CN106181117A - A kind of money base solder paste and preparation method thereof - Google Patents
A kind of money base solder paste and preparation method thereof Download PDFInfo
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- CN106181117A CN106181117A CN201610532403.XA CN201610532403A CN106181117A CN 106181117 A CN106181117 A CN 106181117A CN 201610532403 A CN201610532403 A CN 201610532403A CN 106181117 A CN106181117 A CN 106181117A
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- powder
- solder
- solder paste
- sodium silicate
- saturated sodium
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of money base solder paste and preparation method thereof, by mass percentage, its component is: Ag Cu Zn solder alloy powder 75%～80%, fluoride silver brazing flux powder 10%～14%, saturated sodium silicate aqueous solution 7%～8%, white oil 2%～3%, alkylphenol polyoxyethylene 1%～2%；Preparation method the steps include: that Ag base solder ingot is made the powder about 200 mesh by (1)；Then, choose the solder powder of 75%～80% and the fluoride silver brazing flux powder of 10%～14% by mass percentage, stir with Glass rod so that it is uniformly mix；(2) the sodium silicate powder that modulus is 1.8 to 2.0 is dissolved in the distilled water of about 80 DEG C, prepares saturated sodium silicate solution, weigh 7%～8%；(3) white oil of 2%～3% is substantially soluble in the alkylphenol polyoxyethylene of 1%～2%, after mix homogeneously, obtains organic solution；(4) mixture of powders of solder, brazing flux is stirred with saturated sodium silicate solution, put into organic solution wherein, be again stirring for so that it is mix homogeneously, i.e. prepare solder paste.
Description
Technical field
The present invention relates to welding technology field, particularly relate to a kind of paste pricker for diamond bit induction brazing
Material.
Background technology
At present, plant produced manufactures the method that diamond bit mainly uses gas brazing, and not only efficiency is low, easily to environment
Polluting, and by the unstable product quality that gas brazing produces, easily cause the scaling loss of diamond layer, its quality is complete
Technical merit all dependent on workman.The invention provides a kind of solder paste that can be used for high-frequency induction brazing.This solder paste has
Having activity time interval short, environmental pollution is little, and preparation method is easy, the feature of low cost.Before weldering, solder paste precoating is spread on
At welding position, owing to solder paste contains binding agent, curable in initial position in heating process, it is not necessary to auxiliary positioning.Solder
After fusing, by capillary diffusion effect, in atmospheric conditions, it is achieved that high efficiency, high-quality, disposably it is welded into diamond bit
Target.This not only lowers the cost manufacturing diamond bit at present, also simplify welding equipment and technique.
Summary of the invention
It is an object of the invention to provide a kind of money base solder paste and preparation method thereof.
The present invention is a kind of money base solder paste and preparation method thereof, its money base solder paste, by mass percentage, and its component
For Ag-Cu-Zn solder alloy powder 75%～80%, fluoride silver brazing flux powder 10%～14%, saturated sodium silicate aqueous solution 7%～
8%, white oil 2%～3%, alkylphenol polyoxyethylene 1%～2%.
The preparation method of money base solder paste, gets the raw materials ready by the above component, the steps include:
(1) by grinding or the method for atomization, by Ag base solder ingot, Ag:Cu:Zn ≈ 40%:40%:20%, make about 200 mesh
Powder；Then, choose the solder powder of 75%～80% and the fluoride silver brazing flux powder of 10%～14% by mass percentage, use
Glass rod stirs so that it is uniformly mix；
(2) the sodium silicate powder that modulus is 1.8 to 2.0 is dissolved in the distilled water of about 80 DEG C, prepares saturated sodium silicate
Solution, weighs 7%～8%；
(3) white oil of 2%～3% is substantially soluble in the alkylphenol polyoxyethylene of 1%～2%, after mix homogeneously, obtains organic solution；
(4) mixture of powders of solder, brazing flux is stirred with saturated sodium silicate solution, puts into organic solution wherein,
It is again stirring for so that it is mix homogeneously, i.e. prepares solder paste；Then, prepared solder paste is positioned in glass container, seals
Preserve.
The solder paste of the present invention, can realize completing welding under air.Both simplified production technology, improved efficiency, also saved
About cost, improve the quality of product.
