CN109530973A - A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees - Google Patents
A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees Download PDFInfo
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- CN109530973A CN109530973A CN201811594495.XA CN201811594495A CN109530973A CN 109530973 A CN109530973 A CN 109530973A CN 201811594495 A CN201811594495 A CN 201811594495A CN 109530973 A CN109530973 A CN 109530973A
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- low
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The present invention provides a kind of low low-solid content water-based scaling powders of volatilization and preparation method thereof, and each component and mass percent are as follows: activating agent 1.5 ~ 6%；Surfactant 2.5% ~ 6%；Film forming agent 0 ~ 0.3%；Antioxidant 0.3 ~ 0.8%；Additive 0 ~ 0.8%；Corrosion inhibiter 0.01 ~ 0.5%, remainder are solvent deionized water；Activating agent is lactic acid, acrylic acid, DL-malic acid, adipic acid, fumaric acid at least two be each greater than 0% mass ratio mixing, temperature control is at 30 ~ 60 DEG C when mixing；Surfactant is any one of alcohol ether carboxylate or alkyl phenol polyoxyethylene ether or Polydicetylenic diol ethoxylate chemical combination object or any two are mixed with the mass ratio for being each greater than 0%；Film forming agent is triethanolamine；Antioxidant is hydroquinone；Corrosion inhibiter is hydroxypropyl chitosan.Water-based scaling powder of the present invention is halogen-free, and no rosin, solid content is few, and using deionized water as solvent, cost is small, and escaping gas is few, has no irritating odor, and without tin phenomenon is fried, will not influence operator's health, environmental protection.
Description
Technical field
The invention belongs to the chemical fields of circuit welding soldering flux preparation, and it is low-solid content water-based to be related to a kind of low volatilization
Scaling powder and preparation method thereof.
Background technique
Scaling powder is an indispensable ring in welding procedure, its major function is exactly to remove the oxidation of metal surface
Object.In addition to this it is possible to protect welding section, the surface tension of liquid solder is reduced, improves the cross flow of liquid solder, is enhanced
Seam-filling ability improves transmitting and balance of welding section heat etc..
Currently, containing halogen in the active constituent of part scaling powder in the market, the scaling powder containing halogen can quickly be gone
Except the oxidation film of pad, reinforce the wetability of solder, but the addition of halogen can be such that the unfailing performance of solder joint weakens, surface insulation
Resistance reduces, and also adversely affects to ecological environment, and more and more enterprises start to select halogen-free flux stringent to face
Environment supervision, halogen-free is the development trend of solder flux.Low-solid content scaling powder is to be received by the market development in recent years
Novel no-clean scaling powder, general solid content≤5%, it avoids ozone-depleting substances (ODS) class solvent to ecological environment
Destruction, have postwelding ion residue few, be halogen-free, insulation resistance is high, is not required to clean, and does not influence pcb board appearance after welding
The advantages that.
Currently, many scaling powders all use ethyl alcohol, the alcohols such as isopropanol are as solvent carrier, and at high cost, transport is inconvenient
And it is inflammable and explosive, it be easy to cause security risk.And the volatilization of alcohols will form photochemical fog, body and existence ring to the mankind
Border generates harm.For this purpose, replacing development trend of the alcohols as solder flux with deionized water.Use deionized water as solvent, it can be with
Cost is reduced, but if scaling powder viscosity is inadequate, is not enough to inhibit solvent evaporation rate, fried tin can be caused, splash phenomena can
It can scald staff.In addition, many scaling powders use rosin as film forming agent and carrier, although can achieve for having is exempted from clearly
Condition is washed, but the residual of rosin also has slight corrosivity, can also cause the moisture absorption, for the machinery and electric property of circuit board
There are adverse effects.A kind of water-based scaling powder of Chinese patent (104551452 B of CN), which is halogen-free, admittedly contain
Measure it is low, it is environmentally friendly the advantages that.But its water content only has 1 ~ 30%, contains other organic matter solvents, water content does not account for main portion
Point, the cost of scaling powder is necessarily improved, while escaping gas can be generated.
