CN103111773A - Scaling powder for lead-free solder paste - Google Patents
Scaling powder for lead-free solder paste Download PDFInfo
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- CN103111773A CN103111773A CN2012105361651A CN201210536165A CN103111773A CN 103111773 A CN103111773 A CN 103111773A CN 2012105361651 A CN2012105361651 A CN 2012105361651A CN 201210536165 A CN201210536165 A CN 201210536165A CN 103111773 A CN103111773 A CN 103111773A
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- solder paste
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Abstract
The invention discloses scaling powder for lead-free solder paste. The scaling powder for the lead-free solder paste comprises, by weight, 35.0%-45.0% of colophony, 2.0%-5.0% of activating agent, 3.0%-8.0% of thixotropic agent, 1.5%-3.0% of surface active agent and 0.1%-1.5% of corrosion inhibitor, the other part is solvent. The scaling powder for the lead-free solder paste is wide in viscosity range, good in activity and strong in high temperature oxidation resistance, no halogen residues exist on a welded base plate, washing is not needed, insulation resistance is beyond 108 ohms, and the scaling powder for the lead-free solder paste can be widely applied to the field of welding of electronic materials.
Description
Technical field
The present invention relates to a kind of technical field of welding materials scaling powder, particularly a kind of halogen-free soldering flux for unleaded soldering paste.
Background technology
Along with electronics and IT products towards integrated, microminiaturized, high performance future development, surface mounting technique (SMT) becomes the mainstream technology of Electronic Assemblies gradually, wherein, the use of solder(ing) paste becomes operation crucial in SMT technique, and the performance of solder(ing) paste is determining the quality of electronic product in very large one side.Japan, European Union and the U.S. have promulgated the instruction that bans use of lead and compound thereof, and carry out successively unleaded process, and " the electronics and IT products prevention and cure of pollution management method " that China promulgates also formally implemented, and unleaded process is irresistible.Think the process of leadless soldering tin paste transformation from tin lead welding tin cream, will inevitably run into and a series of all difficulties that bring such as uprise because of the lead-free solder fusing point, traditional scaling powder and Pb-free solder powder match use can not excellent solder(ing) paste, can't satisfy the demand of SMT technique.
Market leadless soldering tin paste scaling powder on sale contains a large amount of halogens mostly, guarantees the activity of tin cream in welding process.But the insulating properties of the excessive halogen meeting butt welding metacoxal plate that brings are thus brought great infringement.A large amount of rosin that use have guaranteed that leadless soldering tin paste has good adhesion, but adhesion cross by force and can affect printing, and different typographies needs the solder(ing) paste of different viscosities scope, so that the thixotropic property of solder(ing) paste just becomes is of crucial importance.
Summary of the invention
The object of the invention is to the problem poor for high-temperature oxidation resistance in prior art, that content of halogen is high, adhesion is higher, a kind of flux for leadless solder paste is provided, guaranteed that effectively leadless soldering tin paste has good antioxygenic property and thixotropic property in welding process, though halogen-freely still maintain good activity in wider temperature range.
For addressing the above problem, the present invention adopts following technical scheme:
A kind of flux for leadless solder paste is characterized in that, the mass percent of each component is respectively, rosin 35.0-45.0%, and activator 2.0-5.0%, thixotropic agent 3.0-8.0%, surfactant 1.5-3.0%, corrosion inhibiter 0.1-1.5%, surplus is solvent.
Described rosin is the mixture of a kind of and newtrex of Foral, water-white rosin, and both weight ratio are 1:3 ~ 5.
Described activator is the mixture of organic acid for activating agent and organic phosphate, and wherein organic acid is in Glycolic acid, lactic acid, tartaric acid, salicylic acid two kinds, and organic phosphate is phytate, and both weight ratio are 4:1.
Described thixotropic agent is a kind of by rilanit special, fatty glyceride, and with a kind of the combining in polyamide, ethylene bis stearic acid amide, both weight ratio are 2 ~ 3:1.
Described surfactant be carbon number be a kind of of 12,14,16 high-carbon fatty alcohol polyoxyethylene ether (AEO) and more than.
Described corrosion inhibiter is a kind of in benzothiazole, benzimidazole, triethylamine.
Described solvent is two kinds or several composition in ethanol, isopropyl alcohol, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether, ethylene glycol ether.
Flux for leadless solder paste of the present invention can be prepared from following methods:
1, a certain amount of solvent of weighing adds in reactor 1, then adds appropriate rosin, is heated to 130-140
oC keeps constant temperature to fusing;
2, add a certain amount of activator, thixotropic agent, surfactant, corrosion inhibiter in another reactor 2, control temperature at 60-80
oC stirs and mixes;
3, the mixed liquor in step 2 is poured in reactor 1, that fully stirs mixes, standing, is cooled to normal temperature, obtains flux for leadless solder paste of the present invention.
Characteristics of the present invention are:
1, selecting weight ratio is the rosin of 1:3 ~ 5, guarantees that tin cream has adhesion preferably, and weight ratio is that the thixotropic agent of 2 ~ 3:1 can obtain the wider solder(ing) paste of range of viscosities, satisfies the demand of the Reflow Soldering of slight gap;
2, active good, halogen-free residual, need not clean, insulaion resistance is 10
8More than ohm;
3, high-temperature oxidation resistance is strong.
The specific embodiment
Describe the present invention in detail below in conjunction with specific embodiment, following embodiment is used for explaining the present invention, but is not limited to following examples.
Embodiment 1
Flux for leadless solder paste, its constituent mass percentage is respectively: Foral 7.0%, newtrex 28.0%, Glycolic acid 2.0%, salicylic acid 2.0%, phytate 1.0%, rilanit special 2.0%, polyamide 1.0%, AEO-12 3.0%, benzothiazole 0.1%, ethanol 23.9%, diethylene glycol monobutyl ether 30.0%.