Accompanying drawing explanation
Fig. 1 is composite polycrystal-diamond structural representation, and Fig. 2 is the diamond particles location drawing to be welded, and Fig. 3 is alkyl phenol
Polyoxyethylene ether OP-30 active agent molecule schematic diagram, Fig. 4 is that the solder paste of the present invention is in the profit treating that weldment surface varies with temperature
Wet angle, Fig. 5 is circular climbing quality test schematic diagram, and Fig. 6, Fig. 7 are that circle is climbed test result pictorial diagram, and Fig. 8 is that rectangle is climbed
High test schematic diagram, Fig. 9 is that solder paste gap filling performance tests schematic diagram, and Figure 10 is joint filling testing vertical plate plate face size, Figure 11
For joint filling test base plate plate face size, Figure 12 is the thickness of gap filling performance testing vertical plate, base plate, and Figure 13 is Mechanics Performance Testing
Result pictorial diagram, Figure 14 is welding procedure schematic diagram.
Detailed description of the invention
The present invention is a kind of money base solder paste and preparation method thereof, its money base solder paste, by mass percentage, and its component
For Ag-Cu-Zn solder alloy powder 75%～80%, fluoride silver brazing flux powder 10%～14%, saturated sodium silicate aqueous solution 7%～
8%, white oil 2%～3%, alkylphenol polyoxyethylene 1%～2%.
Above-described money base solder paste, by mass percentage, its optimal component is: Ag-Cu-Zn solder alloy powder
76%, fluoride silver brazing flux powder 12%, saturated sodium silicate aqueous solution 7.5%, white oil 3%, alkylphenol polyoxyethylene 1.5%.
The preparation method of money base solder paste, gets the raw materials ready by the above component, the steps include:
(1) by grinding or the method for atomization, by Ag base solder ingot, Ag:Cu:Zn ≈ 40%:40%:20%, make about 200 mesh
Powder；Then, choose the solder powder of 75%～80% and the fluoride silver brazing flux powder of 10%～14% by mass percentage, use
Glass rod stirs so that it is uniformly mix；
(2) the sodium silicate powder that modulus is 1.8 to 2.0 is dissolved in the distilled water of about 80 DEG C, prepares saturated sodium silicate
Solution, weighs 7%～8%；
(3) white oil of 2%～3% is substantially soluble in the alkylphenol polyoxyethylene of 1%～2%, after mix homogeneously, obtains organic solution；
(4) mixture of powders of solder, brazing flux is stirred with saturated sodium silicate solution, puts into organic solution wherein,
It is again stirring for so that it is mix homogeneously, i.e. prepares solder paste；Then, prepared solder paste is positioned in glass container, seals
Preserve.
Composite polycrystal-diamond structural representation is shown in Fig. 1.Diamond compact is made up of two parts, above thin layer be gold
Hard rock layer, lower floor is hard alloy layer.Hard alloy layer is mainly welded on drill bit base steel by brazed diamond drill bit securely
In the groove of body.Fig. 2 is the diamond particles location drawing to be welded, and composite polycrystal-diamond is first embedded in before weldering the recessed of steel matrix
In groove, then solder paste precoating is spread on the commissure on its surface.After solder heat melts, complete welding.Finally, then bore
Head surface plates layer of metal and is finished product.
Fig. 3 is shown in by alkylphenol polyoxyethylene OP-30 active agent molecule schematic diagram.Its one end is lipophilic group, and one end is hydrophilic
Base.It can realize oil and well the dissolving each other of water so that solder paste is prolonged not to be layered, and form special Water-In-Oil and tie
Structure, makes solder paste be not susceptible to dry solidification.
The solder paste utilizing said method and step to prepare has carried out wettability test, circle and rectangle climbing quality and has surveyed
Examination, gap filling performance test, Mechanics Performance Testing.The test surfaces of test specimen is polished with No. 400 carborundum cloths on request, riser
Machined surface is vertical with backplate surface；Thoroughly remove and treat the burr of weldment, burr and the impurity such as greasy dirt, oxide.
Test 1: wettability is tested.
Test uses CNS GB/T11364-1989 " solder spreadability and clearance fillability test method " to carry out, should
Novel solder paste is treating that angle of wetting that weldment surface varies with temperature is as shown in Figure 4.Test result shows: along with brazing temperature
Raising, this novel solder paste gradually steps up in mother metal wettability of the surface.After brazing temperature reaches 700 DEG C, this novel soldering
Cream is respectively provided with preferable wettability at 42CrMo steel and WC carbide surface, and angle of wetting is respectively less than 20 degree.
