CN108085168A - A kind of flexible circuit board scavenger specially and preparation method and application - Google Patents
A kind of flexible circuit board scavenger specially and preparation method and application Download PDFInfo
- Publication number
- CN108085168A CN108085168A CN201711452212.3A CN201711452212A CN108085168A CN 108085168 A CN108085168 A CN 108085168A CN 201711452212 A CN201711452212 A CN 201711452212A CN 108085168 A CN108085168 A CN 108085168A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- cleaning agent
- scavenger specially
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002516 radical scavenger Substances 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000012459 cleaning agent Substances 0.000 claims abstract description 36
- -1 acyl diethanol amine Chemical compound 0.000 claims abstract description 22
- 235000019197 fats Nutrition 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims abstract description 13
- 235000019864 coconut oil Nutrition 0.000 claims abstract description 13
- 239000003240 coconut oil Substances 0.000 claims abstract description 13
- 229940043237 diethanolamine Drugs 0.000 claims abstract description 13
- 150000002191 fatty alcohols Chemical class 0.000 claims abstract description 13
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims abstract description 10
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims abstract description 10
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000012964 benzotriazole Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 4
- 235000019441 ethanol Nutrition 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Natural products CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 11
- 238000003756 stirring Methods 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 8
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 238000002525 ultrasonication Methods 0.000 claims description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- 238000010790 dilution Methods 0.000 claims description 3
- 239000012895 dilution Substances 0.000 claims description 3
- 230000035622 drinking Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- IDQBJILTOGBZCR-UHFFFAOYSA-N 1-butoxypropan-1-ol Chemical compound CCCCOC(O)CC IDQBJILTOGBZCR-UHFFFAOYSA-N 0.000 claims description 2
- 125000005909 ethyl alcohol group Chemical group 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- 229910021653 sulphate ion Inorganic materials 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 15
- 229920000056 polyoxyethylene ether Polymers 0.000 abstract description 14
- 229940051841 polyoxyethylene ether Drugs 0.000 abstract description 14
- FQENQNTWSFEDLI-UHFFFAOYSA-J sodium diphosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])([O-])=O FQENQNTWSFEDLI-UHFFFAOYSA-J 0.000 abstract description 10
- 229940048086 sodium pyrophosphate Drugs 0.000 abstract description 10
- 235000019818 tetrasodium diphosphate Nutrition 0.000 abstract description 10
- 239000001577 tetrasodium phosphonato phosphate Substances 0.000 abstract description 10
- 239000008367 deionised water Substances 0.000 abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 abstract description 8
- 239000003344 environmental pollutant Substances 0.000 abstract description 6
- 230000004907 flux Effects 0.000 abstract description 6
- 231100000719 pollutant Toxicity 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 238000002845 discoloration Methods 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 239000000470 constituent Substances 0.000 abstract 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 230000036541 health Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- AJDIZQLSFPQPEY-UHFFFAOYSA-N 1,1,2-Trichlorotrifluoroethane Chemical compound FC(F)(Cl)C(F)(Cl)Cl AJDIZQLSFPQPEY-UHFFFAOYSA-N 0.000 description 2
- HPEUJPJOZXNMSJ-UHFFFAOYSA-N Methyl stearate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OC HPEUJPJOZXNMSJ-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 238000005202 decontamination Methods 0.000 description 2
- 230000003588 decontaminative effect Effects 0.000 description 2
- 239000004210 ether based solvent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 241000737241 Cocos Species 0.000 description 1
- 235000013162 Cocos nucifera Nutrition 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- MOFINMJRLYEONQ-UHFFFAOYSA-N [N].C=1C=CNC=1 Chemical class [N].C=1C=CNC=1 MOFINMJRLYEONQ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- CAMHHLOGFDZBBG-UHFFFAOYSA-N epoxidized methyl oleate Natural products CCCCCCCCC1OC1CCCCCCCC(=O)OC CAMHHLOGFDZBBG-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000004812 organic fluorine compounds Chemical class 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003346 palm kernel oil Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- PANBYUAFMMOFOV-UHFFFAOYSA-N sodium;sulfuric acid Chemical compound [Na].OS(O)(=O)=O PANBYUAFMMOFOV-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/83—Mixtures of non-ionic with anionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/201—Monohydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2017—Monohydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
