CN106479761B - Printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application - Google Patents
Printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application Download PDFInfo
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Abstract
The present invention relates to printed circuit boards to clean field, disclose it is a kind of it is environmentally friendly, without using surfactant and the good printed circuit board waterborne cleaning agent composition of cleaning effect, the printed circuit board waterborne cleaning agent being prepared by the composition, and the cleaning method of the printed circuit board using the cleaning agent.The composition contains: water-soluble alcohol ether, water-insoluble dibasic acid ester, defoaming agent, nonionic organic reducing agent and the organic saponification agent of nonionic, wherein the defoaming agent is dipropylene glycol propyl ether.Printed circuit board waterborne cleaning agent through the invention, within 15min can fully erased remnants the harmful substances such as scaling powder, high-temperature oxide and grease, cleaning process can be completed without rinsing direct baking；Circuit board solder joint light after cleaning, 4 times of amplification sem observation noresidues, surface insulation resistance and ion residues concentration can satisfy the requirement of IPC standard.
Description
Technical field
The present invention relates to a kind of printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application,
It is combined in particular it relates to a kind of printed circuit board waterborne cleaning agent composition, by the printed circuit board with waterborne cleaning agent
The preparation method and use of printed circuit board waterborne cleaning agent, the printed circuit board waterborne cleaning agent that object is prepared
The cleaning method of the printed circuit board of the printed circuit board waterborne cleaning agent and application.
Background technique
There are mainly two types of methods for the postwelding cleaning of wiring board at present.First method is the side cleaned using solvent
Method, this method is by using fluorochlorohydrocarbon class solvent or ethyl alcohol/isopropanol cleaning postwelding residue.Second method is to use
The method that surfactant is cleaned, this method is by using nonylphenol polyoxyethylene ether, fatty alcohol polyoxyethylene ether, alkyl
It mixes after the surfactant compounds such as benzene sulfonic acid sodium salt, glucoside with water to clean postwelding residue.
But the method cleaned using solvent, volatile organic compounds (VOC) discharge is huge, to environment shadow
It rings severe；Also, fluorochlorohydrocarbon class solvent is huge to depletion of the ozone layer, has been strictly limited use；Ethyl alcohol/isopropyl alcohols solvent removes
Evaporation rate is fast, and except VOC emission is high, flash-point itself is lower, and static discharge easily leads to combustion explosion, to production environment
Requirement of explosion proof is very high.
Cleaning method is carried out using surfactant, there are problems that surfactant itself has residual on pcb board, clearly
It needs to be rinsed with deionized water after washing, water resource waste is huge, and rinse water COD is severely exceeded, and needs to discharge after handling；
In addition, surfactant load ability is limited, rear surface activating agent saturation can not continue absorption and clear the pollution off for several times for cleaning, need
Often replacement.
Summary of the invention
It is an object of the invention to overcome above-mentioned problems of the prior art, provide it is a kind of it is environmentally friendly, do not make
With surfactant and the good printed circuit board waterborne cleaning agent composition of cleaning effect, by the printed circuit board with aqueous
The printed circuit board waterborne cleaning agent that cleansing composition is prepared, and use the printed circuit board waterborne cleaning agent
Printed circuit board cleaning method.
According to the first aspect of the invention, the present invention provides a kind of printed circuit board waterborne cleaning agent compositions, should
Composition contains: water-soluble alcohol ether, water-insoluble dibasic acid ester, defoaming agent, nonionic organic reducing agent and nonionic have
Machine saponification agent, wherein the defoaming agent is dipropylene glycol propyl ether.
According to the second aspect of the invention, the present invention provides a kind of preparation sides of printed circuit board waterborne cleaning agent
Method, wherein this method includes mixing printed circuit board of the invention with deionized water with waterborne cleaning agent composition.
According to the third aspect of the invention we, the present invention provides a kind of printed circuit board waterborne cleaning agents, wherein the print
Printed circuit board is prepared with waterborne cleaning agent by the above method.
According to the fourth aspect of the invention, the present invention provides a kind of cleaning methods of printed circuit board, wherein this method
Including printed circuit board of the invention is contacted with waterborne cleaning agent with printed circuit board.
According to the fifth aspect of the invention, the present invention provides printed circuit board waterborne cleaning agents of the invention to clean
Application in the residue of the postwelding of printed circuit board.
