CN112643247A - Soldering flux additive composition and preparation method thereof - Google Patents

Soldering flux additive composition and preparation method thereof Download PDF

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Publication number
CN112643247A
CN112643247A CN202011440915.6A CN202011440915A CN112643247A CN 112643247 A CN112643247 A CN 112643247A CN 202011440915 A CN202011440915 A CN 202011440915A CN 112643247 A CN112643247 A CN 112643247A
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CN
China
Prior art keywords
parts
preparation
additive
triethanolamine
soldering flux
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Pending
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CN202011440915.6A
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Chinese (zh)
Inventor
陈勇
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Hubei Hafu Biochemistry Co ltd
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Hubei Hafu Biochemistry Co ltd
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Priority to CN202011440915.6A priority Critical patent/CN112643247A/en
Publication of CN112643247A publication Critical patent/CN112643247A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes

Abstract

The invention discloses a soldering flux additive composition and a preparation method thereof, wherein the soldering flux additive composition comprises the following raw materials in parts by weight: 10-15 parts of ethylene glycol monobutyl ether, 8-10 parts of a film forming agent, 30-40 parts of a solvent, 5-10 parts of a surfactant, 8-15 parts of an additive, 8-10 parts of itaconic acid, 10-12 parts of triethanolamine, 10-15 parts of fumaric acid, 10-20 parts of an antioxidant and 15-20 parts of an active agent. According to the soldering flux additive composition and the preparation method, the organic acid is used as the activator in the addition of the activator, the high corrosivity is achieved, and meanwhile, due to the addition of the triethanolamine, the triethanolamine and the organic acid can be subjected to neutralization reaction at room temperature to generate a neutral product, so that the acidity is reduced in the welding process, the corrosivity is reduced, the stability in the welding process is improved, the raw materials used in the soldering flux additive composition are wide in source, the soldering flux additive composition is suitable for large-scale process production, and the preparation method is simple.

