CN113214914A - Silicone oil cleaning fluid - Google Patents
Silicone oil cleaning fluid Download PDFInfo
- Publication number
- CN113214914A CN113214914A CN202110172157.2A CN202110172157A CN113214914A CN 113214914 A CN113214914 A CN 113214914A CN 202110172157 A CN202110172157 A CN 202110172157A CN 113214914 A CN113214914 A CN 113214914A
- Authority
- CN
- China
- Prior art keywords
- silicone oil
- cleaning solution
- oil cleaning
- alkali metal
- metal hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 94
- 229920002545 silicone oil Polymers 0.000 title claims abstract description 76
- 239000012530 fluid Substances 0.000 title abstract description 5
- -1 alcohol compound Chemical class 0.000 claims abstract description 32
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 30
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 26
- 150000008044 alkali metal hydroxides Chemical class 0.000 claims abstract description 25
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 21
- 239000008139 complexing agent Substances 0.000 claims abstract description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003513 alkali Substances 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 12
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 claims abstract description 8
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 claims abstract description 8
- CPRMKOQKXYSDML-UHFFFAOYSA-M rubidium hydroxide Chemical compound [OH-].[Rb+] CPRMKOQKXYSDML-UHFFFAOYSA-M 0.000 claims abstract description 8
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 4
- 229910005139 FrOH Inorganic materials 0.000 claims abstract description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910019142 PO4 Inorganic materials 0.000 claims abstract description 3
- 150000001412 amines Chemical class 0.000 claims abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims abstract description 3
- 239000010452 phosphate Substances 0.000 claims abstract description 3
- 229920002257 Plurafac® Polymers 0.000 claims description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 11
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 229920000570 polyether Polymers 0.000 claims description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 claims description 5
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 claims description 4
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 4
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 claims description 4
- 229960003330 pentetic acid Drugs 0.000 claims description 4
- 229920001983 poloxamer Polymers 0.000 claims description 4
- KEZYHIPQRGTUDU-UHFFFAOYSA-N 2-[dithiocarboxy(methyl)amino]acetic acid Chemical compound SC(=S)N(C)CC(O)=O KEZYHIPQRGTUDU-UHFFFAOYSA-N 0.000 claims description 3
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims description 3
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 239000001099 ammonium carbonate Substances 0.000 claims description 3
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 3
- 229960002887 deanol Drugs 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 239000012972 dimethylethanolamine Substances 0.000 claims description 3
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 claims description 3
- PYIDGJJWBIBVIA-UYTYNIKBSA-N lauryl glucoside Chemical compound CCCCCCCCCCCCO[C@@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O PYIDGJJWBIBVIA-UYTYNIKBSA-N 0.000 claims description 3
- 229940048848 lauryl glucoside Drugs 0.000 claims description 3
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 claims description 3
- 229940113115 polyethylene glycol 200 Drugs 0.000 claims description 3
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims description 3
- 229940057847 polyethylene glycol 600 Drugs 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 235000011181 potassium carbonates Nutrition 0.000 claims description 3
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 3
- 235000017550 sodium carbonate Nutrition 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 claims description 2
- 229940035437 1,3-propanediol Drugs 0.000 claims description 2
- 229920000166 polytrimethylene carbonate Polymers 0.000 claims description 2
- 239000003921 oil Substances 0.000 abstract description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052710 silicon Inorganic materials 0.000 abstract description 17
- 239000010703 silicon Substances 0.000 abstract description 17
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000007788 liquid Substances 0.000 abstract description 8
- 239000002585 base Substances 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- 238000007639 printing Methods 0.000 abstract description 5
- 238000007127 saponification reaction Methods 0.000 abstract description 4
- 230000009471 action Effects 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 53
- 239000008367 deionised water Substances 0.000 description 11
- 229910021641 deionized water Inorganic materials 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 9
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 9
- 235000012239 silicon dioxide Nutrition 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 238000005303 weighing Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 238000011086 high cleaning Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- 229940093475 2-ethoxyethanol Drugs 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011268 retreatment Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/662—Carbohydrates or derivatives
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/08—Silicates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/10—Carbonates ; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2006—Monohydric alcohols
- C11D3/2017—Monohydric alcohols branched
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2044—Dihydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2065—Polyhydric alcohols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3703—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3707—Polyethers, e.g. polyalkyleneoxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C11D2111/22—
Abstract
The invention provides a silicone oil cleaning fluid. The silicone oil cleaning solution comprises the following components in parts by weight: 0.5-10g/L of alkali metal hydroxide, 10-30g/L of organic alkali compound, 5-50g/L of alkaline washing aid, 0.5-10g/L of alcohol compound, 0.5-15g/L of complexing agent, 0.1-10g/L of nonionic surfactant and the balance of water; wherein the alkali metal hydroxide comprises LiOH, NaOH, KOH, RbOH, CsOH or FrOH, the organic base compound comprises an organic amine, and the alkaline builder comprises a carbonate, a silicate or a phosphate. Under the saponification action of alkali metal hydroxide, the silicon oil cleaning liquid ensures that the silicon oil cleaning liquid does not corrode a base material while the organic alkali compound provides alkalinity, and is matched with an alkaline washing assistant, an alcohol compound, a complexing agent and a nonionic surfactant, so that the silicon oil is quickly cleaned and removed, and the character printing ink on a substrate is ensured not to be attacked.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a silicone oil cleaning solution.
