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CN105290650B - Lead-free solder paste with water-soluble fluxes halogen and a preparation method - Google Patents

Lead-free solder paste with water-soluble fluxes halogen and a preparation method Download PDF

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CN105290650B
CN105290650B CN 201510773496 CN201510773496A CN105290650B CN 105290650 B CN105290650 B CN 105290650B CN 201510773496 CN201510773496 CN 201510773496 CN 201510773496 A CN201510773496 A CN 201510773496A CN 105290650 B CN105290650 B CN 105290650B
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CN 201510773496
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CN105290650A (en )
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倪志强
胡智信
关智晓
穆振国
方亮
李超英
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北京达博长城锡焊料有限公司
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Abstract

本发明涉及一种水溶性无铅无卤素锡膏用助焊剂及制备方法,它由下述重量百分比的原料组成:无水柠檬酸10‑15%、戊二酸6‑10%、苹果酸1‑3%、聚乙二醇1000 8‑12%、丙三醇60‑65%、三乙醇胺1‑3%、聚氧乙烯‑8‑辛基苯基醚1‑5%,适用于无铅水洗锡膏的工艺要求,焊接后助焊剂残留可溶于水并且不含有卤素,环保安全;制备的锡膏具有粘性好,保存期限长,焊点饱满,亮度适中,解决的问题是传统的助焊剂中含有卤素,在加热过程中会产生有害物质;另一方面,解决了清洗工艺用水来代替例如二氯甲烷、三氯乙烷等有毒有害清洗剂对人和环境的危害。 The present invention relates to a water-soluble flux for lead-free and halogen-free solder paste prepared, the percentage of its raw materials by the following composition by weight: 10-15% anhydrous citric acid, 6-10% glutaric acid, malic acid 1 -3%, 8-12% polyethylene glycol 1000, glycerol 60-65%, 1-3% triethanolamine, polyoxyethylene octylphenyl ether -8- 1-5% for lead-free water process requirements solder paste, flux residues after soldering soluble in water and does not contain a halogen, environmentally safe; paste produced has a good tack, long shelf life, full of solder, moderate brightness, a conventional problem of flux contains a halogen, in the heating process will produce harmful substances; on the other hand, to solve the cleaning process to replace the water hazards methylene chloride, trichloroethane and other toxic cleaning agent, for example, humans and the environment.

Description

水溶性无铅无卤素锡膏用助焊剂及制备方法 Lead-free solder paste with water-soluble fluxes halogen and a preparation method

技术领域 FIELD

[0001] 本发明涉及一种水溶性无铅无卤素锡膏用助焊剂,属电子焊接材料领域。 [0001] The present invention relates to a water-soluble lead-free solder paste with a halogen-free flux, solder belongs to the field of electronic materials.

[0002] 本发明还涉及该助焊剂的制备方法。 [0002] The present invention further relates to a method for the preparation of the flux.

背景技术 Background technique

[0003]随着表面贴装技术的成熟,以往以锡铅焊料为主的焊接材料逐步的再被无铅焊料所替代。 [0003] With the maturity of the surface mount technology, conventional tin-lead-based solder material to gradually and replaced by a lead-free solder. 众所周知,铅及其化合物是有害物质,长期的使用与接触对人的神经系统、血液系统等都有一定的影响。 As we all know, lead and its compounds have a certain influence of harmful substances, long-term use in contact with the human nervous system, blood system. 虽热使用了无铅锡膏来代替有铅锡膏,但助焊剂中的卤素成分在经过加热之后会产生有害物质甚至是致癌物质,对人的身体健康有着很重要的影响。 Although the heat using lead-free solder paste to replace leaded solder paste, but the halogen component of flux after a heating will produce even harmful substances are carcinogenic, it has a very important impact on human health. 还有一些电子行业生产过程中会对焊接过后产生的助焊剂残留进行清洗,传统的松香型助焊剂的紧靠简单的乙醇或者异丙醇等溶剂的清洗效率很慢,所以出现了二氯乙烷,三氯甲烷等强力的清洗剂,这些清洗剂本身就对人体有一定毒害,长期接触势必将对使用者的身体健康造成伤害而且对环境的影响也是不乐观的。 There are a number of flux in the electronics industry in the production process after welding have produced residual cleaning, the cleaning efficiency of a conventional solvent Rosin flux abuts simple ethanol or isopropanol, is very slow, so there dichloroacetyl dioxane, chloroform and other strong cleaning agents, these cleaning agents themselves have a certain toxic to the human body, long-term exposure will inevitably harm the health of users and the impact on the environment is not optimistic. 基于这种现实的背景下,一种水溶性无铅无卤素锡肯的广生可以解决助焊剂的加热产生有害物质以及清洗问题。 Based on this reality background, a water-soluble lead-free halogen-free tin Ken Guangsheng can solve the heat flux of harmful substances and cleaning problems. 这种助焊剂在焊接过后只需要用水就可以清洗干净,不仅保护了人和环境,而且还可以降低生产成本。 This flux after soldering can only clean water, not only to protect people and the environment, but also can reduce the production cost.

