CN108555475A - A kind of lead-free and halogen-free solder(ing) paste - Google Patents
A kind of lead-free and halogen-free solder(ing) paste Download PDFInfo
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- CN108555475A CN108555475A CN201810392076.1A CN201810392076A CN108555475A CN 108555475 A CN108555475 A CN 108555475A CN 201810392076 A CN201810392076 A CN 201810392076A CN 108555475 A CN108555475 A CN 108555475A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of lead-free and halogen-free solder(ing) pastes of high stability, scaling powder are produced by the feed postition of the film forming agent of the suitable type of selection and proportioning, solvent, activating agent, thixotropic agent and thixotropic agent, according to glass putty：Scaling powder=88.5: 11.5 proportioning is obtained with good stability of viscidity and the sloughing lead-free and halogen-free solder(ing) paste of high cold-and-heat resistent.
Description
Technical field
The present invention relates to solder(ing) paste field, more particularly to a kind of lead-free and halogen-free solder(ing) paste.
Background technology
Solder(ing) paste is a kind of pasty masses mixed by solder alloy powder and scaling powder.In SMT technologies, scolding tin
Cream is electronic component and the critical material of substrate connection, and the performance of solder(ing) paste will will have a direct impact on the usability of electronic product
Energy.Performance requirement to solder(ing) paste includes storage stability, printing stability, wetability, solderability and reliability.In order to full
These characteristic requirements of sufficient solder(ing) paste must just reasonably select the type, ratio, feed postition of the raw material of tin cream each component
Deng.
European Union member countries (including Holland, Denmark, Sweden, Australia, Belgium, Italy, Finland and Germany) in 2003
Formally disclose《Waste electronic andelectrical equipment instructs》(WEEE-2002/96/EC) and《Forbid about in electronic electric equipment
Use certain Hazardous Substances Directives》(RoHS-2002/95/EC), main purpose is to reduce electrical and electronic equipment waste
And recycling and reutilization system are established, it may to human body and environment institute in discarded, burial and burning to reduce these substances
Caused by endanger and impact.August member state of European Union all before 31 days in 2004 must make to one's name country and meet
The regulation that WEEE and RoHS two is instructed, and in 1 day July in 2006, the electronic and electrical equipment of defined in all WEEE instructions
When entering European market, the harmful substance (lead, mercury, cadmium, Cr VI, the more bromines connection that are previously mentioned in can not being instructed containing RoHS
Benzene and polybrominated diphenyl ethers).This two instructions propose higher environmental requirement to electronic communication product, are generated to products export huge
It influences.Therefore, unleaded imperative for tin cream product.People are constantly looking for new lead-free solder, wherein Sn-
Ag-Cu systems solder obtains more and more extensive research and application because of its good comprehensive performance.
Halogen refers to V Group IIA nonmetalloid in the periodic table of elements, including fluorine (F), chlorine (Cl), bromine (Br), iodine (I)
With astatine (At) because astatine be radioactive element, it has often been said that halogen be fluorine, chlorine, bromine and iodine.In tin cream, the normal quilt of halogen
Serve as the activating agent in scaling powder, the addition of halogen can greatly enhance the activity of scaling powder, but the corrosivity of postwelding compared with
Greatly, manufactured tin cream storage stability is also poor.Meanwhile halogen is to internal system, reproduction and the toxic effect of development system,
Other spirit and psychological disease can also be caused, or even have carcinogenesis.The test method EN14582 Halogen-free requirements of halogen：Bromine, chlorine
Content is respectively smaller than 900ppm, and (bromine+chlorine) is less than 1500ppm.To meet the requirement to product reliability and avoiding to environment
Research with the injury of human body, Halogen even zero halogen tin cream more and more seems extremely urgent.
Most tin cream product be protected in client producing line using meeting in this preceding a period of time after the completion of by production
There are in 0~10 DEG C of low temperature environment, its purpose is to slow down the chemical reaction of scaling powder and fine particle surface in tin cream,
Viscosity and thixotropy of the tin cream before use is set to be held essentially constant, to ensure the stability and performance of tin cream.But
If the raw material improper use of scaling powder in tin cream, has such as used the mismatch of extremely strong activating agent or film forming agent, or
Be thixotropic agent feed postition it is wrong, leading to tin cream, viscosity and thixotropy vary widely during storage.