- C11D3/3765—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions in liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/29—Sulfates of polyoxyalkylene ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/44—Multi-step processes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/40—Specific cleaning or washing processes
- C11D2111/46—Specific cleaning or washing processes applying energy, e.g. irradiation
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention belongs to pcb cleaning agent technical fields, and in particular to a kind of flexible circuit board scavenger specially and preparation method and application.Including count by weight percentage：35 ﹪ of fatty alcohol polyoxyethylene ether sulfate, 10 15 ﹪ of coconut oil fat acyl diethanol amine, 15 ﹪ of sodium pyrophosphate, 25 ﹪ of triethanolamine, 25 ﹪ of Sodium Polyacrylate, 10 20 ﹪ of alcohol ethers solvent, 23 ﹪ of benzotriazole and deionized water surplus.The cleaning agent not only prepares simple, of low cost, has efficient cleaning ability to flexible circuit board scaling powder and dirt, and does not contain the chemical constituent being harmful to atmospheric environment；It protection circuit plate welding point and metallic copper can not be corroded discoloration effectively simultaneously；The cleaning agent is suitable for the cleaning of printed wiring board, and the flexible PCB for especially having residual flux pollutant cleans.
Description
Technical field
The invention belongs to pcb cleaning agent technical fields, and in particular to a kind of flexible circuit board scavenger specially and its system
Preparation Method and application.
Background technology
As electronic product rapidly develops to miniaturization, high density and high reliability direction, Electronic products manufacturing mistake
More and more pollutants are introduced in journey, if these pollutants cannot be removed timely and effectively, it is possible to line can be caused
The problems such as road plate open circuit, short circuit, corrosion, influences the normal operation of wiring board.
At present, it is containing freon (abbreviation CFC-113) cleaning agent that conventional clean circuit board technique is the most widely used.This
Class cleaning agent has good chemically and thermally stability, appropriate solubility property, selectivity is good, viscosity and surface tension are low, leaching
The advantages that lubricant nature is high, rapid-drying properties are good, but also with do not burn, the advantageous characteristic features such as toxicity and corrosivity are low.Therefore, especially extensively
In cleaning applied to components such as sophisticated electronics and optical instruments.But with fluorinated organic compounds such as CFC-113
Cleaning agent cleaning wiring board is not only of high cost, has extremely strong destructive power to ozone layer, seriously endangers human ecological environment and people
Body health.Also a small number of aqueous cleaning agents are cleaned applied to wiring board, but its cleaning performance is limited, and there are security risks.Meanwhile
Flexible circuit board is compared to All other routes plate precision higher, it is easier to it damages, therefore, the requirement higher to cleaning agent.CN
106635460 A patents disclose a kind of fluxes in electronic industry cleaning agent, and master point includes high-boiling point alcohol ether solvents, N- first
Base -2-Pyrrolidone, nonionic surfactant, ethyl alcohol, water, polyether silicones nanometer antifoaming agent, water-soluble nano titanium dioxide
Silicon and ethanolamine.Wherein the alcohol ether solvents of high mixture ratio and ethanolamine can generate human body certain harm, especially ethanolamine and have
There are stronger toxicity and combustibility.103540460 A patents of CN disclose a kind of PCB circuit board cleaning agent, and main subpackage contains coconut palm
Seed oil alkylolamides phosphate, fatty alcohol polyoxyethylene ether sulfate, Boratex, sodium pyrophosphate, citric acid, ethyl alcohol, auxiliary agent
And water.A certain amount of silane coupling agent has been used in the cleaning agent, a degree of corrosion damage can be caused to wiring board metal,
Influence the service life of wiring board.106479761 A patents of CN disclose a kind of wiring board waterborne cleaning agent, the cleaning agent institute
It is organic to include water-soluble alcohol ether, water-insoluble Second Academy's acid esters, antifoaming agent, non-ionic organic reducing agent and nonionic containing main point
Saponification agent, a variety of alcohol ethers used can bring health certain influence.
