CN105014253A - Lead-free tin solder paste and preparation method thereof - Google Patents
Lead-free tin solder paste and preparation method thereof Download PDFInfo
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- CN105014253A CN105014253A CN201410179613.6A CN201410179613A CN105014253A CN 105014253 A CN105014253 A CN 105014253A CN 201410179613 A CN201410179613 A CN 201410179613A CN 105014253 A CN105014253 A CN 105014253A
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- acid
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- free
- soldering tin
- rosin
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 16
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004094 surface-active agent Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 12
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 11
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 11
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 11
- 150000007524 organic acids Chemical class 0.000 claims abstract description 9
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 230000004907 flux Effects 0.000 claims abstract description 6
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 239000002994 raw material Substances 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- 238000005476 soldering Methods 0.000 claims description 29
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 16
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 claims description 14
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 8
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 7
- 239000001361 adipic acid Substances 0.000 claims description 7
- 235000011037 adipic acid Nutrition 0.000 claims description 7
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 6
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 5
- WGOROJDSDNILMB-UHFFFAOYSA-N octatriacontanediamide Chemical compound NC(=O)CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC(N)=O WGOROJDSDNILMB-UHFFFAOYSA-N 0.000 claims description 5
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 claims description 4
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 claims description 3
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 claims description 3
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 claims description 3
- 229910019142 PO4 Inorganic materials 0.000 claims description 3
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Substances CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 3
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- FUGIIBWTNARRSF-UHFFFAOYSA-N decane-5,6-diol Chemical compound CCCCC(O)C(O)CCCC FUGIIBWTNARRSF-UHFFFAOYSA-N 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 3
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 3
- 239000010452 phosphate Substances 0.000 claims description 3
- 239000008117 stearic acid Substances 0.000 claims description 3
- KLZYRCVPDWTZLH-UHFFFAOYSA-N 2,3-dimethylsuccinic acid Chemical compound OC(=O)C(C)C(C)C(O)=O KLZYRCVPDWTZLH-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- NDSYZZUVPRGESW-UHFFFAOYSA-N 2-(2-octoxyethoxy)ethanol Chemical compound CCCCCCCCOCCOCCO NDSYZZUVPRGESW-UHFFFAOYSA-N 0.000 claims description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 2
- COBPKKZHLDDMTB-UHFFFAOYSA-N 2-[2-(2-butoxyethoxy)ethoxy]ethanol Chemical compound CCCCOCCOCCOCCO COBPKKZHLDDMTB-UHFFFAOYSA-N 0.000 claims description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 2
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims description 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 238000007639 printing Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 238000009835 boiling Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 description 5
- 239000001384 succinic acid Substances 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 210000004243 sweat Anatomy 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
Abstract
The invention discloses a lead-free tin solder paste and a preparation method thereof. The lead-free tin solder paste comprises the raw materials by mass percent: 80-90% of tin-silver-copper alloy tinpowder and 10-20% of lead-free flux, wherein the tin-silver-copper alloy tin powder comprises the componentsby mass percent: 0.3-3.0% of silver, 0.5-0.7% of copper and 96.5-99.0% of tin, and the lead-free flux comprises the componentsby mass percent: 20-35% of solvent, 30-45% of rosin, 5-10% of surface active agent, 10-20% of organic acid, 3-10% of antioxidant and 2-8% of thixotropic agent. The rosin which is a mixture of hydrogenated rosin and polymerized rosin according to a weight ratio of 1:(1-3) is adopted, so that the prepared lead-free tin solder paste is good in adhesive force and stability; by adjusting a ratio of the solvent to the rosin, the prepared lead-free tin solder paste has a wider viscosity range and good printing performance; with the compounding of various organic acid, the prepared lead-free tin solder paste is halogen-free, and the activity of the lead-free tin solder paste is improved greatly; the surface active agent is compounded with the solvent with high boiling point, low viscosity and low volatility, so that the prepared lead-free tin solder paste is long in printing time, and excellent in insulating property.