Summary of the invention
The present invention is directed to the above-mentioned deficiency of the prior art, and the purpose of the present invention is to provide a kind of low volatilization low-solid content water
Based scaling powder and preparation method；Without organic matters such as alcohols ketones as solvent carrier；It is residual to solve existing scaling powder postwelding solid
The disadvantages of surplus is high, and at high cost, volatility is big, inflammable and explosive, pollutes environment.
To achieve the above object, the invention provides the following technical scheme: a kind of low low-solid content water-based scaling powder of volatilization,
Be characterized in that: each component and mass percent are as follows:
Activating agent 1.5 ~ 6%；Surfactant 2.5% ~ 6%；
Film forming agent 0 ~ 0.3%；Antioxidant 0.3 ~ 0.8%；Additive 0 ~ 0.8%；
Corrosion inhibiter 0.01 ~ 0.5%, remainder are solvent, and whole component gross mass percentages are 100%；
The activating agent be lactic acid, acrylic acid, DL-malic acid, adipic acid, at least two of fumaric acid
To be each greater than 0% mass ratio mixing, temperature control is at 30 ~ 60 DEG C when mixing；
The surfactant is alcohol ether carboxylate series or alkyl phenol polyoxyethylene ether series or U.S.'s air
Any one of Surfynol series or any two be each greater than 0% mass ratio mix；
The film forming agent is triethanolamine；
The antioxidant is hydroquinone；
The corrosion inhibiter is hydroxypropyl chitosan；
The solvent is deionized water.
Further feature is: the surfactant is AEC-9NA or alkyl phenol polyoxy second in alcohol ether carboxylate
The U.S. NP-9 or Surfynol465(air 465 in alkene ether) any one of or any two ratios to be each greater than 0%
Mixing.
The additive is polyethylene glycol 400.
A kind of preparation method of the low low-solid content water-based scaling powder of volatilization, it is characterised in that: the following steps are included:
Step 1: preparing component according to the proportion that technique requires；Activating agent is added in solvent, in 30 DEG C ~ 60 DEG C of temperature
It is lower to stir so that activating agent dissolves；
Step 2: in the solution that the surfactant addition first step is obtained, in 30 DEG C ~ 60 DEG C of at a temperature of stirring and dissolving；
Step 3: antioxidant, corrosion inhibiter, additive is added in the solution that second step obtains, at 30 DEG C ~ 60 DEG C by film forming agent
At a temperature of stirring and dissolving filter after mixing up to the scaling powder.
Further: in second step, third step, being heated using heating equipment, keep the temperature at 30 DEG C ~ 60 DEG C models
It encloses.
The low-solid content water-based scaling powder of low volatilization of the invention and preparation method, have the following beneficial effects:
1, postwelding residual solid content is low, halogen-free, no rosin, does not have to the organic matters such as alcohols ketone as solvent carrier；
2, it is small to make simple cost, stores convenient transportation, will not influence operator's health, environmental protection.
In short, the low low-solid content water-based scaling powder of volatilization of the present invention is halogen-free, no rosin, solid content is few, with deionized water
As solvent, cost is small, stores convenient transportation.Escaping gas is few, has no irritating odor, and without tin phenomenon is fried, will not influence behaviour
Make personnel's health, applicable craft is extensive, and production is simple, and solder joint is mellow and full, and bright, chemical property is stablized, environmental protection.
Specific embodiment
Below with reference to specific embodiment, the present invention is described in detail.
A kind of low low-solid content water-based scaling powder of volatilization, each component and mass percent are as follows:
Activating agent 1.5 ~ 6%, surfactant 2.5 ~ 6%, film forming agent 0 ~ 0.3%, antioxidant 0.3 ~ 0.8%, additive 0 ~ 0.8%,
Corrosion inhibiter 0.01 ~ 0.5% and solvent, whole component weight percentages are 100%.
The activating agent is the mixture of organic acid, and organic acid is lactic acid, acrylic acid, DL-malic acid, adipic acid, richness
At least two of horse acid be each greater than 0% mass ratio mixing, temperature controls 30 ~ 60 DEG C when mixing,
The surfactant is alcohol ether carboxylate series or alkyl phenol polyoxyethylene ether series or U.S.'s air
Any one of Surfynol series or any two be each greater than 0% mass ratio mix；
The film forming agent is triethanolamine, and additive amount should not be too many, and content here is 0 ~ 0.3%, at 30 DEG C ~ 60 DEG C
At a temperature of stirring promote film forming agent dissolution.