The content of the invention
To solve the above-mentioned problems, one of the objects of the present invention is to provide a kind of flexible circuit board scavenger speciallies；It should
Cleaning agent is of low cost, it is simple to prepare, and has good cleaning ability to the dirt of electronic equipment, and without environmentally harmful
Chemical substance, health environment-friendly suitable for the cleaning of flexible circuit board, especially have film of flux residue fine cleaning performance, and
And it protection circuit plate welding point and metallic copper can not be corroded discoloration effectively.
The second object of the present invention is to provide the preparation method of the flexible circuit board scavenger specially.
There is provided the application processes of the flexible circuit board scavenger specially for the third object of the present invention.
The present invention is achieved through the following technical solutions：
A kind of flexible circuit board scavenger specially, including following substance count by weight percentage：
It is preferred that the alcohol ethers solvent is ethyl alcohol, polyethylene glycol, ethylene glycol monomethyl ether, isopropanol, n-butanol, propylene glycol
One or more of butyl ether composition.Wherein fatty alcohol polyoxyethylene ether sulfate, preferred fat alcohol polyoxyethylene ether sulfuric acid
Sodium.
The preparation method of the flexible circuit board scavenger specially, first by the deionized water, Sodium Polyacrylate, benzo three
Nitrogen azoles mixes, and stirs 10-20 minutes at normal temperatures and pressures；Then fatty alcohol polyoxyethylene ether sulfate, coconut oil fat are added in
Acyl diethanol amine, triethanolamine and alcohol ethers solvent continue stirring 10-20 minutes to get the flexible circuit board Special cleaning
Agent.
The application of the flexible circuit board scavenger specially, the flexible circuit board scavenger specially handled by wiping,
Spray process or ultrasonication are cleaned to workpiece to be handled.
Wherein, the ultrasonication is specially：At normal temperatures, first flexible circuitry board cleaning agent is diluted using direct drinking
5-12 times, then the cleaning agent after dilution is poured into ultrasonic cleaning tank, board part to be cleaned is all impregnated, ultrasound is clear
5min is washed, is air-dried after finally being rinsed again with pure water and obtains clean wiring board workpiece.
It is preferred that the temperature of cleaning agent is 50-55 DEG C in the ultrasonic cleaning tank.
The present invention is compounded by methyl stearate polyethenoxy ether sulphonate and coconut oil fat acyl diethanol amine, production
Raw synergistic effect, cleaning ability is stronger, and cooperation oil-dissolving solvent alcohol ethers solvent uses the effective cleaning energy for improving cleaning agent
Power and decontamination efficiency, and it is nontoxic, biological degradability is good.Wherein, triethanolamine, Sodium Polyacrylate and sodium pyrophosphate are used as and help
The agent of lotion matching purge uses, and improves the cleaning ability of cleaning agent and decontamination efficiency, while the choosing of sodium pyrophosphate and sodium citrate
Selecting has metal certain corrosion mitigating effect, and BTA is using can play PCB surface metal good corrosion inhibition for cooperation.This
Invention formula belongs to aqueous cleaning agent, and waste liquid can all degrade after cleaning, not can cause environmental pollution.
In short, cleaning agent of the present invention has cleaning efficiency good characteristic that is high, nontoxic, being easy to degradation, and and line
Road plate electronic circuit component compatibility is good, can effectively remove the pollutants such as scaling powder, have very to wiring board solder joint and metallic copper
Good protective effect.
Specific embodiment
The present invention is described in further detail With reference to embodiment, is managed to help those skilled in the art
The solution present invention.
Case study on implementation 1
A kind of flexible circuit board scavenger specially, including count by weight percentage：Fatty alcohol polyoxyethylene ether sulfuric acid
3 ﹪ of salt, 12 ﹪ of coconut oil fat acyl diethanol amine, 2 ﹪ of sodium pyrophosphate, 3 ﹪ of triethanolamine, 3 ﹪ of Sodium Polyacrylate, ethyl alcohol
10 ﹪, 8 ﹪ of n-butanol, 3 ﹪ of benzotriazole, deionized water surplus.