Description
Technical field
The present invention relates to technical field of soldering paste, be specifically related to a kind of leadless soldering tin paste and preparation method thereof.
Background technology
Solder(ing) paste is the paste mixture be mixed to form by solder powder, scaling powder and surfactant, thixotropic agent etc., is auxiliary material very important during current electronic product is produced.Along with the high speed development of electronics and information industry, electronic product more and more changes to light, thin, short, little and high-effect direction, Electronic Assembly Foundation is towards while high accuracy, high density, high reliability future development, internationalization environmental consciousness also improves thereupon, higher requirement be it is also proposed to the solder(ing) paste played a crucial role in Electronic Assemblies, lead-free and halogen-free, low-temperature energy-saving, shaping precise treatment, use high reliability to become the developing direction of current solder(ing) paste.At present, in various leadless soldering tin paste, a kind of solder compositions that Sn/Ag/Cu alloy is accepted extensively the most by industry, but the performance of its each side is not also very desirable, and as also there is solder(ing) paste failure welding, activity is low, wetability is poor, containing defects such as halogens.
Summary of the invention
The object of the invention is to for above-mentioned deficiency, provide a kind of there is excellent printing performance, the demoulding is clean, solderability good, wetability is strong, halogen-free, postwelding bronze mirror is without penetrability corrosion and the high leadless soldering tin paste of welding spot reliability and preparation method thereof.
The technology of the present invention solution:
A kind of leadless soldering tin paste, raw material comprises: tin-silver-copper alloy glass putty, and lead-free soldering flux, is characterized in that: material quality percentage is: 80% ~ 90%:10% ~ 20%.
In described tin-silver-copper alloy glass putty, mass percent is silver: 0.3% ~ 3.0%, copper: 0.5% ~ 0.7%, tin: 96.5% ~ 99.0%.
In described lead-free soldering flux, each component and mass percent are: solvent: rosin: surfactant: organic acid: antioxidant: thixotropic agent=20% ~ 35%:30% ~ 45%:5% ~ 10%:10% ~ 20%:3% ~ 10%:2% ~ 8%.
Described solvent is one or more compositions in dibutyl ethylene glycol ether, butyl acetate, diethylene glycol monobutyl ether, dipropylene glycol methyl ether, diethylene glycol monohexyl ether, diethylene glycol octyl ether, tripropylene glycol butyl ether, triethylene glycol butyl ether.
Described rosin is the mixture of Foral and newtrex, and both part by weight are 1:1 ~ 3.
Described surfactant is one or both in TX-10 phosphate, rosin ether surface active agent, GE-511, trimethylbutene glycol, Surfynol 104E.
Described organic acid is at least two or more combinations in itaconic acid, stearic acid, decanedioic acid, succinic acid, adipic acid, glutaric acid, suberic acid, tetradecylic acid, di-propionic acid, p-tert-butyl benzoic acid, dimethyl succinic acid.
Described antioxidant is one or more combinations in methyl benzotriazazole, antioxidant BHT, CHIMASSORB 3030, benzimidazole, methylimidazole.
Described thixotropic agent is the one in thixotropic agent 7500, modified hydrogenated castor oil, ethylenebis stearic amide.
A kind of Pb-free solder ointment preparation, comprises the following steps:
The first step, weighs solvent, rosin and surfactant according to the above ratio and joins in reaction vessel, is stirred to and dissolves completely after being heated to 100-120 DEG C;
Second step, the mixture first step obtained adds organic acid and antioxidant after being cooled to 80-100 DEG C, is stirred to and dissolves completely;
3rd step, the mixture obtained by second step adds thixotropic agent after being cooled to 50-70 DEG C, is stirred to and dissolves completely, is cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder;
4th step, under normal temperature and pressure, the scaling powder obtain the 3rd step and Pb-free coating glass putty load solder paste stirrer and stir 5 minutes with the speed of 15 revs/min;
5th step, extracting vacuum, continues stirring 15 minutes, namely obtains leadless soldering tin paste of the present invention.
