CN103952243A - Cleaning agent capable of effectively eliminating white frost residue on circuit board - Google Patents
Cleaning agent capable of effectively eliminating white frost residue on circuit board Download PDFInfo
- Publication number
- CN103952243A CN103952243A CN201410156472.6A CN201410156472A CN103952243A CN 103952243 A CN103952243 A CN 103952243A CN 201410156472 A CN201410156472 A CN 201410156472A CN 103952243 A CN103952243 A CN 103952243A
- Authority
- CN
- China
- Prior art keywords
- composite
- circuit board
- cleaning agent
- residue
- effectively eliminating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Detergent Compositions (AREA)
Abstract
The invention relates to a cleaning agent capable of effectively eliminating white frost residue on a circuit board. The cleaning agent capable of effectively eliminating the white frost residue on the circuit board comprises the following components: 15-18% of compound binary acid dimethyl ester, 2-4% of dodecyl glucoside, 0.5-1.0% of ethanol amine, 1-3% of poly aspartic acid and the balance of absolute ethyl alcohol raw material. The cleaning agent provided by the invention has capability of effectively eliminating the white frost residue on the circuit board, can improve electrical performances of the circuit board, is an environmental-friendly high-boiling point solvent and can be automatically biodegraded; besides, the cleaning agent provided by the invention has the advantages and beneficial effects of extremely strong sequestration dispersive capacity, strong adsorbability, good compatibility of components and prevention of dirt redeposition.
Description
Technical field
The present invention relates to a kind of clean-out system that can effectively remove wiring board bloom residue, belong to field of electronic materials.
Background technology
After at present electronics and IT products pcb board welding is cleaned, at the more residual similar bloom residues of plate face, this is the long-term unsolved problem of pcb board cleaning, is also that solvent-borne type pcb board clean-out system is failed the problem breaking through.Bloom residue belongs to rosin or other organic residues use rosin resin class soldering flux and solder paster dress to join while welding wiring board; under high-temperature soldering condition; PCB surface often can generate white sylvic acid salt residue; and in water-soluble flux halogenide and organic acid content higher; there is stronger acidity; solder joint when high-temperature soldering and on wiring board and pad generation chemical reaction generate white metal halide salt, and these white residues are to clean rear board to turn white to form and be difficult for the major cause of bloom removed.These materials not only affect complete machine degree of cleaning and also cause environment for use to pollute.Climate changes, and temperature raises and reduces moisture effect, and pcb board circuit is in service, likely produces parameter, and between line pitch, insulation resistance declines, or produces electromigration.Especially the rapid growth that makes tin whisker between solder joint bonding wire under high temperature salt mist environment, causes short circuit, affects complete machine service precision and reliability and causes normally working.Existing rinse product is also difficult to dispose this class bloom class residue.This not only causes the defective electric property that can affect wiring board of the more important thing is of wiring board outward appearance, and some leaning solvent acid numbers are high, temperature is high, and Reusability butt welding point has corrosion, and this is electronic material welding field urgent problem.
Summary of the invention
The object of the invention is provides a kind of clean-out system that can effectively remove wiring board bloom residue for the shortcoming of existing clean-out system with deficiency, thereby improves wiring board quality, has also increased attractive in appearance.
The present invention also provides the preparation method of this clean-out system.
The object of the invention is to realize by following technical proposal:
The clean-out system that can effectively remove wiring board bloom residue, it is made up of the raw material of following weight per-cent:
Described composite dibasic acid dimethyl ester is that Methyl glutarate, dimethyl succinate and dimethyl adipate are composite, and its composite weight ratio is 35～40:30～35:20～25.
The preparation method that can effectively remove the clean-out system of wiring board bloom residue, it carries out in the steps below:
(a) by Methyl glutarate, dimethyl succinate and the dimethyl adipate composite tank that is placed in 35～40:30～35:20～25 by weight, 0.5～1.0 hour composite dibasic acid dimethyl ester of preparation of mix and blend;
(b) get 15～18%(weight of (a) preparation, composite dibasic acid dimethyl ester, 2～4% lauryl glucosyl, 0.5～1.0% thanomin, 1～3% poly aspartic acid and surplus dehydrated alcohol down together), add successively in reactor and stir 0.5～1 hour, within static 0.5 hour, be rinse product of the present invention.
