CN100571962C - A kind of SMT no-lead tinol - Google Patents
A kind of SMT no-lead tinol Download PDFInfo
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- CN100571962C CN100571962C CNB2006100611566A CN200610061156A CN100571962C CN 100571962 C CN100571962 C CN 100571962C CN B2006100611566 A CNB2006100611566 A CN B2006100611566A CN 200610061156 A CN200610061156 A CN 200610061156A CN 100571962 C CN100571962 C CN 100571962C
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- tinol
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- rosin
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Abstract
The present invention relates to a kind of SMT no-lead tinol, comprise solvent, thixotropic agent, composite adhesive, activating agent, surfactant and antioxidant, described composite reactive agent is the composite reactive agent that is formed by dimethyl succinic acid and other organic acid, halogen salt, described halogen salt is diphenylguanidine hydrobromate or diphenylguanidine hydrochloride, and described antioxidant is the 2.6-di-tert-butyl-4-methy phenol.The use of SMT no-lead tinol of the present invention meets market and environmental protection requirement, the present invention simultaneously uses dimethyl succinic acid and other organic acid, halogen salt to form the composite reactive agent, the lead-free solder paste wetability of making is good, printing good, the lotion uniform and smooth, the postwelding residue is of light color, corrosivity is little, use the characteristics of excellent storage stability, can adapt to the requirement of electron trade double-sided PCB secondary back welding.
Description
Technical field
The present invention relates to a kind of surface mount (SMT) no-lead tinol.
Background technology
Traditional electronic product employed leadless soldering tin paste in assembling process mainly is made up of ashbury metal powder and soldering paste, glass putty alloy wherein mainly is the alloy that the lead of 63% tin and 37% is formed, its fusing point is 183 ℃, but European Union has announced the ROHS instruction, regulation was from July 1st, 2006, forbid containing lead above stipulating the level of limiting the quantity of, cadmium, mercury, Cr VI, the electronic and electrical equipment of PBBs and six kinds of harmful substances of PBDEs enters European Union market, and the ROHS of China also will be in formal enforcement on March 1st, 2007, so electronic enterprise must adopt new material, new technology satisfies market environmental protection and unleaded requirement.Research along with the lead-free alloy material, consider the mechanical performance of material, cost, basic fundamental conditions such as solderability, people progressively focus on SAC, tin copper, on the alloy materials such as Xi Yin, but the fusing point of these materials is all more than 220 ℃, originally be used to make a lot of materials of solder(ing) paste, owing to do not adapt to high-temperature soldering, or volatilization in advance, or oxidation stain is serious, will be no longer suitable, therefore, need restudy and seek the various materials that are suitable for the high-temp leadless welding, good to produce, the leadless soldering tin paste that is suitable for, in traditional solder paste material, activating agent is general to adopt halogen-containing salt compounds as cyclohexylamine hydrochloride, diethylamine hydrochloride, the diphenylguanidine hydrobromate, diphenylguanidine hydrochloride or succinic acid, adipic acid, dibromosuccinic acid, organic acids such as glutaric acid, in general, adopt the haloid compounds as activating agent, welding is better active, but the corrosivity of halogen is stronger, and make resin such as rosin at high temperature produce oxidation stain easily, make welding residue color burn, adopt succinic acid, organic acids such as adipic acid, it is desirable that solder wettability can not reach, and welding tin ball is more.
Summary of the invention
It is darker to the objective of the invention is to solve in the prior art soldering paste residue color in welding, and welding performance such as does not understand at technical problem, and a kind of good welding performance and the light-colored SMT soldering paste of welding back residue are provided.
For achieving the above object, technical scheme of the present invention is: a kind of SMT no-lead tinol, comprise solvent, thixotropic agent, adhesive, composite reactive agent, surfactant and antioxidant, wherein: described composite reactive agent is the composite reactive agent that is formed by dimethyl succinic acid and other organic acid, halogen salt, described halogen salt is diphenylguanidine hydrobromate or diphenylguanidine hydrochloride, and described antioxidant is the 2.6-di-tert-butyl-4-methy phenol.