Beneficial effect of the present invention:
(1) the present invention selects weight ratio to be Foral and the newtrex mixture rosin of 1:1 ~ 3, obtained solder(ing) paste adhesion and having good stability, by regulating the ratio of solvent and rosin, obtained solder(ing) paste has wider range of viscosities and good printing performance;
(2) the present invention adopts multiple organic acid composite, and obtained leadless soldering tin paste is halogen-free, and the activity of solder(ing) paste improves greatly;
(3) the present invention selects higher boiling, low viscosity, the solvent complex surfactant of low volatility, and obtained solder(ing) paste printing time is longer, and insulating properties is excellent.
detailed description of the invention
Embodiment 1
Tripropylene glycol butyl ether 52g, Foral 40g, newtrex 40g, GE-511 8g and trimethylbutene glycol 4g are joined in reaction vessel, is heated to 120 DEG C, is stirred to and dissolves completely; Be cooled to 100 DEG C, add tetradecylic acid 18g, succinic acid 2g, adipic acid 4g, glutaric acid 8g, suberic acid 3g, antioxidant BHT 2g and methylimidazole 10g, is stirred to and dissolves completely; Be cooled to 60 DEG C, add ethylenebis stearic amide 9g, be stirred to and dissolve completely, be cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder 193g.
Pb-free coating glass putty 442.5g is mixed with scaling powder 57.5g, stirs 5 minutes with the mixing speed of 15 revs/min, extracting vacuum, continue stirring 15 minutes, namely obtain leadless soldering tin paste 500g.
Embodiment 2
By dibutyl ethylene glycol ether 58g, Foral 36g, newtrex 40g and rosin ether surface active agent 10g join in reaction vessel, are heated to 116 DEG C, are stirred to and dissolve completely; Be cooled to 80 DEG C, add di-propionic acid 14g, succinic acid 4g, adipic acid 5g, glutaric acid 7g, suberic acid 2g, methyl benzotriazazole 2g and methylimidazole 12g, is stirred to and dissolves completely; Be cooled to 65 DEG C, add thixotropic agent 7500 10g, be stirred to and dissolve completely, be cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder 195g.
Pb-free coating glass putty 442.0g is mixed with scaling powder 58.0g, stirs 5 minutes with the mixing speed of 15 revs/min, extracting vacuum, continue stirring 15 minutes, namely obtain leadless soldering tin paste 500g.
Embodiment 3
Diethylene glycol monohexyl ether 48g, Foral 41g, newtrex 41g, GE-511 8g and trimethylbutene glycol 5g are joined in reaction vessel, is heated to 110 DEG C, is stirred to and dissolves completely; Be cooled to 90 DEG C, add tetradecylic acid 18g, succinic acid 2g, adipic acid 4g, glutaric acid 8g, suberic acid 4g, antioxidant BHT 2g and methylimidazole 10g, is stirred to and dissolves completely; Be cooled to 60 DEG C, add ethylenebis stearic amide 9g, be stirred to and dissolve completely, be cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder 192g.
Pb-free coating glass putty 443.5g is mixed with scaling powder 56.5g, stirs 5 minutes with the mixing speed of 15 revs/min, extracting vacuum, continue stirring 15 minutes, namely obtain leadless soldering tin paste 500g.
Embodiment 4
Diethylene glycol monohexyl ether 48g, Foral 40g, newtrex 40g and TX-10 phosphate 12g are joined in reaction vessel, is heated to 100 DEG C, is stirred to and dissolves completely; Be cooled to 85 DEG C, add tetradecylic acid 16g, succinic acid 3g, adipic acid 6g, glutaric acid 9g, suberic acid 2g, methyl benzotriazazole 2g and methylimidazole 10g, is stirred to and dissolves completely; Be cooled to 70 DEG C, add modified hydrogenated castor oil 12g, be stirred to and dissolve completely, be cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder 191g.
Pb-free coating glass putty 441.5g is mixed with scaling powder 58.5g, stirs 5 minutes with the mixing speed of 15 revs/min, extracting vacuum, continue stirring 15 minutes, namely obtain leadless soldering tin paste 500g.
