidize, effect such as auxiliary heat conduction.In recent years, water-soluble flux was avoided using because of it has the organic cleaning solvent of harm to be used widely to human body and atmosphere.But there is following shortcoming in existing water-soluble flux: the one, and acid strong, corrosivity is big, and the infringement to equipment and apparatus in the welding process is very big, during as the weldering of manual flatiron to the solder horn seriously corroded, can shorten the service life of solder horn greatly, and influence welding effect; The 2nd, the water-soluble flux of the overwhelming majority all contains organohalogen compounds, the welding process halide ion remains on the printed circuit board, water cleaned and can't guarantee to clean up fully after weldering was finished, electromigration takes place in remaining halide ion easily, make the electric property of printed circuit board descend, have a strong impact on reliability of products and service life.In addition, existing water-soluble flux can not satisfy the requirement of industry to the Halogen product, makes the application of water-soluble flux be very limited.
Summary of the invention
The technical problem to be solved in the present invention is the defective at prior art, provides that a kind of acidity is weak, corrosion is little, the water-soluble flux of halide not.
For solving the problems of the technologies described above, the present invention adopts following technical scheme: the little Halogen water-soluble flux of the weak corrosion of a kind of acidity, and it is characterized in that: each composition is (%) meter by weight percentage, organic acid organic amine activator: 3~8%;
Halogen surfactant: 0.5~2%
Cosolvent: 1~15%
All the other are deionized water, and each composition weight sum is 100%.
Further, described organic acid is one or more the composition in DL-malic acid, glycolic acid, lactic acid, maleic anhydride, fumaric acid, triisopropanolamine, the cyclohexylamine.
Further, described Halogen surfactant be in the acetylenic diols surfactant one or more composition and add one or more NPEs.
Further, described cosolvent is one or more the composition in triethylene glycol, dipropylene glycol methyl ether, tripropylene glycol butyl ether, the tetrahydrofurfuryl alcohol.
The preparation method of the Halogen water-soluble flux that the weak corrosion of described acidity is little is as follows: take by weighing organic acid organic amine activator, Halogen surfactant and cosolvent according to formula rate, place stirred tank to stir deionized water, organic acid for activating agent, in whipping process, add cosolvent, Halogen surfactant more successively, until stirring, can obtain described water-soluble flux.
The present invention compares with traditional water-soluble flux and has the following advantages: the one, acidity a little less than, corrosivity is less, and is little to the infringement of welding equipment and apparatus, enhances productivity, reduces production costs; The 2nd, this patent product not containing halide, printed circuit board postwelding good electric property, reliability of products height, long service life; And meet the Halogen requirement, expanded the application and the scope of water-soluble flux greatly.
The specific embodiment
Be described further below in conjunction with the specific embodiment:
Embodiment 1, and each composition is (%) meter by weight percentage,
DL-malic acid 2.5%
Glycolic acid 2.5%
Triisopropanolamine 2%
Cyclohexylamine 1%
Tetrahydrofurfuryl alcohol 9%
Dipropylene glycol methyl ether 6%
The acetylenic diols surfactant that Surfynol 104(U.S. Air Products and Chemicals company produces) 0.7%
The acetylenic diols surfactant that Surfynol 604(U.S. Air Products and Chemicals company produces) 0.3%
The NP-9(NPE) 0.5%
The NP-15(NPE) 0.5%
Deionized water 75%
The preparation method is: place stirred tank to stir deionized water, DL-malic acid, glycolic acid, triisopropanolamine and cyclohexylamine, in whipping process, add tetrahydrofurfuryl alcohol, dipropylene glycol methyl ether, Surfynol 104, Surfynol 604, NP-9 and NP-15 more successively, until stirring, can obtain described water-soluble flux.
Embodiment 2, and each composition is (%) meter by weight percentage,
Maleic anhydride 1%
Glycolic acid 1%
Triisopropanolamine 1%
Triethylene glycol 1%
The acetylenic diols surfactant that Surfynol 465(U.S. Air Products and Chemicals company produces) 0.5%
Deionized water 95.5%
The preparation method is: place stirred tank to stir deionized water, maleic anhydride, glycolic acid and triisopropanolamine, in whipping process, add triethylene glycol and Surfynol 465 more successively, until stirring, can obtain described water-soluble flux.
Embodiment 3, and each composition is (%) meter by weight percentage,
DL-malic acid 0.5%
Glycolic acid 1%
Triisopropanolamine 0.8%
Tetrahydrofurfuryl alcohol 3%
Triethylene glycol 1%
Surfynol?465 0.5%
NP-9 0.5%
Deionized water 92.7%
The preparation method is: place stirred tank to stir deionized water, DL-malic acid, glycolic acid and triisopropanolamine, in whipping process, add tetrahydrofurfuryl alcohol, triethylene glycol, Surfynol 465 and NP-9 more successively, until stirring, can obtain described water-soluble flux.
