JP2520552B2 - Foaming flux for automated soldering process - Google Patents

Abstract

A non-toxic, non-corrosive foaming soldering flux (14) comprises citric acid and water, together with at least one foaming agent. The foam is fast-breaking, dissipating almost immediately. Such a fast-breaking foam is novel in an aqueous-based flux. The unique flux of the invention produces solder joints of high metallic luster and excellent quality. Disposal presents no health hazards, and clean-up of flux residues is accomplished using only water and, optionally, a surfactant. <IMAGE>

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a novel foamable soldering flux used in an automatic soldering process.

[0002]

BACKGROUND OF THE INVENTION Most fluxing and de-fusing chemicals used in the industry to manufacture electronic circuits, such as military hardware, contribute to the reduction of atmospheric ozone or the Port of Los Angeles. It is considered an environmental pollutant or a health hazard by local environmental agencies such as the (basin) Air Quality Management District. For example, CFCs used in vapor degreasing to clean soldered parts
(Chlorofluorohydrocarbons) that use rosin flux are released into the atmosphere
It has been reported to remain in the atmosphere as an ozone reducer for about 100 years. Other chemicals such as rosin flux, alcohol, etc. pose health hazards and industrial waste disposal problems.

Water-soluble fluxes can easily solve this main problem. However, most water-soluble fluxes
It is formulated with severe activators such as hydrochloric acid and complex glycols. These activators primarily cause cleaning and residue problems with the printed circuit board and the electronic circuits thereon, and further, these activators corrode the soldered metal severely, or Contaminating the dielectric, causing a tendency for electromigration. Other, water-soluble fluxes are formulated with isopropanol and / or plasticizers, which cause waste disposal and health problems.

[0004]

A simple, non-toxic, non-toxic material that provides a high quality metallurgical yet excellent quality soldering point when used in an automated soldering process.
A foamable soldering flux that is not corrosive is desired.

[0005]

DISCLOSURE OF THE INVENTION According to the present invention, at least one water-soluble organic acid having at least two carboxyl groups,
A foamable soldering flux comprising water and at least one foaming agent is provided. The fluxes of the present invention produce a continuous foam head upon aeration, which results in automated soldering using a water-based flux instead of the glycol / alcohol type liquid flux commonly found in commercial fluxes. Allows attachment. As a result of the unique formulation, automated soldering can be performed using environmentally safe water-based fluxes. Further, the flux does not require expensive and environmentally harmful defluxing solvents containing chlorofluorocarbons and / or volatile organic solvents (VOCs). The flux is a soldered circuit card assembly that uses water and a surfactant.
easily removed from blies). The resulting soldered joint exhibits high metallic luster and excellent electrical properties.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION A conventional foaming flux system 10 is shown in FIG. The outer housing, or flux tank 12, contains a liquid flux 14 (visible in Figure 2). An aerating stone 16 is placed in the flux chimney, which is then placed in the flux tank 12 and the liquid flux in the flux tank is placed in the flux chimney as required. To a constant flow. As shown more clearly in FIG. 2, by means of an air connection 20 which is connected to an air source (not fixed) (not shown) and is brought up to a pressure controlled by a control means (not shown), The liquid flux is vented to provide the foam head 22. The height of the foam head 22 is preferably wider than the top portion 18a of the flux chimney 18. Preferably,
When used in conjunction with the wave soldering system shown in FIG. 3, the foam head 22 has a height of about 0.5 inch, indicated by "A". However, for other soldering systems this height is different.

The primary factors governing the height of the foam head 22 are the components of the blowing agent used in the expandable flux, the concentration of the blowing agent, the air pressure applied to the aeration stone, and the physical structure of the stone itself. included. The fluxing agent of the present invention contains (a) at least one water-soluble organic acid containing at least two carboxylic acid groups, for example citric acid (b) water, and (c) at least one blowing agent.

Examples of suitable organic acids include citric acid, malic acid, tartaric acid, glutamic acid, phthalic acid and the like. However, the best results are obtained with citric acid. Also, while the group of organic acids shown above is effective, the rest of the description below is directed to the use of an aqueous solution of citric acid as the soldering flux in foam soldering. Although not based on any particular theory, citric acid appears to chelate oxides and not base metals. As a result, the flux of the present invention causes little or no corrosion of the base metal.
Therefore, as long as the members of the above group of organic acids behave similarly to citric acid, the members mentioned above are also within the scope of the present invention.

