CN107617832A - Anti- fried soldering tin cream scaling powder and preparation method thereof - Google Patents
Anti- fried soldering tin cream scaling powder and preparation method thereof Download PDFInfo
- Publication number
- CN107617832A CN107617832A CN201710980974.4A CN201710980974A CN107617832A CN 107617832 A CN107617832 A CN 107617832A CN 201710980974 A CN201710980974 A CN 201710980974A CN 107617832 A CN107617832 A CN 107617832A
- Authority
- CN
- China
- Prior art keywords
- fried
- scaling powder
- tin cream
- soldering tin
- cream scaling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides the anti-each component fried soldering tin cream scaling powder, include following weight：Thickener 3.5 6%, organic mixed acid 0 15%, mixed solvent 50 75%, surfactant 3 5%, white oil 3 10%, thixotropic agent 1 2%, corrosion inhibiter 3 8%, rosin 1 4%.The thickener is polyamide modified rilanit special.The invention provides anti-fried soldering tin cream scaling powder, and after solving the placement for a long time of existing solder(ing) paste, the technical problem of easy fried tin, formula is simple, cheap.
Description
Technical field
The present invention relates to technical field of soldering paste, in particular it relates to anti-fried soldering tin cream scaling powder and preparation method thereof.
Background technology
Solder(ing) paste is mixed by solder powder, scaling powder and other surfactants, thixotropic agent etc., the cream of formation
Shape mixture.Solder(ing) paste has certain viscosity at normal temperatures, electronic component just can be bonded at into commitment positions, in welding temperature
Under, with the volatilization of solvent and portions additive, it will be formed together with printed circuit pad solder by weldering component and forever connected
Connect.It is mainly used in the welding of the electronic components such as SMT industry PCB surfaces resistance, electric capacity, IC.
At present, conventional solder(ing) paste easily fries tin, and this aspect is due to that storage is improper, and environment temperature is unstable, Shi Gao
When it is low so that cold and heat succeed each other on the inside of tin cream bottle, form the globule and enter tin cream；On the other hand it is that tin cream does not return by suitable
Temperature, made moist in atmosphere after uncapping.
The content of the invention
For overcome the deficiencies in the prior art, the invention provides anti-fried soldering tin cream scaling powder, solves existing scolding tin
After cream is placed for a long time, the technical problem of tin is easily fried, formula is simple, cheap.
Technical scheme is as follows：Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is one or more mixtures in succinic acid, tetracosanoic acid, salicylic acid.
Described mixed solvent is diethylene glycol hexyl ether, tetrahydrofurfuryl alcohol, one or more mixed in dibromo butene glycol
Compound.
The corrosion inhibiter is BTA, nitrogen azoles or the mixture of the two.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
Rilanit special is the thickener commonly used in solder(ing) paste, however, rilanit special (fusing point is 85-87 DEG C) part is molten
Solution loses rheological characteristic in solvent.When scaling powder is cooled to room temperature, and separated out from scaling powder, form the attached of softness
Polymers, fineness is thicker, and thick phenomenon is returned in formation, and rheological characteristic is deteriorated.Polyamide modified rilanit special used herein, overcomes
The defects of rilanit special, it is thick to avoid thicker and vacation, has broader temperature in use, can be in aliphatic hydrocarbon or aromatic hydrocarbon solvent
Dissolving.In the application, the dosage of polyamide modified rilanit special is 3.5-6%, best with 5%.Solder(ing) paste is being stored and transported
When defeated, stable is suspended in scaling powder system.The adhesion strength of solder(ing) paste and the dosage of polyamide modified rilanit special are close
It is related.When the dosage of polyamide modified rilanit special is 3.5-5%, with the increasing of polyamide modified rilanit special dosage
Greatly, solder(ing) paste viscosity increases, and is 5-6% in the dosage of polyamide modified rilanit special, with polyamide modified hydrogenated castor
The increase of oily dosage, solder(ing) paste viscosity reduce.The increase of solder(ing) paste viscosity, avoid the generation of fried tin during scolding tin.
In anti-fried soldering tin cream scaling powder of the present invention, containing white oil, thermal source is completely cut off, has prevented scaling powder to greatest extent
With the cold and hot change of environment temperature, prevent moisture from entering scaling powder, avoid fried tin.
Beneficial effects of the present invention are：The anti-fried soldering tin cream scaling powder, solder(ing) paste adhesion strength, scaling powder will not be with
The cold and hot change of environment temperature, prevent the moisture in air from entering scaling powder, avoid fried tin, its preparation method is simple, and solder(ing) paste glues
Spend.