Through the water-soluble flux that said method makes excellent performance is arranged all on the multinomial performance index, specifically sees following table for details:
Table 1 helps weldering property, acidity, bronze mirror corrosivity, copper coin corrosivity, halogen test correction data as a result for certain water-soluble flux commodity commonly used on embodiment of the invention 1-3 and the market:
Below the present invention is described in detail, the above only is the present invention's preferred embodiment, but can not limits practical range of the present invention, promptly allly does impartial change and modify according to the application's scope, all should still belong in the covering scope of the present invention.
Claims (5)
1. the little Halogen water-soluble flux of the weak corrosion of an acidity is characterized in that: each composition by weight percentage, organic acid organic amine activator: 3~8%;
Halogen surfactant: 0.5~2%
Cosolvent: 1~15%
All the other are deionized water, and each composition weight sum is 100%.
2. the little Halogen water-soluble flux of the weak corrosion of acidity according to claim 1 is characterized in that: described organic acid is one or more the composition in DL-malic acid, glycolic acid, lactic acid, maleic anhydride, fumaric acid, triisopropanolamine, the cyclohexylamine.
3. the little Halogen water-soluble flux of the weak corrosion of acidity according to claim 1 is characterized in that: described Halogen surfactant be in the acetylenic diols surfactant one or more composition and add one or more NPEs.
4. the little Halogen water-soluble flux of the weak corrosion of acidity according to claim 1 is characterized in that: described cosolvent is one or more the composition in triethylene glycol, dipropylene glycol methyl ether, tripropylene glycol butyl ether, the tetrahydrofurfuryl alcohol.
5. corrode little Halogen water-soluble flux a little less than the described acidity of claim 1, it is characterized in that: its preparation method is as follows:
Take by weighing organic acid organic amine activator, Halogen surfactant and cosolvent according to formula rate, place stirred tank to stir deionized water, organic acid for activating agent, in whipping process, add cosolvent, Halogen surfactant more successively, until stirring, can obtain described water-soluble flux.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105497370A CN101992366A (en) | 2010-11-19 | 2010-11-19 | Halogen-free water-soluble flux with weak acidity and low corrosion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105497370A CN101992366A (en) | 2010-11-19 | 2010-11-19 | Halogen-free water-soluble flux with weak acidity and low corrosion |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101992366A true CN101992366A (en) | 2011-03-30 |
Family
ID=43783370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105497370A Pending CN101992366A (en) | 2010-11-19 | 2010-11-19 | Halogen-free water-soluble flux with weak acidity and low corrosion |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101992366A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102581521A (en) * | 2012-02-03 | 2012-07-18 | 深圳市兴时达科技产品有限公司 | Halogen-free, lead-free and clean-free scaling powder and preparation method thereof |
CN102873303A (en) * | 2012-09-06 | 2013-01-16 | 安徽理士电池技术有限公司 | Soldering flux and cast-weld method for cast-weld process of expanded grid polar plate |
CN103212922A (en) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | Method for producing water-soluble flux |
CN107249812A (en) * | 2015-02-27 | 2017-10-13 | 千住金属工业株式会社 | Scaling powder |
CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
WO2020062550A1 (en) * | 2018-09-28 | 2020-04-02 | 五邑大学 | Water-soluble flux and method for pickling copper material |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0381468A1 (en) * | 1989-01-31 | 1990-08-08 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
JPH07136794A (en) * | 1993-11-18 | 1995-05-30 | Daiwa Tokushu Kk | Flux for soldering |
US20010045244A1 (en) * | 2000-04-27 | 2001-11-29 | Shinichi Akaike | Soldering flux for circuit board and circuit board |
CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
CN1471450A (en) * | 2000-11-10 | 2004-01-28 | �������ɹ�ҵ��ʽ���� | Water-soluble flux composition and process for producing soldered part |
CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
CN101224528A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Electronic assembly lead-free welding paste scaling powder and preparing method thereof |
CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
CN101244493A (en) * | 2008-03-21 | 2008-08-20 | 天津市瑞星高新技术发展公司 | Aluminum alloy leadless welding wire containing soldering fluid and method for manufacturing soldering fluid |
CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
CN101327553A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Halogenide-free leadless soldering tin paste |
CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
JP4352866B2 (en) * | 2003-11-18 | 2009-10-28 | パナソニック株式会社 | Soldering flux |