The concentration range of citric acid in water can range from 0.5 to 99.5 percent (by weight). Concentrations of at least 5 wt% give significantly improved soldering results. On the other hand, concentrations above about 50 wt% give no additional improvement. Therefore, this range is preferable. Concentrations of at least about 20 wt% ensure consistently improved soldering results, even on non-ideal soldering surfaces. Therefore, the range of about 20 to 50 wt% is most preferred.

The quality of the water used, and the grade of citric acid used, are not critical to the practice of the invention, but for very sensitive electronic circuits distilled, deionized water, And it may be desirable to use a sufficiently high grade of citric acid.

Higher grades of water and citric acid give better results.

Consistent with the above considerations relating to sensitive electronic circuits, the source of citric acid is also unimportant, and this source may be, for example, commercially produced powder or crystals, or oranges, lemons, limes. ,grapefruit,
It may include fruit juices or concentrates of fruit juices such as juices of pineapple, tomato and the like. Finally, the flux contains other ingredients, such as the additives described above,
Impurities may be included, either accidentally or intentionally, as long as they do not have the opposite effect on the result of soldering.

The concentration of blowing agent is about 0.0001, depending on the particular blowing agent or combination of blowing agents selected.
To 5 wt%. Preferably about 0.0002
To 0.04 wt%.

The composition and concentration of the blowing agent should be selected to provide a foam head of about 0.5 inch. If the concentration is too high, there will be too many bubbles and the foam will be too high. If the concentration is too low, there will not be enough foam to form the foam head 22.

Blowing agents suitable for use in the practice of the present invention are selected from anionic, nonionic, cationic and amphoteric surfactants. Examples of anionic surfactants include sulfates such as lauryl sulfate and lauryl ether sulfate, and their sodium and ammonium salts; sulfonates such as dodecylbenzene sulfonate, α-olefin sulfonate, xylene sulfonate, and , Their sodium, ammonium and potassium salts; and sarcosinates such as lauryl sarcosinate, and their sodium, ammonium and potassium salts.
Examples of nonionic surfactants include about 6 to 30 moles ethoxylated nonylphenol ethoxylates; about 4.5 to 30 moles ethoxylated octylphenol ethoxylates; about 6 to 30 moles ethoxylated. Linear alcohol ethoxylates; amides such as those based on coconut and laurilic; amine oxides such as those based on coconut, lauriric, amidopropyl, and alkyldimethyl; silicone glycol copolymers and phosphate esters . Examples of cationic surfactants include quaternary ammonium compounds such as alkyldimethylbenzylammonium chloride. Examples of amphoteric surfactants include imidazolines such as those based on coconut and lauriric; and betaines such as those based on cocoamide and sulfo.

Preferred examples and concentrations of the blowing agent preferably used in the practice of this invention are: (a) in the range of about 0.0315 to 0.0385 wt%, preferably about 0.035 wt%. Obtained sodium alkyl sulfonate (b) in the range of about 0.0018 to 0.003 wt%, preferably about 0.0024 wt% polyoxyalkylene glycol (c) in the range of about 0.0030 to 0.0043 wt% Octylphenoxypolyethoxyethanol, which may be about 0.0036 wt%, and (d) ethoxyl, which may range from about 0.0024 to 0.0037 wt%, preferably about 0.0030 wt%. Includes alcoholized alcohol. A particularly preferred combination of blowing agents is from about 0.0022 to 0.0032 wt%, preferably about 0.002.
0027wt% sodium 1-octane sulfonate,
Containing about 0.0020 to 0.0030 wt%, preferably about 0.0025 wt% N-octyl-2-pyrrolidone, and about 0.0002 to 0.0004 wt%, preferably about 0.0003 wt% fluoroalkyl sulfonate. To do.

Additives may be added to the flux for special purposes. For example, fragrances such as wintergreen oil, green peppermint oil or peppermint oil may be added to fluxes to give the user a pleasant scent. Such fragrances may typically be added in amounts of about 1 to 30 ppm.