Printed circuit board according to the present invention waterborne cleaning agent composition, due to not using surfactant, do not have
There is the residue problem of surfactant, directly dried after cleaning, is rinsed without a large amount of deionized waters.In addition, by using
The compatibility of specific defoaming agent dipropylene glycol propyl ether solves bubble when oil mixing with water, keeps system completely still, can satisfy close
The high-pressure spraying technique closed, and avoid using silicon residue problem caused by organic silicon defoamer.
Also, the present invention, which passes through, further makes the boiling point of water-soluble alcohol ether and water-insoluble dibasic acid ester at 150 DEG C or more,
Thus in use almost without VOC emission, it is environmentally friendly, and cleaning agent system, without flash-point, use process is safe and reliable,
Without explosion-proof.
Other features and advantages of the present invention will the following detailed description will be given in the detailed implementation section.
Specific embodiment
Detailed description of the preferred embodiments below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
In the present invention, solubility when water solubility refers to 20 DEG C in 100g water is greater than 10g；It is water-insoluble to refer to 20 DEG C
When solubility in 100g water be less than 1g.
In the present invention, boiling point refers to boiling point at normal atmospheric pressure.
According to the first aspect of the invention, the present invention provides a kind of printed circuit board waterborne cleaning agent compositions, should
Composition contains: water-soluble alcohol ether, water-insoluble dibasic acid ester, defoaming agent, nonionic organic reducing agent and nonionic have
Machine saponification agent, wherein the defoaming agent is dipropylene glycol propyl ether.
According to the first aspect of the invention, although as long as containing mentioned component, that is, can provide it is a kind of it is environmentally friendly, do not make
With surfactant and the good printed circuit board waterborne cleaning agent composition of cleaning effect.But from further obtaining above-mentioned technology
Effect considers, in preferred situation, relative to the water-soluble alcohol ether of 100 parts by weight, the water-insoluble dibasic acid ester
Content be 85-140 parts by weight, the content of the defoaming agent is 15-45 parts by weight, and the nonionic organic reducing agent contains
Amount is 0.3-1.5 parts by weight, and the content of the organic saponification agent of nonionic is 10-35 parts by weight；It is highly preferred that relative to
The water-soluble alcohol ether of 100 parts by weight, the content of the water-insoluble dibasic acid ester is 100-130 parts by weight, the defoaming
The content of agent is 20-40 parts by weight, and the content of the nonionic organic reducing agent is 0.5-1 parts by weight, the nonionic
The content of organic saponification agent is 15-30 parts by weight；It is further preferred that the water-soluble alcohol ether relative to 100 parts by weight, institute
The content for stating water-insoluble dibasic acid ester is 105-120 parts by weight, and the content of the defoaming agent is 25-35 parts by weight, described non-
The content of ionic organic reducing agent is 0.6-0.8 parts by weight, and the content of the organic saponification agent of nonionic is 18-27 weight
Part.
According to the first aspect of the invention, printed circuit board waterborne cleaning agent composition of the invention contains water-soluble alcohol
Ether.Consider from the safety for improving obtained printed circuit board waterborne cleaning agent, the boiling point of the preferably described water-soluble alcohol ether
It is 150 DEG C or more, more preferably 185 DEG C or more, further preferably 190-280 DEG C.By using such water-soluble alcohol ether,
The cleaning agent flash-point height for being nearly free from VOC, and having the advantages that uses safe.Importantly, being prepared
In printed circuit board waterborne cleaning agent, pass through the water-soluble alcohol ether, the water-insoluble dibasic acid ester and the defoaming
The synergistic effect of agent can make cleaning agent system completely still, have the advantages that high-pressure spraying uses still in confined space.
As above-mentioned water-soluble alcohol ether, preferably dihydric alcohol dialkyl ether.It can as preferred dihydric alcohol dialkyl ether
To enumerate: dipropylene glycol methyl ether (boiling point is 190 DEG C), tripropylene glycol methyl ether (boiling point is 243 DEG C), triethylene glycol butyl ether (boiling point
Be 271.2 DEG C), one of tri ethylene glycol ethyl ether (boiling point is 255.9 DEG C) and butyl (boiling point is 230 DEG C) or more
Kind.
