CN107695567A - A kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste - Google Patents
A kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste Download PDFInfo
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- CN107695567A CN107695567A CN201710807320.1A CN201710807320A CN107695567A CN 107695567 A CN107695567 A CN 107695567A CN 201710807320 A CN201710807320 A CN 201710807320A CN 107695567 A CN107695567 A CN 107695567A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to the preparation method that a kind of stamp-mounting-paper diode welds special solder(ing) paste, the solder(ing) paste is made up of the component of following parts by weight：1~3 part of 10 20 parts of sn-bi alloy solder powder, 60 80 parts of Sn Ag Cu series solder powder, 24 parts of nano-titanium particle, 46 parts of graphene, 6~10 parts of phenoxy polyol resin, 1~3 part of malonic acid, 0.5~1.5 part of lactic acid, 0.5~1.5 part of benzoic acid, 6~12 parts of n-butyl lactate, 5~15 parts of ethylene glycol, 1.5~2.5 parts of alcohol APEO and nitromethane.The advantage of the invention is that：Stamp-mounting-paper diode of the present invention welds the preparation method of special solder(ing) paste, component and appropriate proportioning by the present invention so that solder(ing) paste can effectively ensure welding quality, and then can be effectively applied in electronic component.
Description
Technical field
The present invention relates to a kind of solder(ing) paste, more particularly to a kind of stamp-mounting-paper diode welds special scolding tin
The preparation method of cream.
Background technology
Solder(ing) paste is accompanied by a kind of novel welding material that SMT arises at the historic moment.Solder(ing) paste is a complicated system, is
The lotion formed by solder powder, scaling powder and other additives mixeds.Solder(ing) paste has certain viscosity at normal temperatures, can incite somebody to action
Electronic component is just bonded at commitment positions,, will be by weldering component with the volatilization of solvent and portions additive under welding temperature
It is permanently connected with being formed together with printed circuit pad solder.
Solder(ing) paste is widely used in high-accuracy electronic component, wherein, on the one hand solder(ing) paste can cause electronics
Component and air insulated, and then realize isolation and anti-oxidation；On the other hand solder(ing) paste can ensure the weldering of electronic component
Connect that performance is strong, and then the effect realized high resistance and prevent rosin joint phenomenon from occurring.As electronic technology constantly develops, people couple
The welding quality proposed requirement of electronic product also more and more higher；Clearly to know welding quality, increasing electronics
Product detects its welding performance in postwelding using probe test.
At present, the difficult point of stamp-mounting-paper diode leadless soldering tin paste investigative technique is primarily present three aspects：First, activity is weak.By
In lead-free solder solderability well below tin-lead solder, so its activity performance to scaling powder requires higher.It is based on
Environmental requirement, present solder(ing) paste tend to leave, so activating agent uses organic acid more.Because its effect is soft, bring
Corrosivity it is minimum, will not typically cause larger harm, but the solder(ing) paste activity prepared is weak, solderability is poor, easily causes
Rosin joint.2nd, postwelding residue is more.It is viscous often to add higher boiling, height in order to extend the holding time of solder(ing) paste for most of producers
Degree, the cosolvent of low volatility slow down evaporation rate, can not be printed with ensuring solder(ing) paste not solidify quickly when in use.
Printed board assembly is when being rapidly heated when this has resulted in weld heating, the solvent in solder(ing) paste can not volatilize completely it is clean and
Postwelding forms a large amount of residuals, and not only outward appearance is not good enough, also tacky.3rd, thixotropy is poor.Different printing technique needs different viscosities scope
Solder(ing) paste, especially for the Reflow Soldering of slight gap, the thixotropic property of solder(ing) paste is particularly important.
The content of the invention
The technical problem to be solved in the present invention is to provide the preparation method that a kind of stamp-mounting-paper diode welds special solder(ing) paste, make
Welding quality can effectively be ensured by obtaining solder(ing) paste, and then can be effectively applied in electronic component.
In order to solve the above technical problems, the technical scheme is that：A kind of stamp-mounting-paper diode welds special solder(ing) paste
Preparation method, its innovative point are：The solder(ing) paste is made up of the component of following parts by weight：Tin-bismuth alloy electroplating solder powder 10-20
Part, Sn-Ag-Cu series solder powder 60-80 parts, nano-titanium particle 2-4 parts, graphene 4-6 parts, 6~10 parts of phenoxy polyol resin, the third two
1~3 part of acid, 0.5~1.5 part of lactic acid, 0.5~1.5 part of benzoic acid, 6~12 parts of n-butyl lactate, 5~15 parts of ethylene glycol, alcohol gather
1~3 part of 1.5~2.5 parts of oxygen vinethene and nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
Further, the solder(ing) paste is made up of the component of following parts by weight：Tin-bismuth alloy electroplating solder powder 14-16 parts,
Sn-Ag-Cu series solder powder 65-75 parts, nano-titanium particle 2.5-3.5 parts, graphene 4.5-5.5 parts, 7~9 parts of phenoxy polyol resin,
1.5~2.5 parts of malonic acid, 0.8~1.2 part of lactic acid, 0.8~1.2 part of benzoic acid, 8~10 parts of n-butyl lactate, ethylene glycol 9~
1.5~2.5 parts of 11 parts, 1.9~2.1 parts of alcohol APEO and nitromethane.