Background
A Flexible Printed Circuit (FPC) is a Printed Circuit made of a Flexible insulating base material. The FPC provides excellent electrical performance, can meet design requirements for smaller and higher density mounting, and also contributes to reduction in assembly processes and enhancement of reliability.
In the FPC board lamination, a release film material is used. In the production and coating process, special process technology is adopted for treatment, and the method has the characteristics of high temperature resistance, good release effect and no pollution in the pressing process and is suitable for the production of rigid circuit boards and flexible circuit boards. Silicone oil transfer occurs during lamination of the release film. The tension of the silicone oil is small, the silicone oil is easy to leak out of a machine, the gas solubility of the silicone oil is high, effective sealing treatment is difficult to carry out, the thermal expansion coefficient of the silicone oil is high, and the silicone oil is remained due to an overpressure problem. Therefore, silicone oil on the release film is transferred to the circuit board in the manufacturing process of the flexible FPC circuit board, so that the silicone oil needs to be cleaned to remove in the subsequent manufacturing process.
When a circuit board is cleaned, the removal efficiency of general strong acid and strong base on silicone oil is not high, the strong base has a certain expansion effect on a polyimide PI film, and the problem of falling off of character printing ink is caused. The plasma cleaning can improve the treatment effect on the copper surface of the circuit board, so that an operator is far away from the harm of harmful solvents, the plasma cleaning can be used for increasing a micro-adhesive film sticking flow (high temperature resistance and no glue falling) after gold melting to protect the gold surface, and meanwhile, the surface of a device is dry after the plasma cleaning without retreatment, so that the treatment efficiency of the whole process flow line can be improved. However, the plasma cleaning still has the problems of long cleaning time and low cleaning efficiency.
Disclosure of Invention
The invention aims to provide a silicone oil cleaning solution to solve the problems of slow cleaning and low cleaning efficiency in the prior art.
In order to solve the technical problems, the invention provides a silicone oil cleaning solution which comprises the following components in parts by weight:
0.5-10g/L of alkali metal hydroxide, 10-30g/L of organic alkali compound, 5-50g/L of alkaline washing aid, 0.5-10g/L of alcohol compound, 0.5-15g/L of complexing agent, 0.1-10g/L of nonionic surfactant and the balance of water;
wherein the alkali metal hydroxide comprises LiOH, NaOH, KOH, RbOH, CsOH or FrOH, the organic base compound comprises an organic amine, and the alkaline builder comprises a carbonate, a silicate or a phosphate.
In one embodiment, the alkali metal hydroxide is NaOH or KOH.
In one embodiment, the organic base compound comprises tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethanolamine, dipropylamine, triethanolamine, or dimethylethanolamine.
In one embodiment, the alkali metal hydroxide is present in an amount of 1 to 5 g/L;
the content of the organic alkali compound is 15-20 g/L.
In one embodiment, the alkaline builder comprises at least one of sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, sodium metasilicate pentahydrate, or sodium tripolyphosphate.
In one embodiment, the alcohol compound includes polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, 1, 3-propanediol, 1, 4-butanediol, glycerol, or isopropanol.
In one embodiment, the alkaline wash aid is present in an amount of 10 to 25 g/L; the content of the alcohol compound is 3-5 g/L.
In one embodiment, the complexing agent comprises at least one of nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid.
In one embodiment, the nonionic surfactant comprises at least one of polyoxyethylene nonylphenyl ether X-100, propylene glycol block polyether L61, Plurafac LF 305, PO-EO block polyether, Pluronic PE6200, lauryl glucoside APG1214, Plurafac LF221, Plurafac LF 403.