Colorants may be added for visual purposes.
This allows the operator to see the flux, which is otherwise colorless. In this connection about 1 to 3
0 ppm of at least one colorant (or acid stable, light insensitive dye) may be added.

The flux is most advantageously used in soldering electrical connections of electronic components to printed circuit boards (PCBs). Such printed circuit boards typically comprise copper-plated wiring surrounding a vir opening, which is copper-plated and then tin-lead coated over the copper. Thus, in the PCB, the leads of the components extend therethrough. The solder used during soldering of the components is typically tin-lead solder and the flux of the present invention is 60-
Used successfully with 40, 63-37, and 96-4 tin-lead solders. 63-37 tin-lead solder is used for most applications.

FIG. 3 depicts an apparatus 24 commonly used for soldering printed circuit boards using wave soldering. It can be seen that the device includes a transport rail 26 that carries a printed circuit board (not shown) at a desired height above the foaming flux unit 10 and soldering wave unit 28. After passing over the foaming flux unit 10 and before contacting the solder wave 36, a flux air knife 30 for blowing excess flux from the PCB assembly, an optional auxiliary heater 3
2. Heat the substrate to 2 and the flux and expose it to a preheater 34 to reduce heat shock to the substrate and the components above it. Various aspects of operation are control panel 38
Controlled from. The temperature of the solder pot 28 is also controlled by the temperature controller 40.

Although the flux of the present invention is specifically intended for use in foaming operations such as those used in the automated soldering process described above, the flux also may be waved, sprayed, or dipping techniques. ). The flux of the present invention is 0.
Rapid movement of flux foam (top chimney surface 18a) that can be raised through flux chimney 18 with sufficient force to create a free height head of flux foam greater than 5 inches. Is formulated to produce rapid movement of the foam through a narrow rectangular hole that rises up to the bottom, and as the foam decreases, the flux foam is collected at the appropriate time and the flux support tray 12 (which ,
Sufficient foam cell collapse must occur to prevent flow out of the flux 14, flux chimney 18, and aeration stone 16). Such a timely collapse is virtually immediate and is called "fast-breaking". Surprisingly, fast breaking bubbles are known as solvent-based fluxes, but such bubbles are not generally known in water-based fluxes.

The effervescent flux can be easily removed using an aqueous cleaning system. The system may contain a surfactant to enhance detergency if desired. A non-ionic wetting agent, such as an ethoxylated alcohol, available under the tradename Triton X-100 from Rohm & Haas (Los Angeles, CA) was added up to about 0.1 wt% of the cleaning solution. obtain.

The degree of cleaning and the need for surfactants are:
Somewhat dependent on user cleaning requirements. Measured with an Omega meter, Model 200 (available from Kenko Industries Inc., Atlanta, GA) when using an ethoxylated alcohol such as Triton X-100 in water in an amount of about 0.007 wt%. If you do, about 7.5
To give a cleanliness of between 20 megohm / cm. These values, although not inherently strict, provide guidelines for addressing military specifications regarding cleanliness requirements for this particular test system.

This water-based soldering flux is
After several weeks of use, it produces good flux foam heads without any noticeable degradation. The fluxes of the present invention avoid the use of ingredients such as glycols, alcohols, or other volatile organic compounds (VOCs) commonly found as commercially available liquid fluxes.

The fluxing agent of the present invention has the following advantages.

1. The fluxes of the present invention eliminate the normally harmful environmental emissions associated with rosin-based fluxes, flux thinners (eg, isopropyl alcohol), and defluxes (eg, 1,1,1-trichloroethane). it can.
In fact, the cleaning of the flux is simply carried out in hot or hot water and a surfactant (if required). Therefore, the new flux is environmentally safe.

2. The flux of the present invention provides all soldering personnel with a non-toxic, very safe and highly effective flux for use.

3. The use of the flux of the present invention reduces the actual soldering time by about 50%. This is an automated soldering using foam flux soldering,
Propagation at a rate usually twice that of rosin-based flux allows the electronic components to be exposed to solder heat for significantly less time.

4. The wave soldered assembly can be cleaned with deionized water, thus eliminating the high capital cost of vapor degreasers. There is also no need to regenerate the defluent and costs associated with distillation.