Embodiment 5
By butyl 46g, Foral 30g, newtrex 50g and Surfynol 104E 14g joins in reaction vessel, is heated to 108 DEG C, is stirred to and dissolves completely; Be cooled to 90 DEG C, add p-tert-butyl benzoic acid 12g, stearic acid 4g, succinic acid 4g, adipic acid 7g, glutaric acid 8g, suberic acid 2g, CHIMASSORB 3030 3g and benzimidazole 12g, is stirred to and dissolves completely; Be cooled to 50 DEG C, add ethylenebis stearic amide 8g, be stirred to and dissolve completely, be cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder 194g.
Pb-free coating glass putty 443.0g is mixed with scaling powder 57.0g, stirs 5 minutes with the mixing speed of 15 revs/min, extracting vacuum, continue stirring 15 minutes, namely obtain leadless soldering tin paste 500g.
The solder(ing) paste obtained by above embodiment detects according to SJ/T 11186-2009 standard, and properties testing result is as table 1.
Table 1 embodiment 1 ~ 5 performance test results
As can be seen from Table 1: leadless soldering tin paste range of viscosities of the present invention is wider; Halogen-free, wetability is strong, and tin sweat(ing) is few; Surface insulation resistance value is far above the standard-required of electron trade; Postwelding bronze mirror corrodes without penetrability; The maximum bridging spacing that cold/heat is caved in is 0.06/0.10mm, has good printing, thixotropic property, meets the requirement of high density thin space Full Vision technique completely; Meanwhile, after continuous printing 8h, viscosity B coefficent value is little, ensure that the stability of printing performance during long-time presswork.
Claims (10)
1. a leadless soldering tin paste, raw material comprises: tin-silver-copper alloy glass putty, and lead-free soldering flux, is characterized in that: material quality percentage is: 80% ~ 90%:10% ~ 20%.
2. a kind of leadless soldering tin paste as claimed in claim 1, is characterized in that: in described tin-silver-copper alloy glass putty, mass percent is silver: 0.3% ~ 3.0%, copper: 0.5% ~ 0.7%, tin: 96.5% ~ 99.0%.
3. a kind of leadless soldering tin paste as claimed in claim 1, is characterized in that: in described lead-free soldering flux, each component and mass percent are: solvent: rosin: surfactant: organic acid: antioxidant: thixotropic agent=20% ~ 35%:30% ~ 45%:5% ~ 10%:10% ~ 20%:3% ~ 10%:2% ~ 8%.
4. a kind of leadless soldering tin paste as claimed in claim 3, is characterized in that: described solvent is one or more compositions in dibutyl ethylene glycol ether, butyl acetate, diethylene glycol monobutyl ether, dipropylene glycol methyl ether, diethylene glycol monohexyl ether, diethylene glycol octyl ether, tripropylene glycol butyl ether, triethylene glycol butyl ether.
5. a kind of leadless soldering tin paste as claimed in claim 3, it is characterized in that: described rosin is the mixture of Foral and newtrex, both part by weight are 1:1 ~ 3.
6. a kind of leadless soldering tin paste as claimed in claim 3, is characterized in that: described surfactant is one or both in TX-10 phosphate, rosin ether surface active agent, GE-511, trimethylbutene glycol, Surfynol 104E.
7. a kind of leadless soldering tin paste as claimed in claim 3, is characterized in that: described organic acid is at least two or more combinations in itaconic acid, stearic acid, decanedioic acid, succinic acid, adipic acid, glutaric acid, suberic acid, tetradecylic acid, di-propionic acid, p-tert-butyl benzoic acid, dimethyl succinic acid.
8. a kind of leadless soldering tin paste as claimed in claim 3, is characterized in that: described antioxidant is one or more combinations in methyl benzotriazazole, antioxidant BHT, CHIMASSORB 3030, benzimidazole, methylimidazole.
9. a kind of leadless soldering tin paste as claimed in claim 3, is characterized in that: described thixotropic agent is the one in thixotropic agent 7500, modified hydrogenated castor oil, ethylenebis stearic amide.