Further, the solder(ing) paste is made up of the component of following parts by weight：15 parts of tin-bismuth alloy electroplating solder powder, Sn-
70 parts of Ag-Cu series solder powder, 3 parts of nano-titanium particle, 5 parts of graphene, 8 parts of phenoxy polyol resin, 2 parts of malonic acid, 1.0 parts of lactic acid,
2 parts of 1.0 parts of benzoic acid, 9 parts of n-butyl lactate, 10 parts of ethylene glycol, 2.0 parts of alcohol APEO and nitromethane.
The advantage of the invention is that：Stamp-mounting-paper diode of the present invention welds the preparation method of special solder(ing) paste, passes through the present invention
Component and appropriate proportioning so that solder(ing) paste can effectively ensure welding quality, and then can be effectively applied to electricity
In sub- component；In addition, the graphene by adding proper proportion, graphene and solid solution titanium crystal interaction so that solid solution
Titanium preferentially reacts with oxygen, forms one layer of thin and compact oxide-film in the liquid level moment of fusion welding, the oxide-film can be effective
Isolation extraneous oxygen in ground enters in film, and the copper that can suppress in fusion welding aoxidizes, so as to significantly improve solder alloy
Antioxygenic property.
Embodiment
The following examples can make professional and technical personnel that the present invention be more fully understood, but therefore not send out this
It is bright to be limited among described scope of embodiments.
Embodiment 1
The present embodiment stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, and the solder(ing) paste is by the component of following parts by weight
Composition：10 parts of tin-bismuth alloy electroplating solder powder, 60 parts of Sn-Ag-Cu series solder powder, 2 parts of nano-titanium particle, 4 parts of graphene, phenolic alcohol
6 parts of resin, 1 part of malonic acid, 0.5 part of lactic acid, 0.5 part of benzoic acid, 6 parts of n-butyl lactate, 5 parts of ethylene glycol, alcohol APEO
1.5 parts and 1 part of nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
Embodiment 2
The present embodiment stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, and the solder(ing) paste is by the component of following parts by weight
Composition：20 parts of tin-bismuth alloy electroplating solder powder, 80 parts of Sn-Ag-Cu series solder powder, 4 parts of nano-titanium particle, 6 parts of graphene, phenolic alcohol
10 parts of resin, 3 parts of malonic acid, 1.5 parts of lactic acid, 1.5 parts of benzoic acid, 12 parts of n-butyl lactate, 15 parts of ethylene glycol, alcohol polyoxyethylene
3 parts of 2.5 parts of ether and nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
Embodiment 3
The present embodiment stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, and the solder(ing) paste is by the component of following parts by weight
Composition：14 parts of tin-bismuth alloy electroplating solder powder, 65 parts of Sn-Ag-Cu series solder powder, 2.5 parts of nano-titanium particle, 4.5 parts of graphene,
7 parts of phenoxy polyol resin, 1.5 parts of malonic acid, 0.8 part of lactic acid, 0.8 part of benzoic acid, 8 parts of n-butyl lactate, 9 parts of ethylene glycol, alcohol polyoxy
1.5 parts of 1.9 parts of vinethene and nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
Embodiment 4
The present embodiment stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, and the solder(ing) paste is by the component of following parts by weight
Composition：16 parts of tin-bismuth alloy electroplating solder powder, 75 parts of Sn-Ag-Cu series solder powder, 3.5 parts of nano-titanium particle, 5.5 parts of graphene,
9 parts of phenoxy polyol resin, 2.5 parts of malonic acid, 1.2 parts of lactic acid, 1.2 parts of benzoic acid, 10 parts of n-butyl lactate, 11 parts of ethylene glycol, alcohol gather
2.5 parts of 2.1 parts of oxygen vinethene and nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
Embodiment 5
The present embodiment stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, and the solder(ing) paste is by the component of following parts by weight
Composition：15 parts of tin-bismuth alloy electroplating solder powder, 70 parts of Sn-Ag-Cu series solder powder, 3 parts of nano-titanium particle, 5 parts of graphene, phenolic alcohol
8 parts of resin, 2 parts of malonic acid, 1.0 parts of lactic acid, 1.0 parts of benzoic acid, 9 parts of n-butyl lactate, 10 parts of ethylene glycol, alcohol APEO
2.0 parts and 2 parts of nitromethane；The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The skill of the industry
For art personnel it should be appreciated that the present invention is not limited to the above embodiments, described in above-described embodiment and specification is explanation
The principle of the present invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these
Changes and improvements all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and
Its equivalent thereof.
