CN109920724A - A kind of method of quick removal substrate organic solderability preservatives and oxide - Google Patents
A kind of method of quick removal substrate organic solderability preservatives and oxide Download PDFInfo
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- CN109920724A CN109920724A CN201910090392.8A CN201910090392A CN109920724A CN 109920724 A CN109920724 A CN 109920724A CN 201910090392 A CN201910090392 A CN 201910090392A CN 109920724 A CN109920724 A CN 109920724A
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- cleaned
- oxide
- removal substrate
- organic solderability
- sprinkling
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Abstract
Present invention discloses the method for a kind of quickly removal substrate organic solderability preservatives and oxide is provided, method includes the following steps: S1: pan feeding；Material to be cleaned is placed on transmission net band and initially enters cleaning process；S2: sprinkling is impregnated；Cleaning material is treated using alkalescent medical fluid and carries out sprinkling infiltration, and the metal surface organic weldable protective agent and oxide and chemical liquid of material to be cleaned carry out abundant acid-base neutralization reaction；S3: washing；The material to be cleaned obtained using deionized water sprinkling cleaning through the S2 step, cleans liquor residue；S4: hot blast drying；The material to be cleaned that the S3 step obtains is dried up using circulating air, the material to be cleaned after obtaining hot blast drying enters next welding step.This method mainly solves the problems, such as that the cleannes in prior art are bad and capacity efficiency is low.
Description
Technical field
The present invention relates to the methods of a kind of quickly removal substrate organic solderability preservatives and oxide, belong to semiconductor package
Fill technical field.
Background technique
In traditional semiconductor packaging, the technique for removing substrate organic solderability preservatives and oxide is scaling powder
The deficiency of prerinse, this technique is: 1, although scaling powder takes part in overall process, but the effect played in different and section is not
Equally, when undesirable by weldering substrate metal surface solderability, scaling powder cleaning action is bad, rosin joint, bridge joint etc. can generally occurs
Welding defect；2, scaling powder pre-cleaning processes process is complicated, and board production capacity is low.
Summary of the invention
The object of the invention is to propose a kind of quickly removal substrate to solve the above-mentioned problems in the prior art
The method of organic solderability preservatives and oxide.
A kind of quickly removal substrate Organic Solderability protection that the purpose of the invention will be achieved through the following technical solutions:
The method of agent and oxide, method includes the following steps:
S1: pan feeding；
Material to be cleaned is placed on transmission net band and initially enters cleaning process；
S2: sprinkling is impregnated；
Cleaning material, which is treated, using alkalescent medical fluid carries out sprinkling infiltration, the metal surface organic weldable protective agent of material to be cleaned
And oxide and chemical liquid carry out abundant acid-base neutralization reaction；
S3: washing；
The material to be cleaned obtained using deionized water sprinkling cleaning through the S2 step, cleans liquor residue；
S4: hot blast drying；
The material to be cleaned that the S3 step obtains is dried up using circulating air, the material to be cleaned after obtaining hot blast drying enters
Next welding step.
Preferably, in the S2 step, the alkalescent medical fluid includes that deionized water, amine solvent and fatty alcohols are molten
Agent, the component concentration ranges of deionized water are 30-50%, and the component concentration ranges of amine solvent are 20-40%, fatty alcohols solvent
Component concentration ranges be 30-40%.
Preferably, in the S2 step, the amine solvent is mainly ethanol amine, can be with containing alkalescent functional group
Acid-base reaction occurs for solderability organic film, it is made to decompose and be dissolved in medical fluid.
Preferably, the fatty alcohols solvent is fat alcohol polyethylene ether, and fat alcohol polyethylene ether can be with metal oxide
Complex reaction occurs, after forming metal complex, is dissolved in medical fluid.
Preferably, in the S2 step, cleaning material is treated using alkalescent medical fluid and carries out sprinkling infiltration, sprays distance
About 30-50cm, infiltrating time is greater than 2 minutes under room temperature.
Preferably, in the S1 step, the material to be cleaned is baseplate material or encapsulating material real estate.
Preferably, the power mechanism of promising transmission net band offer power is arranged in the lower section of the transmission net band.
Preferably, the power mechanism is driving source or motor.
The advantages of technical solution of the present invention is mainly reflected in: the cleannes that this method mainly solves in prior art are bad
And the problem that capacity efficiency is low.Medical fluid can be dilute using deionized water according to pdm substrate cleanliness standard and organic film thickness etc.