According to the first aspect of the invention, printed circuit board waterborne cleaning agent composition of the invention contains water-insoluble
Dibasic acid ester.Consider from the safety for improving obtained printed circuit board waterborne cleaning agent, preferably described water-insoluble two
The boiling point of first acid esters is 150 DEG C or more, more preferably 185 DEG C or more, further preferably 200-250 DEG C.By using in this way
Water-insoluble dibasic acid ester, the cleaning agent flash-point height for being nearly free from VOC, and having the advantages that is using safe.More
Importantly, in printed circuit board waterborne cleaning agent is prepared, by the water-insoluble dibasic acid ester, described water-soluble
Property alcohol ether and the defoaming agent synergistic effect, cleaning agent system can be made completely still, with have in confined space
High-pressure spraying uses still advantage.
As above-mentioned water-insoluble dibasic acid ester, preferably dibutyl carbonate (boiling point is 207 DEG C), dimethyl glutarate
(boiling point is 214 DEG C) and dimethyl adipate (boiling point is 226 DEG C), one of or it is a variety of.
According to the first aspect of the invention, printed circuit board waterborne cleaning agent composition of the invention contains defoaming agent,
And the defoaming agent is dipropylene glycol propyl ether.In the present invention, the defoaming agent being capable of oily phase in the present compositions
And with certain dissolubility is all had in water phase, to have the effect of special defoaming.
According to the first aspect of the invention, printed circuit board waterborne cleaning agent composition of the invention contains nonionic
Organic reducing agent.The nonionic organic reducing agent can go back the metal oxide generated when welding in wiring board
Original, so as to keep solder joint bright.Also, it since the reducing agent is nonionic organic reducing agent, can be avoided clear
Ion is introduced when washing, and is compared ionic reducing agent, secondary ion will not be brought to pollute.
The nonionic organic reducing agent is alkyl ketone oximes reducing agent；Preferably, the nonionic organic reducing
Agent is dimethyl ketone oxime and/or diacetylmonoxime.
According to the first aspect of the invention, printed circuit board waterborne cleaning agent composition of the invention contains nonionic
Organic saponification agent.The organic saponification agent of nonionic remaining rosin and organic acid scaling powder progress soap when can be to welding
Change, generate and be dissolved in the salt of water, removes from being dissolved into waterborne cleaning agent on wiring board.Also, due to being in the saponification agent
The organic saponification agent of nonionic, therefore can be avoided and introduce ion in cleaning, ionic saponification agent is compared, will not be brought secondary
Ionic soil.
As long as can be realized as the organic saponification agent of the nonionic, above-mentioned purpose can there is no particular limitation.Example
Such as, the organic saponification agent of the nonionic can be one of aminomethyl propanol, isopropanolamine and ethanol amine or a variety of.
According to the first aspect of the invention, in preferred situation, printed circuit board of the invention is combined with waterborne cleaning agent
Object can also contain the organic pH adjusting agent of nonionic.The print that the organic pH adjusting agent of nonionic can be adjusted
The pH value of printed circuit board waterborne cleaning agent improves the load capacity and use of cleaning agent to keep the pH value of system more stable
Service life；Also, due to the regulator be the organic pH adjusting agent of nonionic, can be avoided cleaning when introduce from
Son compares ionic pH adjusting agent, secondary ion will not be brought to pollute.
As long as can be realized as the organic pH adjusting agent of the nonionic, above-mentioned purpose can there is no particular limitation.
For example, the organic pH adjusting agent of nonionic can be triethanolamine and/or triisopropanolamine.
As the dosage of the organic pH adjusting agent of above-mentioned nonionic, as long as can be by obtained printed circuit board with aqueous
The pH of cleaning agent adjusts the range to 10.4-11.5.In order to enable the pH value of the printed circuit board waterborne cleaning agent arrived
Within the above range, usually, relative to the water-soluble alcohol ether of 100 parts by weight, the organic pH of nonionic
The dosage for being worth regulator is 3-6 parts by weight, preferably 3-5 parts by weight.
According to the first aspect of the invention, in preferred situation, printed circuit board of the invention is combined with waterborne cleaning agent
Object can also contain nonionic organic inhibitor.It, being capable of protection circuit plate by containing the nonionic organic inhibitor
On metalwork be not corroded.Also, it since the corrosion inhibiter is nonionic organic inhibitor, can be avoided in cleaning
Ion is introduced, ionic corrosion inhibiter is compared, secondary ion will not be brought to pollute.
