CN100352598C - Wash-free film forming water-based type welding flux - Google Patents
Wash-free film forming water-based type welding flux Download PDFInfo
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- CN100352598C CN100352598C CNB031397506A CN03139750A CN100352598C CN 100352598 C CN100352598 C CN 100352598C CN B031397506 A CNB031397506 A CN B031397506A CN 03139750 A CN03139750 A CN 03139750A CN 100352598 C CN100352598 C CN 100352598C
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- water
- scaling powder
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- polyvinyl alcohol
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
The present invention relates to wash-free film forming water-based type soldering flux. The water-based type soldering flux contains 0.5 to 8% of water soluble thermosetting resin (measured by weight, the same below), 0.5 to 5% of activator, and 90 to 99% of deionized water, wherein the activator is formed from surface activity component, organic acid and alcohol cosolvent. The water-based type soldering flux is applied to the production of microelectric soldering. The present invention has the advantages that pollution and unsafety which are brought by the organic solvent soldering flux can be eliminated; the water-based type soldering flux does not need to be washed; a non-water solubility film with certain adhesive force can be formed on the surface of a circuit board to prevent moisture and dampness; insulated stability of electric appliances is effectively enhanced.
Description
Technical field
The present invention relates to a kind of scaling powder of microelectronics welding usefulness, particularly a kind of water base type scaling powder.
Background technology
In the microelectronics welding, scaling powder is crucial auxiliary material.Dissimilar scaling powders aspect the quality of welding effect, environmental pollution, production cost and final electric equipment products, has very big difference.The scaling powder that two major types are arranged that is widely used at present, the first kind is an organic solvent type, the characteristics of the type are that the bioactive agent composition in the scaling powder all must be dissolved in the organic solvent (as methyl alcohol, ethanol, propyl alcohol etc.), its advantage is to exempt from matting, but store and production process in, have inflammable, volatilization, contaminated air, problems such as pungent.Second class is an aqua type, though the scaling powder of the type has advantage from environmental protection and secure context, after shortcoming is to use such scaling powder, residues in the residue of panel because the moisture-sensitive dissolving causes insulating properties to descend, so must use a large amount of washed with de-ionized water.And cleaning equipment is many, complex procedures, cost height.This also be up to now water base type scaling powder not if any agent solvent-borne type flux application one of reason widely.
Summary of the invention
The present invention is in line with in order to solve the above-mentioned reality problem in producing, seek to prepare a kind of water base type scaling powder of disposable film-formability, this scaling powder had both been eliminated the safety and the pollution problem of organic solvent, removed the later process that general water base type scaling powder need clean again from.Find through experimental study; after the film-formability thermosetting resin modification with one or more; be equipped with the activator that selectively uses certain content again; the water-based type cleaning-free scaling powder of producing, after using, PCB surface can form layer protecting film; this film is water-insoluble; can damp proof protection against the tide etc., play the effect that improves insulating properties, increases the service life, and scaling powder is functional.
Disposable film-formability water base type scaling powder of the present invention, it contains by weight percentage:
The water-soluble thermosetting resin of 0.5-8%;
The activator of 0.5-5%;
The deionized water of 90-99%, wherein, described activator does not comprise halogen, is made up of the surfactant of 5-17%, the organic acid of 25-35% and the co-solvent of 50-70%.
Contain one or more film-formability thermosetting resins in this scaling powder.These resins because moisture content volatilizees and is subjected to heat effect, form the water-insoluble diaphragm of one deck in the surface of wiring board immediately after scaling powder uses.These thermosetting resins can be polyvinyl alcohol, acrylic resin, alkyd resins, epoxy resin etc. or two kinds or above mixture in them, but are not limited to these.These resins must have certain solubility under uniform temperature (as 50-100 ℃), to reach film-formable concentration.
The activator composition that contains in the disposable film-formability water base type scaling powder of the present invention can not contain halogen to guarantee the insulating properties after disposable.Described activator is made up of surfactant, organic acid and co-solvent.Surfactant is to be selected from succinic acid two own vinegar sodium sulfonates, succinic acid two hot vinegar sodium sulfonate or their mixtures in the activator of the present invention; Described organic acid is to be selected from salicylic acid, acetate or their mixture, and described co-solvent is a glycerine.But be not limited to these.
This water-based type cleaning-free scaling powder provided by the invention is applied in microelectronics wave-soldering or the manual welding production; both environmental protection; disposable again; and because the effect of film-formability thermosetting resin; after electronic circuit board process welding sequence; can form the water-insoluble film that one deck has certain adhesive force in PCB surface, play moistureproof damp proof protective effect, improve the insulation stability of electric equipment products effectively.
Crux part of the present invention is the selection of thermosetting resin, the selection and the additional proportion of activator.Below in conjunction with embodiment the present invention is further described in detail.
The specific embodiment
Embodiment 1
Get deionized water 100kg homemade or that buy, adding can be heated and be with in the reactor that stirs.To wherein adding the 2kg polyvinyl alcohol, begin to heat up and stirring at low speed again, be warming up to 70 ℃ in 30 minutes.Insulation also continued stir about 1 hour, to dissolving fully.Stop heating, still continue to stir.Add activator successively: succinic acid two own vinegar sodium sulfonate 100g, salicylic acid 300g, acetate 100g, glycerine 1000g.After adding finishes, stir 5 minutes, be scaling powder of the present invention to fully evenly.
When this scaling powder evenly is coated with, or be sprayed to PCB surface, and after forming wave-soldering, can play the effect of required common scaling powder, and form the water-insoluble film of one deck in PCB surface, this tunic can be damp proof, moistureproof, the protection circuit plate.
