CN105290650B - The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method - Google Patents
The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method Download PDFInfo
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- CN105290650B CN105290650B CN201510773496.0A CN201510773496A CN105290650B CN 105290650 B CN105290650 B CN 105290650B CN 201510773496 A CN201510773496 A CN 201510773496A CN 105290650 B CN105290650 B CN 105290650B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Detergent Compositions (AREA)
Abstract
The present invention relates to a kind of plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method, it is made up of the raw material of following weight percentage：Anhydrous citric acid 10 15%, glutaric acid 6 10%, malic acid 1 3%, cetomacrogol 1000 8 12%, glycerine 60 65%, triethanolamine 1 3%, the octyl phenyl ether 1 5% of polyoxyethylene 8, suitable for the technological requirement of unleaded washing tin cream, welding assisted agent residuals are water-soluble after welding and do not contain halogen, Environmental Safety；The tin cream of preparation has that viscosity is good, and storage life limit for length, solder joint is full, and brightness is moderate, is to contain halogen in traditional scaling powder the problem of solution, harmful substance can be produced in heating process；On the other hand, cleaning is solved with water come instead of harm of the poisonous and harmful cleaning agent to human and environment such as dichloromethane, trichloroethanes.
Description
Technical field
The present invention relates to a kind of plain tin cream scaling powder of water-soluble lead-free and halogen-free, belong to electronic welding Material Field.
The invention further relates to the preparation method of the scaling powder.
Background technology
With the maturation of surface mounting technology, in the past the welding material based on tin-lead solder progressively again by lead-free solder
Substituted.It is well known that lead and its compound are harmful substances, long-term use is with contacting nervous system to people, blood system
System etc. all has a certain impact.Though heat has used lead-free tin cream to have replaced the halogenic ingredient in Pb-Sn paste, scaling powder in warp
Harmful substance even carcinogen can be produced by crossing after heating, and have critically important influence to the healthy of people.Also one
In a little electronics industry production processes can butt welding take over after the welding assisted agent residuals that produce cleaned, traditional colophony type scaling powder
Cleaning efficiency against simple ethanol or isopropanol equal solvent is very slow, so occurring in that dichloroethanes, chloroform etc. is strong
The cleaning agent of power, these cleaning agents inherently have certain murder by poisoning to human body, and Long Term Contact certainly will be by the healthy of user
Damage and the influence to environment is also pessimistic.Based under this real background, a kind of water-soluble lead-free and halogen-free
The generation of plain tin cream can solve the problems, such as that the heating of scaling powder produces harmful substance and cleaning.This scaling powder is after welding
Only need to just be cleaned up with water, not only protect human and environment, but also production cost can be reduced.
The content of the invention
The purpose of the present invention exactly provides a kind of water-soluble lead-free and halogen-free plain tin cream scaling powder for electronics industry, heating welding
The scaling powder that process does not have halogen will not produce harmful substance, and the welding assisted agent residuals after the completion of welding are only needed to can by washing
To reach the purpose of cleaning, the reliability of welding is greatly ensure that, without the corruption to chemical ion in residual to the welding space of a whole page
Phenomenon regeneration misgivings are lost, so that i.e. environmental protection meets the welding quality requirement of surface mount industry again.
The purpose of the present invention is realized by following technical proposal：
A kind of plain tin cream scaling powder of water-soluble lead-free and halogen-free, it is made up of the raw material of following weight percentage：
Anhydrous citric acid 10-15%, glutaric acid 6-10%, malic acid 1-3%, cetomacrogol 1000 8-12%, glycerine
60-65%, triethanolamine 1-3%, polyoxyethylene -8- octyl phenyl ethers 1-5%.
