CN109014655A - A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance - Google Patents
A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance Download PDFInfo
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- CN109014655A CN109014655A CN201810928355.5A CN201810928355A CN109014655A CN 109014655 A CN109014655 A CN 109014655A CN 201810928355 A CN201810928355 A CN 201810928355A CN 109014655 A CN109014655 A CN 109014655A
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- soldering paste
- silver alloy
- scaling powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of silver alloy soldering paste with good dispensing performance, are prepared by the component as follows in terms of mass percentage: resin 1%~10%, thixotropic agent 0.5%~4%, organic solvent 10%~45%, silver solder alloy 55%~80% and scaling powder 15%~35%.The present invention also provides a kind of preparation methods of silver alloy soldering paste with good dispensing performance.Silver alloy soldering paste of the invention passes through the adjustment to scaling powder system, the available scaling powder suitable for different silver alloy matrix, the melting heat of soldering paste entirety is reduced by reducing the melting temperature of complex salt entirety, to improve speed of welding, solve the problems such as existing silver alloy soldering paste service life is shorter, continuity point colloidality can be bad, properties of product are unstable, have many advantages, such as can continuously dispensing, environmental-friendly, service life is long.
Description
Technical field
The present invention relates to a kind of soldering paste more particularly to a kind of silver alloy soldering paste and its preparation with good dispensing performance
Method.
Background technique
Silver alloy soldering paste is used to electronic component being welded on matrix, to obtain good electrical connection, the group of soldering paste
Point, the addition manner of gluing process, dispersing technology and thixotropic agent be the principal element for influencing weldment electrical connection properties.Dispensing
Journey is that soldering paste is potted in injecting type distributor, by controlling the pressure of compressed air for the soldering paste of extra fine quality from needle
Mouth extrudes, accurate place in the specific position of matrix surface, under gravity soldering paste levelling at specific shape film layer,
Realize component and matrix initial connection, then under brazing temperature organic carrier decompose volatilization, scaling powder play cleaning and
It sprawls to realize that electronic component is electrically connected with the good of matrix from film layer outflow, brazing filler metal melts after wetting action.Influence weldering
The principal element of cream dispensing performance is the thixotropy of soldering paste, and thixotropy is that viscosity reduces soldering paste under the action of shear force
Characteristic.Can static state is lower to keep high viscosity, after stress can moment it is thinning be evaluation soldering paste quality important evidence.And market
On the unstable problem of the generally existing dispensing performance of domestic soldering paste.Secondly, being needed in the domestic generally existing melting process of soldering paste
A large amount of heat, weld interval is long and efficiency is lower.
Summary of the invention
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide one kind to have good dispensing performance
Silver alloy soldering paste, the silver alloy soldering paste is available to be suitable for different silver alloy matrix by the adjustment to scaling powder system
Scaling powder, the melting temperature by reducing complex salt entirety reduces the melting heat of soldering paste entirety, thus improve weld it is fast
Degree solves the problems such as existing silver alloy soldering paste service life is shorter, continuity point colloidality can be bad, properties of product are unstable, has
Can continuous dispensing, it is environmental-friendly, service life is long the advantages that.
The second object of the present invention is to provide a kind of preparation method of silver alloy soldering paste with good dispensing performance,
The avoidable problem for causing ratio of brazing area low by the addition of other components of this method, increases flux activity at the same time, hence it is evident that
Raising helps weldering effect, has many advantages, such as simple process, can large-scale serial production, reproducible.
An object of the present invention adopts the following technical scheme that realization:
A kind of silver alloy soldering paste with good dispensing performance, is by the component system as follows in terms of mass percentage
It is standby to form:
Further, the resin is acrylic resin or rosin resin.
Further, acrylic resin is methyl acrylate, methyl methacrylate, ethyl acrylate, the positive fourth of acrylic acid
Ester, n-BMA, isoamyl acrylate, the just own ester of acrylic acid, the just own ester of methacrylic acid, n-octyl,
One of Isooctyl acrylate monomer and the acrylic acid of carbon atom number 1~10 or any combination；Rosin resin is newtrex or hydrogen
Change rosin.
Further, the thixotropic agent is rilanit special or polyamide wax.