As long as can be realized above-mentioned purpose as the nonionic organic inhibitor, there is no particular limitation.Example
Such as, the nonionic organic inhibitor can be benzotriazole and/or mercaptobenzothiazoler.
Dosage as the nonionic organic inhibitor can change in a wide range.Preferably, relative to 100
The water-soluble alcohol ether of parts by weight, the dosage of the nonionic organic inhibitor is 1-1.5 parts by weight, preferably 1.1-
1.4 parts by weight.
According to the first aspect of the invention, on the basis of not damaging effect of the invention, printed circuit board of the invention
Other various additives commonly used in the art can also be contained with waterborne cleaning agent composition.The additive for example can be
Fungicide.
As the fungicide for example, isothiazolinone and/or benzoisothiazolinone.In addition, as described
The dosage of fungicide is not particularly limited, for example, the water-soluble alcohol ether relative to 100 parts by weight, the non-fungicide
Dosage be 0.6-1 parts by weight.
According to the second aspect of the invention, the present invention provides the preparation sides of above-mentioned printed circuit board waterborne cleaning agent
Method, wherein this method includes mixing printed circuit board of the invention with deionized water with waterborne cleaning agent composition.
According to the second aspect of the invention, printed circuit board of the invention waterborne cleaning agent composition and deionized water
Dosage can change in a wide range.Preferably, relative to the printed circuit board waterborne cleaning agent group of 100 parts by weight
Object is closed, the dosage of the deionized water is 300-400 parts by weight, more preferably 350-400 parts by weight.
In the present invention, for mixing printed circuit board of the invention with deionized water with waterborne cleaning agent composition
There is no particular limitation with mode for conjunction sequence, and sequence can be arbitrary, and hybrid mode can be the routine of this field
Hybrid mode.But consider from the storage stability of the printed circuit board further increased waterborne cleaning agent, the present invention
Printed circuit board preferably prepared using following step with waterborne cleaning agent.
(1) the nonionic organic reducing agent is mixed with portions of de-ionized water, prepares nonionic organic reducing agent
Content is the solution (the preferably solution of 25 weight %) of 22-27 weight %；
(2) solution, the water-soluble alcohol ether, the water-insoluble dibasic acid ester, the nonionic obtained step (1)
Property organic reducing agent, the organic saponification agent of the nonionic, the optionally organic pH adjusting agent of nonionic and optionally non-
After ionic organic inhibitor is mixed, then mix with remaining deionized water.
According to the third aspect of the invention we, the present invention provides a kind of printed circuit board waterborne cleaning agents, wherein the print
Printed circuit board is prepared with waterborne cleaning agent by the above method.
According to the fourth aspect of the invention, the present invention provides a kind of cleaning methods of printed circuit board, wherein this method
Including printed circuit board of the invention is contacted with waterborne cleaning agent with printed circuit board.
According to the fourth aspect of the invention, for by printed circuit board waterborne cleaning agent of the invention and printed circuit board
The mode contacted, there is no particular limitation, can be the way of contact of this field routine.But in order to further provide for cleaning
Effect, present invention preferably employs postwelding printed circuit board is cleaned by way of high-pressure spraying.
According to the fourth aspect of the invention, printed circuit board of the invention is carried out with waterborne cleaning agent and printed circuit board
The temperature of contact is preferably 60 DEG C or less；Consider from safety more preferably 50 DEG C hereinafter, further preferably 45-50
℃.In addition, the time as contact is subject to and cleans up, usually 15 minutes hereinafter, preferably 12-14 minutes.
According to the fifth aspect of the invention, the present invention provides above-mentioned printed circuit board waterborne cleaning agents prints in cleaning
Application in the residue of the postwelding of circuit board.
Printed circuit board waterborne cleaning agent through the invention fully erased remaining can help weldering within 15min
Cleaning process can be completed without rinsing direct baking in the harmful substances such as agent, high-temperature oxide and grease；Circuit board after cleaning
Solder joint is bright, and 4 times of amplification sem observation noresidues, surface insulation resistance and ion residues concentration can satisfy wanting for IPC standard
It asks.
Embodiment
The present invention will be described in detail by way of examples below, but the present invention is not limited in following embodiments.
Embodiment 1-7
Cleaning agent A1-A7 is prepared according to the composite formula of following table 1.Preparation method specifically: have nonionic
Machine reducing agent (abbreviation reducing agent in table 1) be dissolved in deionized water (wherein the concentration of nonionic organic reducing agent be 25 weights
Measure %), it stirs evenly；Then, by the component investment stirred tank in addition to deionized water, high-speed stirred 20min adds residue
Deionized water stirs 5min.