A kind of preparation method of the plain tin cream scaling powder of water-soluble lead-free and halogen-free, it is carried out in the steps below：
（a）60-65% glycerine is added in glass reaction kettle with 8-12% cetomacrogol 1000s, is heated to after 150 DEG C,
Start stirring, rotating speed is 200r/min；
（b）After cetomacrogol 1000 is completely dissolved, 10-15% anhydrous citric acids and 1-3% malic acid are added, continues to stir
Mix, rotating speed is 200r/min；
（c）After anhydrous citric acid and malic acid are completely dissolved, cool 120 DEG C, continue to stir, rotating speed is 200r/min；
（d）Temperature reaches 120 DEG C, adds 6-10% glutaric acids until it cools 110 DEG C after being completely dissolved, continuation is stirred, and is turned
Speed is 200r/min；
（e）Temperature is reached after 110 DEG C, adds 1-3% triethanolamines and 1-5% polyoxyethylene -8- octyl phenyl ethers, is continued
Stirring, rotating speed is 200r/min, is stirred 15-20 minutes, and sealing scaling powder product is carried out after the completion of preparation.
The scaling powder of the present invention is by anhydrous citric acid, glutaric acid, malic acid, cetomacrogol 1000, glycerine, three ethanol
Amine, polyoxyethylene -8- octyl phenyl ethers composition, all raw materials of selection are water-soluble, and the glycerine of selection is used as scaling powder
Carrier can prevent tin cream from collapsing, and can extend the shelf life of tin cream as NMF；Cetomacrogol 1000 is thickener, and its is main
Effect is to confer to the certain lotion form of tin cream；Triethanolamine is tackifier, and its main function is to increase the viscosity of tin cream, is easy to
The attachment of component；Anhydrous citric acid, glutaric acid, malic acid belong to activating agent, and its main function is in welding process
Except the oxide of pad, welding device and solder surface, so as to improve wetability, welding performance is improved；Polyoxyethylene -8- octyl groups
Phenyl ether is surfactant, and its main function is reduction solder surface tension force, increases the wetability of welding.
The scaling powder of the present invention can be configured to lead-free tin cream with unleaded glass putty.
The invention has the advantages that and effect：
a）Suitable for the technological requirement of unleaded washing tin cream, welding assisted agent residuals are water-soluble after welding and do not contain halogen
Element, Environmental Safety；
b）It is sticky good that the tin cream prepared using above-mentioned formula is had, and storage life limit for length, solder joint is full, and brightness is moderate, environmental protection
Safety；The problem of solution is to contain halogen in traditional scaling powder, and harmful substance can be produced in heating process；On the other hand,
Cleaning is solved with water come instead of danger of the poisonous and harmful cleaning agent to human and environment such as dichloromethane, trichloroethanes
Evil.
Embodiment
Embodiment 1
Take 60g glycerine to be added to 10g cetomacrogol 1000s in glass reaction kettle, be heated to after 150 DEG C, startup is stirred
Mix, rotating speed is 200r/min, after cetomacrogol 1000 is completely dissolved, add 15g anhydrous citric acids and 1g malic acid, continue to stir
Mix, rotating speed is 200r/min, after anhydrous citric acid and malic acid are completely dissolved, cool 120 DEG C, continue to stir, rotating speed is
200r/min, temperature reaches 120 DEG C, adds 8g glutaric acids until it cools 110 DEG C after being completely dissolved, continuation is stirred, and rotating speed is
200r/min, temperature is reached after 110 DEG C, adds 1g triethanolamines and 5g polyoxyethylene -8- octyl phenyl ethers, is continued to stir, is turned
Speed is 200r/min, is stirred 15 minutes, and sealing scaling powder product is carried out after the completion of preparation.
Embodiment 2
Take 62g glycerine to be added to 8g cetomacrogol 1000s in glass reaction kettle, be heated to after 150 DEG C, startup is stirred
Mix, rotating speed is 200r/min, after cetomacrogol 1000 is completely dissolved, add 14g anhydrous citric acids and 2g malic acid, continue to stir
Mix, rotating speed is 200r/min, after anhydrous citric acid and malic acid are completely dissolved, cool 120 DEG C, continue to stir, rotating speed is
200r/min, temperature reaches 120 DEG C, adds 10g glutaric acids until it cools 110 DEG C after being completely dissolved, continuation is stirred, and rotating speed is
200r/min, temperature is reached after 110 DEG C, adds 2g triethanolamines and 2g polyoxyethylene -8- octyl phenyl ethers, is continued to stir, is turned
Speed is 200r/min, is stirred 15 minutes, and sealing scaling powder product is carried out after the completion of preparation.
Embodiment 3
Take 65g glycerine to be added to 12g cetomacrogol 1000s in glass reaction kettle, be heated to after 150 DEG C, startup is stirred
Mix, rotating speed is 200r/min, after cetomacrogol 1000 is completely dissolved, add 10g anhydrous citric acids and 3g malic acid, continue to stir
Mix, rotating speed is 200r/min, after anhydrous citric acid and malic acid are completely dissolved, cool 120 DEG C, continue to stir, rotating speed is
200r/min, temperature reaches 120 DEG C, adds 6g glutaric acids until it cools 110 DEG C after being completely dissolved, continuation is stirred, and rotating speed is
200r/min, temperature is reached after 110 DEG C, adds 3g triethanolamines and 1g polyoxyethylene -8- octyl phenyl ethers, is continued to stir, is turned
Speed is 200r/min, is stirred 15 minutes, and sealing scaling powder product is carried out after the completion of preparation.
Claims (2)
1. a kind of plain tin cream scaling powder of water-soluble lead-free and halogen-free, it is characterised in that it by following weight percentage raw material group
Into：
Anhydrous citric acid 10-15%, glutaric acid 6-10%, malic acid 1-3%, cetomacrogol 1000 8-12%, glycerine 60-
65%th, triethanolamine 1-3%, polyoxyethylene -8- octyl phenyl ethers 2-5%.
2. the preparation method of the plain tin cream scaling powder of a kind of water-soluble lead-free and halogen-free according to claim 1, it is characterised in that
It is carried out in the steps below：
（a）60-65% glycerine is added in glass reaction kettle with 8-12% cetomacrogol 1000s, is heated to after 150 DEG C, is started
Stirring, rotating speed is 200r/min；
（b）After cetomacrogol 1000 is completely dissolved, 10-15% anhydrous citric acids and 1-3% malic acid are added, continues to stir, turns
Speed is 200r/min；
（c）After anhydrous citric acid and malic acid are completely dissolved, cool 120 DEG C, continue to stir, rotating speed is 200r/min；
（d）Temperature reaches 120 DEG C, adds 6-10% glutaric acids until it cools 110 DEG C after being completely dissolved, continuation is stirred, and rotating speed is
200r/min；
（e）Temperature is reached after 110 DEG C, adds 1-3% triethanolamines and 1-5% polyoxyethylene -8- octyl phenyl ethers, continues to stir,
Rotating speed is 200r/min, is stirred 15-20 minutes, and sealing scaling powder product is carried out after the completion of preparation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510773496.0A CN105290650B (en) | 2015-11-13 | 2015-11-13 | The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510773496.0A CN105290650B (en) | 2015-11-13 | 2015-11-13 | The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method |
Publications (2)
| Publication Number | Publication Date |
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| CN105290650A CN105290650A (en) | 2016-02-03 |
| CN105290650B true CN105290650B (en) | 2017-09-05 |
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| CN201510773496.0A Active CN105290650B (en) | 2015-11-13 | 2015-11-13 | The plain tin cream scaling powder of water-soluble lead-free and halogen-free and preparation method |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112643249B (en) * | 2020-12-29 | 2022-07-22 | 深圳市福英达工业技术有限公司 | Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3423930B2 (en) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | Bump forming method, electronic component, and solder paste |
| CN101327552A (en) * | 2008-07-31 | 2008-12-24 | 东莞永安科技有限公司 | Low solid content halogenide-free water-based type cleaning-free scaling powder |
| CN102166689B (en) * | 2011-03-30 | 2013-05-22 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102357749A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Water-based halogen-free soldering flux used for lead-free soldering tin |
| CN102825398B (en) * | 2012-08-08 | 2014-11-19 | 北京工业大学 | Soldering flux matched with lead-free solder |
| CN104874940B (en) * | 2015-06-18 | 2017-07-07 | 重庆理工大学 | A kind of low silver leadless solder no-clean scaling powder and preparation method thereof |
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