10. preparation a kind of leadless soldering tin paste as claimed in claim 1, comprises and comprising the following steps:
The first step, weighs solvent, rosin and surfactant according to the above ratio and joins in reaction vessel, is stirred to and dissolves completely after being heated to 100-120 DEG C;
Second step, the mixture first step obtained adds organic acid and antioxidant after being cooled to 80-100 DEG C, is stirred to and dissolves completely;
3rd step, the mixture obtained by second step adds thixotropic agent after being cooled to 50-70 DEG C, is stirred to and dissolves completely, is cooled to room temperature, with three-roll grinder, the solid particle fineness in mixed solution is ground to less than 10 μm, obtains scaling powder;
4th step, under normal temperature and pressure, the scaling powder obtain the 3rd step and Pb-free coating glass putty load solder paste stirrer and stir 5 minutes with the speed of 15 revs/min;
5th step, extracting vacuum, continues stirring 15 minutes, namely obtains leadless soldering tin paste of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN106002000A (en) * | 2016-06-23 | 2016-10-12 | 深圳市唯特偶新材料股份有限公司 | Soldering paste and preparation method thereof |
| CN106271219A (en) * | 2016-08-26 | 2017-01-04 | 王泽陆 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
| CN106271186A (en) * | 2016-08-31 | 2017-01-04 | 苏州恩斯泰金属科技有限公司 | A kind of solder(ing) paste |
| CN106392364A (en) * | 2016-10-28 | 2017-02-15 | 广东中实金属有限公司 | Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste |
| CN108057965A (en) * | 2017-11-29 | 2018-05-22 | 东莞永安科技有限公司 | Leadless soldering tin paste of welding quality and preparation method thereof can be improved |
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| CN111360446A (en) * | 2020-04-28 | 2020-07-03 | 深圳市邦大科技有限公司 | Halogen-free lead-free soldering paste and preparation method thereof |
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| CN114029649A (en) * | 2021-12-24 | 2022-02-11 | 南京青锐风新材料科技有限公司 | Compound solvent modified lead-free soldering paste for jet printing and preparation method thereof |
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| CN115365703A (en) * | 2022-08-19 | 2022-11-22 | 大连海外华昇电子科技有限公司 | Water-soluble soldering flux and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011784A (en) * | 2007-02-06 | 2007-08-08 | 北京蓝景创新科技有限公司 | Leadless alloy tin solder plaster and manufacturing method thereof |
| CN101244491A (en) * | 2008-03-21 | 2008-08-20 | 天津市青禾科技发展有限公司 | Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid |
| CN101642855A (en) * | 2009-08-19 | 2010-02-10 | 浙江一远电子材料研究院 | Rear-earth-containing halogen free Sn-Ag-C series tinol |
| CN101653876A (en) * | 2009-08-19 | 2010-02-24 | 浙江一远电子材料研究院 | Low-silver halogen free soldering paste |
| CN101733573A (en) * | 2009-11-04 | 2010-06-16 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| CN101780606A (en) * | 2009-12-23 | 2010-07-21 | 深圳市唯特偶化工开发实业有限公司 | Washing-free lead-free halogen-free tin soldering paste |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
| JP5019057B2 (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工業株式会社 | Solder flux and cream solder |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
-
2014
- 2014-04-30 CN CN201410179613.6A patent/CN105014253A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101011784A (en) * | 2007-02-06 | 2007-08-08 | 北京蓝景创新科技有限公司 | Leadless alloy tin solder plaster and manufacturing method thereof |
| JP5019057B2 (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工業株式会社 | Solder flux and cream solder |
