CN102825398A - Soldering flux matched with lead-free solder - Google Patents
Soldering flux matched with lead-free solder Download PDFInfo
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- CN102825398A CN102825398A CN2012102800801A CN201210280080A CN102825398A CN 102825398 A CN102825398 A CN 102825398A CN 2012102800801 A CN2012102800801 A CN 2012102800801A CN 201210280080 A CN201210280080 A CN 201210280080A CN 102825398 A CN102825398 A CN 102825398A
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Abstract
The invention discloses a soldering flux matched with a lead-free solder. The soldering flux comprises the following component in percentage by weight: 1.0-8.0 percent of organic active agent, 0.5-2.0 percent of surfactant, 0.1-2 percent of film forming agent, 0.01-0.1 percent of corrosion inhibitor and the balance of alcoholic solvent. The soldering flux has the following advantages that 1, a welding spot is plump and does not need to be washed after soldering; 2, wettability is good, and the defects such as lcicles and bridging do not occur; and 3, halogen is not contained, pollution is avoided, environmental requirements are satisfied, splashing and fiery and harmful gas are not produced in the welding process, and use is safe; and the soldering flux is particularly suitable for lead-free wave soldering and lead-free dipping soldering in a surface mount technology (SMT).
Description
Technical field
The present invention relates to a kind of scaling powder, specifically, relate to a kind of and the matching used scaling powder of lead-free brazing.
Background technology
Along with the develop rapidly of electron trade, and the improving constantly of human environmental consciousness, the negative effect that leypewter brings is outstanding day by day, and the novel lead-free solder is as the substitute of tin-lead solder, and its development and application has become a big focus of electron trade.Big quantity research shows that the most suitable alternative SnPb solder of eutectic SnAg, SnCu and SnAgCu solder obtains widespread usage in electron trade.Wherein the SnAgCu solder reaches solderability preferably because of having good physical and mechanical property, is acknowledged as the most possible lead-free brazing that substitutes the SnPb alloy.
But compare with traditional SnPb solder, the SnAgCu series leadless solder has shortcomings such as fusing point is higher, wetability is poor, easy oxidation.Thereby can't satisfy the soldering requirement of lead-free brazing to the scaling powder of SnPb solder development, and subject matter is: the one, be not suitable for the higher welding temperature of lead-free brazing; The 2nd, the wettability of scaling powder is not enough.The welding temperature of tradition SnPb solder is between 235 ℃～250 ℃, and the fusing point of SnAgCu series leadless solder is higher 30 ℃ than the fusing point of SnPb solder, thereby welding temperature is also corresponding mentions more than 250 ℃.When traditional scaling powder was used for the welding of lead-free brazing, resistance to elevated temperatures was relatively poor, and scaling powder reaches under the higher welding temperature in higher preheat temperature can lose the part activity, thereby produced the bad situation of tin that goes up; In addition, traditional scaling powder wettability is not enough, is prone to cause the solder joint moistening badness, produces the postwelding defective, influences quality of welding spot and reliability.Thereby exploitation also becomes one of research focus of unleaded process with the matching used scaling powder of lead-free brazing, receives increasingly extensive attention.
At present, mostly the scaling powder on the market is colophony type scaling powder and water-soluble flux, and is mostly the product that the residual solids component content is high.The main component of colophony type scaling powder is a rosin, and the postwelding residue is more, needs thoroughly to clean.It is active that water-soluble flux generally all has high helping to weld, and its residue has bigger corrosivity and electrical conductivity, after the substrate assembling is accomplished, needs cleaning immediately.Along with the development of the electronic product of high density, lightweight, microminiaturization and high performance, surface-pasted components and parts and print the gap smaller between base plate have brought quite difficulty to cleaning.Based on above reason, no-clean scaling powder arises at the historic moment, and no-clean scaling powder is that the postwelding residue is few, the New Flux that need not to clean.Compare with traditional scaling powder, no-clean scaling powder has been removed the input to cleaning equipment and cleaning agent from, has reduced the pollution of emissions such as waste gas and waste water to environment, thereby has had great economic benefit and social benefit.
For overcoming the deficiency of prior art; The invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder that satisfies unleaded immersed solder and unleaded wave-soldering welding process requirement, promptly with alcohols as solvent, the new and effective scaling powder that do not contain solid matters such as rosin, need not to clean.Compare with the colophony type scaling powder, the pure based scaling powder that the present invention proposes is not because of containing the rosin composition, and solid content reduces, thereby the postwelding residue is few, satisfies the requirement of no-clean scaling powder.And compare with water-soluble flux, pure based scaling powder is a primary solvent with lower boiling ethanol, in welding process, the volatile ratio water of ethanol is much fast, has effectively avoided the problem of splashing.