And under normal circumstances, during continuous printing, viscosity can be presented first tin cream with the increase of print pass
Then raised trend is reduced, this is primarily due to soldering paste during continuous printing, and viscosity recovery causes just there are hysteresis quality
Start viscosity to decline, with the extension of printing time, the solvent portion in tin cream is volatilized, and powder particles and scaling powder are added
Chemical reaction than occurring in the process in standing during rolling around is more violent, causes tin cream gradually dry, viscosity liter
It is high.If tin cream is poor in printing process medium viscosity stability, tin cream viscosity increase rate is accelerated, and may can draw in a short time
It plays tin cream hair shaft and does not even descend tin completely so as to cause printing is difficult.
After completing paste solder printing, the tin cream in template is needed to maintain its shape invariance and not caved in, i.e., tin cream needs
With good anti-cold collapse resistant.If tin cream is anti-cold collapse resistant bad, especially for the formation bridging of close spacing, cause
Short circuit.Under normal circumstances, the viscosity of tin cream is bigger, and it is cold collapse resistant better to resist, if viscosity is excessive, although it is anti-cold collapse resistant
Very well, but simultaneously it is bad and worthless also to will appear printing.
Collapse resistant heat resistanceheat resistant refers to that tin cream is heated after being completed for printing, before alloy melting, what tin cream did not caved in
Ability.Mainly to prevent tin cream from caving in preheating zone in reflow process, preheating environment temperature is about 150~180 DEG C.
For the bad tin cream of collapse resistance, tin cream adhesion is easily formed between warm-up phase, adjacent tin cream, postwelding easily forms tin sweat(ing),
For close pitch pad, tin cream adhesion caused by caving in easily forms short circuit, to form weld defect after being melted down.
Based on background above, film forming agent of the present invention used in the tin cream scaling powder, solvent, thixotropic agent and thixotropic agent plus
Enter the directions such as mode to start with, it is collapse resistant to obtain high viscosity stability and cold-and-heat resistent.
Invention content
Technical problem to be solved by the invention is to provide a kind of lead-free and halogen-free solder(ing) paste, raising is protected for a long time in tin cream
Deposit in printing process viscosity stability and be completed for printing the collapse resistance energy of tin cream after rear and Reflow Soldering, it is existing to solve
Caused the above-mentioned defects in technology.
To achieve the above object, the present invention provides technical solution below：A kind of lead-free and halogen-free solder(ing) paste, tin tin cream be by
Glass putty and scaling powder are mixed according to the ratio that mass ratio is 88.5: 11.5.
Preferably, the scaling powder is made of substances such as film forming agent, solvent, activating agent and thixotropic agent.
Preferably, the film forming agent is made of KE-100 and KE-604, and total content accounts for the 30%~35% of scaling powder.
Preferably, the solvent is made of tripropylene glycol butyl ether and 2- methyl -2,4- pentanediols, and total content, which accounts for, helps weldering
The 35%~40% of agent.
Preferably, the activating agent is made of succinic acid, adipic acid and dimeric dibasic acid, and total content accounts for the 15% of scaling powder
~20%.
Preferably, the thixotropic agent is made of TALEN VA-79 and ス リ パ Star Network ス ZHS, and total content accounts for scaling powder
4%~5%.
Preferably, the glass putty is Sn96.5Ag3.0Cu0.5, and size specification is 4# (20 μm~38 μm), and oxygen content meets
Required value.
A kind of preparation method of solder(ing) paste scaling powder, the film forming agent and solvent are stirred at high temperature, are that the two is complete
Full-fusing mixing, is added thixotropic agent and activating agent, keeps High Temperature And Velocity stirring, until not undissolved in appearance in reaction system
Substance, pack carry out fast cooling cooling, after a period of time confirm bag in substance solidify completely, move in freezer and preserve.
The scaling powder of gained is risen again after 4h, is by itself and size specification by a kind of preparation method of solder(ing) paste at normal temperatures
The Sn96.5Ag3.0Cu0.5 welding powders of 4# (20 μm~38 μm) uniformly mix, and tinning is stored refrigerated.
