CN106479761A - Use in printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application - Google Patents
Use in printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application Download PDFInfo
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- CN106479761A CN106479761A CN201510539944.0A CN201510539944A CN106479761A CN 106479761 A CN106479761 A CN 106479761A CN 201510539944 A CN201510539944 A CN 201510539944A CN 106479761 A CN106479761 A CN 106479761A
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Abstract
The present invention relates to printed circuit board (PCB) cleaning field, disclose a kind of environmentally friendly, use in printed circuit board waterborne cleaning agent composition for not using surfactant and cleaning performance good, the use in printed circuit board waterborne cleaning agent prepared by said composition, and the cleaning method of the printed circuit board (PCB) using the cleaning agent.The composition contains：Water-soluble alcohol ether, water-insoluble dibasic acid ester, defoamer, nonionic organic reducing agent and the organic saponification agent of nonionic, wherein, the defoamer is dipropylene glycol propyl ether.By the use in printed circuit board waterborne cleaning agent of the present invention, within 15min can the harmful substance such as fully erased remaining scaling powder, high-temperature oxide and grease, complete matting by direct baking need not be rinsed；Circuit board solder joint light after cleaning, 4 times of amplification sem observation noresidues, surface insulation resistance and ion residues concentration can all meet the requirement of IPC standard.
Description
Technical field
The present invention relates to a kind of use in printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation side
Method and application, in particular it relates to a kind of use in printed circuit board waterborne cleaning agent composition, pass through the printing
The use in printed circuit board waterborne cleaning agent that circuit board waterborne cleaning agent composition is prepared, the printing are electric
The preparation method of road plate waterborne cleaning agent and the printing using the use in printed circuit board waterborne cleaning agent
The cleaning method of circuit board and application.
Background technology
The postwelding cleaning of wiring board mainly has two methods at present.First method is to be carried out clearly using solvent
The method that washes, the method clean the residual of postwelding by using fluorochlorohydrocarbon class solvent or ethanol/isopropanol
Thing.Second method is the method being carried out using surfactant, and the method is by using nonyl phenol
The surfactants such as APEO, AEO, sodium alkyl benzene sulfonate, glucoside are multiple
Mix with water to clean postwelding residue after joining.
But, the method being carried out using solvent, its VOC (VOC) are discharged huge
Greatly, effect on environment is severe；Also, fluorochlorohydrocarbon class solvent is huge to depletion of the ozone layer, strictly limited
System is used；Ethanol/isopropyl alcohols solvent is fast except evaporation rate, outside VOC emission height, flash-point itself
Relatively low, static discharge easily causes combustion explosion, and the requirement of explosion proof to production environment is very high.
Method is carried out using surfactant, exist surfactant sheet have on pcb board residual
The problem that stays, needs deionized water to rinse after cleaning, water resource waste is huge, and washings COD
Severe overweight, needs could be discharged after processing；In addition, surfactant load is limited in one's ability, number is cleaned
Secondary rear surfactant saturation cannot continue adsorption removal pollutant, often need to change.
Content of the invention
It is an object of the invention to overcoming above-mentioned problems of the prior art, provide a kind of to environment friend
Use in printed circuit board waterborne cleaning agent composition that is good, not using surfactant and cleaning performance good, leads to
The use in printed circuit board waterborne cleaning agent that the use in printed circuit board waterborne cleaning agent composition is prepared is crossed,
And the cleaning method of the printed circuit board (PCB) using the use in printed circuit board waterborne cleaning agent.
According to the first aspect of the invention, the invention provides a kind of use in printed circuit board waterborne cleaning agent group
Compound, said composition contain：Water-soluble alcohol ether, water-insoluble dibasic acid ester, defoamer, nonionic
Organic reducing agent and the organic saponification agent of nonionic, wherein, the defoamer is dipropylene glycol propyl ether.
According to the second aspect of the invention, the invention provides a kind of use in printed circuit board waterborne cleaning agent
Preparation method, wherein, the method include by the use in printed circuit board waterborne cleaning agent composition of the present invention with
Deionized water mixes.
According to the third aspect of the invention we, the invention provides a kind of use in printed circuit board waterborne cleaning agent,
Wherein, the use in printed circuit board waterborne cleaning agent is prepared by said method.