Summary of the invention
The invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder, be particularly useful for unleaded wave-soldering and unleaded manual immersed solder in the surface mounting technology (SMT).Its advantage is: 1, solder joint is full, and postwelding need not to clean; 2, wetability is good, does not have and draws defectives such as point, bridging; 3, not halogen-containing, pollution-free, satisfy environmental requirement, do not have in the welding process and splash, nonirritant, pernicious gas produce, and be safe in utilization.
Main purpose of the present invention provides a kind of and the matching used scaling powder of lead-free brazing; Said scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter; And alcohols solvent, wherein, by weight percentage; Said organic active agent is that 1.0-8.0%, said surfactant are that 0.5-2.0%, said film forming agent are that 0.1-2%, said corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent.
Preferably; Described organic active agent comprises organic acid activator and organic amine activating agent; Wherein, said organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid and the lactic acid; Said organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
Preferably, scaling powder according to claim 2 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 10:1～50:1.
More preferably, scaling powder according to claim 3 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 15:1～30:1.
Organic acid contains the carboxyl active function groups, in solvent, produces free H+ ion, with the oxide generation chemical reaction of mother metal and solder surface, reaches the purpose of removing oxide-film, increasing wetability, is active higher activator.The organic amine activity a little less than, the main effect in scaling powder is to regulate pH value, reduction corrosivity.
Preferably, described surfactant is selected from any one or a few in APES, NPE, cocoamidopropyl betaine (CAB), the aerosol OT.
More preferably, said APES is that op-10 and op-4, said NPE are TX-10.
More preferably, said surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1～5:1.
More preferably, op-10 and CAB mass ratio are 2:1～3:1.
The main effect of surfactant is the wettability that increases scaling powder, and above-mentioned dissimilar surfactant compound is used, and can produce to add and synergistic effect, improves the maximum wetting power of scaling powder effectively, shortens wetting time.
Preferably, described film forming agent is selected from any one or a few in acrylic resin, isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide and the ethyl benzoate.
Adding film forming agent can form the organic film of one deck on the solder joint surface, prevents that solder and base material again be oxidized, and also have anticorrosive property and electric insulating quality.
Preferably, described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
The main effect of said corrosion inhibiter is to suppress scaling powder to the corrosion of metal effect.
Preferably, described alcohols solvent is by the low-boiling point alcohol kind solvent with the high-boiling point alcohol kind solvent is composite processes.
More preferably, said low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
More preferably, said high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in the 3-hexylene glycol.
More preferably, said alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1～20:1.
More preferably, ethanol and quality of glycol are than being 7:1～9:1.
The main effect of solvent is the active component in the dissolving scaling powder, plays carrier function.Lower boiling ethanol and/or isopropyl alcohol and one or more high-boiling point alcohol kind solvents are used, can guarantee in whole welding temperature scope, to have solvent carrier to exist.Wherein low boiling point solvent is the main composition of dicyandiamide solution, and its effect is the various compositions in the dissolving scaling powder, forms homogeneous phase solution.In welding process, require the low boiling point solvent composition to volatilize rapidly, splash in order to avoid contact and cause with fusion welding.Simultaneously, under welding temperature, the existence of a small amount of high boiling solvent continues to bear carrier function, has guaranteed the even dispersion of the various compositions in the scaling powder at welding region, and the activity that makes scaling powder especially high temperature active is given full play to.
Another object of the present invention provides a kind of method for preparing said scaling powder, and said preparation method is dissolved in the said composite alcohols solvent through the said organic acid activator that will take by weighing by weight percentage, said organic amine activating agent, said surfactant, said film forming agent, said corrosion inhibiter fully.
The lead-free brazing that the present invention relates to is used the alcohol radical low solid-material content cleaning-free scaling powder; Be applicable to the wave-soldering and the manual immersed solder technology of SnAgCu series leadless solder; The solder joint that obtains satisfies the pin-plated-through-hole solder joint of stipulating among the IPC-A-610C " standard of electronic assembly part presentation quality acceptance condition " that has can accept the acceptable standard of secondary in the standard, can be used for the service class electronic product.
The specific embodiment
For making the auditor can further understand structure of the present invention, characteristic and other purposes, combine appended preferred embodiment to specify as follows at present, embodiment only is used to technical scheme of the present invention is described, and non-limiting the present invention.
Preparation embodiment
Embodiment 1
Taking by weighing 2.79g succinic acid, 0.86g adipic acid, 0.23g triethanolamine, 0.71gop-10,0.36g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 10.52g ethylene glycol, the 84.25g ethanol complex solvent fully.
Embodiment 2
Taking by weighing 2.79g succinic acid, 0.86g itaconic acid, 0.23g triethanolamine, 0.71gop-10,0.40g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 11.84g diethylene glycol (DEG), the 82.89g ethanol complex solvent fully.
