CN102825398B - Soldering flux matched with lead-free solder - Google Patents
Soldering flux matched with lead-free solder Download PDFInfo
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- CN102825398B CN102825398B CN201210280080.1A CN201210280080A CN102825398B CN 102825398 B CN102825398 B CN 102825398B CN 201210280080 A CN201210280080 A CN 201210280080A CN 102825398 B CN102825398 B CN 102825398B
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Abstract
The invention discloses a soldering flux matched with a lead-free solder. The soldering flux comprises the following component in percentage by weight: 1.0-8.0 percent of organic active agent, 0.5-2.0 percent of surfactant, 0.1-2 percent of film forming agent, 0.01-0.1 percent of corrosion inhibitor and the balance of alcoholic solvent. The soldering flux has the following advantages that 1, a welding spot is plump and does not need to be washed after soldering; 2, wettability is good, and the defects such as lcicles and bridging do not occur; and 3, halogen is not contained, pollution is avoided, environmental requirements are satisfied, splashing and fiery and harmful gas are not produced in the welding process, and use is safe; and the soldering flux is particularly suitable for lead-free wave soldering and lead-free dipping soldering in a surface mount technology (SMT).
Description
Technical field
The present invention relates to a kind of scaling powder, specifically, relate to a kind of and matching used scaling powder of lead-free brazing.
Background technology
Along with the develop rapidly of electron trade, and the improving constantly of mankind's environmental consciousness, the negative effect that leypewter brings is outstanding day by day, and novel lead-free solder is as the substitute of tin-lead solder, and its development and application has become a large focus of electron trade.Quantity research shows greatly, and the most applicable alternative SnPb solder of eutectic SnAg, SnCu and SnAgCu solder, is widely used in electron trade.Wherein SnAgCu solder is because having good physical and mechanical property, and solderability preferably, is acknowledged as the most possible lead-free brazing that substitutes SnPb alloy.
But compare with traditional SnPb solder, SnAgCu series leadless solder has the shortcomings such as fusing point is higher, wetability is poor, oxidizable.Thereby for the scaling powder of SnPb solder development, cannot meet the soldering requirement of lead-free brazing, and subject matter is: the one, be not suitable for the higher welding temperature of lead-free brazing; The 2nd, the wettability of scaling powder is inadequate.The welding temperature of tradition SnPb solder is between 235 ℃～250 ℃, and the fusing point of SnAgCu series leadless solder is higher 30 ℃ than the fusing point of SnPb solder, thereby also corresponding mentioning more than 250 ℃ of welding temperature.Traditional scaling powder is during for the welding of lead-free brazing, and resistance to elevated temperatures is poor, and scaling powder can lose part activity under higher preheat temperature and higher welding temperature, thereby produces the upper bad situation of tin; In addition, traditional scaling powder wettability is inadequate, easily causes solder joint moistening badness, produces postwelding defect, affects quality of welding spot and reliability.Thereby exploitation also becomes one of study hotspot of unleaded process with the matching used scaling powder of lead-free brazing, is subject to increasingly extensive attention.
At present, the scaling powder on market mostly is colophony type scaling powder and water-soluble flux, and mostly is the product that residual solids component content is high.The main component of colophony type scaling powder is rosin, and postwelding residue is more, need thoroughly clean.It is active that water-soluble flux generally has high helping to weld, and its residue has larger corrosivity and electrical conductivity, needs to clean immediately after substrate has assembled.Along with the development of the electronic product of high density, lightweight, microminiaturization and high performance, surface-pasted components and parts and print the gap smaller between base plate, have brought quite difficulty to cleaning.Based on above reason, no-clean scaling powder arises at the historic moment, and no-clean scaling powder is that postwelding residue is few, without the New Flux of cleaning.Compare with traditional scaling powder, no-clean scaling powder has been removed the input to cleaning equipment and cleaning agent from, has reduced the pollutions of emission to environment such as waste gas and waste water, thereby has had great economic benefit and social benefit.
