CN102825398A - Soldering flux matched with lead-free solder - Google Patents
Soldering flux matched with lead-free solder Download PDFInfo
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- CN102825398A CN102825398A CN2012102800801A CN201210280080A CN102825398A CN 102825398 A CN102825398 A CN 102825398A CN 2012102800801 A CN2012102800801 A CN 2012102800801A CN 201210280080 A CN201210280080 A CN 201210280080A CN 102825398 A CN102825398 A CN 102825398A
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- 229910000679 solder Inorganic materials 0.000 title abstract description 27
- 238000005476 soldering Methods 0.000 title abstract description 11
- 230000004907 flux Effects 0.000 title abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000002904 solvent Substances 0.000 claims abstract description 32
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 23
- 239000004094 surface-active agent Substances 0.000 claims abstract description 14
- 230000007797 corrosion Effects 0.000 claims abstract description 12
- 238000005260 corrosion Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 9
- 239000013543 active substance Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims description 60
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 25
- 238000009835 boiling Methods 0.000 claims description 14
- 230000003213 activating effect Effects 0.000 claims description 12
- MRUAUOIMASANKQ-UHFFFAOYSA-N cocamidopropyl betaine Chemical compound CCCCCCCCCCCC(=O)NCCC[N+](C)(C)CC([O-])=O MRUAUOIMASANKQ-UHFFFAOYSA-N 0.000 claims description 12
- 239000012190 activator Substances 0.000 claims description 11
- 150000001298 alcohols Chemical class 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 11
- 150000007524 organic acids Chemical class 0.000 claims description 11
- 238000005219 brazing Methods 0.000 claims description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical group OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 claims description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 4
- 241001272567 Hominoidea Species 0.000 claims description 4
- 239000001361 adipic acid Substances 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 claims description 4
- 229940051250 hexylene glycol Drugs 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 4
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 3
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 2
- -1 ethylene dimethyl Chemical group 0.000 claims description 2
- 239000010408 film Substances 0.000 claims description 2
- 235000011187 glycerol Nutrition 0.000 claims description 2
- 229940117955 isoamyl acetate Drugs 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- 229960003511 macrogol Drugs 0.000 claims description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 2
- 239000011976 maleic acid Substances 0.000 claims description 2
- BJEPYKJPYRNKOW-UHFFFAOYSA-N malic acid Chemical compound OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 229920002401 polyacrylamide Polymers 0.000 claims description 2
- APSBXTVYXVQYAB-UHFFFAOYSA-M sodium docusate Chemical compound [Na+].CCCCC(CC)COC(=O)CC(S([O-])(=O)=O)C(=O)OCC(CC)CCCC APSBXTVYXVQYAB-UHFFFAOYSA-M 0.000 claims description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 2
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000004140 cleaning Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 229910052736 halogen Inorganic materials 0.000 abstract description 4
- 150000002367 halogens Chemical class 0.000 abstract description 4
- 239000005456 alcohol based solvent Substances 0.000 abstract description 2
- 239000003112 inhibitor Substances 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 10
- 229910007116 SnPb Inorganic materials 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000011343 solid material Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910008433 SnCU Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical group NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
本发明公开了一种与无铅钎料配套使用的助焊剂，包括有机活性剂、表面活性剂、成膜剂、缓蚀剂，以及醇类溶剂，其中，按重量百分比计，有机活性剂为1.0-8.0%、表面活性剂为0.5-2.0%、成膜剂为0.1-2%、缓蚀剂为0.01-0.1%，其余为醇类溶剂。本发明提供的助焊剂具有以下优点：1、焊点饱满，焊后无需清洗；2、润湿性好，无拉尖、桥连等缺陷；3、不含卤素、无污染，满足环保要求，焊接过程中无飞溅，无刺激性、有害气体产生，使用安全；尤其适用于表面封装技术（SMT）中的无铅波峰焊和无铅手工浸焊。The invention discloses a soldering flux used in conjunction with lead-free solder, which includes an organic active agent, a surfactant, a film-forming agent, a corrosion inhibitor, and an alcohol solvent, wherein, by weight percentage, the organic active agent is 1.0-8.0%, surfactant 0.5-2.0%, film-forming agent 0.1-2%, corrosion inhibitor 0.01-0.1%, and the rest are alcohol solvents. The flux provided by the present invention has the following advantages: 1. The solder joints are full, and no cleaning is required after soldering; 2. Good wettability, no defects such as sharpening and bridging; 3. No halogen, no pollution, and meet environmental protection requirements. There is no spatter, no irritating and harmful gas during the soldering process, and it is safe to use; it is especially suitable for lead-free wave soldering and lead-free manual dip soldering in surface mount technology (SMT).