The preparation method step of the cleaning agent is as follows：
1) each raw material for standby is weighed according to parts by weight；
2) deionized water, sodium pyrophosphate, Sodium Polyacrylate, benzotriazole are mixed and poured into mixer, it is normal in room temperature
Pressure stirring 10 minutes；
3) by fatty alcohol polyoxyethylene ether sulfate, coconut oil fat acyl diethanol amine, triethanolamine, ethyl alcohol, n-butanol
Continue to pour into batch mixing agitator tank, continue stirring 20 minutes to get.
Case study on implementation 2
A kind of flexible circuitry board cleaning agent, is prepared by the raw material of following weight percent：Fatty alcohol polyoxyethylene ether
5 ﹪ of sulfate, 10 ﹪ of coconut oil fat acyl diethanol amine, 3 ﹪ of sodium pyrophosphate, 5 ﹪ of triethanolamine, 2 ﹪ of Sodium Polyacrylate, poly- second
10 ﹪ of glycol, 10 ﹪ of propandiol butyl ether, 2 ﹪ of benzotriazole, deionized water surplus.
The preparation method step of the cleaning agent is as follows：
1) each raw material for standby is weighed according to parts by weight；
2) deionized water, sodium pyrophosphate, Sodium Polyacrylate, benzotriazole are mixed and poured into mixer, it is normal in room temperature
Pressure stirring 15 minutes；
3) by fatty alcohol polyoxyethylene ether sulfate, coconut oil fat acyl diethanol amine, triethanolamine, polyethylene glycol, third
Glycol butyl ether continues to pour into batch mixing agitator tank, continue stirring 15 minutes to get.
Case study on implementation 3
A kind of flexible circuitry board cleaning agent, is prepared by the raw material of following weight percent：Fatty alcohol polyoxyethylene ether
4 ﹪ of sulfate, 15 ﹪ of coconut oil fat acyl diethanol amine, 2 ﹪ of sodium pyrophosphate, 4 ﹪ of triethanolamine, 4 ﹪ of Sodium Polyacrylate, second two
8 ﹪ of alcohol methyl ether, 10 ﹪ of isopropanol, 3 ﹪ of benzotriazole, deionized water surplus.
The preparation method step of the cleaning agent is as follows：
1) each raw material for standby is weighed according to parts by weight；
2) deionized water, sodium pyrophosphate, Sodium Polyacrylate, benzotriazole are mixed and poured into mixer, it is normal in room temperature
Pressure stirring 20 minutes；
3) by fatty alcohol polyoxyethylene ether sulfate, coconut oil fat acyl diethanol amine, triethanolamine, ethylene glycol monomethyl ether,
Isopropanol continues to pour into batch mixing agitator tank, continue stirring 10 minutes to get.
Application method：At normal temperatures, flexible circuitry board cleaning agent is diluted 10 times using direct drinking, by the cleaning after dilution
Agent is poured into ultrasonic cleaning tank and heated, and temperature controls 50-55 DEG C, and board part to be cleaned is all impregnated, is cleaned by ultrasonic
It is air-dried after 3-8min, then pure water rinsing and obtains clean board part.
Present invention process method and its effect is only illustrated in above-mentioned case study on implementation, but the invention is not limited in above-mentioned
Process, it means that the present invention is not to rely only on above-mentioned process to implement.Any person skilled in the art should
This is clear, any improvement in the present invention, the addition of equivalence replacement, auxiliary element including selected raw material, specific implementation method
Selection etc. belong within protection scope of the present invention and the open scope.
After testing, the flexible circuitry board cleaning agent that prepared by case study on implementation 1-3 using above-mentioned cleaning method rosin flux and
Dirt removal rate and corrosion condition are as shown in the table：
Wherein comparative example 1 is without fatty alcohol polyoxyethylene ether sulfate, comparative example 2 for formula in the embodiment of the present invention 2
Without coconut oil fat acyl diethanol amine in embodiment 2 in the present invention, surplus is than identical.
