CN103952243B - A kind of cleaning agent that can effectively remove wiring board bloom residue - Google Patents
A kind of cleaning agent that can effectively remove wiring board bloom residue Download PDFInfo
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- CN103952243B CN103952243B CN201410156472.6A CN201410156472A CN103952243B CN 103952243 B CN103952243 B CN 103952243B CN 201410156472 A CN201410156472 A CN 201410156472A CN 103952243 B CN103952243 B CN 103952243B
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Abstract
The present invention relates to a kind of cleaning agent that can effectively remove wiring board bloom residue, it is characterized in that it is made up of dibasic acid dimethyl ester, 2~4% lauryl glucosyls, 0.5~1.0% monoethanolamine, 1~3% poly-aspartate and the surplus absolute ethyl alcohol raw material of 15~18% compoundings, the cleaning agent has the ability that can effectively remove bloom residue on wiring board, improve the electric property of wiring board,, can be voluntarily biodegradable for environmentally friendly high boiling solvent；There is extremely strong chelant dispersibility, adsorptivity is strong, and each component compatibility is good, there is the advantages of dirt-proof redeposition and effect.
Description
Technical field
The present invention relates to a kind of cleaning agent that can effectively remove wiring board bloom residue, belong to field of electronic materials.
Background technology
After the cleaning of electronics and IT products pcb board welding at present, some are remained similar to bloom residue in plate face, this is PCB
Plate cleaning unsolved problem for a long time, and the problem of solvent-borne type pcb board cleaning agent fails to break through.Bloom residue category
When rosin or other organic residues are using rosin tree esters scaling powder and solder(ing) paste dress connection welding wiring board, in high-temperature soldering
Under the conditions of, PCB surface can often generate white rosin acid salt residue, and halide and organic acid in water-soluble flux
Comparision contents it is high, there is stronger acidity, chemical reaction, which occurs, with the solder joint on wiring board and pad during high-temperature soldering generates
The metal halide salt of white, these white residues are to clean rear board to turn white to form the main of the bloom that is not easy to remove
Reason.These materials not only influence complete machine cleannes and also result in use environment pollution.Climate changes, and temperature rise reduces moist
Influence, in the operation of pcb board circuit, it is possible to produce parameter, insulaion resistance declines between circuit spacing, or produces electromigration.Especially
It makes the rapid growth of tin content between solder joint bonding wire under high temperature salt mist environment, causes short circuit, influences complete machine and uses essence
Degree and reliability lead to not normal work.Existing rinse product is also difficult to clean off this kind of bloom class residue.This is not only
Cause the unqualified electric property that can more importantly influence wiring board of wiring board outward appearance, some leaning solvent acid numbers are high,
Temperature is high, and Reusability butt welding point has corrosion, and this is electronic material welding field urgent problem.
The content of the invention
The purpose of the present invention be the shortcomings that being directed to existing cleaning agent with deficiency and one kind is provided can effectively to remove wiring board white
The cleaning agent of white residue, so as to improve wiring board quality, also increase attractive in appearance.
The present invention also provides the preparation method of the cleaning agent.
The purpose of the present invention is realized by following technical proposal：
A kind of cleaning agent that can effectively remove wiring board bloom residue, it is made up of the raw material of following weight percentage：
The dibasic acid dimethyl ester of the compounding is that dimethyl glutarate, dimethyl succinate and dimethyl adipate compound,
It is 35~40 that it, which compounds weight ratio,:30~35:20~25.
A kind of preparation method for the cleaning agent that can effectively remove wiring board bloom residue, it is carried out in the steps below:
（a）By dimethyl glutarate, dimethyl succinate and dimethyl adipate by weight 35~40:30~35:20
~25 compoundings are placed in tank, mix 0.5~1.0 hour dibasic acid dimethyl ester for preparing compounding；
（b）Take（a）The 15~18% of item preparation（Weight, similarly hereinafter）The dibasic acid dimethyl ester of compounding, 2~4% dodecyl
Glucoside, 0.5~1.0% monoethanolamine, 1~3% poly-aspartate and surplus absolute ethyl alcohol, sequentially add in reactor and stir
0.5~1 hour, static 0.5 hour was rinse product of the invention.