For overcoming the deficiencies in the prior art, the invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder that meets unleaded immersed solder and unleaded Wave crest Welding technological requirement, using alcohols as solvent, not containing solid matters such as rosin, without the new and effective scaling powder cleaning.Compare with colophony type scaling powder, the alcohol based scaling powder that the present invention proposes is not because containing rosin composition, and solid content reduces, thereby postwelding residue is few, meets the requirement of no-clean scaling powder.And compare with water-soluble flux, alcohol based scaling powder be take lower boiling ethanol as primary solvent, and in welding process, the volatile ratio water of ethanol is faster, has effectively avoided the problem of splashing.
Summary of the invention
The invention provides a kind of alcohol radical low solid-material content cleaning-free scaling powder, be particularly useful for unleaded wave-soldering and unleaded manual immersed solder in surface mounting technology (SMT).Its advantage is: 1, solder joint is full, and postwelding is without cleaning; 2, wetability is good, without drawing the defects such as point, bridging; 3, not halogen-containing, pollution-free, meet environmental requirement, in welding process, without splashing, nonirritant, pernicious gas produce, and use safety.
Main purpose of the present invention is to provide a kind of and matching used scaling powder of lead-free brazing, described scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter, and alcohols solvent, wherein, by weight percentage, described organic active agent is that 1.0-8.0%, described surfactant are that 0.5-2.0%, described film forming agent are that 0.1-2%, described corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent.
Preferably, described organic active agent comprises organic acid activator and organic amine activating agent, wherein, described organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid and lactic acid; Described organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
Preferably, scaling powder according to claim 2, is characterized in that: the mass ratio of described organic acid activator and described organic amine activating agent is 10:1～50:1.
More preferably, scaling powder according to claim 3, is characterized in that: the mass ratio of described organic acid activator and described organic amine activating agent is 15:1～30:1.
Organic acid contains carboxyl active function groups, produces free H+ ion in solvent, with the oxide generation chemical reaction of mother metal and solder surface, reaches the object of removing oxide-film, increasing wetability, is active higher activator.Organic amine activity a little less than, the Main Function in scaling powder is to regulate pH value, reduction corrosivity.
Preferably, described surfactant is selected from any one or a few in APES, NPE, cocoamidopropyl betaine (CAB), aerosol OT.
More preferably, described APES is that op-10 and op-4, described NPE are TX-10.
More preferably, described surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1～5:1.
More preferably, op-10 and CAB mass ratio are 2:1～3:1.
The Main Function of surfactant is the wettability that increases scaling powder, and above-mentioned dissimilar surfactant compound is used, and can produce additive synergism, effectively improves the maximum wetting power of scaling powder, shortens wetting time.
Preferably, described film forming agent is selected from any one or a few in acrylic resin, isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide and ethyl benzoate.
Add film forming agent to form one deck organic film on solder joint surface, prevent that solder and base material again be oxidized, and also have anticorrosive property and electric insulating quality.
Preferably, described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
The Main Function of described corrosion inhibiter is to suppress scaling powder to corrosion of metal effect.
Preferably, described alcohols solvent is by low-boiling point alcohol kind solvent with high-boiling point alcohol kind solvent is composite makes.
More preferably, described low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
More preferably, described high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in 3-hexylene glycol.
More preferably, described alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1～20:1.
More preferably, ethanol and quality of glycol are than being 7:1～9:1.
The Main Function of solvent is the active component dissolving in scaling powder, plays carrier function.Lower boiling ethanol and/or isopropyl alcohol and one or more high-boiling point alcohol kind solvents are used in conjunction with, can guarantee to have solvent carrier to exist within the scope of whole welding temperature.The chief component that wherein low boiling point solvent is dicyandiamide solution, its effect is the various compositions that dissolve in scaling powder, forms homogeneous phase solution.In welding process, require low boiling point solvent composition to volatilize rapidly, in order to avoid contact with fusion welding, cause and splash.Meanwhile, under welding temperature, the existence of a small amount of high boiling solvent continues to bear carrier function, has guaranteed dispersed at welding region of the various compositions in scaling powder, and the activity that makes scaling powder especially high temperature active is given full play to.
