CN106392364A - Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste - Google Patents
Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste Download PDFInfo
- Publication number
- CN106392364A CN106392364A CN201610966576.2A CN201610966576A CN106392364A CN 106392364 A CN106392364 A CN 106392364A CN 201610966576 A CN201610966576 A CN 201610966576A CN 106392364 A CN106392364 A CN 106392364A
- Authority
- CN
- China
- Prior art keywords
- scaling powder
- printing techniques
- quality accounting
- lead
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a lead-free solder paste used for a jet printing technology and a preparation method of the lead-free solder paste. The lead-free solder paste used for the jet printing technology is prepared from, by mass ratio, 79.13%-82.03% of Sn, 2.46%-2.55% of Ag, 0.41%-0.43% of Cu and 15%-18% of scaling powder. The scaling powder is prepared from, by mass ratio, 36%-42% of a solvent, 6%-10% of an active agent, 8% of a thixotropic agent and the balance rosin. The solder paste prepared through the method is free of lead and halogen, environment-friendly and good in wettability in use, and smooth in jet printing during jet printing, a welding spot is smooth and full, and the mechanical performance is good.
Description
Technical field
The present invention relates to a kind of electronic welding field, specifically a kind of leadless soldering tin paste for Printing techniques and its
Preparation method.
Background technology
Move towards the microencapsulated of higher component density and complicated printed board designer trends with surface installation technique industry
Development, traditionally dominant fabrography gradually can not meet demand, and Printing techniques can process challenging encapsulation, therefore enters
Enter the sight line of people.The advantage of this technology is mainly：Spray printing speed is fast, can mate with the chip mounter of 30,000cph speed, with
The tin cream amount of each solder joint of Shi Youhua, can quickly revise, and postwelding need not clean or manually adjust simultaneously.
The application of Printing techniques is challenged to the current tin cream using.It is commonly 3# using the glass putty particle diameter of tin cream at present
（25-45μm）、4#（20-38μm）Powder, the tin cream glass putty particle diameter that Printing techniques use is 7#（2-11μm）Or 8#（2-8μm）Powder.
Glass putty particle diameter is big, easily blocks shower nozzle, hinders lower stannum, affects tin cream spray printing quality.Glass putty particle diameter is little, and agglomeration is serious, stannum
The worsened wettability of cream.Therefore, research and development are applied to the tin cream of Printing techniques to the popularization of this Printing techniques with using having greatly
Meaning.
Content of the invention
The purpose of the present invention is to overcome the shortcomings of existing for prior art, provides a tin cream being applied to Printing techniques.
For achieving the above object, the technical solution adopted in the present invention is：A kind of leadless soldering tin paste for Printing techniques,
Be by the Sn of quality accounting 79.13%-82.03%, the Ag of quality accounting 2.46-2.55%, the Cu of quality accounting 0.41-0.43%,
The scaling powder composition of quality accounting 18-15%.
Described scaling powder by the solvent of quality accounting 36-42%, the activating agent of quality accounting 6-10%, the touching of quality accounting 8%
Become agent, the Colophonium composition of surplus.
Described solvent is one of Sorbitol, butyl carbitol, 2,2'-ethylenedioxybis(ethanol). methyl ether or two kinds, and its effect can ensure that and helps
Other medicaments in solder flux are completely dissolved.
Described activating agent is one of citric acid, 1,5-pentanedicarboxylic acid., fumaric acid or two kinds, and its effect is to ensure that enough work
Property, remove the oxide of bond pad surface, good wettability is provided.
Described thixotropic agent is castor oil hydrogenated.
Described Colophonium is one of hydrogenated rosin, disproportionated rosin, gum rosin or two kinds, and its effect is to provide good sticking
Put forth effort, prevent running from falling part, can prevent simultaneously tin cream occur cold collapse and heat collapse, reduce components and parts short-circuit risks.
The invention also discloses a kind of preparation method based on the above-mentioned leadless soldering tin paste for Printing techniques, specifically such as
Under：
Step one, the solvent weighing corresponding proportion, activating agent, thixotropic agent, Colophonium are made standby.
Step 2, Sn, Ag, the Cu weighing corresponding proportion are prepared into glass putty.
Step 3, the solvent by step one, activating agent, thixotropic agent, Colophonium cook into scaling powder, after the completion of cooking, cold
But 24 hours, grind scaling powder with grinder, observe under the microscope, until the no obvious graininess of scaling powder even particle size distribution
Material.
Step 4, mixing scaling powder and glass putty, stirring, glass putty and scaling powder mix homogeneously, tin cream completes.
The tin cream that the present invention is prepared from is unleaded, Halogen, and during use, environmental protection and wettability are good, the spray printing stream in spray printing
Freely, solder joint is smooth full, good mechanical performance.
Specific embodiment
For convenience of being further understood to the present invention, now enumerate embodiment, the present invention is further illustrated.
Embodiment 1：
Weigh 42g butyl carbitol, 42g hydrogenated rosin, 7g 1,5-pentanedicarboxylic acid., 1g fumaric acid, beaker put into by 8g castor oil hydrogenated, one
Determine to cook scaling powder at temperature, treat that all medicaments dissolve, during the transparent liquid of scaling powder, beaker is taken off from warm table, natural
Cooling 24h, scaling powder is put on grinder and grinds 3-5 time, examine under a microscope, scaling powder even particle size distribution is no obvious
During particulate material, grinding terminates, and scaling powder preparation completes.The Cu weighing Ag, 0.43kg of Sn, 2.55kg of 82.03kg exists
Glass putty is made, then with 15 under certain condition:85 weight, than mixing scaling powder and glass putty, stirs, tin cream completes.
Embodiment 2：
Weigh 39g 2,2'-ethylenedioxybis(ethanol). methyl ether, 43g disproportionated rosin, 10g 1,5-pentanedicarboxylic acid., beaker put into by 8g castor oil hydrogenated, at a certain temperature
Cook scaling powder, treat that all medicaments dissolve, during the transparent liquid of scaling powder, beaker is taken off from warm table, natural cooling 24h,
Scaling powder is put on grinder and grinds 3-5 time, examine under a microscope, the no obvious granular substance of scaling powder even particle size distribution
During matter, grinding terminates, and scaling powder preparation completes.
Weigh the Cu of Ag, 0.42kg of Sn, 2.52kg of 81.06kg, make glass putty under certain condition, then with 16:
84 weight, than mixing scaling powder and glass putty, stirs, tin cream completes.
Embodiment 3：
Weigh 16g Sorbitol, 20g 2,2'-ethylenedioxybis(ethanol). methyl ether, 30g hydrogenated rosin, 20g gum rosin, 4g citric acid, 2g fumaric acid, 8g hydrogen
Change Oleum Ricini and put into beaker, cook scaling powder at a certain temperature, treat that all medicaments dissolve, during the transparent liquid of scaling powder,
Beaker takes off from warm table, natural cooling 24h, scaling powder is put on grinder and grinds 3-5 time, examine under a microscope, help
Flux particle size be evenly distributed no substantially particulate material when, grinding terminates, and scaling powder preparation completes.
Weigh the Cu of Ag, 0.41kg of Sn, 2.46kg of 79.13kg, make glass putty under certain condition, then with 18:
82 weight, than mixing scaling powder and glass putty, stirs, tin cream completes.
Above-mentioned embodiment is only the preferred embodiment of the present invention it is impossible to limit the scope of protection of the invention with this,
The change of any unsubstantiality that those skilled in the art is done on the basis of the present invention and replacement belong to institute of the present invention
Claimed scope.
Claims (6)
1. a kind of leadless soldering tin paste for Printing techniques it is characterised in that：Be by quality accounting 79.13%-82.03% Sn,
The Ag of quality accounting 2.46-2.55%, the Cu of quality accounting 0.41-0.43%, the scaling powder composition of quality accounting 18-15%；Described
Scaling powder by the solvent of quality accounting 36-42%, the activating agent of quality accounting 6-10%, the thixotropic agent of quality accounting 8%, surplus
Colophonium forms.
2. a kind of preparation method of the leadless soldering tin paste for Printing techniques it is characterised in that：Step one, weigh corresponding proportion
Solvent, activating agent, thixotropic agent, Colophonium are made standby；Step 2, Sn, Ag, the Cu weighing corresponding proportion are prepared into glass putty；Step 3,
Solvent in step one, activating agent, thixotropic agent, Colophonium are cooked into scaling powder, after the completion of cooking, cools down 24 hours, with grinding
Machine grinds scaling powder, observes under the microscope, until the no obvious particulate material of scaling powder even particle size distribution；Step 4, mixed
Close scaling powder and glass putty, stirring, glass putty and scaling powder mix homogeneously, tin cream completes.
3. as described in claim 1 a kind of leadless soldering tin paste for Printing techniques it is characterised in that：Described solvent is mountain
One of pears alcohol, butyl carbitol, 2,2'-ethylenedioxybis(ethanol). methyl ether or two kinds.
4. as described in claim 1 a kind of leadless soldering tin paste for Printing techniques it is characterised in that：Described activating agent is
One of citric acid, 1,5-pentanedicarboxylic acid., fumaric acid or two kinds, its effect is to ensure that enough activity, removes the oxidation of bond pad surface
Thing, provides good wettability.
5. as described in claim 1 a kind of leadless soldering tin paste for Printing techniques it is characterised in that：Described thixotropic agent is
Castor oil hydrogenated.
6. as described in claim 1 a kind of leadless soldering tin paste for Printing techniques it is characterised in that：Described Colophonium is hydrogen
Change one of Colophonium, disproportionated rosin, gum rosin or two kinds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610966576.2A CN106392364A (en) | 2016-10-28 | 2016-10-28 | Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610966576.2A CN106392364A (en) | 2016-10-28 | 2016-10-28 | Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106392364A true CN106392364A (en) | 2017-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610966576.2A Pending CN106392364A (en) | 2016-10-28 | 2016-10-28 | Lead-free solder paste used for jet printing technology and preparation method of lead-free solder paste |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107695561A (en) * | 2017-11-03 | 2018-02-16 | 张家港市东大工业技术研究院 | A kind of spray printing low viscosity leadless soldering tin paste and its preparation technology |
| CN108406166A (en) * | 2018-03-13 | 2018-08-17 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of halogen-free spray printing tin cream scaling powder and preparation method thereof |
| CN108555475A (en) * | 2018-04-27 | 2018-09-21 | 深圳市博士达焊锡制品有限公司 | A kind of lead-free and halogen-free solder(ing) paste |
| CN110405377A (en) * | 2019-07-10 | 2019-11-05 | 深圳市博士达焊锡制品有限公司 | A kind of semiconductor high temperature print solder paste |
| CN113857714A (en) * | 2021-10-22 | 2021-12-31 | 南京航空航天大学 | Epoxy resin composite Sn-Ag-Cu lead-free soldering paste |
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| CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
| CN102357747A (en) * | 2011-09-06 | 2012-02-22 | 云南锡业锡材有限公司 | Lead-free solder paste for ultrafine solder powder and preparation method thereof |
| CN102554489A (en) * | 2011-12-28 | 2012-07-11 | 宁波圣之岛焊锡材料有限公司 | Low-rosin halogen and lead-free solder paste and preparation method thereof |
| CN104476016A (en) * | 2014-11-05 | 2015-04-01 | 苏州赛普特电子科技有限公司 | Lead-free and halogen-free soldering paste for semiconductors |
| CN105014253A (en) * | 2014-04-30 | 2015-11-04 | 江苏博迁新材料有限公司 | Lead-free tin solder paste and preparation method thereof |
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2016
- 2016-10-28 CN CN201610966576.2A patent/CN106392364A/en active Pending
Patent Citations (6)
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| CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN102000927A (en) * | 2009-09-03 | 2011-04-06 | 浙江省冶金研究院有限公司 | Lead-free soldering paste |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107695561A (en) * | 2017-11-03 | 2018-02-16 | 张家港市东大工业技术研究院 | A kind of spray printing low viscosity leadless soldering tin paste and its preparation technology |
| CN108406166A (en) * | 2018-03-13 | 2018-08-17 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of halogen-free spray printing tin cream scaling powder and preparation method thereof |
| CN108555475A (en) * | 2018-04-27 | 2018-09-21 | 深圳市博士达焊锡制品有限公司 | A kind of lead-free and halogen-free solder(ing) paste |
| CN110405377A (en) * | 2019-07-10 | 2019-11-05 | 深圳市博士达焊锡制品有限公司 | A kind of semiconductor high temperature print solder paste |
| CN113857714A (en) * | 2021-10-22 | 2021-12-31 | 南京航空航天大学 | Epoxy resin composite Sn-Ag-Cu lead-free soldering paste |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170215 |
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| RJ01 | Rejection of invention patent application after publication |