Further, the organic solvent be n-butanol, diisobutyl carbinol (DIBC), isobutanol, normal propyl alcohol, n-butyl acetate,
N-propyl acetate, propylene glycol monomethyl ether, dipropylene glycol methyl ether, propylene glycol methyl ether acetate, propylene glycol propyl ether, dipropylene,
Dimethyl ether, diethylene glycol dimethyl ether, glycol propyl ether, butyl acetate, dipropylene glycol methyl ether acetic acid
Ester, dimethyl malenate, diethylene glycol (DEG), diethylene glycol monobutyl ether or N-Methyl pyrrolidone.
Further, the silver solder alloy is liquidus curve in 450 DEG C~950 DEG C, the silver alloy of oxygen content≤0.3%
Powder.
Further, the mass percent of silver alloy soldering paste shared by the silver alloy powder of different-grain diameter is as follows: -300 mesh powder
It is 1~30%, -200~+300 mesh powder be 10~50%, -50~+200 powder is 20~70%.
Further, the scaling powder is scaling powder fluoride, scaling powder boride, scaling powder carbonate, scaling powder sulphur
One of hydrochlorate and scaling powder chloride or any combination；Wherein, scaling powder fluoride is potassium fluoride, sodium fluoride, fluorination
Ammonium, potassium bifluoride or sodium bifluoride；Scaling powder boride is borax, potassium fluoborate, sodium fluoborate, zinc fluoroborate, boric anhydride, boron
Acid, potassium borohydride or sodium borohydride；Scaling powder carbonate is potassium carbonate, sodium carbonate, saleratus, ammonium carbonate or ammonium hydrogen carbonate；
Scaling powder sulfuric acid hydrochlorate is potassium sulfate or sodium sulphate；Scaling powder chloride is potassium chloride, sodium chloride or copper chloride.
The second object of the present invention adopts the following technical scheme that realization:
A kind of preparation method of the silver alloy soldering paste with good dispensing performance, including, resin has been dissolved according to the ratio
In solvent, thixotropic agent is added, obtains preformed solution；Then scaling powder and silver solder alloy are sequentially added into preformed solution
In, after being added every time twice with preformed solution premix；Rolling is finally repeated several times and obtains silver-alloy brazing cream.
Further, scaling powder is added in two portions in preformed solution, and the mass ratio being successively added twice is 4:6.
Compared with prior art, the beneficial effects of the present invention are:
(1) present invention has the silver alloy soldering paste of good dispensing performance, which passes through to scaling powder system
Adjustment, the available scaling powder suitable for different silver alloy matrix are reduced by reducing the melting temperature of complex salt entirety
The melting heat of soldering paste entirety solves that existing silver alloy soldering paste service life is shorter, continuity point colloidality to improve speed of welding
Can it is bad, properties of product are unstable the problems such as, have many advantages, such as can continuously dispensing, environmental-friendly, service life is long；
(2) present invention has the preparation method of the silver alloy soldering paste of good dispensing performance, and this method can avoid by other groups
Point addition and the problem that causes ratio of brazing area low, increase flux activity at the same time, hence it is evident that raising helps weldering effect, has work
Skill is simple, can large-scale serial production, it is reproducible the advantages that.
Detailed description of the invention
Fig. 1 is the 3ITT curve graph of embodiment 1；
Fig. 2 is the 3ITT curve graph of embodiment 2；
Fig. 3 is the Ultrasonic NDT figure of the soldering paste of embodiment 1；
Fig. 4 is the Ultrasonic NDT figure of the soldering paste of embodiment 2；
Fig. 5 is the Ultrasonic NDT figure of the soldering paste of embodiment 3；
Fig. 6 is the Ultrasonic NDT figure of the soldering paste of comparative example 1；
Fig. 7 is the Ultrasonic NDT figure of the soldering paste of comparative example 2；
Fig. 8 is the Ultrasonic NDT figure of the soldering paste of comparative example 3.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the present invention, it should be noted that not
Under the premise of conflicting, new reality can be formed between various embodiments described below or between each technical characteristic in any combination
Apply example.
A kind of silver alloy soldering paste with good dispensing performance, is by the component system as follows in terms of mass percentage
It is standby to form:
As the mode that further carries out, resin is acrylic resin or rosin resin.
As the mode that further carries out, acrylic resin is methyl acrylate, methyl methacrylate, acrylic acid second
Ester, n-butyl acrylate, n-BMA, isoamyl acrylate, the just own ester of acrylic acid, the just own ester of methacrylic acid,
One of acrylic acid of n-octyl, Isooctyl acrylate monomer and carbon atom number 1~10 or any combination；Rosin resin
For newtrex or hydrogenated rosin.