Table 1
Comparative example 1
It carries out according to the method for embodiment 1, unlike, dipropylene glycol propyl ether and dimethyl are not contained in composite formula
Ketoxime obtains cleaning agent D1.
Comparative example 2
It carries out according to the method for embodiment 1, unlike, dipropylene glycol propyl ether is not contained in composite formula, is obtained clear
Lotion D2.
Comparative example 3
It carries out according to the method for embodiment 1, unlike, dimethyl ketone oxime is not contained in composite formula, is cleaned
Agent D3.
Comparative example 4
It carries out according to the method for embodiment 1, unlike, aminomethyl propanol is not contained in composite formula, is cleaned
Agent D4.
Comparative example 5
It carries out according to the method for embodiment 1, unlike, it is living that the aminomethyl propanol in composite formula is replaced with into surface
Property agent AEO-9 (its ingredient is fatty alcohol polyoxyethylene ether, is purchased from the Dow Chemical Company), obtain cleaning agent D5.
Comparative example 6
It carries out according to the method for embodiment 1, unlike, the water-soluble alcohol ether in composite formula replaces with water-insoluble
Alcohol ether tripropylene glycol butyl ether obtains cleaning agent D6.
Comparative example 7
It carries out according to the method for embodiment 1, unlike, the water-insoluble dibasic acid ester in composite formula replaces with ten
Dialkyl benzene sulfonic acids sodium obtains cleaning agent D7.
Test case
The PCB after welding is cleaned using the cleaning agent that above-described embodiment 1-7 and comparative example 1-7 are obtained, it is specific
Method is that each cleaning agent is heated to 48 DEG C, and postwelding printed circuit board, scavenging period 15 are cleaned by way of high-pressure spraying
Minute, then dried at 60 DEG C.And ionic pollution degree, surface insulation resistance are measured to the PCB after cleaning by the following method
And cleaning effect, specific structure are shown in Table 2 below.
Ionic pollution degree test: test pcb board ionic soil is carried out using IPC-TM-6502.3.28.2-2009 standard
Degree, it is quantitative with ion chromatography by the residue on extraction pcb board.Standard is less than 1.56ug/cm2Eq NaClFor qualification.
Surface insulation resistance test: surface insulation resistance test is carried out using the standard of IPC-92010.
Cleaning effect judgement: on 4 times of amplification microscopic observation PCB whether fluxing agent, white pollution object remain and solder joint
State.
Table 2
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail within the scope of the technical concept of the present invention can be with various simple variants of the technical solution of the present invention are made, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, can be combined in any appropriate way, in order to avoid unnecessary repetition, the present invention to it is various can
No further explanation will be given for the combination of energy.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (25)
1. a kind of printed circuit board waterborne cleaning agent composition, which is characterized in that the composition contains: water-soluble alcohol ether, non-
Water soluble dibasic acid ester, defoaming agent, nonionic organic reducing agent and the organic saponification agent of nonionic, wherein the defoaming agent
For dipropylene glycol propyl ether, the water solubility alcohol ether is dipropylene glycol methyl ether, tripropylene glycol methyl ether, triethylene glycol butyl ether, three second two
One of alcohol ether and butyl are a variety of.
2. composition according to claim 1, wherein described non-aqueous relative to the water-soluble alcohol ether of 100 parts by weight
The content of dissolubility dibasic acid ester is 85-140 parts by weight, and the content of the defoaming agent is 15-45 parts by weight, and the nonionic has
The content of machine reducing agent is 0.3-1.5 parts by weight, and the content of the organic saponification agent of nonionic is 10-35 parts by weight.
3. composition according to claim 1, wherein described non-aqueous relative to the water-soluble alcohol ether of 100 parts by weight
The content of dissolubility dibasic acid ester is 100-130 parts by weight, and the content of the defoaming agent is 20-40 parts by weight, the nonionic
The content of organic reducing agent is 0.5-1 parts by weight, and the content of the organic saponification agent of nonionic is 15-30 parts by weight.
4. composition according to claim 1, wherein the boiling point of the water solubility alcohol ether is 150 DEG C or more.