发明内容 SUMMARY

[0004]本发明的目的正是为电子行业提供一种水溶性无铅无卤素锡膏助焊剂,加热焊接过程没有南素的助焊剂不会产生有害物质,焊接完成后的助焊剂残留只需要经过水洗就可以达到清洗的目的,极大的保证了焊接的可靠性,无需对残留中化学离子对焊接版面的腐蚀现象再生顾虑,从而即环保又满足了表面贴装行业的焊接质量要求。 [0004] The object of the present invention is to provide a water-soluble halogen-free lead-free solder paste for the electronics industry, flux, heat welding process without flux Southern Pigment not produce harmful substances, the flux residue after soldering is completed only needs after washing can achieve the purpose of cleaning, greatly ensure the reliability of welding, without the need for chemical residues in ion corrosion phenomena on welded sections of regeneration concerns, so that is environmentally friendly and meets the requirements of welding quality surface mount industry.

[0005]本发明的目的是通过下列技术方案实现的: [0005] The object of the present invention are achieved by the following technical solution:

[0006] —种水溶性无铅无卤素锡膏用助焊剂,它由下述重量百分比的原料组成: [0006] - water-soluble flux with a lead-free solder paste halogen, which consists of raw materials in the following weight percentages:

[0007]无水柠檬酸10-15%、戊二酸6-10%、苹果酸1-3%、聚乙二醇1000 8-12%、丙三醇60-65%、三乙醇胺1-3%、聚氧乙烯-8-辛基苯基醚1-5%。 [0007] 10-15% anhydrous citric acid, 6-10% glutaric acid, malic acid, 1-3%, 8-12% polyethylene glycol 1000, 60-65% glycerol, triethanolamine 1-3 %, polyoxyethylene octylphenyl ether -8- 1-5%.

[0008] —种水溶性无铅无卤素锡膏用助焊剂的制备方法,它按下述步骤进行: [0008] - Lead water soluble halogen-free solder paste prepared with flux, which perform the following steps:

[0009] (a) 60-65%丙三醇与8-12%聚乙二醇1〇〇〇加入到玻璃反应釜中,加热到15〇。 [0009] (a) 60-65% glycerol and 8-12% polyethylene glycol 1〇〇〇 added to a glass reaction vessel and heated to 15〇. 〇后, 启动搅拌,转速为200r/min; After the square, start stirring speed of 200r / min;

[0010] (b)待聚乙二醇1000完全溶解后,加入10-15%无水柠檬酸与丨-3%苹果酸,继续搅拌,转速为200r/min; [0010] (b) polyethylene glycol 1000 was completely dissolved to be added after 10-15% of anhydrous citric acid, malic acid and 3% by Shu, continue stirring speed of 200r / min;

[0011] (c)待无水柠檬酸与苹果酸完全溶解后,降温uot:,继续搅拌,转速为2〇〇r/min; After [0011] (c) to be anhydrous citric acid to malic acid was completely dissolved, stirring was continued cooling uot :, speed of 2〇〇r / min;

[0012] (d)温度达到120°C,加入6-10%戊二酸直至其完全溶解后降温110。 [0012] (d) the temperature reached 120 ° C, 6-10% glutaric acid was added until it was completely dissolved after cooling 110. 〇,继续搅拌,转速为200r/min; Square, continue stirring speed of 200r / min;

[0013] (e)温度达到11(TC后,加入1-3%三乙醇胺与卜5%聚氧乙烯-8-辛基苯基醚,继续搅拌,转速为200r/min,搅拌15-20分钟,制备完成后进行密封助焊剂产品。 After [0013] (e) the temperature reached 11 (TC, and the addition of 1-3% Triethanolamine 5% BU -8- polyoxyethylene octylphenyl ether and continue stirring speed of 200r / min, was stirred for 15-20 min after completion of the preparation of the flux sealing products.