The dibasic acid dimethyl ester that the present invention compounds is de- ester agent, by dimethyl glutarate, dimethyl succinate and adipic acid
Dimethyl ester compounds, dimethyl glutarate, English name Dimethyl glutarate, dimethyl succinate, also known as butanedioic acid diformazan
Ester, English name Dimethyl succinat, wherein dimethyl glutarate 35~40%, dimethyl succinate 30~35% and oneself two
Dimethyl phthalate 20~25%, acid number≤0.3mgKOH/g after compounding can prevent the erosion of the butt welding point in cleaning, and experiment proves
There is the extremely strong ability for removing bloom residue on wiring board after three's compounding.The dibasic acid dimethyl ester of compounding dialogue in cleaning
The clearance more than 98% of the residues such as frost.Cleaning experiment also shows that the dibasic acid dimethyl ester of compounding is less than 15% in cleaning agent and used
Clean effect starts to weaken during amount, and the cost of cleaning agent is added during more than 18% dosage, while to printed circuit board (PCB) and component
On marking ink have slight erosion.Dibasic acid dimethyl ester compound is environmentally friendly high boiling solvent, can be voluntarily biological
Degraded.Its flash-point after measured（Remain silent）For 101 DEG C, naturally put 360 DEG C, -20 DEG C of freezing point, boiling range（101.3KPa）200-236
℃。
Lauryl glucosyl, also known as Dodecyl Glucoside, dodecyl glycosides, Dodecyl Polyglucosides, lauryl Portugal
Polyglycoside, it is nonionic surfactant（AlKylpoLygulocoside）Abbreviation C12APG, make lauryl glucosyl
Raw materials used is glucose and ester fat acid by reproducible natural resources derivative, is nontoxic non-stimulated can give birth to completely
The raw material of thing degraded.C12APG is the liquid of water white transparency, organic solvent soluble in water and conventional, molecular formula C18H36O6,
No. CAS is 110615-47-9, the lauryl glucosyl of 50% content selected from Shijiazhuang gold More Co., Ltd, its index
For:
Outward appearance：Colourless transparent liquid
Lauryl glucosyl can reduce the interfacial tension of cleaning agent, increase and the wetability and dirt of cleaned object
Permeability.There is synergy with the dibasic acid dimethyl ester of compounding, this product can also be provided by the petrochemical plant of Tianjin the 3rd.
Monoethanolamine is emulsifying agent；Poly-aspartate, commercial disignation PASP, molecular formula C4H5NO3M(C4H4NO3M)m
(C4H4NO3M)mC4H4NO3M2, poly-aspartate is the high-molecular compound of artificial bio-mimetic syntheses, easily biological-degradable, is international public
The green chemical recognized, there is extremely strong chelant dispersibility, adsorptivity is strong, good with each component compatibility, there is dirt-proof redeposition
Effect.Selected from Bondi Shandong Chemical Limited By Share Ltd..
Its index is：
Outward appearance:Blueness is to rufous liquid
Due to taking the technology of the present invention that makes of above-mentioned technical proposal to have the following advantages that and effect：
（a）The cleaning agent has the extremely strong ability for removing bloom residue on wiring board, clearance more than 98%, improves
The electric property of wiring board, it is environmentally friendly high boiling solvent, can be voluntarily biodegradable；
（b）The lauryl glucosyl of selection is raw materials used by reproducible natural resources derivative, is grape
Sugar and aliphatic acid, be it is nontoxic it is non-stimulated completely can be with biodegradable raw material；
（c）There is extremely strong chelant dispersibility, adsorptivity is strong, and each component compatibility is good, there is dirt-proof redeposition.
Embodiment:
Embodiment 1
40g dimethyl glutarates, 30g dimethyl succinates and 25g dimethyl adipates compounding are placed in tank,
0.5 hour dibasic acid dimethyl ester for preparing compounding is mixed, takes dibasic acid dimethyl ester 15g, the lauryl glucoside of compounding
Glycosides 2.0g, monoethanolamine 1.0g, poly-aspartate 1.2g and absolute ethyl alcohol 80.8g, sequentially add in reactor and stir 1.0 hours,
Static 0.5 hour is rinse product of the invention.
Embodiment 2
35g dimethyl glutarates, 35g dimethyl succinates and 20g dimethyl adipates compounding are placed in tank,
1.0 hours dibasic acid dimethyl esters for preparing compounding are mixed, take dibasic acid dimethyl ester 18g, the lauryl glucoside of compounding
Glycosides 3.2g, monoethanolamine 0.5g, poly-aspartate 3.0g and absolute ethyl alcohol 75.3g, sequentially add in reactor and stir 0.8 hour,
Static 0.5 hour is rinse product of the invention.
Embodiment 3
38g dimethyl glutarates, 32g dimethyl succinates and 23g dimethyl adipates compounding are placed in tank,
0.8 hour dibasic acid dimethyl ester for preparing compounding is mixed, takes dibasic acid dimethyl ester 16g, the lauryl glucoside of compounding
Glycosides 4.0g, monoethanolamine 0.8g, poly-aspartate 2.0g and absolute ethyl alcohol 77.2g, sequentially add in reactor and stir 0.5 hour,
Static 0.5 hour is rinse product of the invention.
Embodiment 4
40g dimethyl glutarates, 35g dimethyl succinates and 25g dimethyl adipates compounding are placed in tank,
0.8 hour dibasic acid dimethyl ester for preparing compounding is mixed, takes dibasic acid dimethyl ester 17g, the lauryl glucoside of compounding
Glycosides 3.6g, monoethanolamine 0.6g, poly-aspartate 1.0g and absolute ethyl alcohol 77.8g, sequentially add in reactor and stir 1.0 hours,
Static 0.5 hour is rinse product of the invention.