It is using the advantageous effect of above technical scheme：The present invention can not only meet tin cream using preceding and continuous printing mistake
Stability of viscidity in journey, and make solder(ing) paste after being completed for printing and do not cave in reflow process, to be to open
It sends out lead-free and halogen-free solder(ing) paste high performance and practical basis and theoretical foundation is provided.
Specific implementation mode
The following detailed description of the preferred embodiment of the present invention.
In order to make solder(ing) paste obtained meet basic requirement, the research of activating agent is carried out first with preferably, is passed through
Spreadability is tested and the test of activating agent dissolubility, to determine bioactive agent composition used in later stage research.
The present invention selects succinic acid, adipic acid, decanedioic acid, dimeric dibasic acid, dihydromethyl propionic acid etc. as activating agent research pair
As because the ideal reflux temperature that the active decomposition temperature scope of these organic acids meets Sn96.5Ag3.0Cu0.5 solder(ing) pastes is bent
Line.In order to ensure do not occur the precipitation of activating agent in later stage test process, dissolubility test is carried out to activating agent, by activating agent
6h is stood under 0 DEG C of environment after dissolving, gradually increases the content of activating agent, until activating agent is precipitated in a solvent.As a result such as table 1
Shown (dimeric dibasic acid is liquid organic acid, does not have to consider its dissolubility)：
Table 1
Influence of the different activities agent to solder spreading wetting is had studied on the basis of the above dissolubility result.Solder flux at
It is divided into activating agent: hexyl ether solvent (mass ratio)=1: 20, it is enterprising in copper sheet using the Sn96.5Ag3.0Cu0.5 solder balls of 0.3g
Row sprawls experiment.Using Japanese professional standard JIS-Z3198-3, the wettability of solder is weighed by calculating spreading ratio SR,
Spreading ratio is calculated by formula 1：
[formula 1]
In formula：SR is spreading ratio；H is the height (mm) for sprawling rear solder, and D is diameter when solder to be regarded as to sphere
(mm).Table 2 is the result using the Solder Spread rate of different activities agent：
Table 2
In dissolubility test, the dissolubility of succinic acid and adipic acid is got well than two kinds remaining；And in wetability test,
The spreading ratio of succinic acid and adipic acid is also better than two kinds remaining.
So in stability test below,
It is preferred that succinic acid, adipic acid and dimeric dibasic acid are as activating agent.
Preferably, the rosin resin is KE-100 and KE-604.
Preferably, the solvent is tripropylene glycol butyl ether and 2- methyl -2,4- pentanediols.
Preferably, the thixotropic agent is TALEN VA-79 and ZHS.
A kind of preparation method of solder(ing) paste scaling powder, the film forming agent and solvent are stirred at high temperature, are that the two is complete
Full-fusing mixing, is added thixotropic agent and activating agent, keeps High Temperature And Velocity stirring, until not undissolved in appearance in reaction system
Substance, pack carry out fast cooling cooling, after a period of time confirm bag in substance solidify completely, move in freezer and preserve.
A kind of solder(ing) paste rises again the scaling powder of gained after 4h at normal temperatures, is 4# (20 μm~38 by itself and size specification
μm) Sn96.5Ag3.0Cu0.5 welding powders uniformly mix, tinning is stored refrigerated.
Lead-free and halogen-free solder(ing) paste according to the present invention is on the basis of meeting basic requirement, preferably in scaling powder
The feed postition of film forming agent, the type of solvent and thixotropic agent agent and ratio and thixotropic agent, with Sn96.5Ag3.0Cu0.5 welding powders
Mix into tin cream.During prolonged Cord blood, the viscosity of tin cream does not change substantially；In continuous printing 24 hours
During, the viscosity of tin cream starts to change greatly in half an hour, this is because the shear shinning effect that the thixotropy of tin cream is brought
Fruit, later viscosity remain unchanged substantially；After being completed for printing, tin cream keeps shape invariance in 8h；And in heat caves in experiment,
After 10min at 160 DEG C, the tin cream in minimum pad spacing does not still occur connection phenomenon of caving in.It is according to the present invention
The lead-free and halogen-free solder(ing) paste of high stability will be widely applied in following many fields.