The antioxidant is hydroquinone；
The corrosion inhibiter is hydroxypropyl chitosan；
The additive is polyethylene glycol 400；
The solvent is deionized water.
The surfactant is the AEC-9NA or the NP-9 in alkyl phenol polyoxyethylene ether of alcohol ether carboxylate clock, or
Any one of U.S. air Surfynol465 or any two be each greater than 0% ratio mix.
A kind of preparation method of the low low-solid content water-based scaling powder of volatilization, it is characterised in that: the following steps are included:
Step 1: preparing component according to the proportion that technique requires；Activating agent is added in solvent, in 30 DEG C ~ 60 DEG C of temperature
It is lower to stir so that activating agent dissolves；
Step 2: in the solution that the surfactant addition first step is obtained, in 30 DEG C ~ 60 DEG C of at a temperature of stirring and dissolving；
Step 3: antioxidant, corrosion inhibiter, additive is added in the solution that second step obtains, at 30 DEG C ~ 60 DEG C by film forming agent
At a temperature of stirring and dissolving filter after mixing up to the scaling powder.
Further: in second, third step above-mentioned, being heated using heating equipment, keep the temperature at 30 DEG C ~ 60 DEG C
Range.
Activating agent of the invention, selectable specific mass percent are as follows: 1.5%, 2%, 2.5%, 3%, 3.5%, 4%,
4.5%, 5%, 5.5%, 6% etc., needs of the invention can be met；Surfactant, selectable specific mass percent
Are as follows: 2.5%, 2.8%, 3%, 3.2%, 3.5%, 4%1,4.5%, 4.8%, 5%, 5.3%, 5.5%, 5.8%, 6% etc., this hair can be met
Bright needs；Film forming agent of the invention, selectable specific mass percent are as follows: 0%, 0.02%, 0.05%, 0.1%,
0.12%, 0.15%, 0.18%, 0.2%, 0.22%, 0.25%, 0.28%, 0. 3% etc., needs of the invention can be met；The present invention
Antioxidant, selectable specific mass percent are as follows: 0. 3%, 0.35%, 0.4%, 0.5%, 0.55%, 0.6%,
0.68%, 0.7%, 0.72%, 0.75%, 0. 8% etc., needs of the invention can be met；Additive of the invention, it is selectable
Specific mass percent are as follows: 0%, 0.02%, 0.05%, 0.1%, 0.12%, 0.15%, 0.18%, 0.2%, 0.22%, 0.25%,
0.28%、0. 3%、0.35%、0.38%、0.4%、0.45%、0.5%、0.52%、0.55%、0.58%、0. 6%、0.65%、0.68%、
0.7%, 0.75%, 0.78%, 0.8% etc., needs of the invention can be met；Corrosion inhibiter of the invention, it is selectable specific
Mass percent are as follows: 0.01%, 0.02%, 0.05%, 0.1%, 0.12%, 0.15%, 0.18%, 0.2%, 0.22%, 0.25%,
0.28%, 0. 3%, 0.32%, 0.35%, 0.4%, 0.42%, 0.45%, 0.5% etc., needs of the invention can be met.
Embodiment 1
This implementation prepares raw material according to following mass ratio: activating agent mixes for DL-malic acid with lactic acid, lactic acid: DL-malic acid=
1:1, mass ratio 1.5%, surfactant NP-9 are mixed with AEC-9NA, are 1.5%, NP-9:AEC-9NA=1:1, and corrosion inhibiter is
Hydroxypropyl chitosan 0.01%, antioxidant are hydroquinone 0.3%, and film forming agent is triethanolamine, 0.1%.Surplus is solvent, molten
Agent is deionized water.When configuration, activating agent is added in solvent, promotes it sufficiently molten in 30 DEG C ~ 60 DEG C of at a temperature of stirring
Solution, then surfactant is added in the solution, 30 DEG C ~ 60 DEG C at a temperature of stir to being completely dissolved；Again by film forming agent, delay
Agent, antioxidant are lost, additive (if there is) is added in solution above-mentioned, in 30 DEG C ~ 60 DEG C of at a temperature of stirring and dissolving, mixing
Uniform cooled and filtered is up to the scaling powder.