Description
Technical field
The present invention relates to a kind of scaling powder, specifically, relate to a kind of and the matching used scaling powder of lead-free brazing.
Background technology
Along with the develop rapidly of electron trade, and the improving constantly of human environmental consciousness, the negative effect that leypewter brings is outstanding day by day, and the novel lead-free solder is as the substitute of tin-lead solder, and its development and application has become a big focus of electron trade.Big quantity research shows that the most suitable alternative SnPb solder of eutectic SnAg, SnCu and SnAgCu solder obtains widespread usage in electron trade.Wherein the SnAgCu solder reaches solderability preferably because of having good physical and mechanical property, is acknowledged as the most possible lead-free brazing that substitutes the SnPb alloy.
But compare with traditional SnPb solder, the SnAgCu series leadless solder has shortcomings such as fusing point is higher, wetability is poor, easy oxidation.Thereby can't satisfy the soldering requirement of lead-free brazing to the scaling powder of SnPb solder development, and subject matter is: the one, be not suitable for the higher welding temperature of lead-free brazing; The 2nd, the wettability of scaling powder is not enough.The welding temperature of tradition SnPb solder is between 235 ℃～250 ℃, and the fusing point of SnAgCu series leadless solder is higher 30 ℃ than the fusing point of SnPb solder, thereby welding temperature is also corresponding mentions more than 250 ℃.When traditional scaling powder was used for the welding of lead-free brazing, resistance to elevated temperatures was relatively poor, and scaling powder reaches under the higher welding temperature in higher preheat temperature can lose the part activity, thereby produced the bad situation of tin that goes up; In addition, traditional scaling powder wettability is not enough, is prone to cause the solder joint moistening badness, produces the postwelding defective, influences quality of welding spot and reliability.Thereby exploitation also becomes one of research focus of unleaded process with the matching used scaling powder of lead-free brazing, receives increasingly extensive attention.
At present, mostly the scaling powder on the market is colophony type scaling powder and water-soluble flux, and is mostly the product that the residual solids component content is high.The main component of colophony type scaling powder is a rosin, and the postwelding residue is more, needs thoroughly to clean.It is active that water-soluble flux generally all has high helping to weld, and its residue has bigger corrosivity and electrical conductivity, after the substrate assembling is accomplished, needs cleaning immediately.Along with the development of the electronic product of high density, lightweight, microminiaturization and high performance, surface-pasted components and parts and print the gap smaller between base plate have brought quite difficulty to cleaning.Based on above reason, no-clean scaling powder arises at the historic moment, and no-clean scaling powder is that the postwelding residue is few, the New Flux that need not to clean.Compare with traditional scaling powder, no-clean scaling powder has been removed the input to cleaning equipment and cleaning agent from, has reduced the pollution of emissions such as waste gas and waste water to environment, thereby has had great economic benefit and social benefit.
For overcoming the deficiency of prior art; The invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder that satisfies unleaded immersed solder and unleaded wave-soldering welding process requirement, promptly with alcohols as solvent, the new and effective scaling powder that do not contain solid matters such as rosin, need not to clean.Compare with the colophony type scaling powder, the pure based scaling powder that the present invention proposes is not because of containing the rosin composition, and solid content reduces, thereby the postwelding residue is few, satisfies the requirement of no-clean scaling powder.And compare with water-soluble flux, pure based scaling powder is a primary solvent with lower boiling ethanol, in welding process, the volatile ratio water of ethanol is much fast, has effectively avoided the problem of splashing.
Summary of the invention
The invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder, be particularly useful for unleaded wave-soldering and unleaded manual immersed solder in the surface mounting technology (SMT).Its advantage is: 1, solder joint is full, and postwelding need not to clean; 2, wetability is good, does not have and draws defectives such as point, bridging; 3, not halogen-containing, pollution-free, satisfy environmental requirement, do not have in the welding process and splash, nonirritant, pernicious gas produce, and be safe in utilization.