Lead-free and halogen-free solder(ing) paste according to the present invention is according to glass putty: the ratio of scaling powder (mass ratio)=88.5: 11.5
Example is stirred under vacuum in blender under the conditions of 25 DEG C.Wherein, what glass putty was selected is that grain size specification is 4# (20 μm~38 μm)
Sn96.5Ag3.0Cu0.5, the ingredient of glass putty, particle diameter distribution and oxygen content are examined according to SJ/T11391-2009 standards
It surveys, reaches criterion of acceptability.And scaling powder is made of film forming agent, solvent, activating agent, thixotropic agent and other additives, is contained
Amount is as follows：
Film forming agent 25%~30%；Solvent 40%~45%；Activating agent 15%~20%；Thixotropic agent 7%~8%；Addition
Agent 5%~6%.
Embodiment 1
Prepare scaling powder
Raw material：Film forming agent, that is, modified rosin resin 57g (being made of for 12: 7 according to weight ratio KE-100 and KE-604),
Solvent 81g (being made of for 61: 20 according to weight ratio tripropylene glycol butyl ether and 2- methyl -2,4- pentanediol), activating agent 39g
(being made of by weight proportion for 7: 12: 20 succinic acid, adipic acid and dimeric dibasic acid), thixotropic agent 15g are (by TALEN VA-79 and ZHS
Be 4: 1 compositions according to weight ratio), antioxidant 10g is (by 2- ethyl imidazol(e)s, benzotriazole and paracresol according to weight ratio
Example is 7: 2: 1 compositions).
Preparation method：Various raw materials are accurately weighed in proportion, film forming agent and solvent are put into heating container, open stirring
And heating, it is brought rapidly up to 180 DEG C or so.Confirm film forming agent completely with solvent after mixing, maintain it is temperature-resistant, quickly plus
Enter thixotropic agent, activating agent and antioxidant, after stirring to lucky dissolving, takes advantage of high temperature and pour into rapidly in heat-resisting bag air and close is discharged
Envelope, moves in -30 DEG C of pole low temperature environment and is quickly cooled down, and confirms that substance solidifies completely in bag after a period of time, move to 0~
It is preserved in 10 DEG C of environment.
Prepare solder(ing) paste：The scaling powder obtained by embodiment 1 placement is risen again 4 hours at room temperature, according to glass putty: helping weldering
The ratio of agent (mass ratio)=88.5: 11.5 first weighs scaling powder, and scaling powder is put into blender, is stirred under vacuum
6min, speed of agitator 10rpm make scaling powder further be disperseed and be refined.Be added glass putty, set mixing time as
12min, speed of agitator 3rpm make glass putty and scaling powder be sufficiently mixed.It will not be stirred on mixing arm and on agitator wall
Glass putty scrape into bucket, set mixing time to 12min, speed of agitator is set as 10rpm, makes whole glass putty and scaling powder
Reach uniformly mixed state by for a long time and after the stirring of high rotating speed, whole process is passed through in the internal layer cavity of blender and follows
Ring water, it is ensured that whipping process maintains 25 DEG C or so always.After completing above-mentioned steps, the solder(ing) paste tinning that will be obtained is put into 0
It is preserved in~10 DEG C of environment.
Embodiment 2
Prepare scaling powder：Raw material：Film forming agent, that is, modified rosin resin 60g is (by KE-100 and KE-604 according to weight ratio
For 12: 7 compositions), solvent 85g (according to weight ratio be 61: 20 groups by tripropylene glycol butyl ether and 2- methyl -2,4- pentanediol
At), activating agent 36g (being to form at 7: 12: 20 by weight proportion by succinic acid, adipic acid and dimeric dibasic acid), thixotropic agent 16g (by
TALEN VA-79 and ZHS according to weight ratio be 4: 1 composition), antioxidant 11g (by 2- ethyl imidazol(e)s, benzotriazole and
Paracresol is 7: 2: 1 compositions according to weight ratio).