[00M]本发明的助焊剂由无水柠檬酸、戊二酸、苹果酸、聚乙二醇丨〇〇〇、丙三醇、三乙醇胺、來氧乙烯-8-辛基本基醚组成,选择的所有原料均可溶于水,选择的丙三载体可防止锡^塌陷,作为保湿剂可延长锡膏的储存期限;聚乙二醇1〇〇〇为增稠剂其主^ 作用是赋予髓-定浦体懸;三乙_为職剂,其主要作腿馳锡麵樹生、 兀器件的贴装;无水柠檬酸、戊二酸、苹果酸均属于活性剂,其主要作用是在焊接过程中除焊盘、焊接器件及焊料表面的氧化物,从而提高润湿性,提高焊接性能.聚氧乙烯_8—其苯基醚为表面活性剂,其主要作用是降低焊剂表面张力,增加焊接的润湿性。 [00M] flux of the present invention consists of anhydrous citric acid, glutaric acid, malic acid, Shu 〇〇〇 polyethylene glycol, glycerol, triethanolamine, -8- to polyoxyethylene octyl ether present, chosen All raw materials are dissolved in water, glycerol carrier selected collapse against tin ^, as a humectant extended shelf life of the solder paste; polyethylene glycol thickeners 1〇〇〇 main role is given to myeloid ^ - Pu given sUSPENDED; _ as triethylamine level agents, mainly for the tin side leg Chi tree health, Wu mount device; anhydrous citric acid, glutaric acid, malic acid belong to the active agent, its main role in the welding in addition to process pads, and the welding device of the solder surface oxides, thereby improving wettability of weldability. _8- polyoxyethylene phenyl ether which is a surfactant, and its main function is to reduce the surface tension of the solder, increasing soldering wettability. earth

[0015]本发明的助焊剂可以与无铅锡粉配制成无铅锡膏。 [0015] The flux of the present invention may be formulated and the powder-free solder lead-free solder paste.

[0016]本发明具有如下优点及效果: _7] a)酬于无铅水洗锡_工艺要求,焊接后助焊纖留可溶于水并且不含素,环保安全; [0016] The present invention has the following advantages and effects: _7] a) _ paid to lead-free tin washing process requirements, after welding fluxing fibers stay free of pigment and water-soluble, environmentally safe;

[0018] b)采用上述配方制备的锡膏具有粘性好,保存期限长,焊点饱满,亮度适中,环保安全;解决的问题是传统的助焊剂中含有卤素,在加热过程中会产生有害物质;另一方面, 解决了清洗工艺用水来代替例如二氯甲烷、三氯乙烷等有毒有害清洗剂对人和环境的危害。 [0018] b) Preparation of paste using the formula above has a good tack, long shelf life, full of solder, moderate brightness, environmentally safe; problem of conventional halogen-containing flux, generated during heating of harmful substances ; on the other hand, to solve the cleaning process to replace the water hazards methylene chloride, trichloroethane and other toxic cleaning agent, for example, humans and the environment.