In one embodiment, the content of the complexing agent is 1-10g/L, and the content of the nonionic surfactant is 0.5-5 g/L.
According to the technical scheme, the invention has the advantages and positive effects that:
the silicone oil cleaning solution comprises alkali metal hydroxide, an organic alkali compound, an alkaline washing assistant, an alcohol compound, a complexing agent and a nonionic surfactant. The components ensure that the silicon oil cleaning solution does not corrode a base material while providing alkalinity for an organic alkali compound under the saponification action of the alkali metal hydroxide, and are matched with an alkaline washing assistant, an alcohol compound, a complexing agent and a nonionic surfactant, so that the character printing ink on a substrate is not attacked while the silicon oil is quickly cleaned and removed.
Detailed Description
Exemplary embodiments that embody features and advantages of the invention are described in detail below in the specification. It is to be understood that the invention is capable of modification in various embodiments without departing from the scope of the invention, and that the description is intended to be illustrative in nature and not to limit the invention.
Silicone oil generally refers to a linear polysiloxane product that remains a liquid at room temperature, and is generally a colorless (or pale yellow), odorless, non-toxic, and non-volatile liquid. The silicone oil is insoluble in water, methanol, ethylene glycol and 2-ethoxyethanol, can be mutually soluble with benzene, dimethyl ether, methyl ethyl ketone, carbon tetrachloride or kerosene, and is slightly soluble in acetone, dioxane, ethanol and butanol. It has very low vapor pressure, high flash point and ignition point, and low freezing point.
The silicone oil has heat resistance, electric insulation, weather resistance, hydrophobicity, physiological inertia and smaller surface tension, and also has low viscosity-temperature coefficient and higher compression resistance.
Since silicone oil has properties such as insulation, silicone oil is used in the manufacturing process of the wiring board to achieve the effect of insulation. However, in the latter process, the silicone oil needs to be washed away so as not to interfere with the continuation of the process.
The invention provides a silicone oil cleaning fluid which is used for cleaning silicone oil. The silicon oil cleaning solution is suitable for cleaning silicon oil on a substrate, wherein the substrate can be a circuit board, such as a Flexible Printed Circuit (FPC) or a Printed Circuit Board (PCB).
The silicone oil cleaning solution provided by the invention has the advantages of high cleaning speed, no residue, no attack on character ink and suitability for a horizontal spraying operation environment.
The cleaning principle of the silicone oil cleaning solution is specifically described below.
The silicone oil cleaning solution comprises the following components in parts by weight:
0.5-10g/L of alkali metal hydroxide, 10-30g/L of organic alkali compound, 5-50g/L of alkaline washing aid, 0.5-10g/L of alcohol compound, 0.5-15g/L of complexing agent, 0.1-10g/L of nonionic surfactant and the balance of water.
The alkali metal hydroxide, the organic alkali compound, the alkaline washing assistant, the alcohol compound, the complexing agent and the nonionic surfactant are matched with each other, and if the alkali metal hydroxide, the organic alkali compound, the alkaline washing assistant, the alcohol compound, the complexing agent and the nonionic surfactant are matched with each other, the character printing ink on the substrate can be ensured not to be attacked while the silicon oil can be quickly cleaned and removed. The specific principle is as follows:
the alkali metal hydroxide reacts with the silicone oil to form stearate and glycerin, which dissolves into the alkaline solution. The reaction is a saponification reaction.
The organic alkali compound is compounded with the alkali metal hydroxide to provide the alkalinity of the whole silicon oil cleaning solution, and the silicon oil cleaning solution is ensured not to corrode a substrate on the premise of ensuring the cleaning.
The addition of the alkaline washing assistant can keep the alkalinity of the silicon oil cleaning fluid, so that the silicon oil and other oil stains and impurities can swell in an alkaline environment, and the cleaning effect is improved; the alkaline builder also provides negative charges to help remove solid soil particles and increase cleaning effectiveness.
Complexing agents are used to bind heavy metals such as calcium, magnesium, copper, etc. to form soluble complexes that accelerate cleaning. During the cleaning process, the detergent can firstly chelate with metal ions in water to soften the water, thereby saving the surfactant.
The alcohol compound functions to improve the solubility of organic substances. According to the principle of similarity and compatibility, the alcohol compound is added to improve the solubility of organic matters and other organic impurities in the silicone oil so as to promote cleaning.
