CN110408480A - It is a kind of for the aqua type cleaning agent of fingerprint recognition mould-group circuit-board and its application - Google Patents
It is a kind of for the aqua type cleaning agent of fingerprint recognition mould-group circuit-board and its application Download PDFInfo
- Publication number
- CN110408480A CN110408480A CN201910743650.8A CN201910743650A CN110408480A CN 110408480 A CN110408480 A CN 110408480A CN 201910743650 A CN201910743650 A CN 201910743650A CN 110408480 A CN110408480 A CN 110408480A
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- China
- Prior art keywords
- cleaning agent
- agent
- aqua type
- type cleaning
- fingerprint recognition
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 76
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000843 powder Substances 0.000 claims abstract description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000002738 chelating agent Substances 0.000 claims abstract description 17
- 230000000855 fungicidal effect Effects 0.000 claims abstract description 16
- 239000000417 fungicide Substances 0.000 claims abstract description 16
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims abstract description 9
- 229940125810 compound 20 Drugs 0.000 claims abstract description 7
- JAXFJECJQZDFJS-XHEPKHHKSA-N gtpl8555 Chemical compound OC(=O)C[C@H](N)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1CCC[C@@H]1C(=O)N[C@H](B1O[C@@]2(C)[C@H]3C[C@H](C3(C)C)C[C@H]2O1)CCC1=CC=C(F)C=C1 JAXFJECJQZDFJS-XHEPKHHKSA-N 0.000 claims abstract description 7
- 229940125773 compound 10 Drugs 0.000 claims abstract description 6
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 claims abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 45
- 238000004140 cleaning Methods 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 19
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 17
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 claims description 16
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 15
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 15
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 15
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 9
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 claims description 9
- 150000002191 fatty alcohols Chemical class 0.000 claims description 8
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 claims description 8
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 7
- 238000002604 ultrasonography Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- WXMKPNITSTVMEF-UHFFFAOYSA-M sodium benzoate Chemical compound [Na+].[O-]C(=O)C1=CC=CC=C1 WXMKPNITSTVMEF-UHFFFAOYSA-M 0.000 claims description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- 150000002896 organic halogen compounds Chemical class 0.000 claims description 4
- 235000010234 sodium benzoate Nutrition 0.000 claims description 4
- 239000004299 sodium benzoate Substances 0.000 claims description 4
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 229940043237 diethanolamine Drugs 0.000 claims description 3
- -1 ether compound Chemical class 0.000 claims description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 230000001954 sterilising effect Effects 0.000 claims 1
- 238000004659 sterilization and disinfection Methods 0.000 claims 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000460 chlorine Substances 0.000 abstract description 4
- 229910052801 chlorine Inorganic materials 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- 230000001473 noxious effect Effects 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 4
- 239000011593 sulfur Substances 0.000 abstract description 4
- 229910052717 sulfur Inorganic materials 0.000 abstract description 4
- 229910001385 heavy metal Inorganic materials 0.000 abstract description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 7
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical group CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 7
- 230000003321 amplification Effects 0.000 description 6
- 238000003199 nucleic acid amplification method Methods 0.000 description 6
- 230000003213 activating effect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000026030 halogenation Effects 0.000 description 3
- 238000005658 halogenation reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- ABJSOROVZZKJGI-OCYUSGCXSA-N (1r,2r,4r)-2-(4-bromophenyl)-n-[(4-chlorophenyl)-(2-fluoropyridin-4-yl)methyl]-4-morpholin-4-ylcyclohexane-1-carboxamide Chemical compound C1=NC(F)=CC(C(NC(=O)[C@H]2[C@@H](C[C@@H](CC2)N2CCOCC2)C=2C=CC(Br)=CC=2)C=2C=CC(Cl)=CC=2)=C1 ABJSOROVZZKJGI-OCYUSGCXSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- GLGNXYJARSMNGJ-VKTIVEEGSA-N (1s,2s,3r,4r)-3-[[5-chloro-2-[(1-ethyl-6-methoxy-2-oxo-4,5-dihydro-3h-1-benzazepin-7-yl)amino]pyrimidin-4-yl]amino]bicyclo[2.2.1]hept-5-ene-2-carboxamide Chemical compound CCN1C(=O)CCCC2=C(OC)C(NC=3N=C(C(=CN=3)Cl)N[C@H]3[C@H]([C@@]4([H])C[C@@]3(C=C4)[H])C(N)=O)=CC=C21 GLGNXYJARSMNGJ-VKTIVEEGSA-N 0.000 description 1