具体实施方式[0019] 实施例1 _0]、、取60g丙三醇与l〇g聚乙二醇1000加入到玻璃反应釜中,加热到15〇工后,启动揽^,转速为2〇〇r/min,待聚乙二醇1000完全溶解后,加入15g无水柠檬酸与lg苹果酸,继续搅拌,转速为2〇〇r、/min,待无水柠檬酸与苹果酸完全溶解后,降温12(rc,继续搅拌,转速为200r/min,温度达到120°C,加入8g戊二酸直至其完全溶解后降温丨10〇C,继续搅拌,转速为200r/min,温度达到1 l〇°C后,加入lg三乙醇胺与5g聚氧乙烯_8—辛基苯基醚,继续搅拌,转速为2〇Or/min,搅拌I5分钟,制备完成后进行密封助焊剂产品。 After [0019] DETAILED DESCRIPTION _0 Example 1] Take 60g ,, l〇g glycerol and polyethylene glycol 1000 was added to a glass reaction vessel and heated to 15〇 work, ^ embrace start, speed 2〇〇 r / min, until completely dissolved polyethylene glycol 1000, 15g of anhydrous citric acid was added lg malic acid, stirring is continued, the rotation speed of 2〇〇r, / min, the citric acid and malic acid was completely dissolved to be anhydrous, cooling 12 (rc, continued stirring speed of 200r / min, the temperature reached 120 ° C, 8g glutaric acid was added until it was completely dissolved after cooling Shu 10〇C continued stirring speed of 200r / min, the temperature reached a l〇 after ° C, was added lg of triethanolamine and 5g _8- polyoxyethylene octylphenyl ether, stirring is continued, the rotation speed of 2〇Or / min, stirred for I5 minutes, sealed welding flux after preparation.

[0021] 实施例2 [0021] Example 2

[0022]、取62g丙三醇与8g聚乙二醇1000加入到玻璃反应釜中,加热到15〇1:后,启动搅拌,转速为200r/min,待聚乙二醇1000完全溶解后,加入14g无水柠檬酸与2g苹果酸,继续搅拌,转速为200r/min,待无水柠檬酸与苹果酸完全溶解后,降温12(rc,继续搅拌,转速为20〇r/min,温度达到120°C,加入l〇g戊二酸直至其完全溶解后降温丨1(rC,继续搅拌,转速为2〇Or/min,温度达到11(TC后,加入2g三乙醇胺与2g聚氧乙烯-8-辛基苯基醚,继续搅拌,转速为200r/min,搅拌15分钟,制备完成后进行密封助焊剂产品。 [0022], taking 8g 62g glycerol and polyethylene glycol 1000 was added to a glass reaction vessel and heated to 15〇1: After starting stirring speed of 200r / min, until complete dissolution of polyethylene glycol 1000, Add 14g of anhydrous citric acid and malic acid 2g, continue stirring speed of 200R / min, until anhydrous citric acid and malic acid was completely dissolved, cool 12 (rc, continued stirring speed of 20〇r / min, the temperature reached after 120 ° C, was added glutaric acid l〇g until completely dissolved after cooling Shu 1 (rC, continued stirring speed of 2〇Or / min, the temperature reached 11 (TC, was added 2g 2g triethanolamine polyoxyethylene - 8- octylphenyl ether and continue stirring speed of 200r / min, stirred for 15 minutes, sealed welding flux after preparation.

[0023] 实施例3 [0023] Example 3

[0024]、取65g丙三醇与I2g聚乙二醇1〇〇〇加入到玻璃反应釜中,加热到⑽^后,启动搅拌,转速为2〇〇r/min,待聚乙二醇10⑻完全溶解后,加入1〇g无水柠檬酸与3g苹果酸,继续搅拌,转速为2〇〇r/min,待无水柠檬酸与苹果酸完全溶解后,降温12(rc,继续搅拌,转速为200r/min,温度达到120°C,加入6g戊二酸直至其完全溶解后降温110。(:,继续搅拌,转速为200r/min,温度达到1 l(TC后,加入3g三乙醇胺与“聚氧乙烯_8_辛基苯基醚,继续搅拌,转速为200r/min,搅拌15分钟,制备完成后进行密封助焊剂产品。 [0024], taking 65g of glycerol and polyethylene glycol 1〇〇〇 I2g added to a glass reaction vessel and heated to ⑽ ^, start stirring speed was 2〇〇r / min, to be pegylated 10⑻ after complete dissolution, 3g 1〇g anhydrous citric acid and malic acid, and stirring was continued, the rotation speed of 2〇〇r / min, until anhydrous citric acid and malic acid was completely dissolved, cool 12 (rc, continued stirring speed is 200r / min, the temperature reached 120 ° C, was added 6g glutaric acid until it is completely dissolved after cooling 110. (:, continued stirring speed of 200r / min, the temperature reaches 1 l (after TC, and triethanolamine was added 3g " _8_ polyoxyethylene octylphenyl ether and continue stirring speed of 200r / min, stirred for 15 minutes, sealed welding flux after preparation.