Description

Soldering flux additive composition and preparation method thereof
Technical Field
The invention relates to the technical field of welding materials, in particular to a composition of a soldering flux additive and a preparation method thereof.
Background
Welding is a main process in electronic assembly, soldering flux is an indispensable ring in the welding process, the main function of the soldering flux is to remove oxides on the metal surface, in addition, the soldering flux can protect a welding area, reduce the surface tension of liquid solder, improve the diffusion property of the liquid solder, enhance the caulking capacity, improve the heat transfer and balance of the welding area and the like, the soldering flux is an organic mixture with comprehensive functions, is the most important auxiliary material in a welding material, and directly influences the quality and reliability of electronic products in the electronic assembly process.
The existing soldering flux has general corrosion resistance in the using process so as to influence the soldering effect, and in order to improve the using effect of the existing soldering flux, an additive is added in the using process of the soldering flux so as to improve the using performance of the soldering flux.
Disclosure of Invention
In view of the deficiencies of the prior art, the present invention provides a composition of flux additive and a preparation method thereof, so as to solve the problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: the soldering flux additive composition comprises the following raw materials in parts by weight: 10-15 parts of ethylene glycol monobutyl ether, 8-10 parts of a film forming agent, 30-40 parts of a solvent, 5-10 parts of a surfactant, 8-15 parts of an additive, 8-10 parts of itaconic acid, 10-12 parts of triethanolamine, 10-15 parts of fumaric acid, 10-20 parts of an antioxidant and 15-20 parts of an active agent.
A method of preparing a composition of a flux additive, comprising the steps of:
s1, adding raw materials: weighing the required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, and stirring at the temperature of 30-60 ℃ to dissolve the solvent;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, uniformly stirring, and cooling;
s4, preparation of the mixture: the additives are added to the step S3, stirred uniformly, and the film-forming agent is added to prepare a desired mixture of additives.
Further optimizing the technical scheme, the solvent in the step S1 is one of glycerol, diethylene glycol monobutyl ether and tetraethylene glycol dibutyl ether, and the active agent in the step S1 is one of lactic acid or acrylic acid.
Further optimizing the technical scheme, the antioxidant in the step S3 is hydroquinone, and the surfactant in the step S3 is one of fatty alcohol-polyoxyethylene ether or polyethylene glycol monooleate.
Further optimizing the technical scheme, the additive in the step S4 is formed by compounding bismuth chloride and zinc fluoride according to the weight ratio of 2: 4.
Further optimizing the technical scheme, the film forming agent in the step S4 is one of triethanolamine or diethanolamine.
Further optimizing the technical scheme, the pH value of the active agent in the step S1 is 6.0-6.8, and the temperature for slowly heating in the step S2 is 45-50 ℃.
Compared with the prior art, the invention provides the composition of the soldering flux additive and the preparation method thereof, and the soldering flux additive has the following beneficial effects:
1. according to the soldering flux additive composition and the preparation method, the organic acid is used as the activator in the addition of the activator, so that the soldering flux additive has high corrosivity, and meanwhile, due to the addition of the triethanolamine, the triethanolamine and the organic acid can generate a neutralization reaction at room temperature to generate a neutral product, so that in the welding process, the acidity is reduced, the corrosivity is reduced, and the stability in the welding process is improved.
2. The addition of the itaconic acid, the fumaric acid and the ethylene glycol butyl ether can improve the wettability of the soldering flux, shorten the wetting time, improve the maximum wetting power and have few residues, thereby improving the service performance of the soldering flux.
Drawings
Fig. 1 is a flow chart illustrating a composition of a flux additive and a method for preparing the same according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows: referring to fig. 1, the invention discloses a composition of a flux additive, which comprises the following raw materials in parts by weight: 10 parts of ethylene glycol monobutyl ether, 8 parts of a film forming agent, 30 parts of a solvent, 5 parts of a surfactant, 8 parts of an additive, 8 parts of methylene succinic acid, 10 parts of triethanolamine, 10 parts of fumaric acid, 10 parts of an antioxidant and 15 parts of an active agent.
A method of preparing a composition of a flux additive, comprising the steps of:
s1, adding raw materials: weighing the required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, stirring at the temperature of 40 ℃ to dissolve the solvent, wherein the solvent is glycerol, the active agent is lactic acid, and the pH value of the active agent is 6.0;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating at 45 ℃ to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, wherein the antioxidant is hydroquinone, and the surfactant is polyethylene glycol monooleate, uniformly stirring, and cooling;
s4, preparation of the mixture: and (4) adding an additive into the mixture obtained in the step S3, uniformly stirring, and adding a film-forming agent, wherein the additive is formed by compounding bismuth chloride and zinc fluoride according to the weight ratio of 2:4, and the film-forming agent is diethanol amine, so that a mixture of the required additive is prepared.
Example two: referring to fig. 1, the invention discloses a composition of a flux additive, which comprises the following raw materials in parts by weight: 13 parts of ethylene glycol monobutyl ether, 9 parts of a film forming agent, 35 parts of a solvent, 8 parts of a surfactant, 12 parts of an additive, 9 parts of methylene succinic acid, 11 parts of triethanolamine, 12 parts of fumaric acid, 15 parts of an antioxidant and 17 parts of an active agent.
A method of preparing a composition of a flux additive, comprising the steps of:
s1, adding raw materials: weighing the required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, stirring at the temperature of 30-60 ℃ to dissolve the solvent, wherein the solvent is diethylene glycol monobutyl ether, the active agent is lactic acid, and the pH value of the active agent is 6.4;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating at 46 ℃ to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, wherein the antioxidant is hydroquinone, and the surfactant is fatty alcohol-polyoxyethylene ether, uniformly stirring, and cooling;
s4, preparation of the mixture: and (4) adding an additive into the mixture obtained in the step S3, uniformly stirring, and adding a film-forming agent, wherein the additive is formed by compounding bismuth chloride and zinc fluoride according to the weight ratio of 2:4, and the film-forming agent is triethanolamine, so as to prepare the required mixture of the additive.
Example three: referring to fig. 1, the invention discloses a composition of a flux additive, which comprises the following raw materials in parts by weight: 14 parts of ethylene glycol monobutyl ether, 10 parts of a film forming agent, 30 parts of a solvent, 9 parts of a surfactant, 12 parts of an additive, 10 parts of methylene succinic acid, 11 parts of triethanolamine, 14 parts of fumaric acid, 13 parts of an antioxidant and 16 parts of an active agent.