- STBLNCCBQMHSRC-BATDWUPUSA-N (2s)-n-[(3s,4s)-5-acetyl-7-cyano-4-methyl-1-[(2-methylnaphthalen-1-yl)methyl]-2-oxo-3,4-dihydro-1,5-benzodiazepin-3-yl]-2-(methylamino)propanamide Chemical compound O=C1[C@@H](NC(=O)[C@H](C)NC)[C@H](C)N(C(C)=O)C2=CC(C#N)=CC=C2N1CC1=C(C)C=CC2=CC=CC=C12 STBLNCCBQMHSRC-BATDWUPUSA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 1
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical class C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- PRPAGESBURMWTI-UHFFFAOYSA-N [C].[F] Chemical compound [C].[F] PRPAGESBURMWTI-UHFFFAOYSA-N 0.000 description 1
- MOFINMJRLYEONQ-UHFFFAOYSA-N [N].C=1C=CNC=1 Chemical class [N].C=1C=CNC=1 MOFINMJRLYEONQ-UHFFFAOYSA-N 0.000 description 1
- 239000013556 antirust agent Substances 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000711 cancerogenic effect Effects 0.000 description 1
- 231100000315 carcinogenic Toxicity 0.000 description 1
- 229940125758 compound 15 Drugs 0.000 description 1
- 229940125878 compound 36 Drugs 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 150000007529 inorganic bases Chemical class 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 230000002110 toxicologic effect Effects 0.000 description 1
- 231100000759 toxicological effect Toxicity 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/825—Mixtures of compounds all of which are non-ionic
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2079—Monocarboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Inorganic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The present invention provides a kind of for the aqua type cleaning agent of fingerprint recognition mould-group circuit-board and its application, cleaning agent is calculated in mass percent, composed of the following components: polyalcohol ether compound 20~40%, alcamine compound 10~30%, chelating agent 2~6%, nonionic surface active agent 1~3%, fungicide 0.3~2%, surplus are water.Cleaning agent can clean the scaling powder on fingerprint recognition mould-group circuit-board under the collective effect of above-mentioned content component, and small to human body and environmental hazard；Property is stablized, and is not layered；It is not volatile, it is not easily decomposed；Raw material sources are extensive, are easy to get at a low price, and use cost is low；Biodegradable, treatment cost of waste liquor is low, not the noxious materials such as sulfur-bearing, chlorine, benzene, heavy metal；To fingerprint recognition chip and the corrosion-free effect of circuit board；Component is simple, greatly reduces the operation difficulty of actual production and Quality Detection.
Description
Technical field
The invention belongs to film of flux residue cleaning agent fields more particularly to a kind of for fingerprint recognition mould-group circuit-board
Aqua type cleaning agent and its application.
Background technique
Fingerprint mould group is attached between fingerprint identification chip and circuit board by scolding tin in production process, junction
Between can fluxing agent residue exist, be likely to result in use circuit board short circuit, it is therefore desirable to cleaned.
Because the difficult point of fingerprint recognition mould group cleaning is that the gap between circuit board and chip is very small, cleaning degree requires high.
Fluorine carbon solvent and halogenated hydrocarbon solvent is mostly used to prepare the cleaning of scaling powder at present, this kind of solvent contains carcinogenic class
Substance, big to human injury, use cost is high, and treatment cost of waste liquor is high.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of aqua type cleaning agents for fingerprint recognition mould-group circuit-board
And its application, the aqua type cleaning agent can scaling powder on cleaning circuit plate, and
The present invention provides a kind of aqua type cleaning agents for fingerprint recognition mould-group circuit-board, are calculated in mass percent,
It is composed of the following components:
Polyalcohol ether compound 20~40%, alcamine compound 10~30%, chelating agent 2~6%, non-ionic table
Face activating agent 1~3%, fungicide 0.3~2%, surplus are water.
Preferably, the polyalcohol ether compound includes the mixture of ethylene glycol positive propyl ether and butyl；
The ethylene glycol positive propyl ether and butyl account for the 10~20% of aqua type cleaning agent respectively.
Preferably, the chelating agent is selected from potassium pyrophosphate and/or tetrasodium ethylenediamine tetraacetate.