As the mode that further carries out, thixotropic agent is rilanit special or polyamide wax.
As the mode that further carries out, organic solvent is n-butanol, diisobutyl carbinol (DIBC), isobutanol, normal propyl alcohol, second
Sour N-butyl, n-propyl acetate, propylene glycol monomethyl ether, dipropylene glycol methyl ether, propylene glycol methyl ether acetate, propylene glycol propyl ether, dipropyl
Glycol butyl ether, dimethyl ether, diethylene glycol dimethyl ether, glycol propyl ether, butyl acetate, dipropylene glycol
Methyl ether acetate, dimethyl malenate, diethylene glycol (DEG), diethylene glycol monobutyl ether or N-Methyl pyrrolidone.
As the mode that further carries out, silver solder alloy be liquidus curve 450 DEG C~950 DEG C, oxygen content≤0.3%
Silver alloy powder.
The ingredient of silver alloy powder is as shown in table 1.
1 alloying component of table
As the mode that further carries out, the mass percent of silver alloy soldering paste shared by the silver alloy powder of different-grain diameter
As follows: it be 10~50%, -50~+200 powder is 20~70% that -300 mesh powder, which are 1~30%, -200~+300 mesh powder,.
As the mode that further carries out, scaling powder be scaling powder fluoride, scaling powder boride, scaling powder carbonate,
One of scaling powder sulfuric acid hydrochlorate and scaling powder chloride or any combination；Wherein, scaling powder fluoride is potassium fluoride, fluorine
Change sodium, ammonium fluoride, potassium bifluoride or sodium bifluoride；Scaling powder boride is borax, potassium fluoborate, sodium fluoborate, fluoboric acid
Zinc, boric anhydride, boric acid, potassium borohydride or sodium borohydride；Scaling powder carbonate is potassium carbonate, sodium carbonate, saleratus, ammonium carbonate
Or ammonium hydrogen carbonate；Scaling powder sulfuric acid hydrochlorate is potassium sulfate or sodium sulphate；Scaling powder chloride is potassium chloride, sodium chloride or chlorination
Copper.
The preparation method of the above-mentioned silver alloy soldering paste with good dispensing performance, including, resin has been dissolved according to the ratio
In solvent, thixotropic agent is added, obtains preformed solution；Then scaling powder and silver solder alloy are sequentially added into preformed solution
In, after being added every time twice with preformed solution premix；Rolling is finally repeated several times and obtains silver-alloy brazing cream.
As the mode that further carries out, scaling powder is added in two portions in preformed solution, the mass ratio being successively added twice
For 4:6.
Wherein, scaling powder needs drying sieving processing, the whipping process temperature after thixotropic agent is added before adding in preparation method
Degree is not answered excessively high (≤70 DEG C), and the time does not answer too long (≤30min), its should be made to keep solvent swelling state, rather than dissolved state
(color is colorless and transparent).
Silver alloy soldering paste fineness after multi-pass three-roll rolling should be less than maximum alloy for dental amalgam partial size.
Soldering paste answers the solid content of real-time measurement soldering paste during the preparation process, and adds the solvent of loss in proportion in time.
It is specific embodiment of the present invention below, used raw material, equipment etc. remove special limit in the following embodiments
It can be obtained by buying pattern outside fixed.
Embodiment 1:
Based on the weight percent of total soldering paste, the acrylic resin of 15% organic solvent and 4% is added together first
In polytetrafluoroethylene (PTFE) jar, rotation 180min is obtained uniform and stable under conditions of 120 DEG C of constant temperature, 1400 revs/min of revolving speeds
Polyacrylic resin solution measures the solid content of resin solution under conditions of 120 DEG C/1h, adds having for loss in proportion
Solvent.1.5% polyamide wax is added in polyacrylic resin solution, in 55 DEG C of (≤70 DEG C) constant temperature oil baths, stirring
Speed stirs 20min under conditions of being 1000 revs/min, is uniformly distributed in thixotropic agent in resin solution with solvent swelling state, surveys
The solid content for measuring organic carrier, adds the organic solvent of loss in proportion.Alloy for dental amalgam (the partial size that 68Wt.% is sieved again
In -300 mesh 20Wt.%, partial size accounts for 60Wt.% in+300 mesh of -200 mesh, and partial size accounts for 20Wt.% in+200 mesh of -100 mesh) by matter
Amount is added in two portions than 4:6, and alloy for dental amalgam group becomes (Wt.%): silver-colored 56, copper 22, zinc 17, tin 5.Quality is accounted for 11.5%
Scaling powder is sequentially added in resin solution in two times in 4:6 ratio, and scaling powder portfolio ratio is: potassium fluoride 10Wt.%, borax
40Wt.%, potassium carbonate 20Wt.%, potassium fluoborate 30Wt.%, are both needed to premix 2 times after being added every time, guarantee slurry after premixing
300 microns of fineness ﹤.The solid content that solder is measured after rolling, adds the organic solvent of loss in proportion up to required dispensing
Silver alloy soldering paste of good performance；The organic solvent of the present embodiment is n-butanol, and thixotropic agent is rilanit special.