Preparation method：Various raw materials are accurately weighed in proportion, film forming agent and partial solvent are put into heating container, are opened
Stirring and heating, are brought rapidly up to 145 DEG C or so.Thixotropic agent, activating agent, antioxidant and partial solvent are put into emulsifier unit
In emulsified, emulsifying temperature is set as 90 DEG C or so, until the substance that is emulsified becomes paste completely.It waits being mixed thoroughly
Film forming agent and solvent be cooled to 100 DEG C or so, be poured into above-mentioned emulsifier unit, and emulsify complete thixotropic agent, work
Property agent, antioxidant etc. carry out emulsification mixing, this process ON cycle cooling water makes emulsification system be emulsified on one side, on one side into
Row fast cooling, until reactant becomes paste, pack room temperature preservation one week completely.Wait for that scaling powder is stablized after a week, with three rollers
Machine is ground, until scaling powder becomes creamy, seals room temperature preservation.
The step of preparing solder(ing) paste is same as Example 1.
Embodiment 3
The raw material for preparing scaling powder is same as Example 1.Preparation method is same as Example 2.The step of preparing solder(ing) paste
It is same as Example 1.
Embodiment 4
The raw material for preparing scaling powder is same as Example 2.Preparation method is same as Example 1.The step of preparing solder(ing) paste
It is same as Example 1.
Viscosity change result
Four kinds of tin creams involved by aforementioned four embodiment are carried out with the viscosity test after preservation different time and continuous print
Viscosity test after brush different time, result difference are as shown in Table 3 and Table 4：
Table 3
Table 3 shows the viscosity after the tin cream involved by each embodiment corresponds to the different holding times and relative to preservation
Viscosity change after 1 day.Tin cream involved by embodiment 1 viscosity change after preserving 2 months is maximum, by initial
155.2Pas becomes 160.0Pas, change rate 3.09%, and viscosity becomes 156.4Pas after preserving 6 months, becomes
Rate is only 0.77%, from the appearance point of view, the state of tin cream does not change with original state；Tin cream involved by embodiment 2 exists
Viscosity change is maximum after preserving 6 months, becomes 218.6Pas from initial 191.3Pas, change rate 14.27%, and
Viscosity becomes 195.5Pas after preserving 1 week, and change rate just has reached 2.19%, from the appearance point of view, tin cream after preserving 6 months
For state compared with original state, surface is obviously dry, after stirring a few minutes, and the moistening become；Tin cream involved by embodiment 3 exists
Viscosity change is maximum after preserving 6 months, becomes 190.2Pas from initial 175.6Pas, change rate 8.31%, from outer
It is seen in sight, the state of tin cream compared with original state, provoked with scraper, can smoothly flow down and be scraped without being stained on by the slightly aobvious hair shaft in surface
On knife；Tin cream involved by embodiment 4 viscosity change after preserving 6 months is maximum, is become from initial 161.2Pas
170.3Pas, change rate 5.64%, from the appearance point of view, the state of tin cream does not change with original state.
The result obtained according to the above analysis can be summarized as the viscosity change embodiment 1 of four kinds of tin cream Cord blood processes
4 ＜ embodiments of ＜ embodiments, 3 ＜ embodiments 2.Embodiment 1 is identical with the scaling powder preparation method of tin cream involved by embodiment 4, all
It is to be a difference in that the ratio of raw material is different using the burned method of high temperature；And tin cream involved by embodiment 2 and embodiment 3
Scaling powder preparation method is identical, is all the method using low temperature emulsified dispersion, and difference is also that the ratio of raw material is different.Institute
With, it is inferred that the input ratio and preparation method of raw material have to the stability of tin cream Cord blood process medium viscosity it is larger
It influences.