Test 2: circular climbing quality test.
Circular climbing quality test schematic diagram as it is shown in figure 5, spread on the bottom position of weld seam, induction coil by solder paste precoating
Being positioned at bottom to heat, weld gap is 1.2mm.Test result shows, after solder reaches fusing point fusing, makees through capillary diffusion
With, reversible gravity fills up whole weld seam.Postwelding weldment is through simple process, at the basis of microscopic observation of amplification 200 times, appearance of weld
Attractive in appearance, without obvious weld defect.Test result pictorial diagram is as shown in Figure 6, Figure 7.
Test 3: rectangle climbing quality is tested.
Test uses two block specifications is identical and plate that material is different.The size of test sample is as shown in Figure 8, one of
For 42CrMo steel plate, another block is WC hard alloy steel plate.Two test plate (panel)s cleaned up are made gap be respectively 1.2mm,
The T-shaped sample of 2.0mm, and this solder paste is coated in the bottommost of weld gap, height of specimen is 25mm.Use high frequency induction welding
Machine heats.Result shows: along with the increase of weld gap, the capillary diffusion effect of solder gradually weakens, and climbs filling capacity also
Gradually weaken.When weld gap is 1.2mm, the solder in this solder paste can be climbed summit, more than 25mm.Weld gap is
During 2.0mm, the solder in this solder paste can be climbed 10mm.The actual welds gap of the produced drill bit of factory is less than 1.2mm, institute
Requirement is fully met with this novel solder paste.
Test 4: gap filling performance is tested.
Test uses CNS GB/T11364-1989 " solder spreadability and clearance fillability test method " to carry out, and surveys
Fig. 9 is shown in by examination schematic diagram, and with the size of base plate, the test specimen riser of test is shown in that Figure 10, Figure 11, Figure 12 are marked, wherein riser is that WC is hard
Matter alloy sheets, base plate is 42CrMo high strength steel plate, and the thickness of pad is respectively 1.2mm, 2.0mm.Heater is van-type electric furnace,
After test specimen reaches to test temperature (730 DEG C), it is incubated 50s respectively.Test result shows, when adding the amount abundance of this solder paste,
The weld seam that gap is 1.2mm, 2.0mm can be adequately filled up by it.
Test 5: Mechanics Performance Testing.
Carrying out contrast test with two groups of samples, one group of sample is the solder paste weldering using solder, brazing flux and distilled water to make
Become.Another group sample is to use this novel solder paste to be welded into.Test is according to GB/T11363-1989 " soldering joint strength test side
Method " carry out, all tests are all carried out on the fixture of adjustable fastening, and test material is the cylindric hard alloy of a diameter of 18mm
The cylindric 42CrMo steel of WC and diameter 18mm, joint gap is 1.2mm.Test result shows, the weldering that two kinds of solder pastes are welded
Seam is respectively provided with the highest intensity, and multi-drawing breaking part is respectively positioned on the inside of hard alloy WC mother metal.Wherein, by micro-sight
Examining, the hot-engine sludge of this novel solder paste can be discharged effectively weld seam, and is attached to outside weld seam, plays the work of protection weld seam
With.The pictorial diagram of mechanical experimental results is as shown in Figure 13.
Each Ingredient percent of the novel solder paste of the present invention is shown in Table 1:
FormThe component of novel solder paste and the mass percent (%) of each component
| Ag base solder | Fluoride flux | Saturated sodium silicate aqueous solution | White oil | Organic solvent |
| 75～80 | 10～14 | 7～8 | 2～3 | 1～2 |
In formula, Main Function and the limitation reason of each composition are summarized as follows:
(1) silver-base solder selected can realize the enhanced primary treatment of hard alloy WC and high-strength steel 42CrMo, and silver content
Be 40% silver-base solder fusing point typically more than 650 DEG C, it is possible to achieve on composite polycrystal-diamond there is not stone in diamond layer
Welding is completed while inkization.Test finds, the graphitization temperature of this kind of diamond compact is about about 740 DEG C.The present invention
The welding temperature of solder paste is at about 700 DEG C, and now solder paste is good at the wettability of hard alloy side.In solder paste, institute
Mass percent containing silver-base solder can not be too low, otherwise can not fill up whole weld seam.Otherwise, the amount of brazing flux is not enough to protect pricker
Material, solder occur once aoxidize, moistening and sprawl will become difficulty.