Main purpose of the present invention provides a kind of and the matching used scaling powder of lead-free brazing; Said scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter; And alcohols solvent, wherein, by weight percentage; Said organic active agent is that 1.0-8.0%, said surfactant are that 0.5-2.0%, said film forming agent are that 0.1-2%, said corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent.
Preferably; Described organic active agent comprises organic acid activator and organic amine activating agent; Wherein, said organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid and the lactic acid; Said organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
Preferably, scaling powder according to claim 2 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 10:1～50:1.
More preferably, scaling powder according to claim 3 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 15:1～30:1.
Organic acid contains the carboxyl active function groups, in solvent, produces free H+ ion, with the oxide generation chemical reaction of mother metal and solder surface, reaches the purpose of removing oxide-film, increasing wetability, is active higher activator.The organic amine activity a little less than, the main effect in scaling powder is to regulate pH value, reduction corrosivity.
Preferably, described surfactant is selected from any one or a few in APES, NPE, cocoamidopropyl betaine (CAB), the aerosol OT.
More preferably, said APES is that op-10 and op-4, said NPE are TX-10.
More preferably, said surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1～5:1.
More preferably, op-10 and CAB mass ratio are 2:1～3:1.
The main effect of surfactant is the wettability that increases scaling powder, and above-mentioned dissimilar surfactant compound is used, and can produce to add and synergistic effect, improves the maximum wetting power of scaling powder effectively, shortens wetting time.
Preferably, described film forming agent is selected from any one or a few in acrylic resin, isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide and the ethyl benzoate.
Adding film forming agent can form the organic film of one deck on the solder joint surface, prevents that solder and base material again be oxidized, and also have anticorrosive property and electric insulating quality.
Preferably, described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
The main effect of said corrosion inhibiter is to suppress scaling powder to the corrosion of metal effect.
Preferably, described alcohols solvent is by the low-boiling point alcohol kind solvent with the high-boiling point alcohol kind solvent is composite processes.
More preferably, said low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
More preferably, said high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in the 3-hexylene glycol.
More preferably, said alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1～20:1.
More preferably, ethanol and quality of glycol are than being 7:1～9:1.
The main effect of solvent is the active component in the dissolving scaling powder, plays carrier function.Lower boiling ethanol and/or isopropyl alcohol and one or more high-boiling point alcohol kind solvents are used, can guarantee in whole welding temperature scope, to have solvent carrier to exist.Wherein low boiling point solvent is the main composition of dicyandiamide solution, and its effect is the various compositions in the dissolving scaling powder, forms homogeneous phase solution.In welding process, require the low boiling point solvent composition to volatilize rapidly, splash in order to avoid contact and cause with fusion welding.Simultaneously, under welding temperature, the existence of a small amount of high boiling solvent continues to bear carrier function, has guaranteed the even dispersion of the various compositions in the scaling powder at welding region, and the activity that makes scaling powder especially high temperature active is given full play to.
Another object of the present invention provides a kind of method for preparing said scaling powder, and said preparation method is dissolved in the said composite alcohols solvent through the said organic acid activator that will take by weighing by weight percentage, said organic amine activating agent, said surfactant, said film forming agent, said corrosion inhibiter fully.
The lead-free brazing that the present invention relates to is used the alcohol radical low solid-material content cleaning-free scaling powder; Be applicable to the wave-soldering and the manual immersed solder technology of SnAgCu series leadless solder; The solder joint that obtains satisfies the pin-plated-through-hole solder joint of stipulating among the IPC-A-610C " standard of electronic assembly part presentation quality acceptance condition " that has can accept the acceptable standard of secondary in the standard, can be used for the service class electronic product.
The specific embodiment
For making the auditor can further understand structure of the present invention, characteristic and other purposes, combine appended preferred embodiment to specify as follows at present, embodiment only is used to technical scheme of the present invention is described, and non-limiting the present invention.
Preparation embodiment
Embodiment 1
Taking by weighing 2.79g succinic acid, 0.86g adipic acid, 0.23g triethanolamine, 0.71gop-10,0.36g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 10.52g ethylene glycol, the 84.25g ethanol complex solvent fully.