Embodiment 3
Taking by weighing 5.39g succinic acid, 1.67g adipic acid, 0.23g triethanolamine, 0.91gop-10,0.11g op-4,0.23g acrylic resin, 0.06g BTA is dissolved in 91.40 alcohol solvents fully.
Table 1 is the percetage by weight of the Main Ingredients and Appearance of the scaling powder among the embodiment 1-3.
Table 2 is according to " exempting to clean liquid scaling powder SJ/T 11273-2002 " Performance Detection standard, to the performance evaluation result of the scaling powder among the embodiment 1-3.
Can find out that from the performance evaluation result of table 2 scaling powder among the embodiment 1-3 all has the advantage that physical stability is good, residual solids content is low, not halogen-containing, corrosivity is little, need not to clean, meet the environment-friendly type scaling powder requirement of exempting to clean.
Adopt embodiment 1 said scaling powder and SnAgCu solder, on the pcb board of the electronic devices and components that are fitted with the band lead-in wire, implement the wave-soldering welding procedure, the solder joint outward appearance that obtains is full, and the plate face of postwelding pcb board is clean, need not to clean; Wetability is good, does not have and draws defectives such as point, bridging; Not halogen-containing, pollution-free, satisfy environmental requirement; Do not have in the welding process and splash, nonirritant, pernicious gas produce, and be safe in utilization.
What need statement is that the foregoing invention content and the specific embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as the qualification to protection domain of the present invention.Those skilled in the art are in spirit of the present invention and principle, when doing various modifications, being equal to replacement or improvement.Protection scope of the present invention is as the criterion with appended claims.
Claims (16)
- One kind with the matching used scaling powder of lead-free brazing; It is characterized in that: said scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter; And alcohols solvent, wherein, by weight percentage; Said organic active agent is that 1.0-8.0%, said surfactant are that 0.5-2.0%, said film forming agent are that 0.1-2%, said corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent.
- 2. scaling powder according to claim 1; It is characterized in that: described organic active agent comprises organic acid activator and organic amine activating agent; Wherein, said organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid, the lactic acid; Said organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
- 3. scaling powder according to claim 2 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 10:1 ~ 50:1.
- 4. scaling powder according to claim 3 is characterized in that: the mass ratio of said organic acid activator and said organic amine activating agent is 15:1 ~ 30:1.
- 5. scaling powder according to claim 1 is characterized in that: described surfactant is selected from any one or a few in APES, NPE, cocoamidopropyl betaine (CAB), the aerosol OT.
- 6. scaling powder according to claim 5 is characterized in that: said APES is that op-10 and op-4, said NPE are TX-10.
- 7. scaling powder according to claim 6 is characterized in that: said surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1 ~ 5:1.
- 8. scaling powder according to claim 7 is characterized in that: op-10 and CAB mass ratio are 2:1 ~ 3:1.
- 9. scaling powder according to claim 1 is characterized in that: described film forming agent is selected from any one or a few in acrylic resin, isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide, the ethyl benzoate.
- 10. scaling powder according to claim 1 is characterized in that: described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
- 11. scaling powder according to claim 1 is characterized in that: described alcohols solvent is by the low-boiling point alcohol kind solvent and the high-boiling point alcohol kind solvent is composite processes.
- 12. scaling powder according to claim 11 is characterized in that: said low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
- 13. scaling powder according to claim 11 is characterized in that: said high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in the 3-hexylene glycol.
- 14. scaling powder according to claim 11 is characterized in that: said alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1 ~ 20:1.
- 15. scaling powder according to claim 14 is characterized in that: ethanol and quality of glycol are than being 7:1 ~ 9:1.
- 16. a method for preparing the described scaling powder of claim 1, said preparation method is dissolved in the said composite alcohols solvent through the said organic acid activator that will take by weighing by weight percentage, said organic amine activating agent, said surfactant, said film forming agent, said corrosion inhibiter fully.