A method of preparing a composition of a flux additive, comprising the steps of:
s1, adding raw materials: weighing required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, stirring at the temperature of 60 ℃ to dissolve the solvent, wherein the solvent is tetraethylene glycol dibutyl cellosolve, the active agent is lactic acid, and the pH value of the active agent is 6.8;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating at 50 ℃ to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, wherein the antioxidant is hydroquinone, and the surfactant is polyethylene glycol monooleate, uniformly stirring, and cooling;
s4, preparation of the mixture: and (4) adding an additive into the mixture obtained in the step S3, uniformly stirring, and adding a film-forming agent, wherein the additive is formed by compounding bismuth chloride and zinc fluoride according to the weight ratio of 2:4, and the film-forming agent is diethanol amine, so that a mixture of the required additive is prepared.
Example four: referring to fig. 1, the invention discloses a composition of a flux additive, which comprises the following raw materials in parts by weight: 15 parts of ethylene glycol monobutyl ether, 10 parts of a film forming agent, 40 parts of a solvent, 10 parts of a surfactant, 15 parts of an additive, 8-10 parts of itaconic acid, 12 parts of triethanolamine, 15 parts of fumaric acid, 20 parts of an antioxidant and 20 parts of an active agent.
A method of preparing a composition of a flux additive, comprising the steps of:
s1, adding raw materials: weighing the required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, stirring at the temperature of 30-60 ℃ to dissolve the solvent, wherein the solvent is glycerol, the active agent is acrylic acid, and the pH value of the active agent is 6.6;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating at 47 ℃ to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, uniformly stirring, and performing cooling treatment, wherein the antioxidant is hydroquinone, and the surfactant is polyethylene glycol monooleate;
s4, preparation of the mixture: and (4) adding an additive into the mixture obtained in the step S3, uniformly stirring, and adding a film-forming agent, wherein the additive is formed by compounding bismuth chloride and zinc fluoride according to the weight ratio of 2:4, and the film-forming agent is triethanolamine, so as to prepare the required mixture of the additive.
And (4) judging the standard: through comparison of the four embodiments, the best effect is the second embodiment, and therefore, the second embodiment is selected as the best embodiment, and the specific change of the amount also belongs to the protection scope of the technical scheme.
The invention has the beneficial effects that: according to the invention, the addition of the activator adopts the organic acid as the activator, so that the corrosion is high, and meanwhile, due to the addition of the triethanolamine, the triethanolamine can be subjected to a neutralization reaction with the organic acid at room temperature to generate a neutral product, so that in the welding process, the acidity is reduced, the corrosion is reduced, and the stability in the welding process is further improved; the addition of the itaconic acid, the fumaric acid and the ethylene glycol butyl ether can improve the wettability of the soldering flux, shorten the wetting time, improve the maximum wetting power and reduce the residues, thereby improving the service performance of the soldering flux.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The soldering flux additive composition is characterized by comprising the following raw materials in parts by weight: 10-15 parts of ethylene glycol monobutyl ether, 8-10 parts of a film forming agent, 30-40 parts of a solvent, 5-10 parts of a surfactant, 8-15 parts of an additive, 8-10 parts of itaconic acid, 10-12 parts of triethanolamine, 10-15 parts of fumaric acid, 10-20 parts of an antioxidant and 15-20 parts of an active agent.
2. The method of claim 1, comprising the steps of:
s1, adding raw materials: weighing the required raw materials in parts by weight, putting butyl cellosolve and a solvent into a container, adding an active agent into the container, and stirring at the temperature of 30-60 ℃ to dissolve the solvent;
s2, preparation of a first material: placing the weighed itaconic acid, fumaric acid and triethanolamine in a container, and slowly heating to obtain a required material I for later use;
s3, preparation of a material II: sequentially adding a surfactant and an antioxidant into the container in the step S2, uniformly stirring, and cooling;
s4, preparation of the mixture: the additives are added to the step S3, stirred uniformly, and the film-forming agent is added to prepare a desired mixture of additives.
3. The method as claimed in claim 2, wherein the solvent in step S1 is one of glycerol, diethylene glycol monobutyl ether and tetraethylene glycol dibutyl ether, and the active agent in step S1 is one of lactic acid or acrylic acid.
4. The method of claim 2, wherein the antioxidant in step S3 is hydroquinone, and the surfactant in step S3 is one of fatty alcohol-polyoxyethylene ether or polyethylene glycol monooleate.
5. The composition of the flux additive and the preparation method of the flux additive according to claim 2, wherein the additive in the step S4 is bismuth chloride and zinc fluoride compounded according to a weight ratio of 2: 4.
6. The method of claim 2, wherein the film forming agent in step S4 is one of triethanolamine or diethanolamine.
7. The method of claim 2, wherein the pH of the active agent in step S1 is 6.0-6.8, and the temperature for slow heating in step S2 is 45-50 ℃.
CN202011440915.6A 2020-12-08 2020-12-08 Soldering flux additive composition and preparation method thereof Pending CN112643247A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102513733A (en) * 2010-12-31 2012-06-27 广东中实金属有限公司 Flux
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104400257A (en) * 2014-10-29 2015-03-11 重庆理工大学 Scaling powder for no-clean lead-free low-silver welding paste
CN105290649A (en) * 2015-12-02 2016-02-03 苏州捷德瑞精密机械有限公司 No-clean soldering flux and preparation method thereof
CN109530972A (en) * 2018-12-25 2019-03-29 重庆理工大学 A kind of low low-carbon water-based scaling powder and preparation method thereof admittedly
CN109530973A (en) * 2018-12-25 2019-03-29 重庆理工大学 A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees
CN110091098A (en) * 2019-05-17 2019-08-06 江苏三沃电子科技有限公司 A kind of low-residual cleaning-free scaling powder and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102513733A (en) * 2010-12-31 2012-06-27 广东中实金属有限公司 Flux
CN102825398A (en) * 2012-08-08 2012-12-19 北京工业大学 Soldering flux matched with lead-free solder
CN104400257A (en) * 2014-10-29 2015-03-11 重庆理工大学 Scaling powder for no-clean lead-free low-silver welding paste
CN105290649A (en) * 2015-12-02 2016-02-03 苏州捷德瑞精密机械有限公司 No-clean soldering flux and preparation method thereof
CN109530972A (en) * 2018-12-25 2019-03-29 重庆理工大学 A kind of low low-carbon water-based scaling powder and preparation method thereof admittedly
CN109530973A (en) * 2018-12-25 2019-03-29 重庆理工大学 A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees
CN110091098A (en) * 2019-05-17 2019-08-06 江苏三沃电子科技有限公司 A kind of low-residual cleaning-free scaling powder and preparation method thereof

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Application publication date: 20210413