Embodiment 2
Flux for leadless solder paste, its constituent mass percentage is respectively: water-white rosin 10.0%, newtrex 30.0%, lactic acid 1.0%, tartaric acid 1.8%, phytate 0.7%, fatty glyceride 3.9%, ethylene bis stearic acid amide 1.6%, AEO-14 2.2%, benzimidazole 0.8%, isopropyl alcohol 20.0%, ethylene glycol monobutyl ether 28.0%.
Embodiment 2
Flux for leadless solder paste, its constituent mass percentage is respectively: water-white rosin 7.5%, newtrex 37.5%, Glycolic acid 0.6%, tartaric acid 1.0%, phytate 0.4%, rilanit special 6.0%, ethylene bis stearic acid amide 2.0%, AEO-16 1.5%, triethylamine 1.5%, ethanol 12.0%, isopropyl alcohol 15.0%, ethylene glycol ether 15.0%.
Claims (2)
1. flux for leadless solder paste, it is characterized in that: the mass percent of each component is respectively, rosin 35.0-45.0%, activator 2.0-5.0%, thixotropic agent 3.0-8.0%, surfactant 1.5-3.0%, corrosion inhibiter 0.1-1.5%, surplus is solvent.
2. a kind of flux for leadless solder paste according to claim 1, is characterized in that described rosin is the mixture of a kind of and newtrex of Foral, water-white rosin, and both weight ratio are 1:3 ~ 5.
3. a kind of flux for leadless solder paste according to claim 1, it is characterized in that described activator is the mixture of organic acid for activating agent and organic phosphate, wherein organic acid is in Glycolic acid, lactic acid, tartaric acid, salicylic acid two kinds, organic phosphate is phytate, and both weight ratio are 4:1.
4. a kind of flux for leadless solder paste according to claim 1, it is characterized in that a kind of by rilanit special, fatty glyceride of described thixotropic agent, with a kind of the combining in polyamide, ethylene bis stearic acid amide, both weight ratio are 2 ~ 3:1.
5. a kind of flux for leadless solder paste according to claim 1, is characterized in that described surfactant is that carbon number is 12,14,16 high-carbon fatty alcohol polyoxyethylene ether (AEO).
6. a kind of flux for leadless solder paste according to claim 1 is characterized in that described corrosion inhibiter is a kind of in benzothiazole, benzimidazole, triethylamine.
7. a kind of flux for leadless solder paste according to claim 1, is characterized in that described solvent is two kinds or several composition in ethanol, isopropyl alcohol, diethylene glycol monobutyl ether, ethylene glycol monobutyl ether, ethylene glycol ether.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105361651A CN103111773A (en) | 2012-12-13 | 2012-12-13 | Scaling powder for lead-free solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012105361651A CN103111773A (en) | 2012-12-13 | 2012-12-13 | Scaling powder for lead-free solder paste |
Publications (1)
| Publication Number | Publication Date |
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| CN103111773A true CN103111773A (en) | 2013-05-22 |
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| CN2012105361651A Pending CN103111773A (en) | 2012-12-13 | 2012-12-13 | Scaling powder for lead-free solder paste |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096990A (en) * | 2014-06-20 | 2014-10-15 | 苏州锐耐洁电子科技新材料有限公司 | Novel soldering flux |
| CN104148825A (en) * | 2014-08-12 | 2014-11-19 | 工业和信息化部电子第五研究所华东分所 | Lead-free environment-friendly welding-aid paste |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
| CN105921904A (en) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | No-clean precise printing lead-free solder paste special for mobile phones |
| CN106392377A (en) * | 2016-10-07 | 2017-02-15 | 常州市鼎升环保科技有限公司 | Preparation method for washing-free scaling powder |
| CN107931889A (en) * | 2017-11-20 | 2018-04-20 | 双登集团股份有限公司 | Type scaling powder free of cleaning for lead-acid accumulator manufacture |
| CN108672983A (en) * | 2018-04-13 | 2018-10-19 | 广东中实金属有限公司 | A kind of weld-aiding cream and comprising the weld-aiding cream can normal temperature storage solder(ing) paste |
| CN112621013A (en) * | 2020-12-24 | 2021-04-09 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096990A (en) * | 2014-06-20 | 2014-10-15 | 苏州锐耐洁电子科技新材料有限公司 | Novel soldering flux |
| CN104148825A (en) * | 2014-08-12 | 2014-11-19 | 工业和信息化部电子第五研究所华东分所 | Lead-free environment-friendly welding-aid paste |
| CN104889596A (en) * | 2015-06-16 | 2015-09-09 | 广西南宁迈点装饰工程有限公司 | Low-temperature lead-free tin paste and production technique for paste flux thereof |
| CN105921904A (en) * | 2016-06-16 | 2016-09-07 | 深圳市唯特偶新材料股份有限公司 | No-clean precise printing lead-free solder paste special for mobile phones |
| CN106392377A (en) * | 2016-10-07 | 2017-02-15 | 常州市鼎升环保科技有限公司 | Preparation method for washing-free scaling powder |
| CN107931889A (en) * | 2017-11-20 | 2018-04-20 | 双登集团股份有限公司 | Type scaling powder free of cleaning for lead-acid accumulator manufacture |
| CN108672983A (en) * | 2018-04-13 | 2018-10-19 | 广东中实金属有限公司 | A kind of weld-aiding cream and comprising the weld-aiding cream can normal temperature storage solder(ing) paste |
| CN112621013A (en) * | 2020-12-24 | 2021-04-09 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
| CN112621013B (en) * | 2020-12-24 | 2021-07-20 | 常州福伦特无铅焊料有限公司 | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
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Application publication date: 20130522 |