CN101670503A (en) * | 2009-10-12 | 2010-03-17 | 东莞市焊宏爱法电子科技有限公司 | Halogen-free water-based and wash-free welding fluid |
-
2010
- 2010-11-19 CN CN2010105497370A patent/CN101992366A/en active Pending
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0381468A1 (en) * | 1989-01-31 | 1990-08-08 | Senju Metal Industry Co., Ltd. | Water-soluble soldering flux and paste solder using the flux |
JPH07136794A (en) * | 1993-11-18 | 1995-05-30 | Daiwa Tokushu Kk | Flux for soldering |
US20010045244A1 (en) * | 2000-04-27 | 2001-11-29 | Shinichi Akaike | Soldering flux for circuit board and circuit board |
CN1471450A (en) * | 2000-11-10 | 2004-01-28 | �������ɹ�ҵ��ʽ���� | Water-soluble flux composition and process for producing soldered part |
CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
JP4352866B2 (en) * | 2003-11-18 | 2009-10-28 | パナソニック株式会社 | Soldering flux |
CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
CN101224528A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Electronic assembly lead-free welding paste scaling powder and preparing method thereof |
CN101224525A (en) * | 2008-01-21 | 2008-07-23 | 广州瀚源电子科技有限公司 | Lead-free pasty solder and preparing method thereof |
CN101244493A (en) * | 2008-03-21 | 2008-08-20 | 天津市瑞星高新技术发展公司 | Aluminum alloy leadless welding wire containing soldering fluid and method for manufacturing soldering fluid |
CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
CN101327553A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Halogenide-free leadless soldering tin paste |
CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
CN101670503A (en) * | 2009-10-12 | 2010-03-17 | 东莞市焊宏爱法电子科技有限公司 | Halogen-free water-based and wash-free welding fluid |
Non-Patent Citations (2)
Title |
---|
《印制电路信息》 20090910 高四 助焊剂的组成及研究进展 , 第09期 * |
高四: "助焊剂的组成及研究进展", 《印制电路信息》 * |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102581521A (en) * | 2012-02-03 | 2012-07-18 | 深圳市兴时达科技产品有限公司 | Halogen-free, lead-free and clean-free scaling powder and preparation method thereof |
CN102873303A (en) * | 2012-09-06 | 2013-01-16 | 安徽理士电池技术有限公司 | Soldering flux and cast-weld method for cast-weld process of expanded grid polar plate |
CN103212922A (en) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | Method for producing water-soluble flux |
CN107249812A (en) * | 2015-02-27 | 2017-10-13 | 千住金属工业株式会社 | Scaling powder |
CN107249812B (en) * | 2015-02-27 | 2018-11-02 | 千住金属工业株式会社 | Scaling powder |
CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
WO2020062550A1 (en) * | 2018-09-28 | 2020-04-02 | 五邑大学 | Water-soluble flux and method for pickling copper material |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101992366A (en) | Halogen-free water-soluble flux with weak acidity and low corrosion | |
CN102398124B (en) | Water-based cleaning-free flux for lead-free welding flux and preparation method thereof | |
CN101244493B (en) | Aluminum alloy leadless welding wire containing soldering fluid and method for manufacturing soldering fluid | |
JP5428859B2 (en) | Cleaning composition for removing lead-free solder flux and method for removing lead-free solder flux | |
CN102581523B (en) | Halogen-free solder paste | |
CN105458552A (en) | High-performance tin wire soldering flux for automatic tin soldering and preparation method of high-performance tin wire soldering flux | |
CN104889596B (en) | A kind of production technology of low-temperature lead-free tin cream and its weld-aiding cream | |
CN107160052B (en) | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof | |
CN101972906B (en) | Lead-free environmentally friendly soldering flux and preparation method thereof | |
CN107150190B (en) | A kind of scaling powder and preparation method thereof | |
CN102554489A (en) | Low-rosin halogen and lead-free solder paste and preparation method thereof | |
CN101352788B (en) | Scaling powder for leadless soldering tin | |
CN103111773A (en) | Scaling powder for lead-free solder paste | |
CN102513735A (en) | Flux paste for high-bismuth content solder paste and preparation method thereof | |
CN102513733A (en) | Flux | |
CN107186387A (en) | A kind of cleaning-free lead-free solder soldering fluid and preparation method thereof | |
CN108555474B (en) | Halogen-free environment-friendly lead-free tin paste and preparation method thereof | |
CN102528329B (en) | Halogen-free and lead-free solder paste and preparation method | |
CN108465984B (en) | Halogen-free water-soluble soldering flux and preparation method thereof | |
CN110091094A (en) | A kind of halogen-free environmental solder(ing) paste and preparation method thereof | |
CN110328466B (en) | Halogen-free cleaning-free soldering flux | |
CN115846939A (en) | Cleaning-free halogen-free high-lead solder paste and preparation method thereof | |
CN102922179B (en) | Halogenless soldering flux for tin and bismuth low-temperature solder wire and preparation method thereof | |
TW201940684A (en) | Rinse agent and method for using rinse agent | |
CN105598602A (en) | Halogen-free soldering flux for high-activity tin wire and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110330 |