It releases, such as about 0.4 μm of solderability organic film thickness or so, medical fluid can be diluted to 70% original liquid concentration.The dilution of alkalescent medical fluid stoste
Thermal discharge is small, no security risk, and removal ability validity period is still up to 3 months or more after dilution.
Detailed description of the invention
Fig. 1 is the process signal for the method that one kind of the invention quickly removes substrate organic solderability preservatives and oxide
Figure.
Specific embodiment
The purpose of the present invention, advantage and feature, by by the non-limitative illustration of preferred embodiment below carry out diagram and
It explains.These embodiments are only the prominent examples using technical solution of the present invention, it is all take equivalent replacement or equivalent transformation and
The technical solution of formation, all falls within the scope of protection of present invention.
Present invention discloses the methods of a kind of quickly removal substrate organic solderability preservatives and oxide, as shown in Figure 1,
Method includes the following steps:
S1: pan feeding；
Material to be cleaned is placed on transmission net band and initially enters cleaning process；
S2: sprinkling is impregnated；
Cleaning material, which is treated, using alkalescent medical fluid carries out sprinkling infiltration, the metal surface organic weldable protective agent of material to be cleaned
And oxide and chemical liquid carry out abundant acid-base neutralization reaction；
S3: washing；
The material to be cleaned obtained using deionized water sprinkling cleaning through the S2 step, cleans liquor residue；
S4: hot blast drying；
The material to be cleaned that the S3 step obtains is dried up using circulating air, the material to be cleaned after obtaining hot blast drying enters
Next welding step.
In the S1 step, the material to be cleaned is baseplate material or encapsulating material real estate.The transmission net band
Lower section promising transmission net band is set the power mechanism of power is provided, the power mechanism is driving source or motor.
In the S2 step, the stoste main component of the alkalescent medical fluid includes: deionized water, amine solvent, rouge
Fat alcohols solvent；Each component concentration or concentration range (percentage composition) are as follows: 30-50%；
20-40%；30-40%.The component concentration ranges of deionized water are 30-50%, and the component concentration ranges of amine solvent are 20-
40%, the component concentration ranges of fatty alcohols solvent are 30-40%.
Wherein amine solvent is mainly ethanol amine, containing alkalescent functional group (- COOH), can be occurred with solderability organic film
Acid-base reaction makes it decompose and be dissolved in medical fluid.
Fatty alcohols solvent is fat alcohol polyethylene ether, complex reaction can occur with metal oxide, form metal network
After closing object, it is dissolved in medical fluid.
Medical fluid can be diluted according to pdm substrate cleanliness standard and organic film thickness etc. using deionized water, as solderability has
About 0.4 μm of machine film thickness or so, medical fluid can be diluted to 70% original liquid concentration.Alkalescent medical fluid stoste dilution thermal discharge is small, no peace
Full blast danger, removal ability validity period is still up to 3 months or more after dilution.
In the S2 step, cleaning material is treated using alkalescent medical fluid and carries out sprinkling infiltration, sprinkling distance about 30-
50cm reacts to come into full contact with baseplate material surface with medical fluid, it is proposed that infiltrating time is no less than 2 minutes under room temperature.
Chemical liquid method technique is substituted into scaling powder prerinse, is applied to semiconductor packages and plants the pre-treatment of ball station, remove base
Material surface organic solderability preservatives and oxide can will plant the control of ball station fraction defective in 1000ppm hereinafter, and production capacity raising 2
Times.
Substrate face of weld can come into full contact with organic solvent to react, and cleaning effect is significant；Alkalescent liquid medicine and packaging body
Other structures do not chemically react, while not having corrosivity to metal；Through washing noresidue after liquid medicine reaction；Producing line investment
Few, production capacity improves.
Still there are many embodiment, all technical sides formed using equivalents or equivalent transformation by the present invention
Case is within the scope of the present invention.