Embodiment 2:
Based on the weight percent of total soldering paste, first 20% organic solvent and 3% rosin resin are added poly- four together
In vinyl fluoride jar, 180min is rotated under conditions of 120 DEG C of constant temperature, 1400 revs/min of revolving speeds and obtains uniform and stable resin
Solution measures the solid content of resin solution under conditions of 120 DEG C/1h, adds the organic solvent of loss in proportion.By 1%
Rilanit special be added in rosin resin solution, 55 DEG C of (≤70 DEG C) constant temperature oil baths, mixing speed be 1000 revs/min
20min is stirred under conditions of clock, is uniformly distributed in thixotropic agent in resin solution with solvent swelling state, measures consolidating for organic carrier
Body content adds the organic solvent of loss in proportion.By 60Wt.% alloy for dental amalgam, (partial size is in -300 mesh 15Wt.%, partial size again
65Wt.% being accounted in+300 mesh of -200 mesh, partial size accounts for 20Wt.% in+200 mesh of -100 mesh) 4:6 in mass ratio is added in two portions,
Alloy for dental amalgam group becomes (Wt.%): silver-colored 40, copper 30, zinc 28, nickel 2.Quality is accounted for into 16% scaling powder in 4:6 ratio in two times
It sequentially adds in resin solution, scaling powder portfolio ratio is: ammonium fluoride 10Wt.%, boric acid 40Wt.%, ammonium hydrogen carbonate
20Wt.%, potassium fluoborate 30Wt.%, are both needed to premix 2 times after being added every time, guarantee 300 microns of fineness ﹤ of slurry after premix.
Multi- pass rolling is finally carried out on three-roll grinder again, the solid content of solder is measured after rolling, adds loss in proportion
Organic solvent is up to required dispensing silver alloy soldering paste of good performance.Its 3ITT curve is shown in 1# curve in attached drawing 1,2# curve
Not use addition thixotropic agent to prepare the 3ITT of soldering paste, other components and content are same as Example 1；The present embodiment it is organic
Solvent is glycol propyl ether, and thixotropic agent is rilanit special.
Embodiment 3:
Based on the weight percent of total soldering paste, first 20% organic solvent and 3% acrylic resin be added together it is poly-
In tetrafluoroethene jar, 180min is rotated under conditions of 120 DEG C of constant temperature, 1400 revs/min of revolving speeds and obtains uniform and stable tree
Lipoprotein solution measures the solid content of resin solution under conditions of 120 DEG C/1h, adds the organic solvent of loss in proportion.It will
1% polyamide wax is added in acrylic resin soln, 55 DEG C of (≤70 DEG C) constant temperature oil baths, mixing speed be 1000 turns/
20min is stirred under conditions of minute, thixotropic agent is uniformly distributed in resin solution with solvent swelling state, measures organic carrier
Solid content adds the organic solvent of loss in proportion.By 60Wt.% alloy for dental amalgam, (partial size is in -300 mesh 15Wt.%, grain again
Diameter accounts for 65Wt.% in+300 mesh of -200 mesh, and partial size accounts for 20Wt.% in+200 mesh of -100 mesh) 4:6 in mass ratio is added in two portions,
Alloy for dental amalgam group becomes (Wt.%): silver-colored 60, copper 25, zinc 15.Quality is accounted for into 16% scaling powder in 4:6 ratio in two times successively
It is added in resin solution, scaling powder portfolio ratio is: potassium fluoride 5Wt.%, boric acid 40Wt.%, saleratus 10Wt.%, fluorine
Potassium borate 45Wt.%, is both needed to premix 2 times after being added every time, guarantee 300 microns of fineness ﹤ of slurry after premix.Finally again three
Multi- pass rolling is carried out on roller mill, and the solid content of solder is measured after rolling, adds the organic solvent of loss in proportion i.e.