| CN101244491A (en) * | 2008-03-21 | 2008-08-20 | 天津市青禾科技发展有限公司 | Lead-free solder solder paste for electronic industry and method for manufacturing soldering fluid |
| CN101642855A (en) * | 2009-08-19 | 2010-02-10 | 浙江一远电子材料研究院 | Rear-earth-containing halogen free Sn-Ag-C series tinol |
| CN101653876A (en) * | 2009-08-19 | 2010-02-24 | 浙江一远电子材料研究院 | Low-silver halogen free soldering paste |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
| CN101733573A (en) * | 2009-11-04 | 2010-06-16 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| CN101780606A (en) * | 2009-12-23 | 2010-07-21 | 深圳市唯特偶化工开发实业有限公司 | Washing-free lead-free halogen-free tin soldering paste |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
Cited By (21)
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|---|---|---|---|---|
| CN106002000A (en) * | 2016-06-23 | 2016-10-12 | 深圳市唯特偶新材料股份有限公司 | Soldering paste and preparation method thereof |
| CN106271219A (en) * | 2016-08-26 | 2017-01-04 | 王泽陆 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
| CN106271186B (en) * | 2016-08-31 | 2019-11-08 | 苏州恩斯泰金属科技有限公司 | A kind of solder(ing) paste |
| CN106271186A (en) * | 2016-08-31 | 2017-01-04 | 苏州恩斯泰金属科技有限公司 | A kind of solder(ing) paste |
| CN106392364A (en) * | 2016-10-28 | 2017-02-15 | 广东中实金属有限公司 | Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste |
| CN108057965A (en) * | 2017-11-29 | 2018-05-22 | 东莞永安科技有限公司 | Leadless soldering tin paste of welding quality and preparation method thereof can be improved |
| CN108555474A (en) * | 2018-04-03 | 2018-09-21 | 深圳市同方电子新材料有限公司 | A kind of halogen-free environmental-friendly lead-free tin cream and preparation method thereof |
| CN108555474B (en) * | 2018-04-03 | 2021-07-09 | 深圳市同方电子新材料有限公司 | Halogen-free environment-friendly lead-free tin paste and preparation method thereof |
| CN108788512A (en) * | 2018-08-24 | 2018-11-13 | 东莞市仁信电子有限公司 | A kind of low voidage leadless environment-friendly solder(ing) paste of low melting point |
| CN110303272A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Brass base, Ni-based needle tubing halogen-free environmental solder(ing) paste and preparation method thereof |
| CN110303274A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Remain heat cure solder(ing) paste and preparation method thereof |
| CN110405377A (en) * | 2019-07-10 | 2019-11-05 | 深圳市博士达焊锡制品有限公司 | A kind of semiconductor high temperature print solder paste |
| EP3848149A1 (en) * | 2020-01-09 | 2021-07-14 | 3S Silicon Tech, Inc. | Solder paste composition and soldering method using the same |
| CN111360347B (en) * | 2020-03-06 | 2022-07-05 | 深圳市唯特偶新材料股份有限公司 | Method for improving welding performance of 5G communication module |
| CN111360347A (en) * | 2020-03-06 | 2020-07-03 | 深圳市唯特偶新材料股份有限公司 | Method for improving welding performance of 5G communication module |
| CN111360446A (en) * | 2020-04-28 | 2020-07-03 | 深圳市邦大科技有限公司 | Halogen-free lead-free soldering paste and preparation method thereof |
| CN111922551A (en) * | 2020-08-12 | 2020-11-13 | 昆山联金科技发展有限公司 | Sn-Zn lead-free soldering paste and preparation method thereof |
| CN114101972A (en) * | 2021-10-29 | 2022-03-01 | 江苏正能电子科技有限公司 | SMT soldering paste with high wetting dispersibility and weather resistance and preparation method thereof |
| CN114029649A (en) * | 2021-12-24 | 2022-02-11 | 南京青锐风新材料科技有限公司 | Compound solvent modified lead-free soldering paste for jet printing and preparation method thereof |
| CN114769943A (en) * | 2022-04-27 | 2022-07-22 | 深圳市福特佳电子有限公司 | Flux paste, solder paste and soldering method |
| CN115365703A (en) * | 2022-08-19 | 2022-11-22 | 大连海外华昇电子科技有限公司 | Water-soluble soldering flux and preparation method thereof |
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