Described other organic acid is one or more compositions in succinic acid, adipic acid, dibromosuccinic acid, glutaric acid or the itaconic acid.
Described solvent is made up of in terpinol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol list octyl ether, diethylene glycol monohexyl ether, dipropylene glycol methyl ether, the 2-ethyl-1.3-hexylene glycol one or more.
Described thixotropic agent is one or both compositions in polyamide, the rilanit special.
Described adhesive is an abietic resin, and described abietic resin is one or more compositions in rosin or the rosin rosin derivative.
Described abietic resin is one or more compositions in semihydrogenation rosin, perhydrogenated rosin, disproportionated rosin, esterified rosin, the dimerization colophonium.
Described surfactant is APES, NPE or fluorine-containing surfactant.
Described antioxidant is benzotriazole or 2.6-di-tert-butyl-4-methy phenol or its two kinds of compositions.
Compared with prior art, technique effect of the present invention is: soldering paste of the present invention can with leadless tin-base alloy powder mixing after be used for SMT, overcome the SMT leaded problem of tin cream in the prior art, meet market and environmental protection requirement, soldering paste simultaneously of the present invention adopts dimethyl succinic acid and other organic acid, halogen salt to form the composite reactive agent, its dimethyl succinic acid has improved the wettability of solder(ing) paste both as the activating agent material, reduces the generation of tin ball; Also use, make the solder(ing) paste of production have characteristics such as wetting expansion force is good, tin sweat(ing) is few, residue is of light color, insulaion resistance is high, corrosivity is little as a stabilizing agent.
The specific embodiment
The invention provides a kind of surface mounting technology no-lead tinol, its described soldering paste comprises solvent, thixotropic agent, adhesive, composite reactive agent, surfactant and antioxidant, the composite reactive agent is the composite reactive agent that is formed by dimethyl succinic acid and other organic acid, halogen salt, described halogen salt is diphenylguanidine hydrobromate or diphenylguanidine hydrochloride, below is the embodiment and the comparative example of soldering paste prescription of the present invention.See Table 1:
Table 1
Through the product that above-mentioned comparative example and embodiment are made, detection method with reference to SJ/T11186-1998 " tin lead plaster shape scolder general specification ", it has been carried out wetability, solder ball test and has observed the bin stability of solder(ing) paste, the color of second reflow residue, bin stability is a viscosity of measuring solder(ing) paste with (20 ~ 30 ℃) under the normal temperature normality, and the variation of observing apparent condition compares judgement.The color of residue is that the solder(ing) paste of getting about 0.2g places on the white ceramics, observes relatively under 10 times of magnifying glasses after the secondary back welding, the results are shown in following table 2:
Table 2
This shows, add dimethyl succinic acid and other organic acid, the agent of halogen salt formation composite reactive, wetability and minimizing tin ball for leadless soldering tin paste have positive effect, stability for the solder(ing) paste storage at normal temperature improves a lot, simultaneously, can adapt to the secondary back welding, residue is of light color, can reach the requirement of exempting to clean.
It is in the SMT technology that product of the present invention is mainly used in the electron trade surface mount process, at present, the wiring board of electric equipment products has the SMT of employing technology is arranged more than 80%, solder(ing) paste is its main welding material, enforcement along with the ROHS of European Union instruction and Chinese ROHS instruction, use in the market of leadless soldering tin paste will be very extensive, and almost replacing whole is present the lead welding tin cream.
Claims (7)
1, a kind of SMT no-lead tinol, comprise solvent, thixotropic agent, adhesive, composite reactive agent, surfactant and antioxidant, it is characterized in that: described composite reactive agent is the composite reactive agent that is formed by dimethyl succinic acid and other organic acid, halogen salt, described halogen salt is diphenylguanidine hydrobromate or diphenylguanidine hydrochloride, and described antioxidant is the 2.6-di-tert-butyl-4-methy phenol.
2, SMT no-lead tinol according to claim 1 is characterized in that: described other organic acid is one or more compositions in succinic acid, adipic acid, dibromosuccinic acid, glutaric acid or the itaconic acid.