Embodiment 2
This implementation prepares raw material according to following mass ratio: activating agent mixes for DL-malic acid with adipic acid, mass ratio 2.5%,
DL-malic acid: adipic acid=4:1, surfactant Surfynol465 are mixed with AEC-9NA, are 3%, Surfynol465:
AEC-9NA=1:2, film forming agent are that triethanolamine is 0.15%, and corrosion inhibiter is hydroxypropyl chitosan 0.2%, antioxidant hydroquinone
0.5%, additives polyethylene glycol 400 is 0.2%, and surplus is solvent, and solvent is deionized water.
Embodiment 3
Implement to prepare raw material according to following mass ratio: activating agent is that lactic acid, acrylic acid are mixed with DL-malic acid, mass ratio 4%, cream
Acid: acrylic acid: DL-malic acid=1:1:2, surfactant are that NP-9 is mixed with Surfynol465, are 4%, NP-9:
Surfynol465=2:3, film forming agent are that triethanolamine is 0.2%, and corrosion inhibiter is hydroxypropyl chitosan 0.3%, and antioxidant is pair
Benzenediol 0.6%, additive are polyethylene glycol 400, are 0.3%, surplus is solvent, and solvent is deionized water.
Embodiment 4
This implementation is according to following mass ratio preparation raw material: activating agent is that acrylic acid, fumaric acid are mixed with adipic acid, mass ratio 5%,
Acrylic acid: fumaric acid: adipic acid=1:3:1, surfactant are that Surfynol465 is mixed with AEC-9NA, are 5%,
Surfynol465:AEC-9NA=1:3, film forming agent are that triethanolamine is 0.25%, and corrosion inhibiter is hydroxypropyl chitosan 0.4%, antioxygen
Agent is hydroquinone 0.7%, and additive is polyethylene glycol 400, is 0.5%, surplus is solvent, and solvent is deionized water.
Embodiment 5
This implementation prepares raw material according to following mass ratio: activating agent is lactic acid, acrylic acid, DL-malic acid, adipic acid and fumaric acid
Mixing, mass ratio 6%, lactic acid: acrylic acid: DL-malic acid: adipic acid: fumaric acid=1:1:4:1:2, surfactant NP-9
It is mixed with AEC-9NA, is 6%, NP-9:AEC-9NA=1:4, film forming agent is that triethanolamine is 0.3%, and corrosion inhibiter is hydroxypropyl base enclosure
Glycan 0.5%, antioxidant are hydroquinone 0.8%, and additive is polyethylene glycol 400, are 0.8%, surplus is solvent, and solvent is
Deionized water.
When being configured to scaling powder using above-described embodiment, solder joint is full, mellow and full, bright, it has no irritating odor, solid content
Few, postwelding remnants are small, and it is small to make simple cost, store convenient transportation, will not influence operator's health, environmental protection.
Finally, it should be noted that technical side the above examples are only used to illustrate the technical scheme of the present invention and are not limiting
Case, although applicant describes the invention in detail referring to preferred embodiment, those skilled in the art should be managed
Solution, modification or equivalent replacement of the technical solution of the present invention are made for those, without departing from the objective and range of the technical program,
It is intended to be within the scope of the claims of the invention.
Claims (5)
1. a kind of low low-solid content water-based scaling powder of volatilization, it is characterised in that: each component and mass percent are as follows:
Activating agent 1.5 ~ 6%；Surfactant 2.5% ~ 6%；
Film forming agent 0 ~ 0.3%；Antioxidant 0.3 ~ 0.8%；Additive 0 ~ 0.8%；
Corrosion inhibiter 0.01 ~ 0.5%, remainder are solvent, and whole component gross mass percentages are 100%；
The activating agent be lactic acid, acrylic acid, DL-malic acid, adipic acid, at least two of fumaric acid
To be each greater than 0% mass ratio mixing, temperature control is at 30 ~ 60 DEG C when mixing；
The surfactant is in alcohol ether carboxylate or alkyl phenol polyoxyethylene ether or Polydicetylenic diol ethoxylate chemical combination object
Mass ratio mixing any or that any two are to be each greater than 0%；The film forming agent is triethanolamine；
The antioxidant is hydroquinone；
The corrosion inhibiter is hydroxypropyl chitosan；
The solvent is deionized water.