Obtain required dispensing silver alloy soldering paste of good performance；The organic solvent of the present embodiment is diethylene glycol (DEG), and thixotropic agent is hydrogenated castor
Oil.
Effect assessment and performance detection
One, thixotropy is tested
3ITT (3Intervy Thixotropic Test) is the thixotropic method of currently used test soldering paste, can be with
The structure for testing soldering paste well is destroyed and recovery characteristics.By embodiment 1, embodiment 2 soldering paste for, test of the invention
The thixotropy of soldering paste.The setting parameter of 3ITT curve is the shear rate of 0~100s and 120~160s in attached drawing 1 and attached drawing 2
For 1s-1, it is the low shear rate stage, the shear rate of 100~120s is 300s-1, it is the high-rate of shear stage.Low sheraing rank
Section indicates the destruction situation of solder paste texture to the decline degree of high shear stage soldering paste viscosity, and for characterizing its thixotropy, height is cut
The resume speed for cutting stage to low sheraing stage soldering paste viscosity shows the recovery situation of solder paste texture, for characterizing the levelling of soldering paste
Property, entire repetitive process can sufficiently reflect the dispensing performance of soldering paste.It can be seen that from attached drawing 1-2 in soldering paste of the invention
The content and ingredient of thixotropic agent are optimal effectiveness, and content is too low or excessively high cannot get corresponding effect.
Two, situation is welded
Using CN105643148 A, CN101837526 A, CN106181117 A product as comparative example 1-3,
Fig. 3-5 is followed successively by the result figure of the Ultrasonic NDT of the soldering paste of embodiment 1-3, and Fig. 6-8 is followed successively by the ultrasound of comparative example 1-3
The result figure of non-destructive testing, the bigger color the more closer to red display welding hole in figure, the deeper display welding matter of blue
It is better to measure, and for blue, the region that round rectangle outlines is red in the region that ellipse outlines in figure, can from comparison picture
Out, in Fig. 3-5, do not occur red in blue region, and occur red area in Fig. 6-8, inside blue region, this says
It is more that hole is welded in bright Fig. 6-8, and then welding hole in Fig. 3-5, the soldering paste welding quality prepared according to embodiment 2 are bright
Show outstanding in the existing soldering paste of comparative example.
Three, tensile strength
Welding experiment is carried out by taking the soldering paste that embodiment 2 is prepared as an example, solder contacts diameter is 5.0mm, is randomly selected five times
5pcs, five times tensile strength is shown in Table 2.
2 tensile strength of table
It is shown according to data in table 2, the average every square millimeter of shearing force in the contact of embodiment 2 is greater than 11.9kgf, is higher than
Required standard 8kgf in the prior art, this illustrates that soldering paste tensile strength of the invention is good.
To sum up, soldering paste of the invention effectively solve existing silver alloy soldering paste service life is shorter, continuity point colloidality can not
Good, the problems such as properties of product are unstable, have many advantages, such as can continuously dispensing, environmental-friendly, service life is long.
The above embodiment is only the preferred embodiment of the present invention, and the scope of protection of the present invention is not limited thereto,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of silver alloy soldering paste with good dispensing performance, which is characterized in that it is by as follows in terms of mass percentage
Component be prepared:
2. silver alloy soldering paste as described in claim 1, which is characterized in that the resin is acrylic resin or rosin resin.
3. silver alloy soldering paste as claimed in claim 2, which is characterized in that acrylic resin is methyl acrylate, metering system
Sour methyl esters, ethyl acrylate, n-butyl acrylate, n-BMA, isoamyl acrylate, the just own ester of acrylic acid, first
Base the just own ester of acrylic acid, n-octyl, Isooctyl acrylate monomer and carbon atom number 1~10 one of acrylic acid or any
Combination；Rosin resin is newtrex or hydrogenated rosin.
4. silver alloy soldering paste as described in claim 1, which is characterized in that the thixotropic agent is rilanit special or polyamide
Wax.