Another object of the present invention is to provide a kind of method of preparing described scaling powder, and described preparation method is by being dissolved in the described organic acid activator taking by weight percentage, described organic amine activating agent, described surfactant, described film forming agent, described corrosion inhibiter completely in described composite alcohols solvent.
The lead-free brazing the present invention relates to alcohol radical low solid-material content cleaning-free scaling powder, be applicable to wave-soldering and the manual immersed solder technique of SnAgCu series leadless solder, the solder joint obtaining meets the acceptable standard of secondary in pin-plated-through-hole solder joint acceptable standard that has of stipulating in the standard > > of IPC-A-610C < < electronic assembly part presentation quality acceptance condition, can be used for service class electronic product.
The specific embodiment
For making auditor can further understand structure of the present invention, feature and other objects, now in conjunction with appended preferred embodiment, be described in detail as follows, embodiment is only for technical scheme of the present invention is described, and non-limiting the present invention.
Preparation Example
Embodiment 1
Taking 2.79g succinic acid, 0.86g adipic acid, 0.23g triethanolamine, 0.71gop-10,0.36g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 10.52g ethylene glycol, 84.25g ethanol complex solvent completely.
Embodiment 2
Taking 2.79g succinic acid, 0.86g itaconic acid, 0.23g triethanolamine, 0.71gop-10,0.40g CAB, 0.23g acrylic resin, 0.05g BTA is dissolved in 11.84g diethylene glycol (DEG), 82.89g ethanol complex solvent completely.
Embodiment 3
Taking 5.39g succinic acid, 1.67g adipic acid, 0.23g triethanolamine, 0.91gop-10,0.11g op-4,0.23g acrylic resin, 0.06g BTA is dissolved in 91.40 alcohol solvents completely.
Table 1 is the percetage by weight of the Main Ingredients and Appearance of the scaling powder in embodiment 1-3.
Table 2 is to exempt to clean liquid scaling powder SJ/T 11273-2002 > > Performance Detection standard, the Evaluation results to the scaling powder in embodiment 1-3 according to < <.
From the Evaluation results of table 2, can find out, the scaling powder in embodiment 1-3 all has advantages of that physical stability is good, residual solids content is low, not halogen-containing, corrosivity is little, without cleaning, meets the environment-friendly type scaling powder requirement of exempting from cleaning.
Scaling powder and SnAgCu solder described in employing embodiment 1 are implemented Wave crest Welding technique on the pcb board of electronic devices and components that is fitted with band lead-in wire, and the solder joint outward appearance obtaining is full, and the plate face of postwelding pcb board is clean, without cleaning; Wetability is good, without drawing the defects such as point, bridging; Not halogen-containing, pollution-free, meet environmental requirement; In welding process, without splashing, nonirritant, pernicious gas produce, and use safety.
Need statement, foregoing invention content and the specific embodiment are intended to prove the practical application of technical scheme provided by the present invention, should not be construed as limiting the scope of the present invention.Those skilled in the art are in spirit of the present invention and principle, when doing various modifications, be equal to and replace or improve.Protection scope of the present invention is as the criterion with appended claims.