According to the fourth aspect of the invention, the invention provides a kind of cleaning method of printed circuit board (PCB), its
In, the method includes to be connect the use in printed circuit board waterborne cleaning agent of the present invention with printed circuit board (PCB)
Touch.
According to the fifth aspect of the invention, the invention provides the aqueous cleaning of the use in printed circuit board of the present invention
Application of the agent in the residue of the postwelding of cleaning printed circuit board (PCB).
According to the use in printed circuit board waterborne cleaning agent composition of the present invention, due to not using surface-active
Agent, therefore, residue problem without surfactant, directly dry after cleaning, need not go in a large number
Ionized water is rinsed.In addition, solve profit by using the compatibility of specific defoamer dipropylene glycol propyl ether mixing
Bubble during conjunction, makes system completely still, can meet closed high-pressure spraying technique, and avoid
The silicon residue problem caused using organic silicon defoamer.
Also, the present invention is existed by making water-soluble alcohol ether and the boiling point of water-insoluble dibasic acid ester further
More than 150 DEG C, so as in use almost without VOC emission, environmentally friendly, and cleaning agent body
Be nothing flash-point, using process safety reliability, without the need for explosion-proof.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Specific embodiment
Specific embodiment to the present invention is described in detail below.It should be appreciated that this place is retouched
The specific embodiment that states is merely to illustrate and explains the present invention, is not limited to the present invention.
In the present invention, solubility when water solubility refers to 20 DEG C in 100g water is more than 10g；Non-aqueous
Solubility when dissolubility refers to 20 DEG C in 100g water is less than 1g.
In the present invention, boiling point refers to boiling point at normal atmospheric pressure.
According to the first aspect of the invention, the invention provides a kind of use in printed circuit board waterborne cleaning agent group
Compound, said composition contain：Water-soluble alcohol ether, water-insoluble dibasic acid ester, defoamer, nonionic
Organic reducing agent and the organic saponification agent of nonionic, wherein, the defoamer is dipropylene glycol propyl ether.
According to the first aspect of the invention, although as long as containing mentioned component, you can provide a kind of to environment
Use in printed circuit board waterborne cleaning agent composition that is friendly, not using surfactant and cleaning performance good.
But consider from above-mentioned technique effect is obtained further, preferred in the case of, with respect to 100 weight portions
The water solubility alcohol ether, the content of the water-insoluble dibasic acid ester is 85-140 weight portion, described disappears
The content of infusion is 15-45 weight portion, and the content of the nonionic organic reducing agent is 0.3-1.5 weight
Part, the content of the organic saponification agent of the nonionic is 10-35 weight portion；It is highly preferred that with respect to 100
The water solubility alcohol ether of weight portion, the content of the water-insoluble dibasic acid ester is 100-130 weight portion,
The content of the defoamer is 20-40 weight portion, and the content of the nonionic organic reducing agent is 0.5-1
Weight portion, the content of the organic saponification agent of the nonionic is 15-30 weight portion；It is further preferred that
With respect to the water solubility alcohol ether of 100 weight portions, the content of the water-insoluble dibasic acid ester is
105-120 weight portion, the content of the defoamer is 25-35 weight portion, and the nonionic is organic also
The content of former agent is 0.6-0.8 weight portion, and the content of the organic saponification agent of the nonionic is 18-27 weight
Part.
According to the first aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention contains
Water-soluble alcohol ether.Consider from the security of use in printed circuit board waterborne cleaning agent that obtains is improved, preferably
The boiling point of the water solubility alcohol ether is more than 150 DEG C, more preferably more than 185 DEG C, more preferably
190-280℃.By using such water solubility alcohol ether, VOC is nearly free from, and have and obtain
The high advantage using safety of cleaning agent flash-point.Importantly, preparing use in printed circuit board water
Property cleaning agent in, by the water solubility alcohol ether, the water-insoluble dibasic acid ester and the defoamer
Synergy, cleaning agent system can be made completely still, with confined space inner high voltage spray use
Still advantage.