Embodiment 5
Example 1 prepares the dibasic acid dimethyl ester 15.8g of compounding, lauryl glucoside 2.8g, monoethanolamine 0.7g, gathers
Aspartic acid 2.8g and absolute ethyl alcohol 77.9g, sequentially add and stirred in reactor 0.5 hour, static 0.5 hour is the present invention
Rinse product.
Embodiment 6
Example 2 prepares the dibasic acid dimethyl ester 16.3g of compounding, lauryl glucoside 2.4g, monoethanolamine 0.9g, gathers
Aspartic acid 2.2g and absolute ethyl alcohol 78.2g, sequentially add and stirred in reactor 1.0 hours, static 0.5 hour is the present invention
Rinse product.
Claims (2)
- A kind of 1. cleaning agent that can effectively remove wiring board bloom residue, it is characterised in that it by following weight percentage original Material composition：The dibasic acid dimethyl ester of the compounding is dimethyl glutarate, dimethyl succinate and dimethyl adipate compounding, and it is multiple It is 35~40 with weight ratio:30~35:20~25.
- 2. can effectively remove the preparation method of the cleaning agent of wiring board bloom residue as claimed in claim 1, its feature exists Carried out in the steps below in it：（a）By dimethyl glutarate, dimethyl succinate and dimethyl adipate by weight 35~40:30~35:20~25 Compounding is placed in tank, mixes 0.5~1.0 hour dibasic acid dimethyl ester for preparing compounding；（b）Take（a）The 15~18% of item preparation（Weight, similarly hereinafter）The dibasic acid dimethyl ester of compounding, 2~4% dodecyl grape Glucosides, 0.5~1.0% monoethanolamine, 1~3% poly-aspartate and surplus absolute ethyl alcohol, sequentially add and 0.5~1 is stirred in reactor Hour, static 0.5 hour is rinse product of the invention.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410156472.6A CN103952243B (en) | 2014-04-18 | 2014-04-18 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
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| CN201410156472.6A CN103952243B (en) | 2014-04-18 | 2014-04-18 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
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| CN103952243A CN103952243A (en) | 2014-07-30 |
| CN103952243B true CN103952243B (en) | 2018-01-09 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898734B (en) * | 2015-05-18 | 2017-12-29 | 中国地质大学（武汉） | A kind of dynamic type temperature difference controls tape deck |
| CN106479761B (en) * | 2015-08-28 | 2019-07-26 | 比亚迪股份有限公司 | Printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application |
| FI127921B (en) * | 2016-02-18 | 2019-05-15 | Vauhti Speed Oy | Composition for cleaning skin strips of skin skis |
| CN106337196B (en) * | 2016-07-31 | 2018-08-10 | 深圳市贝加电子材料有限公司 | Microscopic void sealer for the processing of printed wiring board precious metal surface |
| CN106398892A (en) * | 2016-08-30 | 2017-02-15 | 乐凯特科技铜陵有限公司 | Circuit board cleaning agent with excellent cleaning performance |
| CN108774606A (en) * | 2018-06-14 | 2018-11-09 | 郑州创客科技有限公司 | A kind of cleaning agent and preparation method for removing printed wiring board bloom residue |
| CN111893003A (en) * | 2020-08-24 | 2020-11-06 | 上海珑灵洁净科技有限公司 | Aqueous degumming agent composition and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524939A (en) * | 2003-09-15 | 2004-09-01 | 李伟光 | Multifunctional scrubbing cleanser |
| CN101503648A (en) * | 2009-02-26 | 2009-08-12 | 深圳市合明科技有限公司 | Water-based cleaning agent for SMT printing screen |
| WO2012082565A1 (en) * | 2010-12-16 | 2012-06-21 | Kyzen Corporation | Cleaning agent for removal of soldering flux |
| CN103031016A (en) * | 2012-12-12 | 2013-04-10 | 深圳中海化石油化工投资有限公司 | Environment-friendly cleaning agent for printed screen of circuit board |
-
2014
- 2014-04-18 CN CN201410156472.6A patent/CN103952243B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524939A (en) * | 2003-09-15 | 2004-09-01 | 李伟光 | Multifunctional scrubbing cleanser |
| CN101503648A (en) * | 2009-02-26 | 2009-08-12 | 深圳市合明科技有限公司 | Water-based cleaning agent for SMT printing screen |
| WO2012082565A1 (en) * | 2010-12-16 | 2012-06-21 | Kyzen Corporation | Cleaning agent for removal of soldering flux |
| CN103031016A (en) * | 2012-12-12 | 2013-04-10 | 深圳中海化石油化工投资有限公司 | Environment-friendly cleaning agent for printed screen of circuit board |
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Effective date of registration: 20200408 Address after: 523000, No. 2, No. 1, industrial North Road, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Patentee after: GUANGDONG ZHONGSHI METAL Co.,Ltd. Address before: 100016 Chaoyang District Jiuxianqiao Jiali Hotel Beijing B113 Co-patentee before: GUANGDONG ZHONGSHI METAL Co.,Ltd. Patentee before: BEIJING CHAOBOHANG SCIENCE & TECHNOLOGY Co.,Ltd. |
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