Claims (12)
- One kind with the matching used scaling powder of lead-free brazing, it is characterized in that: described scaling powder comprises organic activating agent, surfactant, film forming agent, corrosion inhibiter, and alcohols solvent, wherein, by weight percentage, described organic active agent is that 1.0-8.0%, described surfactant are that 0.5-2.0%, described film forming agent are that 0.1-2%, described corrosion inhibiter are 0.01-0.1%, and all the other are alcohols solvent;Wherein, described organic active agent comprises organic acid activator and organic amine activating agent, and the mass ratio of described organic acid activator and described organic amine activating agent is 10:1～50:1;Wherein, described surfactant is by APES or aerosol OT and composite the making of cocoamidopropyl betaine (CAB);Wherein, described film forming agent is selected from acrylic resin, any one or a few in isoamyl acetate, Macrogol 600, ethylene dimethyl, polyacrylamide, ethyl benzoate;Wherein, described alcohols solvent is by low-boiling point alcohol kind solvent with high-boiling point alcohol kind solvent is composite makes.
- 2. scaling powder according to claim 1, is characterized in that: described organic acid activator is selected from any one or a few in succinic acid, adipic acid, glutaric acid, decanedioic acid, maleic acid, acrylic acid, itaconic acid, citric acid, DL-malic acid, lactic acid; Described organic amine activating agent is triethanolamine and/or N methyldiethanol amine.
- 3. scaling powder according to claim 1, is characterized in that: the mass ratio of described organic acid activator and described organic amine activating agent is 15:1～30:1.
- 4. scaling powder according to claim 1, is characterized in that: described APES is op-10 and op-4, and described NPE is TX-10.
- 5. scaling powder according to claim 4, is characterized in that: described surfactant is the compounded combination of op-10 and CAB, and op-10 and CAB mass ratio are 1:1～5:1.
- 6. scaling powder according to claim 5, is characterized in that: op-10 and CAB mass ratio are 2:1～3:1.
- 7. scaling powder according to claim 1, is characterized in that: described corrosion inhibiter is BTA (BTA) and/or methyl benzotriazazole (TTA).
- 8. scaling powder according to claim 1, is characterized in that: described low-boiling point alcohol kind solvent is selected from ethanol and/or isopropyl alcohol.
- 9. scaling powder according to claim 1, is characterized in that: described high-boiling point alcohol kind solvent is selected from ethylene glycol, glycerine, hexylene glycol, diethylene glycol (DEG), 2-ethyl-1, one or more in 3-hexylene glycol.
- 10. scaling powder according to claim 1, is characterized in that: described alcohols solvent is ethanol and ethylene glycol complex solvent system, and ethanol and quality of glycol are than being 5:1～20:1.
- 11. scaling powders according to claim 10, is characterized in that: ethanol and quality of glycol are than being 7:1～9:1.
- 12. 1 kinds of methods of preparing scaling powder claimed in claim 1, described preparation method is by being dissolved in the described organic acid activator taking by weight percentage, described organic amine activating agent, described surfactant, described film forming agent, described corrosion inhibiter completely in described alcohols solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280080.1A CN102825398B (en) | 2012-08-08 | 2012-08-08 | Soldering flux matched with lead-free solder |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210280080.1A CN102825398B (en) | 2012-08-08 | 2012-08-08 | Soldering flux matched with lead-free solder |
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| Publication Number | Publication Date |
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| CN102825398A CN102825398A (en) | 2012-12-19 |
| CN102825398B true CN102825398B (en) | 2014-11-19 |
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| CN112621024B (en) * | 2020-12-08 | 2022-04-29 | 湖北省哈福生物化学有限公司 | Soldering flux material composition and preparation method of soldering flux |
| CN112643247A (en) * | 2020-12-08 | 2021-04-13 | 湖北省哈福生物化学有限公司 | Soldering flux additive composition and preparation method thereof |
| CN114749828B (en) * | 2022-05-13 | 2022-10-14 | 深圳市兴鸿泰锡业有限公司 | Soldering flux for wave soldering and manufacturing method thereof |
| CN114986019B (en) * | 2022-07-19 | 2023-09-29 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
| CN116618778B (en) * | 2023-05-05 | 2023-12-05 | 广东剑鑫科技股份有限公司 | Welding process of efficient soldering flux |
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