Preferably, the nonionic surface active agent is selected from nonylphenol polyoxyethylene ether and/or aliphatic alcohol polyethenoxy
Ether.
Preferably, the fungicide is selected from sodium benzoate and/or benzotriazole.
Preferably, the pH value of the cleaning agent is 8.5~9.5.
Preferably, the alcamine compound is selected from one of monoethanolamine, diethanol amine and triethanolamine or a variety of.
Preferably, triethanolamine 15%, ethylene glycol positive propyl ether 18%, butyl in the aqua type cleaning agent
18%, chelating agent 2%, nonionic surface active agent 3% and fungicide 0.3%, surplus are water；
Or triethanolamine 20%, ethylene glycol positive propyl ether 15%, butyl 20%, chelating agent 2%, non-ionic table
Face activating agent 3% and fungicide 0.5%, surplus are water.
The present invention provides a kind of aqua type cleaning agents described by adopting the above technical scheme to clean fingerprint recognition modular circuit
The method of plate, comprising the following steps:
Fingerprint recognition mould-group circuit-board to be cleaned is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, is washed, drying,
Fingerprint recognition mould-group circuit-board after being cleaned；
The temperature of the ultrasonic cleaning is 50~60 DEG C；The time of ultrasonic cleaning is 8~12min.
Preferably, fluxing agent is remained on the fingerprint recognition mould-group circuit-board to be cleaned；The scaling powder includes rosin
Resin, solvent, organohalogen compounds and metal.
The present invention provides a kind of aqua type cleaning agents for fingerprint recognition mould-group circuit-board, are calculated in mass percent,
It is composed of the following components: polyalcohol ether compound 20~40%, alcamine compound 10~30%, chelating agent 2~6%, non-
Ionic surfactant 1~3%, fungicide 0.3~2%, surplus are water.Cleaning agent provided by the invention is in above-mentioned content
The scaling powder on fingerprint recognition mould-group circuit-board can be cleaned under the collective effect of component, and small to human body and environmental hazard.
The cleaning agent is stablized, and is not layered；It is not volatile, it is not easily decomposed；Raw material sources are extensive, are easy to get at a low price, and use cost is low；It should
The group of cleaning agent is grouped as biodegradable, and treatment cost of waste liquor is low, not the noxious materials such as sulfur-bearing, chlorine, benzene, heavy metal；To finger
Line identification chip and the corrosion-free effect of circuit board；The component of cleaning agent is simple, significantly reduces actual production and Quality Detection
Operation difficulty.The results showed that amplification sem observation, cleaning agent cleaning fingerprint recognition mould-group circuit-board on scaling powder without
Residual；Volatile quantity is that volatile quantity is that volatile quantity is 2.67 at 1.60~2.31%, 75 DEG C at 0.59~0.96%, 65 DEG C at 55 DEG C
~3.93%.
Specific embodiment
The present invention provides a kind of aqua type cleaning agents for fingerprint recognition mould-group circuit-board, are calculated in mass percent,
It is composed of the following components:
Polyalcohol ether compound 20~40%, alcamine compound 10~30%, chelating agent 2~6%, non-ionic table
Face activating agent 1~3%, fungicide 0.3~2%, surplus are water.
Cleaning agent provided by the invention can clean fingerprint recognition mould group electricity under the collective effect of the component of above-mentioned content
Scaling powder on the plate of road, and it is small to human body and environmental hazard.The cleaning agent is stablized, and is not layered；It is not volatile, it is not easy point
Solution；Raw material sources are extensive, are easy to get at a low price, and use cost is low；The group of the cleaning agent is grouped as biodegradable, treatment cost of waste liquor
It is low, not noxious materials such as sulfur-bearing, chlorine, benzene, heavy metal；To fingerprint recognition chip and the corrosion-free effect of circuit board；The group of cleaning agent
Divide simply, significantly reduces the operation difficulty of actual production and Quality Detection.
In the present invention, the alcohol ethers compound preferably includes the mixing of ethylene glycol positive propyl ether and butyl
Object；The ethylene glycol positive propyl ether and butyl preferably account for the 10~20% of aqua type cleaning agent respectively.In the present invention,
The ethylene glycol positive propyl ether and butyl higher boiling, volatility is small, and toxicological effect is small, has good dissolution to scaling powder
Property, to had no corrosive effect on metals；It is water-soluble fine.