Embodiment 2
Taking by weighing 2.79g succinic acid, 0.86g itaconic acid, 0.23g triethanolamine, 0.71gop-10,0.40g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 11.84g diethylene glycol (DEG), the 82.89g ethanol complex solvent fully.
Embodiment 3
Taking by weighing 5.39g succinic acid, 1.67g adipic acid, 0.23g triethanolamine, 0.91gop-10,0.11g op-4,0.23g acrylic resin, 0.06g BTA is dissolved in 91.40 alcohol solvents fully.
Table 1 is the percetage by weight of the Main Ingredients and Appearance of the scaling powder among the embodiment 1-3.
Table 2 is according to " exempting to clean liquid scaling powder SJ/T 11273-2002 " Performance Detection standard, to the performance evaluation result of the scaling powder among the embodiment 1-3.
Can find out that from the performance evaluation result of table 2 scaling powder among the embodiment 1-3 all has the advantage that physical stability is good, residual solids content is low, not halogen-containing, corrosivity is little, need not to clean, meet the environment-friendly type scaling powder requirement of exempting to clean.
Adopt embodiment 1 said scaling powder and SnAgCu solder, on the pcb board of the electronic devices and components that are fitted with the band lead-in wire, implement the wave-soldering welding procedure, the solder joint outward appearance that obtains is full, and the plate face of postwelding pcb board is clean, need not to clean; Wetability is good, does not have and draws defectives such as point, bridging; Not halogen-containing, pollution-free, satisfy environmental requirement; Do not have in the welding process and splash, nonirritant, pernicious gas produce, and be safe in utilization.
What need statement is that the foregoing invention content and the specific embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as the qualification to protection domain of the present invention.Those skilled in the art are in spirit of the present invention and principle, when doing various modifications, being equal to replacement or improvement.Protection scope of the present invention is as the criterion with appended claims.
Claims (16)
- One kind with the matching used scaling powder of lead-free brazing; It is characterized in that: said scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter; And alcohols solvent, wherein, by weight percentage; Said organic active agent is that 1.0-8.0%, said surfactant are that 0.5-2.0%, said film forming agent are that 0.1-2%, said corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent.
- 2. scaling powder according to claim 1; It is characterized in that: described organic active agent comprises organic acid activator and organic amine activating agent; Wherein, said organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid, the lactic acid; Said organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
- 3. scaling powder according to claim 2 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 10:1 ~ 50:1.
- 4. scaling powder according to claim 3 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 15:1 ~ 30:1.
- 5. scaling powder according to claim 1 is characterized in that: described surfactant is selected from any one or a few in APES, NPE, cocoamidopropyl betaine (CAB), the aerosol OT.
- 6. scaling powder according to claim 5 is characterized in that: said APES is that op-10 and op-4, said NPE are TX-10.
- 7. scaling powder according to claim 6 is characterized in that: said surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1 ~ 5:1.
- 8. scaling powder according to claim 7 is characterized in that: op-10 and CAB mass ratio are 2:1 ~ 3:1.
- 9. scaling powder according to claim 1 is characterized in that: described film forming agent is selected from any one or a few in acrylic resin, isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide, the ethyl benzoate.
- 10. scaling powder according to claim 1 is characterized in that: described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
- 11. scaling powder according to claim 1 is characterized in that: described alcohols solvent is by the low-boiling point alcohol kind solvent and the high-boiling point alcohol kind solvent is composite processes.
- 12. scaling powder according to claim 11 is characterized in that: said low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
- 13. scaling powder according to claim 11 is characterized in that: said high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in the 3-hexylene glycol.
- 14. scaling powder according to claim 11 is characterized in that: said alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1 ~ 20:1.
- 15. scaling powder according to claim 14 is characterized in that: ethanol and quality of glycol are than being 7:1 ~ 9:1.
- 16. a method for preparing the described scaling powder of claim 1, said preparation method is dissolved in the said composite alcohols solvent through the said organic acid activator that will take by weighing by weight percentage, said organic amine activating agent, said surfactant, said film forming agent, said corrosion inhibiter fully.
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| CN104690450A (en) * | 2015-04-07 | 2015-06-10 | 武汉谊盛新材料科技有限公司 | Special scaling powder for automatic welding of photovoltaic battery piece |
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