5. silver alloy soldering paste as described in claim 1, which is characterized in that the organic solvent is n-butanol, diisobutyl first
Alcohol, isobutanol, normal propyl alcohol, n-butyl acetate, n-propyl acetate, propylene glycol monomethyl ether, dipropylene glycol methyl ether, propylene glycol monomethyl ether acetic acid
Ester, propylene glycol propyl ether, dipropylene, dimethyl ether, diethylene glycol dimethyl ether, glycol propyl ether, diethylene glycol fourth
Ether acetate, dipropylene glycol methyl ether acetate, dimethyl malenate, diethylene glycol (DEG), diethylene glycol monobutyl ether or N- crassitude
Ketone.
6. silver alloy soldering paste as described in claim 1, which is characterized in that the silver solder alloy be liquidus curve 450 DEG C~
950 DEG C, the silver alloy powder of oxygen content≤0.3%.
7. silver alloy soldering paste as described in claim 1, which is characterized in that silver-alloy brazing shared by the silver alloy powder of different-grain diameter
The mass percent of cream is as follows: it be 10~50%, -50~+200 powder is 20 that -300 mesh powder, which are 1~30%, -200~+300 mesh powder,
~70%.
8. silver alloy soldering paste as described in claim 1, which is characterized in that the scaling powder is scaling powder fluoride, scaling powder
One of boride, scaling powder carbonate, scaling powder sulfuric acid hydrochlorate and scaling powder chloride or any combination；Wherein, weldering is helped
Agent fluoride is potassium fluoride, sodium fluoride, ammonium fluoride, potassium bifluoride or sodium bifluoride；Scaling powder boride is borax, fluoboric acid
Potassium, sodium fluoborate, zinc fluoroborate, boric anhydride, boric acid, potassium borohydride or sodium borohydride；Scaling powder carbonate is potassium carbonate, carbonic acid
Sodium, saleratus, ammonium carbonate or ammonium hydrogen carbonate；Scaling powder sulfuric acid hydrochlorate is potassium sulfate or sodium sulphate；Scaling powder chloride is chlorine
Change potassium, sodium chloride or copper chloride.
9. a kind of preparation method of such as described in any item silver alloy soldering paste with good dispensing performance of claim 1-8,
It is characterized in that including that resin is dissolved in organic solvent according to the ratio, adds thixotropic agent, obtain preformed solution；Then it will help
Solder flux and silver solder alloy sequentially add in preformed solution, after being added every time twice with preformed solution premix；Finally it is repeated several times
Rolling obtains silver-alloy brazing cream.
10. the preparation method of silver alloy soldering paste as claimed in claim 9, which is characterized in that scaling powder is added in two portions prefabricated
In solution, the mass ratio being successively added twice is 4:6.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524139A (en) * | 2019-08-06 | 2019-12-03 | 界首市南都华宇电源有限公司 | A kind of scaling powder of low-corrosiveness |
| CN110744222A (en) * | 2019-10-18 | 2020-02-04 | 郑州机械研究所有限公司 | Brazing flux not prone to moisture absorption and preparation method thereof |
| CN115026458A (en) * | 2022-06-17 | 2022-09-09 | 温州宏丰电工合金股份有限公司 | Ag-based alloy powder slurry, Ag-based alloy active solder and preparation method thereof |
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| CN1927526A (en) * | 2006-09-28 | 2007-03-14 | 昆山成利焊锡制造有限公司 | Leadless solder for electronic industry and preparation method |
| CN102764938A (en) * | 2012-07-18 | 2012-11-07 | 熊进 | Aluminum soldering paste |
| CN104752531A (en) * | 2013-12-31 | 2015-07-01 | 比亚迪股份有限公司 | Solar battery electrode paste, solar battery back electrode and preparation method of solar battery back electrode |
| CN106181117A (en) * | 2016-07-07 | 2016-12-07 | 兰州理工大学 | A kind of money base solder paste and preparation method thereof |
| CN106563893A (en) * | 2016-10-21 | 2017-04-19 | 四川科力特硬质合金股份有限公司 | Silver brazing solder of cemented carbide and steel and silver brazing method thereof |
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| CN110524139A (en) * | 2019-08-06 | 2019-12-03 | 界首市南都华宇电源有限公司 | A kind of scaling powder of low-corrosiveness |
| CN110744222A (en) * | 2019-10-18 | 2020-02-04 | 郑州机械研究所有限公司 | Brazing flux not prone to moisture absorption and preparation method thereof |
| CN115026458A (en) * | 2022-06-17 | 2022-09-09 | 温州宏丰电工合金股份有限公司 | Ag-based alloy powder slurry, Ag-based alloy active solder and preparation method thereof |
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