The composite dibasic acid dimethyl ester of the present invention is de-ester agent, by Methyl glutarate, dimethyl succinate and dimethyl adipate are composite, Methyl glutarate, English name Dimethyl glutarate, dimethyl succinate, have another name called Succinic acid dimethylester, English name Dimethyl succinat, wherein Methyl glutarate 35～40%, dimethyl succinate 30～35% and dimethyl adipate 20～25%, acid number≤0.3mgKOH/g after composite, can prevent the erosion of butt welding point in cleaning, experimental results show that three has the ability of bloom residue on extremely strong removing wiring board after composite.Composite dibasic acid dimethyl ester in cleaning to the clearance of the residues such as bloom more than 98%.When washing test also shows that composite dibasic acid dimethyl ester is less than 15% consumption in clean-out system, clean effect starts to weaken, while exceeding 18% consumption, increase the cost of clean-out system, the marking ink on printed circuit board (PCB) and components and parts has been had to slight erosion simultaneously.Dibasic acid dimethyl ester compound is environmental protection high boiling solvent, voluntarily biological degradation.Its flash-point (remaining silent) is 101 DEG C after measured, 360 DEG C naturally, and zero pour-20 DEG C, boiling range (101.3KPa) 200-236 DEG C.
Lauryl glucosyl, has another name called Dodecyl Glucoside, dodecyl glycosides, Dodecyl Polyglucosides, lauryl glucoside, for nonionogenic tenside (AlKylpoLygulocoside) is called for short C
12aPG, make lauryl glucosyl raw materials used by reproducible natural resources derivative, be glucose and the acid of ester fat, be nontoxic non-stimulated completely can biodegradable raw material.C
12aPG is water white liquid, soluble in water and conventional organic solvent, and molecular formula is C
18h
36o
6, No. CAS is 110615-47-9, is selected from the lauryl glucosyl of 50% content of Shijiazhuang gold More company limited, its index is:
Outward appearance: colourless transparent liquid
Lauryl glucosyl can reduce the interfacial tension of clean-out system, increases and is cleaned the wettability of object and the perviousness of dirt.Have synergy with composite dibasic acid dimethyl ester, this product also can be provided by Tianjin the 3rd petroleum chemical plant.
Thanomin is emulsifying agent; Poly aspartic acid, commercial disignation PASP, molecular formula C
4h
5nO
3m (C
4h
4nO
3m)
m(C
4h
4nO
3m)
mc
4h
4nO
3m
2, poly aspartic acid is the synthetic macromolecular compound of artificial bionic, and readily biodegradable, is internationally recognized green chemical, has extremely strong huge legendary turtle to close dispersive ability, and adsorptivity is strong, good with each component compatibility, the effect that has dirt-proof to deposit again.Be selected from Bondi Shandong Chemical Limited By Share Ltd..
Its index is:
Outward appearance: blue to reddish-brown liquid
Because the technology of the present invention tool that makes of taking technique scheme has the following advantages and effect:
(a) this clean-out system has the ability of bloom residue on extremely strong removing wiring board, and clearance more than 98%, improves the electric property of wiring board, is environmental protection high boiling solvent, voluntarily biological degradation;
(b) lauryl glucosyl of selecting is raw materials used by reproducible natural resources derivative, is glucose and lipid acid, be nontoxic non-stimulated completely can biodegradable raw material;
(c) have extremely strong huge legendary turtle to close dispersive ability, adsorptivity is strong, and each component compatibility is good, the effect that has dirt-proof to deposit again.
Embodiment:
Embodiment 1
By composite to 40g Methyl glutarate, 30g dimethyl succinate and the 25g dimethyl adipate tank that is placed in, 0.5 hour composite dibasic acid dimethyl ester of preparation of mix and blend, get composite dibasic acid dimethyl ester 15g, lauryl glucosyl 2.0g, thanomin 1.0g, poly aspartic acid 1.2g and dehydrated alcohol 80.8g, add successively in reactor and stir 1.0 hours, within static 0.5 hour, be rinse product of the present invention.
Embodiment 2
By composite to 35g Methyl glutarate, 35g dimethyl succinate and the 20g dimethyl adipate tank that is placed in, 1.0 hours composite dibasic acid dimethyl esters of preparation of mix and blend, get composite dibasic acid dimethyl ester 18g, lauryl glucosyl 3.2g, thanomin 0.5g, poly aspartic acid 3.0g and dehydrated alcohol 75.3g, add successively in reactor and stir 0.8 hour, within static 0.5 hour, be rinse product of the present invention.
Embodiment 3
By composite to 38g Methyl glutarate, 32g dimethyl succinate and the 23g dimethyl adipate tank that is placed in, 0.8 hour composite dibasic acid dimethyl ester of preparation of mix and blend, get composite dibasic acid dimethyl ester 16g, lauryl glucosyl 4.0g, thanomin 0.8g, poly aspartic acid 2.0g and dehydrated alcohol 77.2g, add successively in reactor and stir 0.5 hour, within static 0.5 hour, be rinse product of the present invention.