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| CN201210280080.1A CN102825398B (en) | 2012-08-08 | 2012-08-08 | Soldering flux matched with lead-free solder |
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| CN201210280080.1A CN102825398B (en) | 2012-08-08 | 2012-08-08 | Soldering flux matched with lead-free solder |
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| CN102825398B CN102825398B (en) | 2014-11-19 |
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| CN103769775A (en) * | 2014-02-20 | 2014-05-07 | 苏州龙腾万里化工科技有限公司 | Capsulation water-based washing-free flux for lead-free welding flux and preparation method |
| CN104416297A (en) * | 2013-08-21 | 2015-03-18 | 苏州优诺电子材料科技有限公司 | Clean-free solder paste low in ICT (in circuit testing) false positive rate |
| CN104690450A (en) * | 2015-04-07 | 2015-06-10 | 武汉谊盛新材料科技有限公司 | Special scaling powder for automatic welding of photovoltaic battery piece |
| CN104942479A (en) * | 2015-07-08 | 2015-09-30 | 深圳市东方亮化学材料有限公司 | Flux paste consisting of microcapsule activating agents and preparation method thereof |
| CN105290650A (en) * | 2015-11-13 | 2016-02-03 | 北京达博长城锡焊料有限公司 | Scaling powder for water-soluble lead-free and halogen-free solder paste and preparing method |
| CN107442970A (en) * | 2017-08-10 | 2017-12-08 | 东北大学 | Low temperature No-clean Flux Used for Making Solder Paste and preparation method thereof |
| CN107971654A (en) * | 2017-11-24 | 2018-05-01 | 无锡盛雅生物科技有限公司佛山分公司 | A kind of water-soluble flux and preparation method thereof |
| CN108274161A (en) * | 2018-04-09 | 2018-07-13 | 苏州锐耐洁电子科技新材料有限公司 | A kind of scaling powder to the corrosion-free effect in surface |
| CN108311815A (en) * | 2017-12-31 | 2018-07-24 | 天长市飞龙金属制品有限公司 | A kind of water base low corrosion scaling powder free of cleaning |
| CN108356445A (en) * | 2018-01-30 | 2018-08-03 | 深圳市合明科技有限公司 | Environment protection soldering fluid and its preparation method and application |
| CN108480877A (en) * | 2018-04-13 | 2018-09-04 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder that can make solder joint beauty |
| CN108526765A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder that ionic pollution degree is small |
| CN108526757A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder not will produce toxic gas |
| CN109822261A (en) * | 2019-02-25 | 2019-05-31 | 王若梅 | A kind of steady splash-proof welding agent of high fever |
| CN109940311A (en) * | 2017-12-20 | 2019-06-28 | 海太半导体（无锡）有限公司 | A kind of low-temperature catalyzed scaling powder |
| CN110449768A (en) * | 2019-09-02 | 2019-11-15 | 重庆理工大学 | A kind of halogen-free no rosin solvent type scaling powder free of cleaning |
| CN110449773A (en) * | 2019-09-02 | 2019-11-15 | 重庆理工大学 | A kind of multifunctional solvent type scaling powder free of cleaning |
| CN110653519A (en) * | 2019-10-23 | 2020-01-07 | 宁波新锦春新材料科技有限公司 | Formula and production process of environment-friendly soldering flux |
| CN110838571A (en) * | 2019-11-25 | 2020-02-25 | 北京居安瑞韩电子有限公司 | Lead-coated aluminum electrode manufacturing method and storage battery |
| CN110977250A (en) * | 2019-11-25 | 2020-04-10 | 大连大学 | Soldering flux and preparation method thereof |
| CN111055045A (en) * | 2019-12-29 | 2020-04-24 | 武汉风帆电化科技股份有限公司 | Special soldering flux for photovoltaic solder strip |
| CN111716038A (en) * | 2019-03-20 | 2020-09-29 | 天津市同鑫泰钢管制造有限公司 | Anti-cracking soldering flux for welding of long-distance transportation spiral steel pipe |
| CN112621024A (en) * | 2020-12-08 | 2021-04-09 | 湖北省哈福生物化学有限公司 | Soldering flux material composition and preparation method of soldering flux |
| CN112643247A (en) * | 2020-12-08 | 2021-04-13 | 湖北省哈福生物化学有限公司 | Soldering flux additive composition and preparation method thereof |
| CN114749828A (en) * | 2022-05-13 | 2022-07-15 | 深圳市兴鸿泰锡业有限公司 | Soldering flux for wave soldering and manufacturing method thereof |
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| CN108526757A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder not will produce toxic gas |
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| CN109822261A (en) * | 2019-02-25 | 2019-05-31 | 王若梅 | A kind of steady splash-proof welding agent of high fever |
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| CN110449773A (en) * | 2019-09-02 | 2019-11-15 | 重庆理工大学 | A kind of multifunctional solvent type scaling powder free of cleaning |
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| CN110977250A (en) * | 2019-11-25 | 2020-04-10 | 大连大学 | Soldering flux and preparation method thereof |
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| CN112621024B (en) * | 2020-12-08 | 2022-04-29 | 湖北省哈福生物化学有限公司 | Soldering flux material composition and preparation method of soldering flux |
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| CN114986019B (en) * | 2022-07-19 | 2023-09-29 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
| CN116618778A (en) * | 2023-05-05 | 2023-08-22 | 广东剑鑫科技股份有限公司 | Welding process of efficient soldering flux |
| CN116618778B (en) * | 2023-05-05 | 2023-12-05 | 广东剑鑫科技股份有限公司 | Welding process of efficient soldering flux |
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