As above-mentioned water-soluble alcohol ether, preferably dihydroxylic alcohols dialkyl ether.As preferred dihydroxylic alcohols two
Alkyl ether can be enumerated：(boiling point is for dipropylene glycol methyl ether (boiling point be 190 DEG C), tripropylene glycol methyl ether
243 DEG C), triethylene glycol butyl ether (boiling point be 271.2 DEG C), tri ethylene glycol ethyl ether (boiling point is 255.9 DEG C)
With one or more in butyl (boiling point is 230 DEG C).
According to the first aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention contains
Water-insoluble dibasic acid ester.Examine from the security of use in printed circuit board waterborne cleaning agent that obtains is improved
Consider, the boiling point of preferably described water-insoluble dibasic acid ester is more than 150 DEG C, more preferably more than 185 DEG C,
More preferably 200-250 DEG C.By using such water-insoluble dibasic acid ester, it is nearly free from
VOC, and have the advantages that the cleaning agent flash-point height for obtaining using safety.Importantly, preparing
Obtain in use in printed circuit board waterborne cleaning agent, by the water-insoluble dibasic acid ester, the water solubility
Alcohol ether and the synergy of the defoamer, can make cleaning agent system completely still, with have
Confined space inner high voltage spray uses still advantage.
As above-mentioned water-insoluble dibasic acid ester, preferably dibutyl carbonate (boiling point is 207 DEG C), penta
Acid dimethyl (boiling point be 214 DEG C) and dimethyl adipate (boiling point is 226 DEG C), in one kind or
Multiple.
According to the first aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention contains
Defoamer, and the defoamer is dipropylene glycol propyl ether.In the present invention, the defoamer can be at this
Oil phase in the composition of invention and with water phase in be respectively provided with certain dissolubility, so as to special
The effect of froth breaking.
According to the first aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention contains
Nonionic organic reducing agent.The nonionic organic reducing agent can be to producing during welding in wiring board
Metal oxide reduced such that it is able to make solder joint light.Also, due to the reducing agent for non-from
Sub- property organic reducing agent, therefore, it is possible to avoid introducing ion in cleaning, compares ionic reducing agent, no
Secondary ion can be brought to pollute.
The nonionic organic reducing agent is alkyl ketone oximes reducing agent；Preferably, the nonionic
Organic reducing agent is DMKO and/or diacetylmonoxime.
According to the first aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention contains
The organic saponification agent of nonionic.The organic saponification agent of the nonionic can to the rosin that remains during welding and
Organic acid scaling powder carries out saponification, generates the salt for being dissolved in water, is dissolved into aqueous cleaning from wiring board
Remove in agent.Also, due to being the organic saponification agent of nonionic in the saponification agent, therefore, it is possible to avoid
Ion is introduced in cleaning, ionic saponification agent is compared, secondary ion will not be brought to pollute.
As long as above-mentioned purpose can be realized as the organic saponification agent of the nonionic can be without particularly
Limit.For example, the organic saponification agent of the nonionic can be aminomethyl propanol, isopropanolamine and ethanol
One or more in amine.
According to the first aspect of the invention, in the case of preferred, the use in printed circuit board of the present invention is aqueous clear
Detergent composition can also contain the organic pH value regulator of nonionic.The organic pH of the nonionic
Value conditioning agent can adjust the pH value of the use in printed circuit board waterborne cleaning agent for obtaining, so that system
PH value is more stable, improves load capacity and the service life of cleaning agent；Also, due in the conditioning agent
For the organic pH value regulator of nonionic, therefore, it is possible to avoid ion being introduced in cleaning, compare ion
Property pH value regulator, will not bring secondary ion pollute.
As long as above-mentioned purpose can be realized as the organic pH value regulator of the nonionic can be without spy
Other restriction.For example, the organic pH value regulator of the nonionic can be that triethanolamine and/or three are different
Propanolamine.
As the consumption of the organic pH value regulator of above-mentioned nonionic, as long as can be by the printing for obtaining electricity
The pH of road plate waterborne cleaning agent is adjusted to the scope of 10.4-11.5.In order that the printing electricity for arriving
The pH value of road plate waterborne cleaning agent within the above range, usually, with respect to 100 weight
Part the water solubility alcohol ether, the consumption of the organic pH value regulator of the nonionic is 3-6 weight portion,
Preferably 3-5 weight portion.