2. the low low-solid content water-based scaling powder of volatilization according to claim 1, it is characterised in that: the surfactant
In NP-9 or Polydicetylenic diol ethoxylate chemical combination object for the AEC-9NA in alcohol ether carboxylate or in alkyl phenol polyoxyethylene ether
Any one of Surfynol465 or any two be each greater than 0% ratio mix.
3. the low low-solid content water-based scaling powder of volatilization according to claim 2, it is characterised in that: the additive is poly-
Ethylene glycol 400.
4. a kind of preparation method of the low low-solid content water-based scaling powder of volatilization, it is characterised in that: the following steps are included:
Step 1: preparing component according to the proportion that technique requires；Activating agent is added in solvent, in 30 DEG C ~ 60 DEG C of temperature
It is lower to stir so that activating agent dissolves；
Step 2: in the solution that the surfactant addition first step is obtained, in 30 DEG C ~ 60 DEG C of at a temperature of stirring and dissolving；
Step 3: antioxidant, corrosion inhibiter, additive is added in the solution that second step obtains, at 30 DEG C ~ 60 DEG C by film forming agent
At a temperature of stirring and dissolving filter after mixing up to the scaling powder.
5. the preparation method of the low low-solid content water-based scaling powder of volatilization according to claim 4, it is characterised in that: second
In step, third step, is heated using heating equipment, keep the temperature at 30 DEG C ~ 60 DEG C ranges.
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| CN201811594495.XA CN109530973A (en) | 2018-12-25 | 2018-12-25 | A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449770A (en) * | 2019-09-02 | 2019-11-15 | 重庆理工大学 | A kind of low VOC low-corrosiveness environmentally-friendly water-based soldering flux |
| CN112643247A (en) * | 2020-12-08 | 2021-04-13 | 湖北省哈福生物化学有限公司 | Soldering flux additive composition and preparation method thereof |
| CN113118667A (en) * | 2021-05-13 | 2021-07-16 | 北京达博长城锡焊料有限公司 | Soldering flux for tin wire, preparation method thereof and lead-free tin wire |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100420540C (en) * | 2006-04-30 | 2008-09-24 | 北京市航天焊接材料厂 | Low-solid content water-based cleaning-free soldering flux without volatile organic compound and halogen |
| CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
| CN104874940A (en) * | 2015-06-18 | 2015-09-02 | 重庆理工大学 | Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux |
| JP2017080757A (en) * | 2015-10-26 | 2017-05-18 | 株式会社弘輝 | Flux, and solder composition |
| US20180056422A1 (en) * | 2016-08-30 | 2018-03-01 | Hyundai Motor Company | Flux composition containing carbon component, solder paste containing the same, and soldering method |
-
2018
- 2018-12-25 CN CN201811594495.XA patent/CN109530973A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100420540C (en) * | 2006-04-30 | 2008-09-24 | 北京市航天焊接材料厂 | Low-solid content water-based cleaning-free soldering flux without volatile organic compound and halogen |
| CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
| CN104874940A (en) * | 2015-06-18 | 2015-09-02 | 重庆理工大学 | Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux |
| JP2017080757A (en) * | 2015-10-26 | 2017-05-18 | 株式会社弘輝 | Flux, and solder composition |
| US20180056422A1 (en) * | 2016-08-30 | 2018-03-01 | Hyundai Motor Company | Flux composition containing carbon component, solder paste containing the same, and soldering method |
Non-Patent Citations (2)
| Title |
|---|
| 光伏组件制造技术: "《光伏组件制造技术》", 31 August 2017, 北京邮电大学出版社 * |
| 王雯雯等: "新型水基波峰焊助焊剂的研究", 《山东化工》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449770A (en) * | 2019-09-02 | 2019-11-15 | 重庆理工大学 | A kind of low VOC low-corrosiveness environmentally-friendly water-based soldering flux |
| CN112643247A (en) * | 2020-12-08 | 2021-04-13 | 湖北省哈福生物化学有限公司 | Soldering flux additive composition and preparation method thereof |
| CN113118667A (en) * | 2021-05-13 | 2021-07-16 | 北京达博长城锡焊料有限公司 | Soldering flux for tin wire, preparation method thereof and lead-free tin wire |
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