CN104175023A - Halogen-free soldering flux for lead-free solder paste - Google Patents
Halogen-free soldering flux for lead-free solder paste Download PDFInfo
- Publication number
- CN104175023A CN104175023A CN201410179776.4A CN201410179776A CN104175023A CN 104175023 A CN104175023 A CN 104175023A CN 201410179776 A CN201410179776 A CN 201410179776A CN 104175023 A CN104175023 A CN 104175023A
- Authority
- CN
- China
- Prior art keywords
- halogen
- soldering flux
- acid
- free
- unleaded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 59
- 230000004907 flux Effects 0.000 title claims abstract description 33
- 229910000679 solder Inorganic materials 0.000 title abstract description 18
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 15
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000004094 surface-active agent Substances 0.000 claims abstract description 10
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 10
- 150000007524 organic acids Chemical class 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims abstract description 9
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims abstract description 8
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims abstract description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 28
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 14
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 14
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 7
- 239000001361 adipic acid Substances 0.000 claims description 7
- 235000011037 adipic acid Nutrition 0.000 claims description 7
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 claims description 5
- RMJMOIGSWATFGE-UHFFFAOYSA-N 3,4-dimethylpentane-1,4-diol Chemical compound CC(O)(C)C(C)CCO RMJMOIGSWATFGE-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 claims description 3
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- FUGIIBWTNARRSF-UHFFFAOYSA-N decane-5,6-diol Chemical compound CCCCC(O)C(O)CCCC FUGIIBWTNARRSF-UHFFFAOYSA-N 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- MCSAJNNLRCFZED-UHFFFAOYSA-N nitroethane Chemical compound CC[N+]([O-])=O MCSAJNNLRCFZED-UHFFFAOYSA-N 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- KLZYRCVPDWTZLH-UHFFFAOYSA-N 2,3-dimethylsuccinic acid Chemical compound OC(=O)C(C)C(C)C(O)=O KLZYRCVPDWTZLH-UHFFFAOYSA-N 0.000 claims description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- NDSYZZUVPRGESW-UHFFFAOYSA-N 2-(2-octoxyethoxy)ethanol Chemical compound CCCCCCCCOCCOCCO NDSYZZUVPRGESW-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 229910052736 halogen Inorganic materials 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 230000001105 regulatory effect Effects 0.000 abstract description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 235000005985 organic acids Nutrition 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 5
- 239000001384 succinic acid Substances 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 241000500881 Lepisma Species 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229940023462 paste product Drugs 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention relates to the technical field of welding materials, in particular to a halogen-free soldering flux for lead-free solder paste. The halogen-free soldering flux for the lead-free solder paste comprises the following components in percentage by mass: 20 to 35 percent of solvent, 30 to 45 percent of rosin, 5 to 10 percent of surfactant, 10 to 20 percent of organic acid, 3 to 10 percent of antioxidant and 2 to 8 percent of thixotropic agent. According to the halogen-free soldering flux, a rosin mixture consisting of hydrogenated rosin and polymerized rosin at a weight ratio of 1:(1-3) is adopted, so that higher adhesive force of the solder paste is ensured; the proportion of the solvent and the rosin in the soldering flux is regulated, so that the viscosity range of the solder paste is wider; by the compounding of multiple organic acids, the prepared soldering flux is free of halogen, and has higher activity; the antioxidant for preparing the soldering flux is one or a combination of more than two of methylbenzotriazole, an antioxidant BHT, CHIMASSORB3030, benzimidazole and methylimidazole; the solder paste prepared from the soldering flux is long in service life, and has good de-molding effects.
Description
Technical field
The present invention relates to technical field of welding materials, be specifically related to a kind of halogen-free soldering flux for unleaded soldering paste.
Background technology
Along with the develop rapidly of electronic technology, electronics and IT products are towards microminiaturized, integrated, multifunction future development, and surface installation technique has become the mainstream technology in Electronic Assemblies field.Solder(ing) paste is to be accompanied by a kind of Novel welding material that surface installation technique arises at the historic moment, and the quality of solder(ing) paste directly affects the quality of welding.Traditional solder(ing) paste product is mixed and is formed by tin slicker solder powder and scaling powder, and along with the progress of technology in recent years and the people growing interest to self and environment, unleaded glass putty has replaced tin slicker solder powder gradually.From there being lead welding tin cream to change to leadless soldering tin paste, some technical barriers when having adapted to environmental requirement, are also brought, traditional scaling powder mixes with unleaded glass putty the solder(ing) paste poor-performing making mutually, postwelding halogen residue thing is many, insulating properties is not high enough, bring great potential safety hazard to the dependability of product, cannot meet the demand of surface mounting technique.