According to the first aspect of the invention, in the case of preferred, the use in printed circuit board of the present invention is aqueous clear
Detergent composition can also contain nonionic organic inhibitor.By organic slow containing the nonionic
Erosion agent, metalwork that can be on protection circuit plate are not corroded.Also, as the corrosion inhibiter is nonionic
Property organic inhibitor, therefore, it is possible to avoid cleaning when introduce ion, compare ionic corrosion inhibiter, will not
Secondary ion is brought to pollute.
As long as above-mentioned purpose can be realized as the nonionic organic inhibitor, not special
Limit.For example, the nonionic organic inhibitor can be BTA and/or mercaptobenzothiazoler.
Consumption as the nonionic organic inhibitor can be changed in wide scope.Preferably,
With respect to the water solubility alcohol ether of 100 weight portions, the consumption of the nonionic organic inhibitor is
1-1.5 weight portion, preferably 1.1-1.4 weight portion.
According to the first aspect of the invention, on the basis of the effect for not damaging the present invention, the print of the present invention
Printed circuit board waterborne cleaning agent composition can also contain other various additives commonly used in the art.
The additive can be for example bactericide.
OIT and/or BIT can for example be enumerated as the bactericide.In addition,
Consumption as the bactericide has no particular limits, for example, with respect to the water of 100 weight portions
Dissolubility alcohol ether, the consumption of the non-bactericide is 0.6-1 weight portion.
According to the second aspect of the invention, the invention provides above-mentioned use in printed circuit board waterborne cleaning agent
Preparation method, wherein, the method include by the use in printed circuit board waterborne cleaning agent composition of the present invention with
Deionized water mixes.
According to the second aspect of the invention, the use in printed circuit board waterborne cleaning agent composition of the present invention with go
The consumption of ionized water can be changed in wide scope.Preferably, with respect to the print of 100 weight portions
Printed circuit board waterborne cleaning agent composition, the consumption of the deionized water is 300-400 weight portion, more
Preferably 350-400 weight portion.
In the present invention, for by the use in printed circuit board waterborne cleaning agent composition of the present invention and deionization
Water carries out order by merging and mode, and there is no particular limitation, and which can be sequentially arbitrary, its hybrid mode
It can be the hybrid mode of the routine of this area.But it is aqueous from the use in printed circuit board that obtains is improved further
The storage stability of cleaning agent considering, the use in printed circuit board waterborne cleaning agent of the present invention preferably adopt with
Under step be prepared.
(1) the nonionic organic reducing agent is mixed with portions of de-ionized water, prepares nonionic
Organic reducing agent content is the solution (the preferably solution of 25 weight %) of 22-27 weight %；
(2) solution that step (1) obtained, the water solubility alcohol ether, the water-insoluble binary acid
Ester, the nonionic organic reducing agent, the optionally organic saponification agent of the nonionic, nonionic
Organic pH value regulator and after optionally nonionic organic inhibitor is mixed, then with remaining
Deionized water mixes.
According to the third aspect of the invention we, the invention provides a kind of use in printed circuit board waterborne cleaning agent,
Wherein, the use in printed circuit board waterborne cleaning agent is prepared by said method.
According to the fourth aspect of the invention, the invention provides a kind of cleaning method of printed circuit board (PCB), its
In, the method includes to be connect the use in printed circuit board waterborne cleaning agent of the present invention with printed circuit board (PCB)
Touch.
According to the fourth aspect of the invention, for by the use in printed circuit board waterborne cleaning agent of the present invention and print
The mode contacted by printed circuit board, there is no particular limitation, can be the conventional way of contact in this area.
But in order to further provide for the effect that cleans, present invention preferably employs cleaning weldering by way of high-pressure spraying
Printed circuit board (PCB) afterwards.
According to the fourth aspect of the invention, by the use in printed circuit board waterborne cleaning agent of the present invention and printing electricity
The temperature contacted by road plate is preferably less than 60 DEG C；Consider from security more preferably 50 DEG C with
Under, more preferably 45-50 DEG C.In addition, the time as contact is defined by cleaning up, generally
For less than 15 minutes, preferably 12-14 minute.
According to the fifth aspect of the invention, the invention provides above-mentioned use in printed circuit board waterborne cleaning agent exists
Application in the residue of the postwelding of cleaning printed circuit board (PCB).