5. composition according to claim 4, wherein the boiling point of the water solubility alcohol ether is 185 DEG C or more.
6. composition according to claim 1, wherein the boiling point of the water-insoluble dibasic acid ester is 150 DEG C or more.
7. composition according to claim 6, wherein the boiling point of the water-insoluble dibasic acid ester is 185 DEG C or more.
8. composition according to claim 1, wherein the water-insoluble dibasic acid ester is dibutyl carbonate, glutaric acid
One of dimethyl ester and dimethyl adipate are a variety of.
9. composition according to claim 1, wherein the nonionic organic reducing agent is the reduction of alkyl ketone oximes
Agent,
10. composition according to claim 9, wherein the nonionic organic reducing agent be dimethyl ketone oxime and/or
Diacetylmonoxime.
11. composition according to claim 1, wherein the organic saponification agent of nonionic is aminomethyl propanol, isopropyl
One of hydramine and ethanol amine are a variety of.
12. composition according to any one of claims 1-7, wherein it is organic that the composition also contains nonionic
PH adjusting agent.
13. composition according to claim 12, wherein described non-relative to the water-soluble alcohol ether of 100 parts by weight
The dosage of ionic organic pH adjusting agent is 3-6 parts by weight.
14. composition according to claim 13, wherein the organic pH adjusting agent of nonionic is triethanolamine
And/or triisopropanolamine.
15. composition according to any one of claims 1-7, wherein it is organic that the composition also contains nonionic
Corrosion inhibiter.
16. composition according to claim 15, wherein described non-relative to the water-soluble alcohol ether of 100 parts by weight
The dosage of ionic organic inhibitor is 1-1.5 parts by weight.
17. composition according to claim 16, wherein the nonionic organic inhibitor be benzotriazole and/
Or mercaptobenzothiazoler.
18. composition according to any one of claims 1-7, wherein the composition also contains fungicide.
19. composition according to claim 18, wherein the fungicide is isothiazolinone and/or benzisothiazole
Quinoline ketone.
20. a kind of preparation method of printed circuit board waterborne cleaning agent, which is characterized in that this method includes by claim 1-
Printed circuit board described in any one of 7 is mixed with waterborne cleaning agent composition with deionized water.
21. according to the method for claim 20, wherein relative to 100 parts by weight the printed circuit board with it is aqueous clearly
Detergent composition, the dosage of the deionized water are 300-400 parts by weight.
22. a kind of printed circuit board waterborne cleaning agent, which is characterized in that the printed circuit board waterborne cleaning agent passes through right
It is required that method described in 20 or 21 is prepared.
23. a kind of cleaning method of printed circuit board, which is characterized in that this method includes by the electricity of printing described in claim 22
Road plate is contacted with waterborne cleaning agent with printed circuit board.
24. the cleaning method of printed circuit board according to claim 23, wherein the temperature of the contact be 60 DEG C with
Under.
25. printed circuit board waterborne cleaning agent described in claim 22 is in the residue of the postwelding of cleaning printed circuit board
Application.
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| CN108384668A (en) * | 2018-04-25 | 2018-08-10 | 上海尤希路化学工业有限公司 | High magnification dilution, the special-purpose aqueous cleaning agent of 50MPa ultra-high pressure numerical control cleaning centers |
| CN111171970A (en) * | 2020-01-21 | 2020-05-19 | 苏州市晶协高新电子材料有限公司 | Welding slag cleaning method |
| CN112500938A (en) * | 2020-12-22 | 2021-03-16 | 苏州柏越纳米科技有限公司 | Semi-water-based semiconductor component cleaning agent |
| WO2023108400A1 (en) * | 2021-12-14 | 2023-06-22 | Dow Global Technologies Llc | Cleaning formulation |
| CN114381344A (en) * | 2022-01-25 | 2022-04-22 | 陕西科技大学 | Micro-bubble dissolution promoting cleaning solution and application thereof |
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| CN104001350B (en) * | 2013-02-22 | 2015-07-15 | 南京四新科技应用研究所有限公司 | Method for improving performances of antifoaming agent for circuit board cleaning |
| CN103834484B (en) * | 2014-03-12 | 2016-08-10 | 中山火炬职业技术学院 | A kind of environment-friendly water-based wiring board scavenger specially and preparation method thereof |
| CN103952243B (en) * | 2014-04-18 | 2018-01-09 | 北京朝铂航科技有限公司 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
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