Embodiment 4
By composite to 40g Methyl glutarate, 35g dimethyl succinate and the 25g dimethyl adipate tank that is placed in, 0.8 hour composite dibasic acid dimethyl ester of preparation of mix and blend, get composite dibasic acid dimethyl ester 17g, lauryl glucosyl 3.6g, thanomin 0.6g, poly aspartic acid 1.0g and dehydrated alcohol 77.8g, add successively in reactor and stir 1.0 hours, within static 0.5 hour, be rinse product of the present invention.
Embodiment 5
Get embodiment 1 and prepare composite dibasic acid dimethyl ester 15.8g, dodecyl glucose 2.8g, thanomin 0.7g, poly aspartic acid 2.8g and dehydrated alcohol 77.9g, add successively in reactor and stir 0.5 hour, within static 0.5 hour, is rinse product of the present invention.
Embodiment 6
Get embodiment 2 and prepare composite dibasic acid dimethyl ester 16.3g, dodecyl glucose 2.4g, thanomin 0.9g, poly aspartic acid 2.2g and dehydrated alcohol 78.2g, add successively in reactor and stir 1.0 hours, within static 0.5 hour, is rinse product of the present invention.
Claims (2)
1. can effectively remove a clean-out system for wiring board bloom residue, it is characterized in that it is made up of the raw material of following weight per-cent:
Described composite dibasic acid dimethyl ester is that Methyl glutarate, dimethyl succinate and dimethyl adipate are composite, and its composite weight ratio is 35～40:30～35:20～25.
2. the preparation method of the clean-out system that can effectively remove wiring board bloom residue as claimed in claim 1, is characterized in that it carries out in the steps below:
(a) by Methyl glutarate, dimethyl succinate and the dimethyl adipate composite tank that is placed in 35～40:30～35:20～25 by weight, 0.5～1.0 hour composite dibasic acid dimethyl ester of preparation of mix and blend;
(b) get 15～18%(weight of (a) preparation, composite dibasic acid dimethyl ester, 2～4% lauryl glucosyl, 0.5～1.0% thanomin, 1～3% poly aspartic acid and surplus dehydrated alcohol down together), add successively in reactor and stir 0.5～1 hour, within static 0.5 hour, be rinse product of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156472.6A CN103952243B (en) | 2014-04-18 | 2014-04-18 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410156472.6A CN103952243B (en) | 2014-04-18 | 2014-04-18 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103952243A true CN103952243A (en) | 2014-07-30 |
| CN103952243B CN103952243B (en) | 2018-01-09 |
Family
ID=51329603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410156472.6A Active CN103952243B (en) | 2014-04-18 | 2014-04-18 | A kind of cleaning agent that can effectively remove wiring board bloom residue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103952243B (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898734A (en) * | 2015-05-18 | 2015-09-09 | 中国地质大学（武汉） | Dynamic type temperature difference control and record device |
| CN106337196A (en) * | 2016-07-31 | 2017-01-18 | 深圳市贝加电子材料有限公司 | Micro pore sealing agent for noble metal surface treatment of printed circuit board |
| CN106398892A (en) * | 2016-08-30 | 2017-02-15 | 乐凯特科技铜陵有限公司 | Circuit board cleaning agent with excellent cleaning performance |
| CN106479761A (en) * | 2015-08-28 | 2017-03-08 | 比亚迪股份有限公司 | Use in printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application |
| WO2017140951A1 (en) * | 2016-02-18 | 2017-08-24 | Vauhti Speed Oy | Composition for cleaning skin strips of skin skis |
| CN108774606A (en) * | 2018-06-14 | 2018-11-09 | 郑州创客科技有限公司 | A kind of cleaning agent and preparation method for removing printed wiring board bloom residue |
| CN111893003A (en) * | 2020-08-24 | 2020-11-06 | 上海珑灵洁净科技有限公司 | Aqueous degumming agent composition and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524939A (en) * | 2003-09-15 | 2004-09-01 | 李伟光 | Multifunctional scrubbing cleanser |
| CN101503648A (en) * | 2009-02-26 | 2009-08-12 | 深圳市合明科技有限公司 | Water-based cleaning agent for SMT printing screen |
| WO2012082565A1 (en) * | 2010-12-16 | 2012-06-21 | Kyzen Corporation | Cleaning agent for removal of soldering flux |
| CN103031016A (en) * | 2012-12-12 | 2013-04-10 | 深圳中海化石油化工投资有限公司 | Environment-friendly cleaning agent for printed screen of circuit board |
-
2014
- 2014-04-18 CN CN201410156472.6A patent/CN103952243B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1524939A (en) * | 2003-09-15 | 2004-09-01 | 李伟光 | Multifunctional scrubbing cleanser |
| CN101503648A (en) * | 2009-02-26 | 2009-08-12 | 深圳市合明科技有限公司 | Water-based cleaning agent for SMT printing screen |