5. By using the fluxing agent of the present invention, the total cleaning time is reduced by about 10 to 15 minutes as degreasing is not required.

6. By using the fluxing agent of the present invention, there is no need for costly control due to the use of solvents, and no need for equipment approval as required by the local environmental agency.

7. The use of this flux significantly reduces waste disposal costs and waste management costs.

8. Use of the flux of the present invention provides a soldered joint that exhibits high metallic luster and apparent electrical properties.

[0034]

INDUSTRIAL APPLICABILITY The soldering flux of the present invention is suitable for commercial and military foamable automated soldering operations, especially
It is expected to be used for soldering electronic components in circuit boards.

[0035]

EXAMPLES Example 1 A standard fluxing agent solution is essentially prepared by mixing citric acid powder in water to 46%.
It was adjusted to be wt%. The following foaming agents were added to this solution. 0.00274 wt% sodium 1-octane sulfonate, 0.00249 wt% N-octyl-2
-Pyrrolidone and 0.00032 wt% fluoroalkyl sulfonate (sodium salt).

Example 2 A reference flux solution was prepared as in Example 1. The following foaming agents were added to this solution. 0.035 wt% sodium alkyl sulfonate.

Example 3 A standard flux solution was prepared as in Example 1. The following foaming agents were added to this solution. 0.0024 wt% polyoxyalkylene glycol.

Example 4 A standard flux solution was prepared as in Example 1. The following foaming agents were added to this solution. 0.0036 wt% octylphenoxypolyethoxyethanol.

Example 5 A reference flux solution was prepared as in Example 1. The following foaming agents were added to this solution. 0.0030 wt% ethoxylated alcohol.

Example 6 The fluxes prepared in Examples 1-5 were evaluated by foam height, foam cell breakage, life, and level of cleaning. The results are tabulated as Table 1 below.

[0041]

[Table 1] Example 7 A solder / flux malleability test was performed by comparing the process of making a soldering flux with and without the use of a foaming agent (a soldering flux without a foaming agent is a related application. It is the subject of another patent application, previously described in the incorporated Alternate References). A comparison was made to determine if the malleability of the solder was affected by the foaming additive. The flux combinations included the five combinations described in Examples 1-5 and 46% citric acid granules in water.

For the test, a copper panel (about 2 × 2.5 ×
0.060 inch) with 60/40 solid solder wire rings (3/8 inch inner diameter).
Included is placement at a diameter of 060 inches. Place 3 drops of flux in the center of each ring. Next, the copper sample was heated on the hot plate above the melting temperature of the solder. The samples were removed from heat once the solder had liquefied, cleaned and visually examined.

The malleability of the solders prepared with each of the foaming fluxes of Examples 1-5 was compared with the citric acid fluxing agent without the foaming additive.

As noted above, a non-toxic, non-corrosive, foamable soldering flux suitable for use in soldering electronic components has been disclosed. It will be apparent to those skilled in the art that obvious properties can be varied and modified. Also, all such changes and changes are
It is considered to be within the scope of the invention as defined by the appended claims.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view of a conventional effervescent fluxing agent system.

2 is a cross-sectional view of the effervescent fluxing agent system of FIG.

FIG. 3 is a side elevational view of a conventional wave soldering system incorporating the foam flux system of FIGS. 1 and 2.

[Explanation of symbols]

10 ... Conventional foaming flux system, 12 ... Flux tank, 1
4 ... Liquid flux, 16 ... Aeration stone, 18 ... Flux chimney, 1
8a ... Top of flux chimney, 20 ... Air connection, 22
... foam heads, 24 ... equipment normally used for soldering printed circuit boards, 26 ... transport rails, 28 ... solder wave units (solder pots),
30 ... Flux agent air knife, 32 ... Optional auxiliary heater, 3
4 ... Pre-heater, 36 ... Solder wave, 38 ... Control panel, 40 ... Temperature controller.