By the use in printed circuit board waterborne cleaning agent of the present invention, can be fully erased residual within 15min
The harmful substances such as remaining scaling powder, high-temperature oxide and grease, complete by need not rinsing direct baking clear
Wash operation；Circuit board solder joint light after cleaning, 4 times of amplification sem observation noresidues, surface insulation resistance
The requirement of IPC standard can be all met with ion residues concentration.
Embodiment
Hereinafter will be described the present invention by embodiment, but the present invention will be not limited in following realities
Apply example.
Embodiment 1-7
Composite formula according to table 1 below prepares cleaning agent A1-A7.Its preparation method is specially：Will
Nonionic organic reducing agent (abbreviation reducing agent in table 1) is dissolved in deionized water (wherein nonionic
The concentration of organic reducing agent is 25 weight %), stir；Then, by the component in addition to deionized water
Put in stirred tank, high-speed stirred 20min, add remaining deionized water stirring 5min.
Table 1
Comparative example 1
Method according to embodiment 1 is carried out, and except for the difference that, does not contain DPG third in composite formula
Ether and DMKO, obtain cleaning agent D1.
Comparative example 2
Method according to embodiment 1 is carried out, and except for the difference that, does not contain DPG third in composite formula
Ether, obtains cleaning agent D2.
Comparative example 3
Method according to embodiment 1 is carried out, and except for the difference that, does not contain DMKO in composite formula,
Obtain cleaning agent D3.
Comparative example 4
Method according to embodiment 1 is carried out, and except for the difference that, does not contain aminomethyl propanol in composite formula,
Obtain cleaning agent D4.
Comparative example 5
Method according to embodiment 1 is carried out, and except for the difference that, the aminomethyl propanol in composite formula is replaced
Surfactant A EO-9 (its composition is AEO, is purchased from the Dow Chemical Company) is changed to, is obtained
To cleaning agent D5.
Comparative example 6
Method according to embodiment 1 is carried out, and except for the difference that, the water-soluble alcohol ether in composite formula is replaced
For water-insoluble alcohol ether tripropylene glycol butyl ether, cleaning agent D6 is obtained.
Comparative example 7
Method according to embodiment 1 is carried out, except for the difference that, water-insoluble binary acid in composite formula
Ester replaces with neopelex, obtains cleaning agent D7.
Test case
The cleaning agent obtained using above-described embodiment 1-7 and comparative example 1-7 is carried out clearly to the PCB after welding
Wash, its concrete grammar is that each cleaning agent is heated to 48 DEG C, postwelding print is cleaned by way of high-pressure spraying
Printed circuit board, scavenging period are 15 minutes, then dry at 60 DEG C.And by the following method to clear
PCB after washing determines ionic pollution degree, surface insulation resistance and cleaning performance, and concrete structure represents
In table 2.
Ionic pollution degree is tested：Test pcb board is carried out using IPC-TM-6502.3.28.2-2009 standard
Ionic pollution degree, by extracting the residue on pcb board, uses chromatography of ions quantitation.Standard be less than
1.56ug/cm2Eq NaClFor qualified.
Surface insulation resistance is tested：Surface insulation resistance test is carried out using the standard of IPC-92010.
Cleaning performance judges：4 times are amplified on Microscopic observation PCB whether fluxing agent, white pollution thing are residual
Stay and solder joint state.
Table 2
The preferred embodiment of the present invention described in detail above, but, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, can be to the technical side of the present invention
Case carries out multiple simple variant, and these simple variant belong to protection scope of the present invention.
It is further to note that each particular technique described in above-mentioned specific embodiment is special
Levy, in the case of reconcilable, can be combined by any suitable means, in order to avoid need not
The repetition that wants, the present invention are no longer separately illustrated to various possible combinations.
Additionally, can also be combined between a variety of embodiments of the present invention, as long as its
Without prejudice to the thought of the present invention, which should equally be considered as content disclosed in this invention.
Claims (11)
1. a kind of use in printed circuit board waterborne cleaning agent composition, it is characterised in that said composition contains：
Water-soluble alcohol ether, water-insoluble dibasic acid ester, defoamer, nonionic organic reducing agent and nonionic
Organic saponification agent, wherein, the defoamer is dipropylene glycol propyl ether.
