CN102925298A - Water-based cleaning agent for soldering flux and preparation method thereof - Google Patents
Water-based cleaning agent for soldering flux and preparation method thereof Download PDFInfo
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- CN102925298A CN102925298A CN2012104878406A CN201210487840A CN102925298A CN 102925298 A CN102925298 A CN 102925298A CN 2012104878406 A CN2012104878406 A CN 2012104878406A CN 201210487840 A CN201210487840 A CN 201210487840A CN 102925298 A CN102925298 A CN 102925298A
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- diethylene glycol
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Abstract
The invention relates to a water-based cleaning agent for soldering flux and a preparation method thereof. The water-based cleaning agent comprises the following components in percentage by weight: 30-40% of diethylene glycol butyl ether, 10-20% of diethylene glycol ethyl ether, 5-10% of monoethanolamine, 10-15% of triethanolamine, 1-3% of corrosion inhibitor, 5-10% of AEO (fatty alcohol polyoxyethylene ether)-9, 5-10% of Ninol and the balance of water. The main steps of the preparation method are as follows: firstly adding four solvents, namely the diethylene glycol butyl ether, the diethylene glycol ethyl ether, the monoethanolamine and the triethanolamine into water, and then adding the AEO-9, the Ninol and the corrosion inhibitor for mixing. The action mechanism of the preparation method disclosed by the invention is scientific and scientific, the cleaning effect can achieve the optimal state through synergy of all the components, and the corrosion inhibitor is contained in the cleaning agent so as to play a role in metal protection during the cleaning process.
Description
Technical field
The invention belongs to the clean-out system field, relate to the cleaning of soldering flux, especially a kind of soldering flux aqueous cleaning agent and preparation method thereof.
Background technology
In production such as electronics, instrument, machineries, be the critical process that affects quality product on the cleaning performance of soldering flux.At present, fluorine carbon solvent and halogenated hydrocarbon solvent preparation are adopted in the flux cleaning agent more, and such clean-out system contains carcinogenic substance, and human body directly contacts and easily causes skin carcinoma, and cost is high and environment is caused severe contamination.
By retrieval, find following two pieces of publication documents:
1, a kind of halogen free environment-friendly cleaning agent (CN101748003A) is comprised of the material of following weight proportioning: the alkyl alcohol of C9-C12 isoparaffin 5～10%, degreaser 1～8%, glycol ether 5～12%, nonionogenic tenside 1～5%, surplus.This halogen free environment-friendly cleaning agent has fabulous cleansing power to soldering flux remaining on the wiring board in the electron trade, and cleaning speed is fast, and evaporation rate is moderate, and nontoxic, Halogen, have no irritating odor, without injury, the plate face can not turn white after cleaning, and prints without washmarking to human body.
2, a kind of cleaning agent for circuit board of computer (CN102504976A) it is characterized in that being comprised of anion surfactant palm oil fatty acid methyl esters sodium sulfonate, zwitterionics AMONYL 380LC, metal antirusting agent trolamine, metal inhibitor benzotriazole, solvent propylene glycol monomethyl ether, solvent ethylene glycol methyl ether, etoh solvent.The present invention cleans the dirts such as soldering flux on the computer circuit board, rosin, particle contamination, sweat mark, original handwriting.Outward appearance is transparent liquid, and water-soluble, alcohol, ether solvent are harmless to ozonosphere, pH value 7-8, very low toxicity, to the human body skin nonirritant, to the metal non-corrosiveness.The suitable can of the present invention direct spraywashing object in " aerosol " tank or valve formula spray tank.
By the technical characterictic contrast, above-mentioned publication document and the present patent application have more different.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part, a kind of green non-poisonous, soldering flux aqueous cleaning agent that cleaning performance is good is provided, and the preparation method of this clean-out system.
The objective of the invention is to be achieved through the following technical solutions:
A kind of soldering flux aqueous cleaning agent, its moiety and weight percent are:
And described inhibiter is a kind of in imidazolines inhibiter, the triazole species inhibiter, or their mixture.
A kind of preparation method of soldering flux aqueous cleaning agent, the step of preparation is as follows: water is added in the reactor, under whipped state, add successively reacting weight Diethylene Glycol butyl ether, diethylene glycol ether, Monoethanolamine MEA BASF, trolamine, AEO-9, Ninol, inhibiter, mix and blend 20-30 minute, namely become the soldering flux aqueous cleaning agent.