The nonionic surfactant generates a small amount of foam in the horizontal spraying process, and is used for reducing the surface tension of the silicone oil cleaning solution, so that the silicone oil cleaning solution is easier to wet and permeate.
The silicon oil cleaning liquid disclosed by the invention realizes quick cleaning and silicon oil removal through the matching of all components, and simultaneously ensures that the character characters on the substrate are not attacked, thereby ensuring the cleaning efficiency and the cleaning quality.
Specifically, the alkali metal hydroxide includes LiOH, NaOH, KOH, RbOH, CsOH, FrOH. In this example, the alkali metal hydroxide is NaOH or KOH.
When the content of the alkali metal hydroxide is less than 0.5g/L, it is not favorable for removing organic matters and impurity particles. When the content of the alkali metal hydroxide is more than 10g/L, swelling of a Polyimide Film (PI Film for short) and ink falling-off of characters and characters are caused.
Further, the content of the alkali metal hydroxide is 1 to 5 g/L.
The organic base compound comprises tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethanolamine, dipropylamine, triethanolamine or dimethylethanolamine.
Wherein, the content of the organic base compound is preferably 15-20 g/L.
The alkaline builder comprises one or more of carbonate such as sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, silicate such as sodium metasilicate pentahydrate, and sodium tripolyphosphate.
Further, the content of the alkaline builder is more preferably 10 to 25 g/L.
The complexing agent comprises at least one of Nitrilotriacetic Acid (NTA), ethylenediaminetetraacetic Acid (EDTA), and diethylenetriaminepentaacetic Acid (DPTA).
Further, the content of the complexing agent is preferably 1-10 g/L.
The alcohol compounds include polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, 1, 3-propylene glycol, 1, 4-butylene glycol, glycerol or isopropanol.
When the content of the alcohol compound is less than 0.5g/L, the wetting effect is not significant. When the content of the alcohol compound is more than 10g/L, the overall cost is increased.
Further, the content of the alcohol compound is more preferably 3 to 5 g/L.
The nonionic surfactant comprises at least one of polyoxyethylene nonyl phenyl ether X-100, propylene glycol block polyether L61, Plurafac LF 305, PO-EO block polyether, Pluronic PE6200, lauryl glucoside APG1214, Plurafac LF221, Plurafac LF 403.
Of these, Plurafac LF 305, Pluronic PE6200, Plurafac LF221 and Plurafac LF 403 are all surfactants produced by BASF.
When the content of the nonionic surfactant is less than 0.1g/L, the wetting and penetrating effect is not significant. When the content of the nonionic surfactant is more than 10g/L, the nonionic surfactant is likely to remain on the surface of the substrate, thereby increasing the cleaning time.
Further, the content of the nonionic surfactant is more preferably 0.5 to 1.5 g/L.
The applicant of the invention can obtain the silicone oil cleaning solution with high cleaning efficiency and high cleaning quality by strictly compounding the components.
The contents of the components are described below by way of examples.
Example 1
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 2
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 3
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 4
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 5
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 6
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Example 7
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
the preparation method of the silicone oil cleaning solution in the embodiment comprises the following steps:
weighing the components, mixing, and slowly adding deionized water while stirring to obtain the silicic acid cleaning solution.
Comparative example 1
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
20g of sodium hydroxide, namely sodium hydroxide,
the balance of deionized water.
The preparation method of the silicone oil cleaning solution in the comparative example comprises the following steps:
20g of sodium hydroxide is weighed, and deionized water is slowly added while stirring, so that the silicic acid cleaning solution is obtained.
Comparative example 2
Taking 1L of prepared silicone oil cleaning solution as an example, the silicone oil cleaning solution comprises the following components in percentage by weight:
20g of potassium hydroxide is added into the mixture,
the balance of deionized water.
The preparation method of the silicone oil cleaning solution in the comparative example comprises the following steps:
20g of potassium hydroxide is weighed, and deionized water is slowly added while stirring, so that the silicic acid cleaning solution is obtained.
After the characters are printed on the flexible circuit board (hereinafter referred to as FPC) after high-temperature pressing, the FPC is used as a test substrate to test whether the character characters on the FPC are attacked by the silicon oil cleaning liquid. The FPC was cleaned for 15 to 45 seconds at normal temperature using the silicone oil cleaning solutions of examples 1 to 6 and comparative examples 1 to 2, and then cleaned and dried, and the surface tension was measured using a Daton pen No. 34. The Dainan pen does not fade within 5 seconds is taken as a judgment standard. The test results are shown in table 1.