Embodiment
In order that the goal of the invention of the present invention, technical scheme and technique effect are more clearly understood, with reference to specific reality
Applying mode, the present invention is described further.It should be understood that specific embodiment described herein, is only used for explaining the present invention,
It is not intended to limit the present invention.
Embodiment 1
Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is succinic acid, tetracosanoic acid and salicylic acid.
Described mixed solvent is the mixture of tetrahydrofurfuryl alcohol and dibromo butene glycol.
The corrosion inhibiter is BTA, the mixture of nitrogen azoles.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
Embodiment 2
Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is succinic acid and tetracosanoic acid.
Described mixed solvent is the mixture of diethylene glycol hexyl ether and dibromo butene glycol.
The corrosion inhibiter is BTA mixture.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
Embodiment 3
Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is tetracosanoic acid and salicylic mixture.
Described mixed solvent is dibromo butene glycol.
The corrosion inhibiter is nitrogen azoles.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
Embodiment 4
Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is succinic acid.
Described mixed solvent is the mixture of diethylene glycol hexyl ether and tetrahydrofurfuryl alcohol.
The corrosion inhibiter is BTA.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
Embodiment 5
Anti- fried soldering tin cream scaling powder, include each component of following weight：
The thickener is polyamide modified rilanit special.
Organic mixed acid is tetracosanoic acid.
Described mixed solvent is diethylene glycol hexyl ether.
The corrosion inhibiter is BTA, the mixture of nitrogen azoles.
The preparation method of the anti-fried soldering tin cream scaling powder, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, is heated to 100-120 DEG C, mixing
Uniformly obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed,
Obtain mixtures II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to 10um with
Under, white oil and corrosion inhibiter are added, is mixed, filtering, except defoaming and insoluble matter, the anti-fried soldering tin cream is obtained and helps weldering
Agent.
In order to verify the technique effect of the present invention, solder(ing) paste is made with the thin alloyed powders of Sn-Ag-Cu in the present invention, with commercially available weldering
Tin cream scaling powder is control, according to GB/T991-2002, prevents fried tin described in ST/J11186-2009 standard detections embodiment 1-5
The performance of solder(ing) paste scaling powder, detection method and testing result such as table 1 below：
The performance of fried soldering tin cream scaling powder is prevented described in the embodiment 1-5 of table 1
| Embodiment | Control | 1 | 2 | 3 | 4 | 5 |
| Viscosity Pa.S | 180 | 237 | 230 | 235 | 240 | 238 |
| The cold and hot mm that caves in | 0.06/0.10 | 0.06/0.10 | 0.06/0.10 | 0.06/0.10 | 0.06/0.10 | 0.06/0.10 |
| Tin sweat(ing) rank | I levels | I levels | I levels | I levels | I levels | I levels |
| Surface insulation resistance (Ω) | 5.8X1011 | 5.8X1011 | 6.0X1011 | 5.8X1011 | 5.6X1011 | 6.2X1011 |
| Whether there is fried tin | Have | Nothing | Nothing | Nothing | Nothing | Nothing |
Above content is to combine specific preferred embodiment further description made for the present invention, it is impossible to is assert
The specific implementation of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of not departing from present inventive concept, its framework form can be flexible and changeable, can be with subseries product.Simply make some
Simple deduction or replace, it should all be considered as belonging to the scope of patent protection that the present invention is determined by the claims submitted.
Claims (5)
1. anti-fried soldering tin cream scaling powder, it is characterised in that include each component of following weight：
The thickener is polyamide modified rilanit special.
2. soldering tin cream scaling powder as claimed in claim 1 anti-fried, it is characterised in that organic mixed acid be succinic acid,
One or more mixtures in tetracosanoic acid, salicylic acid.
3. anti-fried soldering tin cream scaling powder as claimed in claim 1, it is characterised in that described mixed solvent is diethylene glycol
One or more mixtures in hexyl ether, tetrahydrofurfuryl alcohol, dibromo butene glycol.
4. soldering tin cream scaling powder as claimed in claim 1 anti-fried, it is characterised in that the corrosion inhibiter be BTA,
Nitrogen azoles or the mixture of the two.