(2) resistance to elevated temperatures of sodium silicate inorganic binding agent is good, the solder paste prepared with it, when 600 DEG C curable in
Pre-coated position, non-volatile, without scaling loss, diamond compact granule can be played fixation.Postwelding, its formed slag
Float on face of weld, serve the effect of protection weld seam.Select sodium silicate make binding agent than common tripotassium phosphate binding agent,
The viscosity of Borax binding agent etc. is big, and the viscosity of sodium silicate increases along with the increase of modulus of water glass, and we select modulus
At the sodium silicate of 1.8～2.0, the solder paste of modest viscosity can be prepared.Modulus is excessive, and solder paste viscosity is excessive, is not easy to
Welding；Modulus is too low, and its viscosity does not reaches positioning requirements during pre-coated.
(3) common fluoride flux QJ102 is used.The fusing point of QJ102 brazing flux is 550 DEG C, is suitable for brazing temperature 600
～the welding of 850 DEG C, also it is the conventional brazing flux of silver-base solder brazing alloy steel, rustless steel and high temperature alloy etc. simultaneously, it can have
Various oxides are removed on effect ground, promote solder cross flow, and chemical composition and each Ingredient percent of QJ102 brazing flux are shown in Table 3.
After QJ102 brazing flux soldering, available quality mark be 15% aqueous citric acid solution scrub the joint of soldering, to prevent remaining pricker
The corrosion of agent.
FormThe chemical composition of QJ102 brazing flux and each Ingredient percent (%)
| KF (is dehydrated) | B2O3(boric anhydride) | KBF4 |
| 40～44 | 33～37 | 21～25 |
(4) purpose of organic solvent and thixotropic agent is selected to be to more they tend to so that the internal component of solder paste stablize, it is simple to long-term
Storage.The thixotropic agent added is white oil, and in atmospheric conditions, the initial boiling point temperature of white oil is at about 300 DEG C.Solder paste is in weldering
Connecing in heating process, generate because white oil composition has white cigarette, consider from environmental angle, the interpolation of white oil wants appropriate.Organic solvent
Belong to high molecular polymer, i.e. alkylphenol polyoxyethylene OP-30, it can with emulsifying white oil and there is hydrophilic (need to be less than 40
DEG C, temperature crosses Macromolecular motion aggravation, and hydrophilic reduces, and oil emulsion will lose its stability), it is achieved sodium silicate solution and white oil
Good mixing, form water in oil special construction, can improve solder paste in cream with extend the storage time.
Using the solder paste of the present invention, the surface first treating weldment before weldering carries out the process such as dedusting, degreasing, subsequently by gold
Hard rock composite sheet granule is embedded in the groove on 42CrMo steel surface successively by specification, is coated in be welded by the solder paste prepared
The surface of part weld seam.Then, by thermocouple end against region to be heated, with high-frequency induction welder, this drill bit is carried out entirety and add
Heat, can carry out brazing operation by Figure 14 welding procedure, and postwelding air cooling is to room temperature.
Claims (3)
1. a money base solder paste, it is characterised in that by mass percentage, its component is: Ag-Cu-Zn solder alloy powder
75%～80%, fluoride silver brazing flux powder 10%～14%, saturated sodium silicate aqueous solution 7%～8%, white oil 2%～3%, alkyl phenol gathers
Oxygen vinyl Ether 1%～2%.
2., according to the money base solder paste described in claims 1, it is characterised in that by mass percentage, its optimal component is:
Ag-Cu-Zn solder alloy powder 76%, fluoride silver brazing flux powder 12%, saturated sodium silicate aqueous solution 7.5%, white oil 3%, alkyl
Phenol polyethenoxy ether 1.5%.