TABLE 1
| Surface tension | Character of the characters | |
| Example 1 | Superior food | Not attack |
| Example 2 | Superior food | Not attack |
| Example 3 | Good effect | Not attack |
| Example 4 | Superior food | Not attack |
| Example 5 | Good effect | Not attack |
| Example 6 | Superior food | Not attack |
| Example 7 | Superior food | Not attack |
| Comparative example 1 | Difference (D) | Attack of |
| Comparative example 2 | Difference (D) | Attack of |
Wherein, in the surface tension test result, the dyne pen does not fade within 5 seconds; good means that within 5 seconds, the dyne pen fades slightly; the middle represents that the dyne pen fades within 5 seconds; the difference represents that the dyne pen faded significantly within 5 seconds.
As can be seen from the above table, the surface tension of the silicone oil remover in examples 1 to 7 is better than that of comparative examples 1 to 2, and therefore, the removing effect of the silicone oil remover in examples 1 to 7 is better. The silicone oil removing liquid in the examples 1 to 6 does not attack the characters on the FPC, while the silicone oil removing liquid in the comparative examples 1 to 2 attacks the characters on the FPC, damages the FPC and further causes the quality of the FPC to be poor.
According to the technical scheme, the invention has the advantages and positive effects that:
the silicone oil cleaning solution comprises alkali metal hydroxide, an organic alkali compound, an alkaline washing assistant, an alcohol compound, a complexing agent and a nonionic surfactant. The components ensure that the silicon oil cleaning solution does not corrode a base material while providing alkalinity for an organic alkali compound under the saponification action of the alkali metal hydroxide, and are matched with an alkaline washing assistant, an alcohol compound, a complexing agent and a nonionic surfactant, so that the character printing ink on a substrate is not attacked while the silicon oil is quickly cleaned and removed.
While the present invention has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.
Claims (10)
1. The silicone oil cleaning solution is characterized by comprising the following components in parts by weight:
0.5-10g/L of alkali metal hydroxide, 10-30g/L of organic alkali compound, 5-50g/L of alkaline washing aid, 0.5-10g/L of alcohol compound, 0.5-15g/L of complexing agent, 0.1-10g/L of nonionic surfactant and the balance of water;
wherein the alkali metal hydroxide comprises LiOH, NaOH, KOH, RbOH, CsOH or FrOH, the organic base compound comprises an organic amine, and the alkaline builder comprises a carbonate, a silicate or a phosphate.
2. The silicone oil cleaning solution according to claim 1, characterized in that the alkali metal hydroxide is NaOH or KOH.
3. The silicone oil cleaning solution according to claim 1, wherein the organic base compound comprises tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethanolamine, dipropylamine, triethanolamine, or dimethylethanolamine.
4. The silicone oil cleaning solution according to claim 1, characterized in that the content of the alkali metal hydroxide is 1 to 5 g/L;
the content of the organic alkali compound is 15-20 g/L.
5. The silicone oil cleaning solution of claim 1, wherein the alkaline builder comprises at least one of sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, sodium metasilicate pentahydrate, or sodium tripolyphosphate.
6. The silicone oil cleaning solution as set forth in claim 1, wherein the alcohol compound comprises polyethylene glycol 200, polyethylene glycol 400, polyethylene glycol 600, 1, 3-propanediol, 1, 4-butanediol, glycerol or isopropanol.
7. The silicone oil cleaning solution according to claim 1, characterized in that the content of the alkaline builder is 10-25 g/L; the content of the alcohol compound is 3-5 g/L.
8. The silicone oil cleaning solution according to claim 1, wherein the complexing agent comprises at least one of nitrilotriacetic acid, ethylenediaminetetraacetic acid, diethylenetriaminepentaacetic acid.
9. The silicone oil cleaning solution of claim 1, wherein the nonionic surfactant comprises at least one of polyoxyethylene nonylphenyl ether X-100, propylene glycol block polyether L61, Plurafac LF 305, PO-EO block polyether, Pluronic PE6200, lauryl glucoside APG1214, Plurafac LF221, Plurafac LF 403.
10. The silicone oil cleaning solution as set forth in claim 1, wherein the complexing agent is present in an amount of 1 to 10g/L, and the nonionic surfactant is present in an amount of 0.5 to 5 g/L.
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