Claims (8)
1. a kind of method of quickly removal substrate organic solderability preservatives and oxide, it is characterised in that: this method include with
Lower step:
S1: pan feeding；
Material to be cleaned is placed on transmission net band and initially enters cleaning process；
S2: sprinkling is impregnated；
Cleaning material, which is treated, using alkalescent medical fluid carries out sprinkling infiltration, the metal surface organic weldable protective agent of material to be cleaned
And oxide and chemical liquid carry out abundant acid-base neutralization reaction；
S3: washing；
The material to be cleaned obtained using deionized water sprinkling cleaning through the S2 step, cleans liquor residue；
S4: hot blast drying；
The material to be cleaned that the S3 step obtains is dried up using circulating air, the material to be cleaned after obtaining hot blast drying enters
Next welding step.
2. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 1, special
Sign is: in the S2 step, the alkalescent medical fluid includes deionized water, amine solvent and fatty alcohols solvent, go from
The component concentration ranges of sub- water are 30-50%, and the component concentration ranges of amine solvent are 20-40%, the component of fatty alcohols solvent
Concentration range is 30-40%.
3. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 2, special
Sign is: in the S2 step, the amine solvent is mainly ethanol amine, containing alkalescent functional group, can be had with solderability
Acid-base reaction occurs for machine film, it is made to decompose and be dissolved in medical fluid.
4. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 2, special
Sign is: the fatty alcohols solvent is fat alcohol polyethylene ether, and fat alcohol polyethylene ether can be complexed with metal oxide
Reaction is dissolved in medical fluid after forming metal complex.
5. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 1, special
Sign is: in the S2 step, treating cleaning material using alkalescent medical fluid and carries out sprinkling infiltration, sprinkling distance about 30-
50cm, infiltrating time is greater than 2 minutes under room temperature.
6. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 1, special
Sign is: in the S1 step, the material to be cleaned is baseplate material or encapsulating material real estate.
7. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 1, special
Sign is: the lower section of the transmission net band is arranged promising transmission net band and provides the power mechanism of power.
8. the method for a kind of quickly removal substrate organic solderability preservatives and oxide according to claim 3, special
Sign is: the power mechanism is driving source or motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910090392.8A CN109920724A (en) | 2019-01-30 | 2019-01-30 | A kind of method of quick removal substrate organic solderability preservatives and oxide |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910090392.8A CN109920724A (en) | 2019-01-30 | 2019-01-30 | A kind of method of quick removal substrate organic solderability preservatives and oxide |
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| CN109920724A true CN109920724A (en) | 2019-06-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910090392.8A Pending CN109920724A (en) | 2019-01-30 | 2019-01-30 | A kind of method of quick removal substrate organic solderability preservatives and oxide |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822867A (en) * | 2020-12-31 | 2021-05-18 | 杨亚军 | False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method |
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| CN1503758A (en) * | 2002-02-04 | 2004-06-09 | 住友精密工业株式会社 | Substrate processing apparatus of transfer type |
| CN102989709A (en) * | 2012-12-28 | 2013-03-27 | 深圳市凯尔迪光电科技有限公司 | Printed circuit board assembly (PCBA) on-line cleaning machine |
| CN103555448A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Circuit board welding flux cleaner and preparation method thereof |
| CN205701589U (en) * | 2016-04-22 | 2016-11-23 | 开平帛汉电子有限公司 | Product automatic cleaning line |
| CN108085168A (en) * | 2017-12-28 | 2018-05-29 | 广东山之风环保科技有限公司 | A kind of flexible circuit board scavenger specially and preparation method and application |
-
2019
- 2019-01-30 CN CN201910090392.8A patent/CN109920724A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1503758A (en) * | 2002-02-04 | 2004-06-09 | 住友精密工业株式会社 | Substrate processing apparatus of transfer type |
| CN102989709A (en) * | 2012-12-28 | 2013-03-27 | 深圳市凯尔迪光电科技有限公司 | Printed circuit board assembly (PCBA) on-line cleaning machine |
| CN103555448A (en) * | 2013-10-30 | 2014-02-05 | 合肥市华美光电科技有限公司 | Circuit board welding flux cleaner and preparation method thereof |
| CN205701589U (en) * | 2016-04-22 | 2016-11-23 | 开平帛汉电子有限公司 | Product automatic cleaning line |
| CN108085168A (en) * | 2017-12-28 | 2018-05-29 | 广东山之风环保科技有限公司 | A kind of flexible circuit board scavenger specially and preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112822867A (en) * | 2020-12-31 | 2021-05-18 | 杨亚军 | False-soldering and missing-soldering prevention equipment for PCB (printed circuit board) of integrated circuit carrier and use method |
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Application publication date: 20190621 |
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