2. composition according to claim 1, wherein, with respect to the water of 100 weight portions
Dissolubility alcohol ether, the content of the water-insoluble dibasic acid ester is 85-140 weight portion, the defoamer
Content is 15-45 weight portion, and the content of the nonionic organic reducing agent is 0.3-1.5 weight portion, institute
The content for stating the organic saponification agent of nonionic is 10-35 weight portion；
Preferably, with respect to the water solubility alcohol ether of 100 weight portions, the water-insoluble dibasic acid ester
Content be 100-130 weight portion, the content of the defoamer is 20-40 weight portion, the nonionic
Property organic reducing agent content be 0.5-1 weight portion, the content of the organic saponification agent of the nonionic is
15-30 weight portion.
3. composition according to claim 1, wherein, the boiling point of the water solubility alcohol ether is 150 DEG C
More than, preferably more than 185 DEG C；
Preferably, the boiling point of the water-insoluble dibasic acid ester be more than 150 DEG C, preferably 185 DEG C with
On.
4. the composition according to any one in claim 1-3, wherein, the water-soluble alcohol
Ether be dihydroxylic alcohols dialkyl ether, preferably dipropylene glycol methyl ether, tripropylene glycol methyl ether, triethylene glycol butyl ether,
One or more in tri ethylene glycol ethyl ether and butyl；
Preferably, the water-insoluble dibasic acid ester is dibutyl carbonate, dimethyl glutarate and adipic acid
One or more in dimethyl ester；
Preferably, the nonionic organic reducing agent is alkyl ketone oximes reducing agent, preferably dimethyl
Ketoxime and/or diacetylmonoxime；
Preferably, the organic saponification agent of the nonionic is in aminomethyl propanol, isopropanolamine and monoethanolamine
One or more.
5. the composition according to any one in claim 1-4, wherein, said composition also contains
There is the organic pH value regulator of nonionic；
Preferably, with respect to the water solubility alcohol ether of 100 weight portions, the organic pH of the nonionic
The consumption of value conditioning agent is 3-6 weight portion；
It is highly preferred that the organic pH value regulator of the nonionic is triethanolamine and/or triisopropanolamine.
6. the composition according to any one in claim 1-5, wherein, said composition also contains
There is nonionic organic inhibitor；
Preferably, with respect to the water solubility alcohol ether of 100 weight portions, the nonionic organic inhibition
The consumption of agent is 1-1.5 weight portion；
It is highly preferred that the nonionic organic inhibitor is BTA and/or mercaptobenzothiazoler.
7. the composition according to any one in claim 1-6, wherein, said composition also contains
There is bactericide；
Preferably, the bactericide is OIT and/or BIT.
8. a kind of preparation method of use in printed circuit board waterborne cleaning agent, it is characterised in that the method bag
Include by the use in printed circuit board waterborne cleaning agent composition described in any one in claim 1-7 with go from
Sub- water mixing；
Preferably, with respect to the use in printed circuit board waterborne cleaning agent composition of 100 weight portions, institute
The consumption for stating deionized water is 300-400 weight portion.
9. a kind of use in printed circuit board waterborne cleaning agent, it is characterised in that the use in printed circuit board is aqueous
Cleaning agent is prepared by the method described in claim 8.
10. a kind of cleaning method of printed circuit board (PCB), it is characterised in that the method is included claim
Use in printed circuit board waterborne cleaning agent described in 9 is contacted with printed circuit board (PCB)；
Preferably, the temperature of the contact is less than 60 DEG C.
Use in printed circuit board waterborne cleaning agent described in 11. claims 9 is in the weldering of cleaning printed circuit board (PCB)
The application in residue afterwards.
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| CN111171970A (en) * | 2020-01-21 | 2020-05-19 | 苏州市晶协高新电子材料有限公司 | Welding slag cleaning method |
| CN112500938A (en) * | 2020-12-22 | 2021-03-16 | 苏州柏越纳米科技有限公司 | Semi-water-based semiconductor component cleaning agent |
| WO2023108400A1 (en) * | 2021-12-14 | 2023-06-22 | Dow Global Technologies Llc | Cleaning formulation |
| CN114381344A (en) * | 2022-01-25 | 2022-04-22 | 陕西科技大学 | Micro-bubble dissolution promoting cleaning solution and application thereof |
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