3. the preparation method of money base solder paste, component as described in claims 1 is got the raw materials ready, it is characterised in that the steps include:
(1) by grinding or the method for atomization, by Ag base solder ingot, Ag:Cu:Zn ≈ 40%:40%:20%, make about 200 mesh
Powder；Then, choose the solder powder of 75%～80% and the fluoride silver brazing flux powder of 10%～14% by mass percentage, use
Glass rod stirs so that it is uniformly mix；
(2) the sodium silicate powder that modulus is 1.8 to 2.0 is dissolved in the distilled water of about 80 DEG C, prepares saturated sodium silicate
Solution, weighs 7%～8%；
(3) white oil of 2%～3% is substantially soluble in the alkylphenol polyoxyethylene of 1%～2%, after mix homogeneously, obtains organic solution；
(4) mixture of powders of solder, brazing flux is stirred with saturated sodium silicate solution, puts into organic solution wherein,
It is again stirring for so that it is mix homogeneously, i.e. prepares solder paste；Then, prepared solder paste is positioned in glass container, seals
Preserve.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610532403.XA CN106181117A (en) | 2016-07-07 | 2016-07-07 | A kind of money base solder paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610532403.XA CN106181117A (en) | 2016-07-07 | 2016-07-07 | A kind of money base solder paste and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107617832A (en) * | 2017-10-20 | 2018-01-23 | 东莞市华粤焊锡制品有限公司 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
| CN109014655A (en) * | 2018-08-15 | 2018-12-18 | 佛山市诺普材料科技有限公司 | A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance |
| CN109108524A (en) * | 2018-08-30 | 2019-01-01 | 桂林电子科技大学 | A kind of diamond-nano mattisolda Heat Conduction Material and preparation method thereof |
| CN110666392A (en) * | 2019-10-18 | 2020-01-10 | 郑州机械研究所有限公司 | Adhesive-free self-bonding silver-based solder paste and preparation method thereof |
| CN112756842A (en) * | 2020-12-30 | 2021-05-07 | 福达合金材料股份有限公司 | Silver-based solder paste and preparation method and application thereof |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
| CN113878264A (en) * | 2021-11-10 | 2022-01-04 | 湖南盛华源材料科技有限公司 | Brazing flux paste for hard alloy-tool steel cutter and preparation method thereof |
| WO2023015784A1 (en) * | 2021-08-12 | 2023-02-16 | 郑州机械研究所有限公司 | Braze paste for fluxless brazing of stainless steel and preparation method therefor, copper-manganese-nickel-cobalt braze material, and application |
| CN115889918A (en) * | 2022-12-23 | 2023-04-04 | 郑州机械研究所有限公司 | Brazing method of PDC cutting tooth and PDC cutting tooth |
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| CN107617832A (en) * | 2017-10-20 | 2018-01-23 | 东莞市华粤焊锡制品有限公司 | Anti- fried soldering tin cream scaling powder and preparation method thereof |
| CN109014655A (en) * | 2018-08-15 | 2018-12-18 | 佛山市诺普材料科技有限公司 | A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance |
| CN109108524A (en) * | 2018-08-30 | 2019-01-01 | 桂林电子科技大学 | A kind of diamond-nano mattisolda Heat Conduction Material and preparation method thereof |
| CN110666392A (en) * | 2019-10-18 | 2020-01-10 | 郑州机械研究所有限公司 | Adhesive-free self-bonding silver-based solder paste and preparation method thereof |
| CN112756842A (en) * | 2020-12-30 | 2021-05-07 | 福达合金材料股份有限公司 | Silver-based solder paste and preparation method and application thereof |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
| WO2023015784A1 (en) * | 2021-08-12 | 2023-02-16 | 郑州机械研究所有限公司 | Braze paste for fluxless brazing of stainless steel and preparation method therefor, copper-manganese-nickel-cobalt braze material, and application |
| CN113878264A (en) * | 2021-11-10 | 2022-01-04 | 湖南盛华源材料科技有限公司 | Brazing flux paste for hard alloy-tool steel cutter and preparation method thereof |
| CN113878264B (en) * | 2021-11-10 | 2023-01-31 | 湖南盛华源材料科技有限公司 | Brazing flux paste for hard alloy-tool steel cutter and preparation method thereof |
| CN115889918A (en) * | 2022-12-23 | 2023-04-04 | 郑州机械研究所有限公司 | Brazing method of PDC cutting tooth and PDC cutting tooth |
| CN115889918B (en) * | 2022-12-23 | 2024-03-08 | 郑州机械研究所有限公司 | Brazing method of PDC cutting pick and PDC cutting pick |
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