5. the preparation method of the anti-fried soldering tin cream scaling powder described in claim any one of 1-4, comprises the following steps：
(1) each component is weighed, rosin and surfactant are added in reaction vessel, are heated to 100-120 DEG C, is well mixed
Obtain mixture I；
(2) organic mixed acid, mixed solvent, thixotropic agent, thickener are added in another reaction vessel, are well mixed, obtain mixed
Compound II；
(3) mixture I is cooled to room temperature, adds mixtures II, with three-roll grinder abrasive solid particle to below 10um, add
Enter white oil and corrosion inhibiter, mix, filtering, except defoaming and insoluble matter, obtain the anti-fried soldering tin cream scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980974.4A CN107617832A (en) | 2017-10-20 | 2017-10-20 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980974.4A CN107617832A (en) | 2017-10-20 | 2017-10-20 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107617832A true CN107617832A (en) | 2018-01-23 |
Family
ID=61092100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710980974.4A Pending CN107617832A (en) | 2017-10-20 | 2017-10-20 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107617832A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526758A (en) * | 2018-04-16 | 2018-09-14 | 东莞市华粤焊锡制品有限公司 | Solder(ing) paste scaling powder and preparation method thereof |
| CN111040632A (en) * | 2019-12-26 | 2020-04-21 | 无锡市斯威克科技有限公司 | Photovoltaic precoating material, precoating welding strip and preparation method thereof |
| CN111745323A (en) * | 2020-07-01 | 2020-10-09 | 云南锡业锡材有限公司 | Low-solid-content soldering flux for pressure hot-melt solder paste spot coating and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN104175023A (en) * | 2014-04-30 | 2014-12-03 | 江苏博迁新材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN106181117A (en) * | 2016-07-07 | 2016-12-07 | 兰州理工大学 | A kind of money base solder paste and preparation method thereof |
| CN106271221A (en) * | 2016-09-09 | 2017-01-04 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
-
2017
- 2017-10-20 CN CN201710980974.4A patent/CN107617832A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101073862A (en) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN104175023A (en) * | 2014-04-30 | 2014-12-03 | 江苏博迁新材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN106181117A (en) * | 2016-07-07 | 2016-12-07 | 兰州理工大学 | A kind of money base solder paste and preparation method thereof |
| CN106271221A (en) * | 2016-09-09 | 2017-01-04 | 成都九十度工业产品设计有限公司 | A kind of scaling powder for leadless soldering tin paste |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108526758A (en) * | 2018-04-16 | 2018-09-14 | 东莞市华粤焊锡制品有限公司 | Solder(ing) paste scaling powder and preparation method thereof |
| CN111040632A (en) * | 2019-12-26 | 2020-04-21 | 无锡市斯威克科技有限公司 | Photovoltaic precoating material, precoating welding strip and preparation method thereof |
| CN111745323A (en) * | 2020-07-01 | 2020-10-09 | 云南锡业锡材有限公司 | Low-solid-content soldering flux for pressure hot-melt solder paste spot coating and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104889596B (en) | A kind of production technology of low-temperature lead-free tin cream and its weld-aiding cream | |
| CN102785039B (en) | Solder paste and preparation method thereof | |
| CN108655606B (en) | Formula and preparation method of low-melting-point SMT soldering paste | |
| CN107617832A (en) | Anti- fried soldering tin cream scaling powder and preparation method thereof | |
| CN102039497B (en) | Lead-free paste flux | |
| CN105618953B (en) | A kind of lead-free and halogen-free roller coating tin cream and preparation method thereof | |
| CN107000133A (en) | Soldering paste scaling powder, soldering paste and soldered joint body | |
| CN104175024A (en) | High-performance lead-free halogen-free soldering flux for soldering paste and preparing method of soldering flux | |
| CN104175023A (en) | Halogen-free soldering flux for lead-free solder paste | |
| CN107570911A (en) | A kind of lead-free high-temperature solder(ing) paste for being used for mobile phone, computer main board and preparation method thereof | |
| CN101780606A (en) | Washing-free lead-free halogen-free tin soldering paste | |
| CN103212923A (en) | High temperature resistant rosinyl scaling powder | |
| CN104107989A (en) | High-temperature semiconductor solid crystal solder paste and preparation method thereof | |
| CN101733573B (en) | Lead-free and halogen-free environmental soldering paste for electronic industry | |
| CN106205773A (en) | A kind of rare earth thick film circuit electrode slurry based on stainless steel substrate and preparation method thereof | |
| CN104526185A (en) | High-stability SMT (Surface Mount Technology) low-temperature solder paste soldering flux and preparation method thereof | |
| CN101352788B (en) | Scaling powder for leadless soldering tin | |
| CN103980854A (en) | Novel conductive adhesive and preparation method thereof | |
| CN104175025A (en) | Halogen-free soldering flux for lead-containing solder paste | |
| CN105921905A (en) | Environment-friendly soldering paste and preparing method thereof | |
| CN103706961B (en) | Halogen-free tin paste | |
| CN108555474B (en) | Halogen-free environment-friendly lead-free tin paste and preparation method thereof | |
| CN106944767A (en) | High lead semiconductor weld-aiding cream, preparation method and tin cream | |
| CN104476018B (en) | A kind of special solder paster of paster welding diode | |
| CN108526758A (en) | Solder(ing) paste scaling powder and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20220517 |
|
| AD01 | Patent right deemed abandoned |