Summary of the invention
The object of the invention is to for the problem that in prior art, solder(ing) paste content of halogen is high, high-temperature oxidation resistance is poor, provide that a kind of activity is high, halogen-free, thixotropy and high-temperature oxidation resistance is good, the wider halogen-free soldering flux for unleaded soldering paste of range of viscosities.
Technical solution of the present invention:
A kind of halogen-free soldering flux for unleaded soldering paste, is characterized in that: each component and mass percent are solvent: rosin: surfactant: organic acid: antioxidant: thixotropic agent=20% ~ 35%:30% ~ 45%:5% ~ 10%:10% ~ 20%:3% ~ 10%:2% ~ 8%.
Described solvent is one or more compositions in dibutyl ethylene glycol ether, diethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether, dipropylene glycol methyl ether, diethylene glycol monohexyl ether, nitroethane, diethylene glycol octyl ether, tripropylene glycol butyl ether, triethylene glycol butyl ether.
Described rosin is the mixture of Foral and newtrex, and both part by weight are 1:1 ~ 3.
Described surfactant is one or both in TX-10 phosphate, rosin ether surface active agent, GE-511, trimethyl butylene glycol, Surfynol 104E.
Described organic acid is at least two or more combinations in itaconic acid, stearic acid, decanedioic acid, succinic acid, adipic acid, glutaric acid, suberic acid, tetradecylic acid, di-propionic acid, p-tert-butyl benzoic acid, dimethyl succinic acid.
Described antioxidant is one or more combinations in methyl benzotriazazole, antioxidant BHT, CHIMASSORB 3030, benzimidazole, methylimidazole.
Described thixotropic agent is at least one in thixotropic agent 7500, modified hydrogenated castor oil, ethylenebis stearic amide.
A kind of halogen-free soldering flux for unleaded soldering paste preparation technology, comprises the following steps:
(1) weigh according to the above ratio solvent, rosin and surfactant and join in reaction vessel, be heated to 100-120 DEG C, be stirred to completely and dissolve;
(2) after mixture step (1) being obtained is cooled to 80-100 DEG C, add organic acid and antioxidant, be stirred to completely and dissolve;
(3) after being cooled to 50-70 DEG C, mixture step (2) being obtained adds thixotropic agent, be stirred to completely and dissolve, be cooled to 20-25 DEG C, solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, makes halogen-free soldering flux for unleaded soldering paste of the present invention.
Beneficial effect of the present invention:
(1) to select weight ratio be Foral and the newtrex mixture rosin of 1:1 ~ 3 to scaling powder of the present invention, ensures that solder(ing) paste has good adhesion, by regulating the ratio of solvent and rosin in scaling powder, can obtain the wider solder(ing) paste of range of viscosities;
(2) scaling powder of the present invention is composite by multiple organic acid, and the scaling powder making is not only not halogen-containing but also have a higher activity;
(3) preparing scaling powder of the present invention antioxidant used is one or more combinations in methyl benzotriazazole, antioxidant BHT, CHIMASSORB 3030, benzimidazole, methylimidazole, the solder(ing) paste long service life that this scaling powder makes and have good stripping result.
Detailed description of the invention
Embodiment 1
By diethylene glycol monohexyl ether 48g, Foral 40g, newtrex 40g and TX-10 phosphate 12g join in reaction vessel, are heated to 100 DEG C, are stirred to completely and dissolve; Be cooled to 85 DEG C, add tetradecylic acid 16g, succinic acid 3g, adipic acid 6g, glutaric acid 9g, suberic acid 2g, methyl benzotriazazole 2g and methylimidazole 10g, be stirred to completely and dissolve; Be cooled to 70 DEG C, add modified hydrogenated castor oil 12g, be stirred to completely and dissolve, be cooled to 23 DEG C, the solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, obtain halogen-free soldering flux for unleaded soldering paste 196g.