Advantage of the present invention and beneficial effect are:
1, this clean-out system is the weakly alkaline clean-out system, do not contain harmful fluorocarbon solvent and halogenated hydrocarbon solvent, can not cause the infringement to HUMAN HEALTH, easy to use, safe, environmental protection, nontoxic, economical (working concentration is 10-20%), using method is simple, can soak or the ultrasonic cleaning use, can significantly improve the cleaning parts working efficiency.
2, this clean-out system has very strong cleanup action to soldering flux, the soldering flux on the workpiece and welding slag can be cleaned up, the electronic component cleaning surfaces after this clean-out system is processed, again through water rinse and air-dry after can be directly used in assembling or packing.
3, the simple science of the mechanism of action of this clean-out system, the synergy by each component make cleaning performance all reach best, contain inhibiter in this clean-out system, can effectively prevent in the cleaning process corrosion to metal works.
4, the preparation method that relates to of this clean-out system is simple, and raw materials used wide material sources, obtains easily, and usage quantity is few, is highly suitable for large-scale explained hereafter.
Embodiment
Below in conjunction with embodiment, the present invention is further described, and following embodiment is illustrative, is not determinate, can not limit protection scope of the present invention with following embodiment.
The related raw material of the embodiment of the invention is marketable material.
Embodiment 1:
A kind of soldering flux aqueous cleaning agent, its moiety and weight thereof are respectively (take 1000g soldering flux aqueous cleaning agent as example):
A kind of preparation method of soldering flux aqueous cleaning agent, step is as follows:
Water is added reactor, under agitation add successively reacting weight Diethylene Glycol butyl ether, diethylene glycol ether, Monoethanolamine MEA BASF, trolamine, AEO-9, Ninol, inhibiter, namely became the soldering flux aqueous cleaning agent in mix and blend 20-30 minute.
Embodiment 2:
A kind of soldering flux aqueous cleaning agent, its moiety and weight thereof are respectively (take 1000g soldering flux aqueous cleaning agent as example)
The step of its preparation method is same as embodiment 1.
The mechanism of action of the present invention:
At first be dissolving and wash soldering flux and welding slag on the workpiece, in producing the soldering flux aqueous cleaning agent, add inhibiter and play the metal works provide protection, make cleaning performance reach best by the above mechanism of action.
This clean-out system application example:
Add embodiment 1 or the soldering flux aqueous cleaning agent of embodiment 2 and the mixed solution of water by 20% concentration in the liquid bath, temperature 60 C is immersed in the mixed solution 30 minutes with the metal parts after cleaning, and then ultrasonic cleaning is 30 minutes, and usefulness clear water rinsing workpiece gets final product again.
Conclusion: workpiece light as new after the clean, without film of flux residue.
This soldering flux aqueous cleaning agent quality standard:
Outward appearance: light yellow transparent liquid
Density: 1.010-1.020(g/ml)
PH：3%11.5-12.5
50-60 ℃ of washing rate 10%(temperature): 〉=95%
Workpiece: wash rear light as newly
Working concentration: 10-20%
Soak or ultrasonic cleaning time: 1-2 hour
Use temperature: 50-60 ℃.
Claims (3)
1. soldering flux aqueous cleaning agent, it is characterized in that: its moiety and weight percent are:
All the other add water to 100%.
2. soldering flux aqueous cleaning agent according to claim 1 is characterized in that: described inhibiter is a kind of in imidazolines inhibiter, the triazole species inhibiter, or their mixture.