Table 4 show the viscosity after the tin cream involved by each embodiment corresponds to the different continuous printing times and relative to
Viscosity change before printing.Tin cream involved by embodiment 1 viscosity change after continuous printing 4h is maximum, by initial
156.2Pas becomes 161.6Pas, change rate 3.46%, and viscosity becomes 160.5Pas after continuous printing 8h, becomes
Rate is 2.75%, and tin cream is provoked with scraper from steel mesh, can be under normal stream, and is in moisture state in appearance；Involved by embodiment 2
And tin cream after continuous printing 8h viscosity change it is maximum, 171.2Pas is become from initial 189.9Pas, change rate is
9.85%, from steel mesh tin cream is provoked with scraper, can be under normal stream, and be in moisture state in appearance；Tin involved by embodiment 3
Cream viscosity change after continuous printing 1h is maximum, becomes 162.3Pas from initial 175.5Pas, change rate 7.52%,
From steel mesh tin cream is provoked with scraper, can be under normal stream, and be in moisture state in appearance；Tin cream involved by embodiment 4 is even
Viscosity change is maximum after continuous printing 4h, becomes 170.3Pas, change rate 4.48%, from steel mesh from initial 163.0Pas
On with scraper provoke tin cream, can be under normal stream, and be in moisture state in appearance.
Table 4
Consolidated statement 3,4 analysis results, the input ratio of tin cream scaling powder raw material and the preparation method of scaling powder are to tin cream
The variation of preservation process medium viscosity has larger impact.And in continuous 8 hours printing process although tin cream viscosity changes, but print
Brush result is simultaneously without exception.This illustrates that the viscosity change of tin cream is possible to that the bad of subsequent print run can be caused, but such as fruit
Border production status is good, and tin cream is still considered as can be used.In order to ensure the reliability of product, it is proposed that the small tin of selection viscosity change
Cream.
The collapse resistant result of cold-and-heat resistent
Tin cream involved by four embodiments is carried out to resist cold test of caving in, testing standard is by the base after print solder paste
Plate places 15min at a temperature of 25 DEG C.The unconnected minimum spacing of tin cream is smaller on test board, illustrates the anti-cold collapse resistant of tin cream
Better.Test result is as shown in table 5 and table 6.
The cold test result of caving in of table 5 (IPC-TM-650 standards)
The cold test result of caving in of table 6 (JISZ3284 standards)
As shown in Table 5, it is not interconnected using four kinds of solder(ing) pastes of 0.63 × 2.03mm templates, i.e., horizontal and vertical tin
The minimum spacing that cream does not interconnect is 0.33mm；And four kinds of tin creams of 0.33 × 2.03mm templates is used to occur at 0.06mm
It caves in interconnection, i.e., the minimum spacing not interconnected is 0.10mm.
As shown in Table 6, do not interconnected using soldering paste in the four of 3.0 × 1.5mm and 3.0 × 0.7mm templates, it is minimum not
It is 0.20mm to interconnect spacing.
From the above, it can be seen that raw material types are identical in formulations of solder flux, the different ratio of raw material
With the tin cream obtained by different scaling powder preparation methods, although viscosity differences are larger, it is anti-cold collapse resistant all preferable.Supposition pair
In tin cream it is anti-it is cold cave in, what is played a decisive role is the type of scaling powder raw material, type, grain size, oxygen content and the print of glass putty
Brush test parameters.
The collapse resistant test of heat resistanceheat resistant for the tin cream involved by four embodiments, equally using IPC-TM-650 and
Two kinds of standards of JISZ3284.Test condition is that solder(ing) paste printing test board is stood 15min at a temperature of 150 DEG C.Test result
As shown in table 7 and table 8.
7 heat of table is caved in test result (IPC-TM-650 standards)
It can be seen from test result compared with cold test result of caving in, after hot slump consistency test, the interconnection of some tin creams is existing
As serious, some variations are little.
In table 7, using the tin cream of 0.63 × 2.03mm templates after hot slump consistency test, the tin cream involved by embodiment 1
It does not interconnect, embodiment 2,3,4 interconnects, and embodiment 4 is only caved at 0.33mm spacing, i.e., minimum not interconnect
Spacing be 0.41mm, and embodiment 2,3 occur it is serious cave in, the spacing that does not interconnect of minimum is 0.56mm；Using
The tin cream of 0.33 × 2.03mm templates is through after hot slump consistency test, the tin cream involved by embodiment 1 only collapses at 0.06mm spacing
It collapses interconnection, it is 0.10mm that minimum, which does not interconnect spacing still, and embodiment 2,3,4 interconnects, and minimum does not interconnect spacing and divides
It Wei not 0.25mm, 0.30mm and 0.20mm.