Embodiment 2
A kind of halogen-free soldering flux for unleaded soldering paste, by diethylene glycol butyl ether 46g, Foral 30g, newtrex 50g and Surfynol 104E 14g join in reaction vessel, are heated to 108 DEG C, are stirred to completely and dissolve; Be cooled to 90 DEG C, add p-tert-butyl benzoic acid 12g, stearic acid 4g, succinic acid 4g, adipic acid 7g, glutaric acid 8g, suberic acid 2g, CHIMASSORB 3030 3g and benzimidazole 12g, be stirred to completely and dissolve; Be cooled to 50 DEG C, add ethylenebis stearic amide 8g, be stirred to completely and dissolve, be cooled to 20 DEG C, the solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, obtain halogen-free soldering flux for unleaded soldering paste 194g.
Embodiment 3
A kind of halogen-free soldering flux for unleaded soldering paste, by dibutyl ethylene glycol ether 58g, Foral 36g, newtrex 40g and rosin ether surface active agent 10g join in reaction vessel, are heated to 116 DEG C, are stirred to completely and dissolve; Be cooled to 80 DEG C, add di-propionic acid 14g, succinic acid 4g, adipic acid 5g, glutaric acid 7g, suberic acid 2g, methyl benzotriazazole 2g and methylimidazole 12g, be stirred to completely and dissolve; Be cooled to 65 DEG C, add thixotropic agent 7500 10g, be stirred to completely and dissolve, be cooled to 22 DEG C, the solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, obtain halogen-free soldering flux for unleaded soldering paste 193g.
Embodiment 4
A kind of halogen-free soldering flux for unleaded soldering paste, by diethylene glycol monohexyl ether 48g, nitroethane 4g, Foral 40g, newtrex 40g, GE-511 8g and trimethyl butylene glycol 4g join in reaction vessel, are heated to 120 DEG C, are stirred to completely and dissolve; Be cooled to 100 DEG C, add tetradecylic acid 18g, succinic acid 2g, adipic acid 4g, glutaric acid 8g, suberic acid 3g, antioxidant BHT 2g and methylimidazole 10g, be stirred to completely and dissolve; Be cooled to 60 DEG C, add ethylenebis stearic amide 9g, be stirred to completely and dissolve, be cooled to 21 DEG C, the solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, obtain halogen-free soldering flux for unleaded soldering paste 191g.
Embodiment 5
A kind of halogen-free soldering flux for unleaded soldering paste, by diethylene glycol monohexyl ether 48g, Foral 41g, newtrex 41g, GE-511 8g and trimethyl butylene glycol 5g join in reaction vessel, are heated to 110 DEG C, are stirred to completely and dissolve; Be cooled to 90 DEG C, add tetradecylic acid 18g, succinic acid 2g, adipic acid 4g, glutaric acid 8g, suberic acid 4g, antioxidant BHT 2g and methylimidazole 10g, be stirred to completely and dissolve; Be cooled to 60 DEG C, add ethylenebis stearic amide 9g, be stirred to completely and dissolve, be cooled to 23 DEG C,, the solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, obtain halogen-free soldering flux for unleaded soldering paste 195g.
The scaling powder making by above embodiment and Sn-Ag-Cu are associated bronze and are mixed and made into solder(ing) paste, detect according to GB/T 9491-2002, SJ/T 11186-2009 standard, and properties testing result is as table 1.
Table 1 embodiment 1 ~ 5 performance test results
As can be seen from Table 1: halogen-free soldering flux for unleaded soldering paste of the present invention is not halogen-containing, wetability well all reaches the more than 2 grades requirement of standard; Solder(ing) paste range of viscosities is wider; Surface insulation resistance value, far above standard-required, meets electric insulation requirement; Postwelding bronze mirror corrodes without penetrability; The maximum bridging spacing that cold/heat is caved in is 0.06/0.10mm, has good printing, thixotropic property, meets the requirement of high density thin space Full Vision technique completely.
Claims (8)
1. a halogen-free soldering flux for unleaded soldering paste, is characterized in that: each component and mass percent are solvent: rosin: surfactant: organic acid: antioxidant: thixotropic agent=20% ~ 35%:30% ~ 45%:5% ~ 10%:10% ~ 20%:3% ~ 10%:2% ~ 8%.
2. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described solvent is one or more compositions in dibutyl ethylene glycol ether, diethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether, dipropylene glycol methyl ether, diethylene glycol monohexyl ether, nitroethane, diethylene glycol octyl ether, tripropylene glycol butyl ether, triethylene glycol butyl ether.
3. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described rosin is the mixture of Foral and newtrex, both part by weight are 1:1 ~ 3.
4. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described surfactant is one or both in TX-10 phosphate, rosin ether surface active agent, GE-511, trimethyl butylene glycol, Surfynol 104E.
5. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described organic acid is at least two or more combinations in itaconic acid, stearic acid, decanedioic acid, succinic acid, adipic acid, glutaric acid, suberic acid, tetradecylic acid, di-propionic acid, p-tert-butyl benzoic acid, dimethyl succinic acid.
6. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described antioxidant is one or more combinations in methyl benzotriazazole, antioxidant BHT, CHIMASSORB 3030, benzimidazole, methylimidazole.
7. a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, is characterized in that: described thixotropic agent is at least one in thixotropic agent 7500, modified hydrogenated castor oil, ethylenebis stearic amide.
8. preparation a kind of halogen-free soldering flux for unleaded soldering paste as claimed in claim 1, comprises the following steps:
(1) weigh according to the above ratio solvent, rosin and surfactant and join in reaction vessel, be heated to 100-120 DEG C, be stirred to completely and dissolve;
(2) after mixture step (1) being obtained is cooled to 80-100 DEG C, add organic acid and antioxidant, be stirred to completely and dissolve;
(3) after being cooled to 50-70 DEG C, mixture step (2) being obtained adds thixotropic agent, be stirred to completely and dissolve, be cooled to 20-25 DEG C, solid particle fineness in mixed solution is ground to below 10 μ m with three-roll grinder, makes halogen-free soldering flux for unleaded soldering paste of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410179776.4A CN104175023A (en) | 2014-04-30 | 2014-04-30 | Halogen-free soldering flux for lead-free solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410179776.4A CN104175023A (en) | 2014-04-30 | 2014-04-30 | Halogen-free soldering flux for lead-free solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104175023A true CN104175023A (en) | 2014-12-03 |
Family
ID=51956521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410179776.4A Pending CN104175023A (en) | 2014-04-30 | 2014-04-30 | Halogen-free soldering flux for lead-free solder paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104175023A (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722959A (en) * | 2015-03-31 | 2015-06-24 | 北京航空航天大学 | Soldering flux for aluminum alloy low-temperature brazing |
| CN105290647A (en) * | 2015-11-13 | 2016-02-03 | 北京达博长城锡焊料有限公司 | Organic scaling powder for frequency conversion refrigerator welding materials and preparing method |
| CN106670680A (en) * | 2017-02-17 | 2017-05-17 | 广州适普电子有限公司 | Scaling powder capable of preventing head-in-pillow effect and preparation method and application thereof |
| CN107088716A (en) * | 2017-07-03 | 2017-08-25 | 中山翰华锡业有限公司 | A kind of environment-friendly low-temperature noresidue tin cream and preparation method thereof |
| CN107447220A (en) * | 2017-07-26 | 2017-12-08 | 苏州天承化工有限公司 | A kind of chromium-free environment-friendly antioxidant and preparation method |
| CN107617832A (en) * | 2017-10-20 | 2018-01-23 | 东莞市华粤焊锡制品有限公司 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
| CN107695561A (en) * | 2017-11-03 | 2018-02-16 | 张家港市东大工业技术研究院 | A kind of spray printing low viscosity leadless soldering tin paste and its preparation technology |
| CN108472771A (en) * | 2016-01-15 | 2018-08-31 | 千住金属工业株式会社 | Scaling powder |
| CN109093290A (en) * | 2018-08-31 | 2018-12-28 | 安徽红桥金属制造有限公司 | A kind of scaling powder that can be reduced weldment residue and improve welding efficiency |
| CN110303273A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module |
| CN111906472A (en) * | 2020-08-10 | 2020-11-10 | 云南锡业锡材有限公司 | Solder wire soldering flux capable of reducing splashing and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