| WO2012082565A1 (en) * | 2010-12-16 | 2012-06-21 | Kyzen Corporation | Cleaning agent for removal of soldering flux |
| CN103031016A (en) * | 2012-12-12 | 2013-04-10 | 深圳中海化石油化工投资有限公司 | Environment-friendly cleaning agent for printed screen of circuit board |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104898734A (en) * | 2015-05-18 | 2015-09-09 | 中国地质大学（武汉） | Dynamic type temperature difference control and record device |
| CN106479761A (en) * | 2015-08-28 | 2017-03-08 | 比亚迪股份有限公司 | Use in printed circuit board waterborne cleaning agent composition and cleaning agent and its preparation method and application |
| WO2017140951A1 (en) * | 2016-02-18 | 2017-08-24 | Vauhti Speed Oy | Composition for cleaning skin strips of skin skis |
| US10711226B2 (en) | 2016-02-18 | 2020-07-14 | Vauhti Speed Oy | Composition for cleaning skin strips of skin skis |
| CN106337196A (en) * | 2016-07-31 | 2017-01-18 | 深圳市贝加电子材料有限公司 | Micro pore sealing agent for noble metal surface treatment of printed circuit board |
| CN106337196B (en) * | 2016-07-31 | 2018-08-10 | 深圳市贝加电子材料有限公司 | Microscopic void sealer for the processing of printed wiring board precious metal surface |
| CN106398892A (en) * | 2016-08-30 | 2017-02-15 | 乐凯特科技铜陵有限公司 | Circuit board cleaning agent with excellent cleaning performance |
| CN108774606A (en) * | 2018-06-14 | 2018-11-09 | 郑州创客科技有限公司 | A kind of cleaning agent and preparation method for removing printed wiring board bloom residue |
| CN111893003A (en) * | 2020-08-24 | 2020-11-06 | 上海珑灵洁净科技有限公司 | Aqueous degumming agent composition and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103952243B (en) | 2018-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103952243A (en) | Cleaning agent capable of effectively eliminating white frost residue on circuit board | |
| CN100528461C (en) | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| CN101214594A (en) | Environment-friendly type lead-free solder water-based scaling powder and preparation thereof | |
| CN103286477B (en) | A kind of lead-free solder scaling powder and preparation method thereof | |
| CN103597547B (en) | Containing wax thixotrope can the thick film paste compositions of high aspect ratio silk screen printing | |
| CN100496867C (en) | Cleaning-free soldering flux without halogen and rosin for solder without lead | |
| JP5428859B2 (en) | Cleaning composition for removing lead-free solder flux and method for removing lead-free solder flux | |
| CN100571962C (en) | A kind of SMT no-lead tinol | |
| CN102398124B (en) | Water-based cleaning-free flux for lead-free welding flux and preparation method thereof | |
| CN101972906B (en) | Lead-free environmentally friendly soldering flux and preparation method thereof | |
| CN105331471A (en) | Environment-friendly neutral water-based cleaning agent, preparation method and application | |
| DE69004521T2 (en) | Detergent based on a dibasic ester and a hydrocarbon solvent and cleaning method. | |
| SG176948A1 (en) | Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux | |
| CN101085497A (en) | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| WO2008021782A2 (en) | An etching mask usable in a process for manufacturing solar cells | |
| CN101143407A (en) | Soldering paste and its preparation method | |
| CN101780606A (en) | Washing-free lead-free halogen-free tin soldering paste | |
| CN102513733A (en) | Flux | |
| CN104073167B (en) | The composition of welding soldering flux containing rosin ester and paste composition | |
| US5062988A (en) | Cleaning composition of dibasic ester, hydrocarbon solvent and compatibilizing component | |
| CN107186387A (en) | A kind of cleaning-free lead-free solder soldering fluid and preparation method thereof | |
| US5011620A (en) | Cleaning composition of dibasic ester and hydrocarbon solvent | |
| CN102528329B (en) | Halogen-free and lead-free solder paste and preparation method | |
| CN100352598C (en) | Wash-free film forming water-based type welding flux | |
| RU2438845C1 (en) | Solder paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200408 Address after: 523000, No. 2, No. 1, industrial North Road, Songshan hi tech Industrial Development Zone, Guangdong, Dongguan Patentee after: GUANGDONG ZHONGSHI METAL Co.,Ltd. Address before: 100016 Chaoyang District Jiuxianqiao Jiali Hotel Beijing B113 Co-patentee before: GUANGDONG ZHONGSHI METAL Co.,Ltd. Patentee before: BEIJING CHAOBOHANG SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |