CN106929852A - A kind of pcb board surface automatic film coating technique - Google Patents
A kind of pcb board surface automatic film coating technique Download PDFInfo
- Publication number
- CN106929852A CN106929852A CN201511028737.5A CN201511028737A CN106929852A CN 106929852 A CN106929852 A CN 106929852A CN 201511028737 A CN201511028737 A CN 201511028737A CN 106929852 A CN106929852 A CN 106929852A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- station
- delivery roller
- oxidant
- transported
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F17/00—Multi-step processes for surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by subclass C21D or C22F or class C25
Abstract
The invention discloses a kind of pcb board surface automatic film coating technique, by entering the pcb board that plate → oil removing → the first washing → microetch → the second washing → anti-oxidant → road technique of the 3rd washing → cold wind drying → hot blast drying → ejecting plate 11 is processed, ensure that erosion is stung in big copper face position by 2 sections of microetches uniform, no color differnece, and anti-oxidant preceding 3 sections of washings strengthen cleaning performance, acid liquid medicine is avoided excessively to bring anti-oxidant groove into, OSP face thickness is uniform, simultaneously, high degree of automation, operating personnel only need to put plate manually and receive plate, reduce labour intensity.
Description
Technical field
The present invention relates to a kind of pcb board coating process, more particularly to a kind of pcb board surface automatic film coating technique.
Background technology
OSP is the abbreviation of Organic Solderability Preservatives, in be translated into organic guarantor weldering film, also known as
Copper-protection agent.Briefly OSP be exactly on clean naked copper surface, with the method for chemistry grow one layer it is organic
Epithelium, this tunic has anti-oxidation a, heat shock resistance, moisture-proof, is used to protect copper surface in normal environment
Do not continue to get rusty (oxidation or vulcanization etc.)；But in follow-up welding high temperature, this kind of diaphragm is again necessary
It is easy to be removed rapidly by scaling powder, can so enables the clean copper surface exposed in very short time
Firm solder joint is combined into immediately with melting scolding tin.When existing process carries out OSP treatment on pcb board face,
Common washing is not thorough before not causing thoroughly big copper face position face to produce aberration, and anti-oxidant groove due to microetch,
So that acid liquid medicine easily brings anti-oxidant groove into microetch groove, cause thickness not enough.In view of disadvantages described above, has in fact
A kind of indirect heating type surface modification device of necessity design.
The content of the invention
The technical problems to be solved by the invention are：A kind of pcb board surface automatic film coating technique is provided to solve
Aberration and thickness not enough problem are certainly produced during pcb board plated film.
In order to solve the above technical problems, the technical scheme is that：A kind of pcb board surface automatic film coating technique,
Comprise the following steps：
1) plate is entered：Pcb board is positioned over into automatic anti-oxidant machine production line manually to enter on the delivery roller of plate station；
2) oil removing：Pcb board uniformly through oil removing station, is arranged at the shower nozzle of oil removing station by oil removing with delivery roller
Agent sprays to pcb board surface；
3) the first washing：By step 2) obtained in pcb board the first wash station be transported to by delivery roller use
Water knife is cleaned, and the first described wash station quantity is 3, and described water knife pressure is：2-2.2kg/
cm2；
4) microetch：By step 3) obtained in pcb board by delivery roller be transported to microetch station immerse microetch groove in
Anti-oxidant treatment is carried out, micro-corrosion liquid is sprayed to by pcb board surface by water knife, described microetch station quantity is
2,2 sections of microetches ensure that erosion is stung uniformly in the big copper face position of pcb board, and OSP faces are uniform, described microetch
Liquid composition is：Concentration is 98% sulfuric acid 4%-6%, and sodium peroxydisulfate is 70-90g/L, and remaining composition is pure water；
5) the second washing：By step 4) obtained in pcb board the second wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and 3 sections of washings strengthen cleaning performance, keep away
Exempt from acid liquid medicine and excessively bring anti-oxidant groove into, described water knife pressure is：2-2.2kg/cm2；
6) it is anti-oxidant：By step 5) obtained in pcb board anti-oxidant station be transported to by delivery roller immerse antioxygen
Changing in groove carries out anti-oxidant treatment, and oxidation resistance liquid is sprayed into pcb board surface by water knife；
7) the 3rd washing：By step 6) obtained in pcb board the 3rd wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and described water knife pressure is：2-2.2kg/
cm2；
8) cold wind drying：By step 7) obtained in pcb board by delivery roller be transported to cold wind dry up station use
Air blower carries out room temperature drying, water stain with the bulk for removing PCB surface attachment；
9) hot blast drying：By step 8) obtained in pcb board hot blast drying station be transported to by delivery roller use
Heat gun carries out high temperature drying, heat
Air temperature is 95-100 DEG C.
10) ejecting plate, by step 9) obtained in pcb board automatic anti-oxidant machine production line is transported to by delivery roller
Ejecting plate station, operating personnel are unloaded manually.
Further improvement of the invention is as follows：
Further, described step 4) microetch temperature be 45-51 DEG C.
Beneficial effects of the present invention：High degree of automation, operating personnel only need to put plate manually and receive plate, reduce
Labour intensity, automatic 2 sections of microetches ensure that erosion is stung uniformly in big copper face position, no color differnece, and anti-oxidant first 3 sections
Washing strengthens cleaning performance, it is to avoid acid liquid medicine excessively brings anti-oxidant groove into, and OSP face thickness is uniform.
Brief description of the drawings
Fig. 1 shows flow chart of the present invention
Specific embodiment
Embodiment 1
A kind of pcb board surface automatic film coating technique as shown in Figure 1, comprises the following steps：
1) plate is entered：Pcb board is positioned over into automatic anti-oxidant machine production line manually to enter on the delivery roller of plate station；
2) oil removing：Pcb board uniformly through oil removing station, is arranged at the shower nozzle of oil removing station by oil removing with delivery roller
Agent sprays to pcb board surface；
3) the first washing：By step 2) obtained in pcb board the first wash station be transported to by delivery roller use
Water knife is cleaned, and the first described wash station quantity is 3, and described water knife pressure is：2kg/cm2；
4) microetch：By step 3) obtained in pcb board by delivery roller be transported to microetch station immerse microetch groove in
Anti-oxidant treatment is carried out, micro-corrosion liquid is sprayed to by pcb board surface by water knife, described microetch station quantity is
2,2 sections of microetches ensure that erosion is stung uniformly in the big copper face position of pcb board, and OSP faces are uniform, described microetch
Liquid composition is：Concentration is 98% sulfuric acid 4%, and sodium peroxydisulfate is 70g/L, and remaining composition is pure water；
5) the second washing：By step 4) obtained in pcb board the second wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and 3 sections of washings strengthen cleaning performance, keep away
Exempt from acid liquid medicine and excessively bring anti-oxidant groove into, described water knife pressure is：2kg/cm2；
6) it is anti-oxidant：By step 5) obtained in pcb board anti-oxidant station be transported to by delivery roller immerse antioxygen
Changing in groove carries out anti-oxidant treatment, and oxidation resistance liquid is sprayed into pcb board surface by water knife；
7) the 3rd washing：By step 6) obtained in pcb board the 3rd wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and described water knife pressure is：2kg/cm2；
8) cold wind drying：By step 7) obtained in pcb board by delivery roller be transported to cold wind dry up station use
Air blower carries out room temperature drying, water stain with the bulk for removing PCB surface attachment；
9) hot blast drying：By step 8) obtained in pcb board hot blast drying station be transported to by delivery roller use
Heat gun carries out high temperature drying, heat
Air temperature is 95 DEG C.
10) ejecting plate, by step 9) obtained in pcb board automatic anti-oxidant machine production line is transported to by delivery roller
Ejecting plate station, operating personnel are unloaded manually.
Step 4 of the present invention) microetch temperature be 45 DEG C.
Embodiment 2
A kind of pcb board surface automatic film coating technique, comprises the following steps：
1) plate is entered：Pcb board is positioned over into automatic anti-oxidant machine production line manually to enter on the delivery roller of plate station；
2) oil removing：Pcb board uniformly through oil removing station, is arranged at the shower nozzle of oil removing station by oil removing with delivery roller
Agent sprays to pcb board surface；
3) the first washing：By step 2) obtained in pcb board the first wash station be transported to by delivery roller use
Water knife is cleaned, and the first described wash station quantity is 3, and described water knife pressure is：2.2kg/cm2；
4) microetch：By step 3) obtained in pcb board by delivery roller be transported to microetch station immerse microetch groove in
Anti-oxidant treatment is carried out, micro-corrosion liquid is sprayed to by pcb board surface by water knife, described microetch station quantity is
2,2 sections of microetches ensure that erosion is stung uniformly in the big copper face position of pcb board, and OSP faces are uniform, described microetch
Liquid composition is：Concentration is 98% sulfuric acid 6%, and sodium peroxydisulfate is 90g/L, and remaining composition is pure water；
5) the second washing：By step 4) obtained in pcb board the second wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and 3 sections of washings strengthen cleaning performance, keep away
Exempt from acid liquid medicine and excessively bring anti-oxidant groove into, described water knife pressure is：2.2kg/cm2；
6) it is anti-oxidant：By step 5) obtained in pcb board anti-oxidant station be transported to by delivery roller immerse antioxygen
Changing in groove carries out anti-oxidant treatment, and oxidation resistance liquid is sprayed into pcb board surface by water knife；
7) the 3rd washing：By step 6) obtained in pcb board the 3rd wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and described water knife pressure is：2.2kg/cm2；
8) cold wind drying：By step 7) obtained in pcb board by delivery roller be transported to cold wind dry up station use
Air blower carries out room temperature drying, water stain with the bulk for removing PCB surface attachment；
9) hot blast drying：By step 8) obtained in pcb board hot blast drying station be transported to by delivery roller use
Heat gun carries out high temperature drying, and hot blast temperature is 100 DEG C.
10) ejecting plate, by step 9) obtained in pcb board automatic anti-oxidant machine production line is transported to by delivery roller
Ejecting plate station, operating personnel are unloaded manually.
Step 4 of the present invention) microetch temperature be 51 DEG C.
Embodiment 3
A kind of pcb board surface automatic film coating technique, comprises the following steps：
1) plate is entered：Pcb board is positioned over into automatic anti-oxidant machine production line manually to enter on the delivery roller of plate station；
2) oil removing：Pcb board uniformly through oil removing station, is arranged at the shower nozzle of oil removing station by oil removing with delivery roller
Agent sprays to pcb board surface；
3) the first washing：By step 2) obtained in pcb board the first wash station be transported to by delivery roller use
Water knife is cleaned, and the first described wash station quantity is 3, and described water knife pressure is：2.1kg/
cm2；
4) microetch：By step 3) obtained in pcb board by delivery roller be transported to microetch station immerse microetch groove in
Anti-oxidant treatment is carried out, micro-corrosion liquid is sprayed to by pcb board surface by water knife, described microetch station quantity is
2,2 sections of microetches ensure that erosion is stung uniformly in the big copper face position of pcb board, and OSP faces are uniform, described microetch
Liquid composition is：Concentration is 98% sulfuric acid 5%, and sodium peroxydisulfate is 80g/L, and remaining composition is pure water；
5) the second washing：By step 4) obtained in pcb board the second wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and 3 sections of washings strengthen cleaning performance, keep away
Exempt from acid liquid medicine and excessively bring anti-oxidant groove into, described water knife pressure is：2.1kg/cm2；
6) it is anti-oxidant：By step 5) obtained in pcb board anti-oxidant station be transported to by delivery roller immerse antioxygen
Changing in groove carries out anti-oxidant treatment, and oxidation resistance liquid is sprayed into pcb board surface by water knife；
7) the 3rd washing：By step 6) obtained in pcb board the 3rd wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and described water knife pressure is：2.1kg/
cm2；
8) cold wind drying：By step 7) obtained in pcb board by delivery roller be transported to cold wind dry up station use
Air blower carries out room temperature drying, water stain with the bulk for removing PCB surface attachment；
9) hot blast drying：By step 8) obtained in pcb board hot blast drying station be transported to by delivery roller use
Heat gun carries out high temperature drying, heat
Air temperature is 98 DEG C.
10) ejecting plate, by step 9) obtained in pcb board automatic anti-oxidant machine production line is transported to by delivery roller
Ejecting plate station, operating personnel are unloaded manually.
Step 4 of the present invention) microetch temperature be 48 DEG C.