Embodiment 2
Preparation process is with embodiment 1, and just each component and content are to as follows:
Deionized water: 100kg;
Polyvinyl alcohol: 1.5kg;
Water soluble acrylic resin: 0.3kg;
Aerosol OT: 100g;
Salicylic acid: 300g;
Acetate: 100g;
Glycerine: 1000g;
Embodiment 3
Preparation process is with embodiment 1, and just each component and content are to as follows:
Deionized water: 100kg;
Polyvinyl alcohol: 2kg;
Water soluble alkyd resin: 0.2kg;
Succinic acid dihexyl sodium sulfonate: 100g;
Aerosol OT: 50g;
Salicylic acid: 200g;
Acetate: 120g;
Glycerine: 500g;
Each component changes, and mainly is different and adjust to the requirement that helps weldering property, moisture resistance and cost according to different electronic products.
Claims (6)
1, a kind of disposable film-formability water base type scaling powder, it contains by weight percentage:
The water-soluble thermosetting resin of 0.5-8%;
The activator of 0.5-5%;
The deionized water of 90-99%;
It is characterized in that: described activator does not comprise halogen, is made up of the surfactant of 5-17%, the organic acid of 25-35% and the co-solvent of 50-70%.
2, scaling powder according to claim 1, wherein water-soluble thermosetting resin is to be selected from polyvinyl alcohol, water soluble acrylic resin, water soluble alkyd resin, water-soluble epoxy resin or two kinds or above mixture in them; Surfactant is to be selected from succinic acid two own vinegar sodium sulfonates, succinic acid two hot vinegar sodium sulfonate or their mixtures in the described activator; Described organic acid is to be selected from salicylic acid, acetate or their mixture, and described co-solvent is a glycerine.
3, scaling powder according to claim 2, wherein water-soluble thermosetting resin is the mixture of polyvinyl alcohol and acrylic resin, the proportion of polyvinyl alcohol and acrylic resin is 3: 1-5: 1.
4, scaling powder according to claim 2, wherein said water-soluble thermosetting resin are the mixtures of polyvinyl alcohol and alkyd resins, and the proportion of polyvinyl alcohol and alkyd resins is 5: 1-10: 1.
5, scaling powder according to claim 2, organic acid is the mixture of salicylic acid and acetate in the wherein said activator, acetate and salicylic proportion are 2: 6-3.6: 6.
6, scaling powder according to claim 2, wherein surfactant is succinic acid two own vinegar sodium sulfonates and the succinic acid two hot vinegar sodium sulfonates mixture with 2: 1 ratios in the activator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031397506A CN100352598C (en) | 2003-07-03 | 2003-07-03 | Wash-free film forming water-based type welding flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031397506A CN100352598C (en) | 2003-07-03 | 2003-07-03 | Wash-free film forming water-based type welding flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1565791A CN1565791A (en) | 2005-01-19 |
| CN100352598C true CN100352598C (en) | 2007-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB031397506A Expired - Fee Related CN100352598C (en) | 2003-07-03 | 2003-07-03 | Wash-free film forming water-based type welding flux |
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100457375C (en) * | 2007-08-11 | 2009-02-04 | 厦门大学 | Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth |
| CN101733586B (en) * | 2010-01-08 | 2013-02-06 | 四川大学 | Halogen-free soldering flux for electronic industry |
| CN101890596A (en) * | 2010-07-23 | 2010-11-24 | 深圳市亿铖达工业有限公司 | Low-carbon environmentally-friendly water-based soldering flux |
| CN102248328A (en) * | 2011-07-28 | 2011-11-23 | 常州佳讯光电产业发展有限公司 | No-cleaning type low-rosin soldering flux |
| JP5218686B2 (en) * | 2011-08-08 | 2013-06-26 | Ｊｓｒ株式会社 | Flux composition, method of forming electrical connection structure, electrical connection structure, and semiconductor device |
| JP6196036B2 (en) * | 2012-12-26 | 2017-09-13 | ハリマ化成株式会社 | Flux and solder paste |
| CN105108380B (en) * | 2015-07-31 | 2017-12-12 | 重庆硕奥科技有限公司 | The preparation method of flux material composition and scaling powder |
| CN106624464A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Water-based flux |
| CN106624457A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Low-corrosiveness water-based soldering flux composite |
| CN107838578A (en) * | 2017-11-29 | 2018-03-27 | 温州宏丰电工合金股份有限公司 | A kind of water-based preparation method into lotion prepared for the nickel-based solders of paste XHBNi 5 |
| CN108080808A (en) * | 2017-11-29 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | It is a kind of to be used for the aqueous into lotion of paste XHBNi-5 nickel-based solders preparation |
| CN109048122A (en) * | 2018-08-17 | 2018-12-21 | 佛山朝鸿新材料科技有限公司 | A kind of preparation method of the disposable flux material of high activity |
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| US5334260A (en) * | 1993-02-05 | 1994-08-02 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| US5443660A (en) * | 1994-10-24 | 1995-08-22 | Ford Motor Company | Water-based no-clean flux formulation |
| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
| CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
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2003
- 2003-07-03 CN CNB031397506A patent/CN100352598C/en not_active Expired - Fee Related
Patent Citations (5)
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| US5334260A (en) * | 1993-02-05 | 1994-08-02 | Litton Systems, Inc. | No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| US5334260B1 (en) * | 1993-02-05 | 1995-10-24 | Litton Systems Inc | No-clean, low-residue, volatile organic conpound free soldering flux and method of use |
| US5443660A (en) * | 1994-10-24 | 1995-08-22 | Ford Motor Company | Water-based no-clean flux formulation |
| CN1131076A (en) * | 1995-03-16 | 1996-09-18 | 雒社教 | Cleaning-free scaling powder |
| CN1404959A (en) * | 2002-10-18 | 2003-03-26 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
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| CN1565791A (en) | 2005-01-19 |
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