| CN114101972A (en) * | 2021-10-29 | 2022-03-01 | 江苏正能电子科技有限公司 | SMT soldering paste with high wetting dispersibility and weather resistance and preparation method thereof |
| CN114273820A (en) * | 2021-12-30 | 2022-04-05 | 云南锡业锡材有限公司 | High-lead soldering tin paste soldering flux and preparation method thereof |
| CN114559181A (en) * | 2022-04-13 | 2022-05-31 | 邢台福润德化工有限公司 | Photovoltaic cleaning-free soldering flux and preparation method thereof |
| CN116174997A (en) * | 2023-02-25 | 2023-05-30 | 东莞市千岛金属锡品有限公司 | Lead-free halogen-free soldering paste and preparation process thereof |
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| CN101934437A (en) * | 2010-09-30 | 2011-01-05 | 常州市亚太微电子材料有限公司 | Unleaded solder paste and preparation method thereof |
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| JP2007069260A (en) * | 2005-09-09 | 2007-03-22 | Uchihashi Estec Co Ltd | Flux composition for resin flux cored solder, and resin flux cored solder |
| CN101934437A (en) * | 2010-09-30 | 2011-01-05 | 常州市亚太微电子材料有限公司 | Unleaded solder paste and preparation method thereof |
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Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104722959A (en) * | 2015-03-31 | 2015-06-24 | 北京航空航天大学 | Soldering flux for aluminum alloy low-temperature brazing |
| CN105290647A (en) * | 2015-11-13 | 2016-02-03 | 北京达博长城锡焊料有限公司 | Organic scaling powder for frequency conversion refrigerator welding materials and preparing method |
| CN105290647B (en) * | 2015-11-13 | 2017-08-29 | 北京达博长城锡焊料有限公司 | Frequency conversion refrigerator welding material organic scaling powder and preparation method |
| CN108472771A (en) * | 2016-01-15 | 2018-08-31 | 千住金属工业株式会社 | Scaling powder |
| US11571772B2 (en) | 2016-01-15 | 2023-02-07 | Senju Metal Industry Co., Ltd. | Flux |
| CN108472771B (en) * | 2016-01-15 | 2019-05-28 | 千住金属工业株式会社 | Scaling powder |
| CN106670680A (en) * | 2017-02-17 | 2017-05-17 | 广州适普电子有限公司 | Scaling powder capable of preventing head-in-pillow effect and preparation method and application thereof |
| CN106670680B (en) * | 2017-02-17 | 2018-11-23 | 广州适普电子有限公司 | A kind of anti-pillow effect scaling powder and its preparation method and application |
| CN107088716A (en) * | 2017-07-03 | 2017-08-25 | 中山翰华锡业有限公司 | A kind of environment-friendly low-temperature noresidue tin cream and preparation method thereof |
| CN107088716B (en) * | 2017-07-03 | 2020-01-24 | 中山翰华锡业有限公司 | Environment-friendly low-temperature residue-free solder paste and preparation method thereof |
| CN107447220A (en) * | 2017-07-26 | 2017-12-08 | 苏州天承化工有限公司 | A kind of chromium-free environment-friendly antioxidant and preparation method |
| CN107617832A (en) * | 2017-10-20 | 2018-01-23 | 东莞市华粤焊锡制品有限公司 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
| CN107695561A (en) * | 2017-11-03 | 2018-02-16 | 张家港市东大工业技术研究院 | A kind of spray printing low viscosity leadless soldering tin paste and its preparation technology |
| CN109093290A (en) * | 2018-08-31 | 2018-12-28 | 安徽红桥金属制造有限公司 | A kind of scaling powder that can be reduced weldment residue and improve welding efficiency |
| CN110303273A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module |
| CN111906472A (en) * | 2020-08-10 | 2020-11-10 | 云南锡业锡材有限公司 | Solder wire soldering flux capable of reducing splashing and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
| CN114101972A (en) * | 2021-10-29 | 2022-03-01 | 江苏正能电子科技有限公司 | SMT soldering paste with high wetting dispersibility and weather resistance and preparation method thereof |
| CN114273820A (en) * | 2021-12-30 | 2022-04-05 | 云南锡业锡材有限公司 | High-lead soldering tin paste soldering flux and preparation method thereof |
| CN114559181A (en) * | 2022-04-13 | 2022-05-31 | 邢台福润德化工有限公司 | Photovoltaic cleaning-free soldering flux and preparation method thereof |
| CN116174997A (en) * | 2023-02-25 | 2023-05-30 | 东莞市千岛金属锡品有限公司 | Lead-free halogen-free soldering paste and preparation process thereof |
| CN116174997B (en) * | 2023-02-25 | 2023-08-25 | 东莞市千岛金属锡品有限公司 | Lead-free halogen-free soldering paste and preparation process thereof |
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