The present invention is not limited to above-mentioned specific embodiment, and one of ordinary skill in the art is from above-mentioned design
Set out, without performing creative labour, a variety of conversion made, all fall within protection scope of the present invention it
It is interior.
Claims (2)
1. a kind of pcb board surface automatic film coating technique, it is characterised in that comprise the following steps：
1) plate is entered：Pcb board is positioned over into automatic anti-oxidant machine production line manually to enter on the delivery roller of plate station；
2) oil removing：Pcb board uniformly through oil removing station, is arranged at the shower nozzle of oil removing station by oil removing with delivery roller
Agent sprays to pcb board surface；
3) the first washing：By step 2) obtained in pcb board the first wash station be transported to by delivery roller use
Water knife is cleaned, and the first described wash station quantity is 3, and described water knife pressure is：2-2.2kg/
cm2；
4) microetch：By step 3) obtained in pcb board by delivery roller be transported to microetch station immerse microetch groove in
Anti-oxidant treatment is carried out, micro-corrosion liquid is sprayed to by pcb board surface by water knife, described microetch station quantity is 2
Individual, 2 sections of microetches ensure that the big copper face positions of pcb board sting that erosion is uniform, and OSP faces are uniform, described micro-corrosion liquid into
It is divided into：Concentration is 98% sulfuric acid 4%-6%, and sodium peroxydisulfate is 70-90g/L, and remaining composition is pure water；
5) the second washing：By step 4) obtained in pcb board the second wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and 3 sections of washings strengthen cleaning performance, keep away
Exempt from acid liquid medicine and excessively bring anti-oxidant groove into, described water knife pressure is：2-2.2kg/cm2；
6) it is anti-oxidant：By step 5) obtained in pcb board anti-oxidant station be transported to by delivery roller immerse antioxygen
Changing in groove carries out anti-oxidant treatment, and oxidation resistance liquid is sprayed into pcb board surface by water knife；
7) the 3rd washing：By step 6) obtained in pcb board the 3rd wash station be transported to by delivery roller use
Water knife is cleaned, and the second described wash station quantity is 3, and described water knife pressure is：2-2.2kg/
cm2；
8) cold wind drying：By step 7) obtained in pcb board by delivery roller be transported to cold wind dry up station use
Air blower carries out room temperature drying, water stain with the bulk for removing PCB surface attachment；
9) hot blast drying：By step 8) obtained in pcb board hot blast drying station be transported to by delivery roller use
Heat gun carries out high temperature drying, and hot blast temperature is 95-100 DEG C.
10) ejecting plate, by step 9) obtained in pcb board automatic anti-oxidant machine production line be transported to by delivery roller go out
Plate station, operating personnel are unloaded manually.
2. pcb board surface automatic film coating technique as claimed in claim 1, it is characterised in that described step 4) in
Microetch temperature is 45-51 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511028737.5A CN106929852A (en) | 2015-12-31 | 2015-12-31 | A kind of pcb board surface automatic film coating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511028737.5A CN106929852A (en) | 2015-12-31 | 2015-12-31 | A kind of pcb board surface automatic film coating technique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106929852A true CN106929852A (en) | 2017-07-07 |
Family
ID=59442261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511028737.5A Pending CN106929852A (en) | 2015-12-31 | 2015-12-31 | A kind of pcb board surface automatic film coating technique |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106929852A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109631365A (en) * | 2018-12-17 | 2019-04-16 | 沧州天瑞星光热技术有限公司 | A kind of cleaning method of solar vacuum heat-collecting tube glass outer tube |
| CN112888186A (en) * | 2021-02-24 | 2021-06-01 | 铜陵安博电路板有限公司 | Production process of PCB for quick-charging pile of new energy automobile |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109631365A (en) * | 2018-12-17 | 2019-04-16 | 沧州天瑞星光热技术有限公司 | A kind of cleaning method of solar vacuum heat-collecting tube glass outer tube |
| CN109631365B (en) * | 2018-12-17 | 2020-04-17 | 沧州天瑞星光热技术有限公司 | Method for cleaning glass outer tube of solar vacuum heat collecting tube |
| CN112888186A (en) * | 2021-02-24 | 2021-06-01 | 铜陵安博电路板有限公司 | Production process of PCB for quick-charging pile of new energy automobile |
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