In the present invention, the alcamine compound is preferably selected from one in monoethanolamine, diethanol amine and triethanolamine
Kind is a variety of.The alcamine compound has protective effect to bump, provides weakly alkaline environment, compares inorganic base such as hydroxide
For potassium, sodium hydroxide, sodium carbonate, basicity is very low, will not cause to corrode to circuit board and bump, is conducive to loose in scaling powder
The removal of fragrant ingredient.The alcamine compound accounts for 10~30% in aqua type cleaning agent, can be formed in cleaning parts surface
Layer protecting film can play antirust function, without additional addition antirust agent.
In the present invention, the chelating agent is preferably selected from potassium pyrophosphate and/or tetrasodium ethylenediamine tetraacetate (EDTA-4Na)；
The chelating agent can be to the metal chelating in scaling powder.
The nonionic surface active agent is preferably selected from nonylphenol polyoxyethylene ether and/or fatty alcohol polyoxyethylene ether；
The model of the fatty alcohol polyoxyethylene ether is preferably selected from AEO-9.The emulsification of the nonionic surface active agent of mentioned kind divides
It dissipates and wetting ability is very strong.
The fungicide is preferably selected from sodium benzoate and/or benzotriazole；The fungicide can guarantee that cleaning agent is long
Time saves and uses.
The pH value of the cleaning agent is preferably 8.5~9.5；In a particular embodiment, the pH value of the cleaning agent is 9.
In the present invention, it is calculated in mass percent, aqua type cleaning agent is composed of the following components:
Polyalcohol ether compound 35~36%, alcamine compound 15~20%, chelating agent 2%, non-ionic surface
Activating agent 3%, fungicide 0.3~0.5%, surplus are water.Alcamine compound in aqua type cleaning agent provided by the invention
15%, polyalcohol ether compound 36%, chelating agent 2%, nonionic surface active agent 3% and fungicide 0.3%, surplus are
Water；
Or alcamine compound 20%, polyalcohol ether compound 35%, chelating agent 2%, ionic surfactant 3%
With fungicide 0.5%, surplus is water.
In an embodiment of the invention, the aqua type cleaning agent is made by following components:
Triethanolamine 15%, ethylene glycol positive propyl ether 18%, butyl 18%, potassium pyrophosphate 1%, EDTA-4Na
1%, nonylphenol polyoxyethylene ether 2%, fatty alcohol polyoxyethylene ether 1%, sodium benzoate 0.3%, surplus are water；
In another embodiment, the aqua type cleaning agent is made by following components:
Triethanolamine 20%, ethylene glycol positive propyl ether 15%, butyl 20%, potassium pyrophosphate 1%, EDTA-4Na
1%, nonylphenol polyoxyethylene ether 1%, fatty alcohol polyoxyethylene ether 2%, benzotriazole 0.5%, surplus is water.
The present invention provides a kind of aqua type cleaning agents described by adopting the above technical scheme to clean fingerprint recognition modular circuit
The method of plate, comprising the following steps:
Fingerprint recognition mould-group circuit-board to be cleaned is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, is washed, drying,
Fingerprint recognition mould-group circuit-board after being cleaned.
In the present invention, fluxing agent is remained on the fingerprint recognition mould-group circuit-board to be cleaned；The scaling powder includes
Rosin resin, solvent, organohalogen compounds and metal.
In the present invention, the temperature of the ultrasonic cleaning is 50~60 DEG C, preferably 52~58 DEG C；In specific embodiment
In, the temperature of the ultrasonic cleaning is 55 DEG C.The time of the ultrasonic cleaning is 8~12min, preferably 5~10min.
In the present invention, the number of the washing is preferably three times；Cleaning agent is washed to clean up.
The present invention is not particularly limited the method for drying, is using drying technology scheme well known to those skilled in the art
It can.
In order to further illustrate the present invention, below with reference to embodiment to provided by the invention a kind of for fingerprint recognition mould group
The aqua type cleaning agent of circuit board and its application are described in detail, but they cannot be interpreted as to the scope of the present invention
Restriction.
Embodiment 1
Aqua type cleaning agent is composed of the following components: triethanolamine 15%, ethylene glycol positive propyl ether 18%, butyl
18%, potassium pyrophosphate 1%, EDTA-4Na 1%, nonylphenol polyoxyethylene ether 2%, fatty alcohol polyoxyethylene ether 1%, benzoic acid
Sodium 0.3%, surplus are water.