Claims (3)
1. a kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste, it is characterised in that：
The solder(ing) paste is made up of the component of following parts by weight：Tin-bismuth alloy electroplating solder powder 10-20 parts, Sn-Ag-Cu series welderings
Glass putty 60-80 parts, nano-titanium particle 2-4 parts, graphene 4-6 parts, 6~10 parts of phenoxy polyol resin, 1~3 part of malonic acid, lactic acid 0.5
~1.5 parts, 0.5~1.5 part of benzoic acid, 6~12 parts of n-butyl lactate, 5~15 parts of ethylene glycol, alcohol APEO 1.5~2.5
1~3 part of part and nitromethane；
The preparation method of the solder(ing) paste comprises the following steps：
（1）The tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder and nano-titanium particle of above-mentioned parts by weight are encapsulated in vacuum
In quartz ampoule, the nitrogen protective gas of high-purity is then charged with；
（2）By step（1）In packaged raw material be put into melting in reacting furnace and be heat-treated, the liquation after being completely melt；
（3）Graphene is placed in stirring ball mill, is filled with liquid nitrogen to after being totally submerged abrading-ball, ball milling is carried out, after ball milling
Powder take out, add step（2）Liquation in be stirred, be subsequently placed in inert gas shielding case and be cooled to room temperature, then
Load mould for hot pressed sintering and obtain solder alloy powder；
（4）Phenoxy polyol resin, malonic acid, lactic acid, benzoic acid, n-butyl lactate, second are sequentially added into synthesizer according to dosage
Glycol, alcohol APEO, nitromethane and step（3）In solder alloy powder, then sealing stirring, produce.
2. stamp-mounting-paper diode according to claim 1 welds the preparation method of special solder(ing) paste, it is characterised in that：The weldering
Tin cream is made up of the component of following parts by weight：Tin-bismuth alloy electroplating solder powder 14-16 parts, Sn-Ag-Cu series solder powders 65-75
Part, nano-titanium particle 2.5-3.5 parts, graphene 4.5-5.5 parts, 7~9 parts of phenoxy polyol resin, 1.5~2.5 parts of malonic acid, lactic acid
0.8~1.2 part, 0.8~1.2 part of benzoic acid, 8~10 parts of n-butyl lactate, 9~11 parts of ethylene glycol, alcohol APEO 1.9~
2.1 parts and 1.5~2.5 parts of nitromethane.
3. stamp-mounting-paper diode according to claim 1 welds the preparation method of special solder(ing) paste, it is characterised in that：The weldering
Tin cream is made up of the component of following parts by weight：15 parts of tin-bismuth alloy electroplating solder powder, Sn-Ag-Cu series solder powder 70 part, nanometer
3 parts of titanium particle, 5 parts of graphene, 8 parts of phenoxy polyol resin, 2 parts of malonic acid, 1.0 parts of lactic acid, 1.0 parts of benzoic acid, n-butyl lactate 9
Part, 10 parts of ethylene glycol, 2.0 parts of alcohol APEO and 2 parts of nitromethane.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710807320.1A CN107695567A (en) | 2017-09-08 | 2017-09-08 | A kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710807320.1A CN107695567A (en) | 2017-09-08 | 2017-09-08 | A kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste |
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| CN201710807320.1A Pending CN107695567A (en) | 2017-09-08 | 2017-09-08 | A kind of stamp-mounting-paper diode welds the preparation method of special solder(ing) paste |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109262162A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of high-performance solder(ing) paste |
| CN113199171A (en) * | 2021-04-19 | 2021-08-03 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for automobile control panel and homogenizing equipment thereof |
| US20230199949A1 (en) * | 2021-12-16 | 2023-06-22 | Dell Products L.P. | Solder composition for use in solder joints of printed circuit boards |
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| CN106695158A (en) * | 2016-12-28 | 2017-05-24 | 北京康普锡威科技有限公司 | Soft solder containing graphene and preparation method of soft solder |
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| CN102581504A (en) * | 2012-03-23 | 2012-07-18 | 天津大学 | Graphene reinforced lead-free solder and preparation method thereof |
| WO2015004467A2 (en) * | 2013-07-10 | 2015-01-15 | Cambridge Enterprise Limited | Materials and methods for soldering, and soldered products |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109262162A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of high-performance solder(ing) paste |
| CN113199171A (en) * | 2021-04-19 | 2021-08-03 | 江苏博蓝锡威金属科技有限公司 | Preparation method of solder paste for automobile control panel and homogenizing equipment thereof |
| US20230199949A1 (en) * | 2021-12-16 | 2023-06-22 | Dell Products L.P. | Solder composition for use in solder joints of printed circuit boards |
| US11832386B2 (en) * | 2021-12-16 | 2023-11-28 | Dell Products L.P. | Solder composition for use in solder joints of printed circuit boards |
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Application publication date: 20180216 |