3. the preparation method of a soldering flux aqueous cleaning agent as claimed in claim 1, it is characterized in that: the step of preparation is as follows: water is added in the reactor, under whipped state, add successively reacting weight Diethylene Glycol butyl ether, diethylene glycol ether, Monoethanolamine MEA BASF, trolamine, AEO-9, Ninol, inhibiter, mix and blend 20-30 minute, namely become the soldering flux aqueous cleaning agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104878406A CN102925298A (en) | 2012-11-26 | 2012-11-26 | Water-based cleaning agent for soldering flux and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104878406A CN102925298A (en) | 2012-11-26 | 2012-11-26 | Water-based cleaning agent for soldering flux and preparation method thereof |
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| CN102925298A true CN102925298A (en) | 2013-02-13 |
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| CN2012104878406A Pending CN102925298A (en) | 2012-11-26 | 2012-11-26 | Water-based cleaning agent for soldering flux and preparation method thereof |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103194319A (en) * | 2013-03-29 | 2013-07-10 | 深圳市同方电子新材料有限公司 | Water-based cleaning agent for electronics and preparation method thereof |
| CN104194971A (en) * | 2014-08-25 | 2014-12-10 | 深圳市唯特偶新材料股份有限公司 | Micro-emulsion cleaning agent for welding jigs |
| CN104611161A (en) * | 2015-01-19 | 2015-05-13 | 通山瑞邦电子科技有限公司 | Alkaline degreasing and conditioning agent as well as preparation method thereof |
| CN106833993A (en) * | 2016-12-27 | 2017-06-13 | 东莞市先飞电子材料有限公司 | A kind of aqueous cleaning agent and preparation method thereof |
| CN108085166A (en) * | 2017-12-25 | 2018-05-29 | 三达奥克化学股份有限公司 | It is exclusively used in the ceramic cleaning agent of acidity and preparation method of cleaning high technology ceramics casing |
| CN109517677A (en) * | 2017-09-19 | 2019-03-26 | 荒川化学工业株式会社 | Detergent composition stoste and detergent composition comprising the detergent composition stoste |
| CN110408480A (en) * | 2019-08-13 | 2019-11-05 | 蓝思科技（长沙）有限公司 | It is a kind of for the aqua type cleaning agent of fingerprint recognition mould-group circuit-board and its application |
| CN111849652A (en) * | 2020-08-11 | 2020-10-30 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly foamless water-based cleaning agent and preparation method thereof |
| CN112980602A (en) * | 2021-02-09 | 2021-06-18 | 深圳市合明科技有限公司 | Water-soluble solder paste cleaning agent and preparation method and application thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265440A (en) * | 2008-04-30 | 2008-09-17 | 山东大学 | Printed wiring board cleaning agent |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
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- 2012-11-26 CN CN2012104878406A patent/CN102925298A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265440A (en) * | 2008-04-30 | 2008-09-17 | 山东大学 | Printed wiring board cleaning agent |
| CN102482625A (en) * | 2009-09-03 | 2012-05-30 | 荒川化学工业株式会社 | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103194319A (en) * | 2013-03-29 | 2013-07-10 | 深圳市同方电子新材料有限公司 | Water-based cleaning agent for electronics and preparation method thereof |
| CN103194319B (en) * | 2013-03-29 | 2015-10-21 | 深圳市同方电子新材料有限公司 | A kind of electronic water based cleaning agent and preparation method thereof |
| CN104194971A (en) * | 2014-08-25 | 2014-12-10 | 深圳市唯特偶新材料股份有限公司 | Micro-emulsion cleaning agent for welding jigs |
| CN104194971B (en) * | 2014-08-25 | 2017-07-18 | 深圳市唯特偶新材料股份有限公司 | A kind of welding fixture microemulsion cleaning agent |
| CN104611161A (en) * | 2015-01-19 | 2015-05-13 | 通山瑞邦电子科技有限公司 | Alkaline degreasing and conditioning agent as well as preparation method thereof |
| CN106833993A (en) * | 2016-12-27 | 2017-06-13 | 东莞市先飞电子材料有限公司 | A kind of aqueous cleaning agent and preparation method thereof |
| CN109517677A (en) * | 2017-09-19 | 2019-03-26 | 荒川化学工业株式会社 | Detergent composition stoste and detergent composition comprising the detergent composition stoste |
| CN109517677B (en) * | 2017-09-19 | 2021-05-18 | 荒川化学工业株式会社 | Detergent composition stock solution, and detergent composition containing the same |
| CN108085166A (en) * | 2017-12-25 | 2018-05-29 | 三达奥克化学股份有限公司 | It is exclusively used in the ceramic cleaning agent of acidity and preparation method of cleaning high technology ceramics casing |
| CN110408480A (en) * | 2019-08-13 | 2019-11-05 | 蓝思科技（长沙）有限公司 | It is a kind of for the aqua type cleaning agent of fingerprint recognition mould-group circuit-board and its application |
| CN111849652A (en) * | 2020-08-11 | 2020-10-30 | 深圳市唯特偶新材料股份有限公司 | Environment-friendly foamless water-based cleaning agent and preparation method thereof |
| CN112980602A (en) * | 2021-02-09 | 2021-06-18 | 深圳市合明科技有限公司 | Water-soluble solder paste cleaning agent and preparation method and application thereof |
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Application publication date: 20130213 |