The component of above-mentioned content is mixed, aqua type cleaning agent is obtained.Fingerprint recognition mould-group circuit-board to be cleaned is placed in
Aqua type cleaning agent continuous ultrasound cleans twice, washes, drying, the fingerprint recognition mould-group circuit-board after being cleaned；It is described to
Fluxing agent is remained on cleaning fingerprint recognition mould-group circuit-board；The scaling powder include rosin resin, solvent, organohalogen compounds and
Metal；The temperature of ultrasonic cleaning is 55 DEG C, ultrasonic cleaning 5min~10min.
The present invention, in amplification microscopic observation, observes result are as follows: flux-free to the fingerprint recognition mould-group circuit-board after cleaning
Residual.
The present invention carries out the measurement of volatile component to the aqua type cleaning agent that embodiment 1 configures, and the results are shown in Table 1, table 1 is
The test result of the volatile component of aqua type cleaning agent prepared by embodiment 1:
The test result of the volatile component of the aqua type cleaning agent of 1 embodiment 1 of table preparation
| Temperature/DEG C | Quality/g before heating | Quality/g after heating | Volatile quantity/% |
| 55℃ | 500.03 | 495.22 | 0.96 |
| 65℃ | 500.09 | 488.53 | 2.31 |
| 75℃ | 500.12 | 480.48 | 3.93 |
Embodiment 2
Aqua type cleaning agent is composed of the following components: triethanolamine 20%, ethylene glycol positive propyl ether 15%, butyl
20%, potassium pyrophosphate 1%, EDTA-4Na 1%, nonylphenol polyoxyethylene ether 1%, fatty alcohol polyoxyethylene ether 2%, benzo three
Nitrogen azoles 0.5%, surplus are water.
The component of above-mentioned percentage composition is mixed, aqua type cleaning agent is obtained.By fingerprint recognition mould-group circuit-board to be cleaned
It is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, washes, drying, the fingerprint recognition mould-group circuit-board after being cleaned；Institute
It states and remains fluxing agent on fingerprint recognition mould-group circuit-board to be cleaned；The scaling powder includes rosin resin, solvent, organic halogenation
Object and metal；The temperature of ultrasonic cleaning is 55 DEG C, ultrasonic cleaning 5min~10min.
The present invention, in amplification microscopic observation, observes result are as follows: flux-free to the fingerprint recognition mould-group circuit-board after cleaning
Residual.
The present invention carries out the measurement of volatile component to the aqua type cleaning agent that embodiment 2 configures, and the results are shown in Table 2, table 2 is
The test result of the volatile component of aqua type cleaning agent prepared by embodiment 2:
The test result of the volatile component of the aqua type cleaning agent of 2 embodiment 2 of table preparation
Comparative example 1
AT cleaning agent (model) the water base type scaling powder cleaning agent produced using commercially available Dongguan Etta electronics corporation is carried out
Ultrasonic Wave heating, solution are layered, and are 5min, fluxing agent residual in scavenging period.
Comparative example 2
On that basis of example 1, butyl is substituted for ethylene glycol phenyl ether.
The component of above-mentioned percentage composition is mixed, aqua type cleaning agent is obtained.By fingerprint recognition mould-group circuit-board to be cleaned
It is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, washes, drying, the fingerprint recognition mould-group circuit-board after being cleaned；Institute
It states and remains fluxing agent on fingerprint recognition mould-group circuit-board to be cleaned；The scaling powder includes rosin resin, solvent, organic halogenation
Object and metal；The temperature of ultrasonic cleaning is 55 DEG C, ultrasonic cleaning 5min~10min.
The present invention, in amplification microscopic observation, observes result are as follows: fluxing agent to the fingerprint recognition mould-group circuit-board after cleaning
Residual.
Comparative example 3
Aqua type cleaning agent is composed of the following components: triethanolamine 20%, ethylene glycol positive propyl ether 5%, butyl
5%, potassium pyrophosphate 1%, EDTA-4Na 1%, nonylphenol polyoxyethylene ether 1%, fatty alcohol polyoxyethylene ether 2%, three nitrogen of benzo
Azoles 0.5%, surplus are water.
The component of above-mentioned percentage composition is mixed, aqua type cleaning agent is obtained.By fingerprint recognition mould-group circuit-board to be cleaned
It is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, washes, drying, the fingerprint recognition mould-group circuit-board after being cleaned；Institute
It states and remains fluxing agent on fingerprint recognition mould-group circuit-board to be cleaned；The scaling powder includes rosin resin, solvent, organic halogenation
Object and metal；The temperature of ultrasonic cleaning is 55 DEG C, ultrasonic cleaning 5min~10min.