3, SMT no-lead tinol according to claim 2 is characterized in that: described solvent is made up of in terpinol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol list octyl ether, diethylene glycol monohexyl ether, dipropylene glycol methyl ether, DPG butyl ether, tetraethylene glycol dimethyl ether, 2-butyl-1-octanol, the 2-ethyl-1.3-hexylene glycol one or more.
4, SMT no-lead tinol according to claim 3 is characterized in that: described thixotropic agent is one or both compositions in polyamide, the rilanit special.
5, SMT no-lead tinol according to claim 4, it is characterized in that: described adhesive is an abietic resin, described abietic resin is made up of in rosin or the rosin derivative one or more.
6, SMT no-lead tinol according to claim 4 is characterized in that: described abietic resin is made up of in semihydrogenation rosin, perhydrogenated rosin, disproportionated rosin, esterified rosin, the dimerization colophonium one or more.
7, SMT no-lead tinol according to claim 5 is characterized in that: described surfactant is APES, NPE or fluorine-containing surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100611566A CN100571962C (en) | 2006-06-13 | 2006-06-13 | A kind of SMT no-lead tinol |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100611566A CN100571962C (en) | 2006-06-13 | 2006-06-13 | A kind of SMT no-lead tinol |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101088695A CN101088695A (en) | 2007-12-19 |
| CN100571962C true CN100571962C (en) | 2009-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2006100611566A Expired - Fee Related CN100571962C (en) | 2006-06-13 | 2006-06-13 | A kind of SMT no-lead tinol |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695796B (en) * | 2009-10-23 | 2012-11-14 | 东莞市特尔佳电子有限公司 | Halogen-free lead-free soldering paste for radiator and preparation method thereof |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100590227C (en) * | 2008-01-14 | 2010-02-17 | 深圳市堃琦鑫华科技有限公司 | Molten metal oxidation resistance reducing agent |
| CN101532130B (en) * | 2009-01-12 | 2011-09-14 | 深圳市堃琦鑫华科技有限公司 | Molten metal anti-oxidation reducing agent, preparation method and application thereof |
| CN101745760B (en) * | 2008-12-08 | 2012-07-04 | 厦门法拉电子股份有限公司 | Lead-free solder environmental-protection scaling powder used for soldering capacitor with film adhered on surface |
| JP5486281B2 (en) * | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | Solder paste |
| CN102107340B (en) * | 2009-12-24 | 2015-10-21 | 汉高股份有限及两合公司 | A kind of paste composition, soldering paste and a kind of scaling powder |
| CN103801861A (en) * | 2014-02-21 | 2014-05-21 | 东莞市博特科技有限公司 | Tin alloy soldering paste capable of being stored at normal temperature and preparing method thereof |
| CN104028912A (en) * | 2014-06-18 | 2014-09-10 | 谢光玉 | Lead-free solder paste |
| CN104191109B (en) * | 2014-08-13 | 2016-09-07 | 深圳市汉尔信电子科技有限公司 | A kind of lead-free tin cream activating agent and preparation method thereof and a kind of lead-free tin cream |
| CN112296469A (en) * | 2020-11-16 | 2021-02-02 | 东莞市诚鸿电子科技有限公司 | IC ball mounting process and solder paste |
| CN114273820B (en) * | 2021-12-30 | 2023-05-23 | 云南锡业锡材有限公司 | High-lead soldering paste soldering flux and preparation method thereof |
| CN115781098B (en) * | 2023-01-19 | 2023-04-25 | 广东成利泰科技有限公司 | High-temperature-resistant and oxidation-resistant soldering tin powder and solder paste containing metal indium and preparation methods thereof |
-
2006
- 2006-06-13 CN CNB2006100611566A patent/CN100571962C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695796B (en) * | 2009-10-23 | 2012-11-14 | 东莞市特尔佳电子有限公司 | Halogen-free lead-free soldering paste for radiator and preparation method thereof |
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| CN101088695A (en) | 2007-12-19 |
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