It is real using the tin cream of 3.0 × 1.5mm templates through after hot slump consistency test, embodiment 1 does not interconnect in table 8
It applies example 4 only to cave at 0.2mm spacing, i.e., the minimum spacing not interconnected is 0.3mm, and embodiment 2,3 occurs relatively sternly
Weight caves in, and the spacing that minimum does not interconnect is respectively 0.6mm and 0.4mm；Using the tin cream of 3.0 × 0.7mm templates through collapsing through heat
Collapse after experiment, embodiment 1,4 is to interconnect, embodiment 2,3 occur it is more serious cave in, the minimum spacing that does not interconnect point
It Wei not 0.5mm and 0.4mm.
8 heat of table is caved in test result (JISZ3284 standards)
Show that the collapse resistant embodiment 1 of the tin cream heat resistanceheat resistant involved by four embodiments is optimal according to the above results analysis, secondly
It is embodiment 4, is embodiment 3 again, worst is embodiment 2.The raw material of tin cream scaling powder involved by four embodiments
Type all same.Embodiment 1 and the preparation method of 4 scaling powders are all that high temperature is burned, and difference is scaling powder raw material input ratio
Example；The preparation method of tin cream scaling powder involved by embodiment 2 and 3 is all low temperature emulsified dispersion, and difference lies also in scaling powder original
Material puts into ratio.It is possible thereby to infer, raw material types under the same conditions, suitably change each former material in formulations of solder flux
The proportioning of material, the heat resistanceheat resistant that can't influence solder(ing) paste is collapse resistant, but has an impact certainly to welding performance；And preparation method is not
Together, be scaling powder the technological process of production difference, the characteristic of obtained scaling powder is also different, and thus prepared tin cream is not
Only welding performance is variant, and heat resistanceheat resistant is collapse resistant also entirely different.
The viscosity stability and the collapse resistant result of cold-and-heat resistent of tin cream involved by comprehensive four embodiments are analyzed, and are obtained
Conclusion to be tin cream involved by embodiment 1 have optimal viscosity stability and cold-and-heat resistent collapse resistant.This tin cream is as one
Money has the lead-free and halogen-free solder paste of high stability, and preparation process is simple, and welding performance is good, is expected in military and aircraft industry
It is applied and promotes.
The above is only a preferred embodiment of the present invention, it is noted that come for those of ordinary skill in the art
It says, without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to the present invention's
Protection domain.
Claims (7)
1. a kind of lead-free and halogen-free solder(ing) paste, which is characterized in that it according to mass ratio is 88.5 that tin tin cream, which is by glass putty and scaling powder:
11.5 ratio mixes.
2. lead-free and halogen-free solder(ing) paste as described in claim 1, which is characterized in that the scaling powder is by film forming agent, solvent, activity
The substances such as agent and thixotropic agent are constituted.
3. lead-free and halogen-free solder(ing) paste as claimed in claim 2, which is characterized in that the film forming agent is by KE-100 and KE-604 structures
At total content accounts for the 30%~35% of scaling powder.
4. lead-free and halogen-free solder(ing) paste as claimed in claim 2, which is characterized in that the solvent is by tripropylene glycol butyl ether and 2- first
Base -2,4- pentanediol is constituted, and total content accounts for the 35%~40% of scaling powder.
5. lead-free and halogen-free solder(ing) paste as claimed in claim 2, which is characterized in that the activating agent be by succinic acid, adipic acid and
Dimeric dibasic acid is constituted, and total content accounts for the 15%~20% of scaling powder.
6. lead-free and halogen-free solder(ing) paste as claimed in claim 2, which is characterized in that the thixotropic agent is by TALEN VA-79 and ZHS
It constitutes, total content accounts for the 4%~5% of scaling powder.
7. lead-free and halogen-free solder(ing) paste as described in claim 1, which is characterized in that the glass putty is Sn96.5Ag3.0Cu0.5, grain
Metric lattice are 4# (20 μm~38 μm), and oxygen content conforms to evaluation.
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