The present invention, in amplification microscopic observation, observes result are as follows: fluxing agent to the fingerprint recognition mould-group circuit-board after cleaning
Residual.
As seen from the above embodiment, the present invention provides a kind of aqua type cleanings for fingerprint recognition mould-group circuit-board
Agent is calculated in mass percent, composed of the following components: polyalcohol ether compound 20~40%, alcamine compound 10~
30%, chelating agent 2~6%, nonionic surface active agent 1~3%, fungicide 0.3~2%, surplus are water.The present invention provides
Cleaning agent the scaling powder on fingerprint recognition mould-group circuit-board can be cleaned under the collective effect of the component of above-mentioned content, and it is right
Human body and environmental hazard are small.The cleaning agent is stablized, and is not layered；It is not volatile, it is not easily decomposed；Raw material sources are extensive, low
Valence is easy to get, and use cost is low；The group of the cleaning agent is grouped as biodegradable, and treatment cost of waste liquor is low, not sulfur-bearing, chlorine, benzene, again
The noxious materials such as metal；To fingerprint recognition chip and the corrosion-free effect of circuit board；The component of cleaning agent is simple, significantly reduces
The operation difficulty of actual production and Quality Detection.The results showed that amplification sem observation, the fingerprint recognition mould group of cleaning agent cleaning
Scaling powder noresidue on circuit board；Volatile quantity is that volatile quantity is 1.60~2.31% at 0.59~0.96%, 65 DEG C at 55 DEG C,
Volatile quantity is 2.67~3.93% at 75 DEG C.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of aqua type cleaning agent for fingerprint recognition mould-group circuit-board, is calculated in mass percent, composed of the following components:
Polyalcohol ether compound 20~40%, alcamine compound 10~30%, chelating agent 2~6%, non-ionic surface are living
Property agent 1~3%, fungicide 0.3~2%, surplus is water.
2. aqua type cleaning agent according to claim 1, which is characterized in that the polyalcohol ether compound includes second two
The mixture of alcohol positive propyl ether and butyl；
The ethylene glycol positive propyl ether and butyl account for the 10~20% of aqua type cleaning agent respectively.
3. aqua type cleaning agent according to claim 1, which is characterized in that the chelating agent be selected from potassium pyrophosphate and/or
Tetrasodium ethylenediamine tetraacetate.
4. aqua type cleaning agent according to claim 1, which is characterized in that the nonionic surface active agent is selected from nonyl
Base phenol polyethenoxy ether and/or fatty alcohol polyoxyethylene ether.
5. aqua type cleaning agent according to claim 1, which is characterized in that the fungicide be selected from sodium benzoate and/or
Benzotriazole.
6. aqua type cleaning agent according to claim 1, which is characterized in that the pH value of the cleaning agent is 8.5~9.5.
7. aqua type cleaning agent according to claim 1, which is characterized in that the alcamine compound is selected from monoethanol
One of amine, diethanol amine and triethanolamine are a variety of.
8. aqua type cleaning agent according to claim 1, which is characterized in that triethanolamine in the aqua type cleaning agent
15%, ethylene glycol positive propyl ether 18%, butyl 18%, chelating agent 2%, nonionic surface active agent 3% and sterilization
Agent 0.3%, surplus are water；
Or triethanolamine 20%, ethylene glycol positive propyl ether 15%, butyl 20%, chelating agent 2%, non-ionic surface are living
Property agent 3% and fungicide 0.5%, surplus are water.
9. a kind of method using any one of the claim 1~8 aqua type cleaning agent cleaning fingerprint recognition mould-group circuit-board,
The following steps are included:
Fingerprint recognition mould-group circuit-board to be cleaned is placed in the cleaning of aqua type cleaning agent continuous ultrasound twice, is washed, drying obtains
Fingerprint recognition mould-group circuit-board after cleaning；
The temperature of the ultrasonic cleaning is 50~60 DEG C；The time of ultrasonic cleaning is 8~12min.
10. according to the method described in claim 9, it is characterized in that, being remained on the fingerprint recognition mould-group circuit-board to be cleaned
Fluxing agent；The scaling powder includes rosin resin, solvent, organohalogen compounds and metal.
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Application publication date: 20191105 |