As seen from the above table, cleaning agent of the present invention is preferable to the effect of the pollutants such as rosin flux and dirt, wherein fat
Alcohol polyoxyethylene ether sulfate is significantly larger than single group with coconut oil fat acyl diethanol amine synergistic effect (embodiment 1,2,3) effect
Divide (comparative example 1,2) effect, illustrate fatty alcohol polyoxyethylene ether sulfate and coconut oil fat acyl diethanol amine in the present invention
With synergistic effect.
Pcb cleaning agent stability prepared by the present invention is preferably not stratified, non-corrosive to metallic copper and scolding tin, and
It is environment friendly and pollution-free.Cleaning agent prepared by the present invention is preferable to the effect of the pollutants such as rosin flux and dirt, meets national mark
It is accurate.
Claims (6)
1. a kind of flexible circuit board scavenger specially, which is characterized in that including following substance count by weight percentage：
2. flexible circuit board scavenger specially as described in claim 1, which is characterized in that the alcohol ethers solvent is ethyl alcohol, gathers
One or more of ethylene glycol, ethylene glycol monomethyl ether, isopropanol, n-butanol, propandiol butyl ether composition.
3. the preparation method of the flexible circuit board scavenger specially of claim 1 or 2, which is characterized in that first by it is described go from
Sub- water, Sodium Polyacrylate, benzotriazole mixing, are stirred 10-20 minutes at normal temperatures and pressures；Then fatty alcohol polyoxy second is added in
Alkene ether sulphate, coconut oil fat acyl diethanol amine, triethanolamine and alcohol ethers solvent continue stirring 10-20 minutes, obtain described
Flexible circuit board scavenger specially.
4. the application of flexible circuit board scavenger specially described in any one in claim 1-3, which is characterized in that the flexibility
Wiring board scavenger specially is cleaned to workpiece to be handled by wiping processing, spray process or ultrasonication.
5. the application of flexible circuit board scavenger specially as claimed in claim 4, which is characterized in that the ultrasonication is specific
For：At normal temperatures, flexible circuitry board cleaning agent is first diluted 5-12 times using direct drinking, then the cleaning agent after dilution is poured into super
In sound rinse bath, board part to be cleaned is all impregnated, is cleaned by ultrasonic 3-8min, is air-dried after finally being rinsed again with pure water
Obtain clean wiring board workpiece.
6. flexible circuit board scavenger specially as claimed in claim 5, which is characterized in that cleaning agent in the ultrasonic cleaning tank
Temperature is 50-55 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711452212.3A CN108085168A (en) | 2017-12-28 | 2017-12-28 | A kind of flexible circuit board scavenger specially and preparation method and application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711452212.3A CN108085168A (en) | 2017-12-28 | 2017-12-28 | A kind of flexible circuit board scavenger specially and preparation method and application |
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| Publication Number | Publication Date |
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| CN108085168A true CN108085168A (en) | 2018-05-29 |
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ID=62180490
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| Application Number | Title | Priority Date | Filing Date |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109920724A (en) * | 2019-01-30 | 2019-06-21 | 矽品科技（苏州）有限公司 | A kind of method of quick removal substrate organic solderability preservatives and oxide |
| CN113214914A (en) * | 2021-02-08 | 2021-08-06 | 深圳市松柏实业发展有限公司 | Silicone oil cleaning fluid |
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| CN104293500A (en) * | 2014-11-04 | 2015-01-21 | 国家电网公司 | Chemical agent used for cleaning printed circuit boards |
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| CN106635460A (en) * | 2016-11-28 | 2017-05-10 | 东莞市联洲知识产权运营管理有限公司 | Cleaning agent for water-based electronic industrial flux, as well as preparation method and using method thereof |
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| CN103834490A (en) * | 2012-11-28 | 2014-06-04 | 昆山太鲁阁电子材料科技有限公司 | Circuit board cleaning agent |
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| CN109920724A (en) * | 2019-01-30 | 2019-06-21 | 矽品科技（苏州）有限公司 | A kind of method of quick removal substrate organic solderability preservatives and oxide |
| CN113214914A (en) * | 2021-02-08 | 2021-08-06 | 深圳市松柏实业发展有限公司 | Silicone oil cleaning fluid |
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Application publication date: 20180529 |