Claims (2)

  1. 1.一种水溶性无铅无卤素锡膏用助焊剂,其特征在于它由下述重量百分比的原料组成: 无水梓檬酸1〇_15%、戊二酸6-10%、苹果酸1-3%、聚乙二醇1〇〇〇8-12%、丙三醇60-65%、三乙醇胺1-3%、聚氧乙烯-8-辛基苯基醚2-5%。 A halogen-free solder paste with water-soluble lead-free flux, characterized by the following weight percentages its raw material composition: Anhydrous citric acid 1〇_15 Zi%, 6-10% glutaric acid, malic acid 1-3%, 1〇〇〇8-12% polyethylene glycol, 60-65% glycerol, 1-3% triethanolamine, polyoxyethylene octylphenyl ether -8- 2-5%.
  2. 2.根据权利要求1所述一种水溶性无铅无卤素锡膏用助焊剂的制备方法,其特征在于它按下述步骤进行: (a) 60_65%丙三醇与8_12%聚乙二醇1〇〇〇加入到玻璃反应釜中,加热到150。 1 according to the one water soluble halogen-free method for preparing lead-free solder paste with flux as claimed in claim, characterized in that it is carried out by the following steps: (a) 60_65% glycerol and polyethylene glycol 8_12% 1〇〇〇 was added to a glass reaction vessel and heated to 150. (:后,启动搅拌,转速为200r/min; (b) 待聚乙二醇1000完全溶解后,加入10_15%无水柠檬酸与卜观苹果酸,继续搅拌,转速为200r/min; (C)待无水柠檬酸与苹果酸完全溶解后,降温120°C,继续搅拌,转速为200r/min; (d) 温度达到120°c,加入6-10%戊二酸直至其完全溶解后降温丨10-C,继续搅拌,转速为200r/min; (e) 温度达到1 l〇°C后,加入1-3%三乙醇胺与1-5%聚氧乙烯-8-辛基苯基醚,继续搅拌, 转速为200r/min,搅拌15-20分钟,制备完成后进行密封助焊剂产品。 (:, Start stirring speed of 200r / min; (b) polyethylene glycol 1000 to be completely dissolved, 10_15% of anhydrous citric acid and malic acid BU concept, continue stirring speed of 200r / min; (C ) after anhydrous citric acid and malic acid is completely dissolved, cooling 120 ° C, stirring was continued, the rotation speed of 200r / min; (d) the temperature reached 120 ° c, 6-10% glutaric acid was added until it was completely dissolved after cooling Shu 10-C, stirring was continued, the rotation speed of 200r / min; (e) When the temperature reaches 1 l〇 ° C, added with 1-3% triethanolamine 1-5% -8- polyoxyethylene octylphenyl ether, continue stirring speed of 200r / min, stirring for 15-20 minutes, sealed welding flux after preparation.
CN 201510773496 2015-11-13 2015-11-13 Lead-free solder paste with water-soluble fluxes halogen and a preparation method CN105290650B (en)

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JP3423930B2 (en) * 1999-12-27 2003-07-07 富士通株式会社 Bump forming method, an electronic component and solder paste,
CN101327552A (en) * 2008-07-31 2008-12-24 东莞永安科技有限公司 Low solid content halogenide-free water-based type cleaning-free scaling powder
CN102166689B (en) * 2011-03-30 2013-05-22 浙江强力焊锡材料有限公司 Halogen-free lead-free soldering paste and soldering flux used by same
CN102357749A (en) * 2011-10-18 2012-02-22 苏州之侨新材料科技有限公司 Water-based halogen-free soldering flux used for lead-free soldering tin
CN102825398B (en) * 2012-08-08 2014-11-19 北京工业大学 Soldering flux matched with lead-free solder
CN104874940B (en) * 2015-06-18 2017-07-07 重庆理工大学 A low-silver lead-free solder with a no-clean flux and preparation method

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