Front Page Continuation (56) Bibliography Translated by Tadashi Takemoto and Shinichi Fujiuchi "Soldering in Electronics" (August 30, 1986), Nikkan Kogyo Shimbun, Inc. 162-164, 329-331

Claims (16)

(57) [Claims] 1. Soldering a metal comprising applying a foamable soldering flux to a surface, heating the metal to a desired soldering temperature, and applying a solder to the surface. Wherein the flux comprises three components : (a) citric acid in a concentration range of 0.5 to 99.5 wt%, (b) water, and (c) at least one blowing agent. A method characterized by. 2. The method of claim 1, wherein the surface is copper or tinned copper and the solder is
A method that is tin-lead solder. 3. The method of claim 1, wherein the citric acid concentration is at least 5 wt%. 4. The method according to claim 3, wherein the concentration of citric acid is in the range of 20 to 50 wt%. 5. The method of claim 1, wherein the concentration of at least one blowing agent results in a foam head height of at least 0.5 inch for an automated wave soldering process. A method that is sufficient to quickly disintegrate to prevent foam buildup. 6. The method according to claim 5, wherein the concentration of said at least one blowing agent is in the range of 0.0001 to 5.0 wt%. 7. The method of claim 6, wherein said at least one blowing agent is sulfate, sulfonate, sarcosinate, nonylphenol ethoxylate having 6 to 30 moles of ethoxylation, at least 4.5 to Octylphenol ethoxylates with 30 mol ethoxylation, linear alcohol ethoxylates with 6 to 30 mol ethoxylation, amides, amine oxide silicone glycol copolymers, phosphate esters,
A method selected from the group consisting of quaternary ammonium salts, imidazolines, and betaines. 8. The method of claim 7, wherein the at least one blowing agent is sodium 1-octane sulfonate, N-octyl-2-pyrrolidone, fluoroalkyl sulfonate, sodium alkyl sulfonate, polyoxyalkylene. A method selected from the group consisting of glycol, octylphenoxypolyethoxyethanol, and ethoxylated alcohols. 9. The method of claim 8 wherein said at least one blowing agent comprises: (a) 0.0315 wt% to 0.0385 wt% sodium alkyl sulfonate; (b) 0.0018 wt% 0.003 wt% polyoxyalkylene glycol; (c) 0.0030 wt% to 0.0043 wt% octylphenoxypolyethoxyethanol; and (d) 0.0024 wt% to 0.0037 wt% ethoxylated alcohol. A method selected from the group. 10. A non-corrosive, non-toxic, rosin-free, foamable soldering fluxing composition comprising: (a) at least 5 wt% citric acid. A fluxing agent composition comprising three components : (b) water, and (c) at least one blowing agent. 11. The fluxing composition according to claim 10, wherein the citric acid is present in an amount in the range of 20 to 50 wt%. 12. The fluxing composition of claim 10, wherein the concentration of said at least one blowing agent is at least 0.5 for an automated wave soldering process.
Enough to produce an inch foam head height,
A fluxing composition that is sufficient to rapidly disintegrate to prevent foam buildup. 13. The fluxing composition of claim 12, wherein the concentration of the at least one blowing agent is 0.
A fluxing composition in the range of 0001 to 5.0 wt%. 14. The fluxing composition of claim 13, wherein the at least one blowing agent is sulfate, sulfonate, sarcosinate, nonylphenol ethoxylate having 6 to 30 moles of ethoxylation, at least 4. Octylphenol ethoxylates with 5 to 30 mol ethoxylation, linear alcohol ethoxylates with 6 to 30 mol ethoxylation, amides,
A fluxing agent composition selected from the group consisting of amine oxides, silicone glycol copolymers, phosphate esters, quaternary ammonium salts, imidazolines, and betaines. 15. The fluxing composition of claim 14, wherein the at least one blowing agent is sodium 1-
A fluxing composition selected from the group consisting of octane sulfonate, N-octyl-2-pyrrolidone, fluoroalkyl sulfonate, sodium alkyl sulfonate, polyoxyalkylene glycol, octylphenoxy polyethoxyethanol, and ethoxylated alcohol. 16. The fluxing composition of claim 15, wherein said at least one blowing agent comprises: (a) 0.0315 wt% to 0.0385 wt% sodium alkyl sulfonate; 0018 wt% to 0.003 wt% polyoxyalkylene glycol; (c) 0.0030 wt% to 0.0043 wt% octylphenoxypolyethoxyethanol; and (d) 0.0024 wt% to 0.0037 wt% ethoxylated. A fluxing agent composition selected from the group consisting of alcohols.