CN109439463A - Aqueous cleaning agent and its preparation method and application - Google Patents
Aqueous cleaning agent and its preparation method and application Download PDFInfo
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- CN109439463A CN109439463A CN201811563003.0A CN201811563003A CN109439463A CN 109439463 A CN109439463 A CN 109439463A CN 201811563003 A CN201811563003 A CN 201811563003A CN 109439463 A CN109439463 A CN 109439463A
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- Prior art keywords
- cleaning agent
- aqueous cleaning
- aqueous
- preparation
- circuit board
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 124
- 238000002360 preparation method Methods 0.000 title claims abstract description 26
- 238000004140 cleaning Methods 0.000 claims abstract description 37
- 238000003466 welding Methods 0.000 claims abstract description 20
- 239000004094 surface-active agent Substances 0.000 claims abstract description 14
- -1 alcohol ethers Chemical class 0.000 claims abstract description 12
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 12
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011737 fluorine Substances 0.000 claims abstract description 11
- 239000006210 lotion Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 21
- 229920000570 polyether Polymers 0.000 claims description 11
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims description 11
- 125000000963 oxybis(methylene) group Chemical group [H]C([H])(*)OC([H])([H])* 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 3
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 2
- IDQBJILTOGBZCR-UHFFFAOYSA-N 1-butoxypropan-1-ol Chemical compound CCCCOC(O)CC IDQBJILTOGBZCR-UHFFFAOYSA-N 0.000 claims description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 2
- CUDYYMUUJHLCGZ-UHFFFAOYSA-N 2-(2-methoxypropoxy)propan-1-ol Chemical compound COC(C)COC(C)CO CUDYYMUUJHLCGZ-UHFFFAOYSA-N 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- RNFAKTRFMQEEQE-UHFFFAOYSA-N Tripropylene glycol butyl ether Chemical compound CCCCOC(CC)OC(C)COC(O)CC RNFAKTRFMQEEQE-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000002148 esters Chemical class 0.000 claims description 2
- 150000002191 fatty alcohols Chemical class 0.000 claims description 2
- 229940102253 isopropanolamine Drugs 0.000 claims description 2
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 2
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 125000004422 alkyl sulphonamide group Chemical group 0.000 claims 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 150000007513 acids Chemical class 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052751 metal Inorganic materials 0.000 abstract description 16
- 239000002184 metal Substances 0.000 abstract description 16
- 239000000463 material Substances 0.000 abstract description 15
- 239000006185 dispersion Substances 0.000 abstract description 10
- 230000001681 protective effect Effects 0.000 abstract description 5
- 239000003344 environmental pollutant Substances 0.000 abstract description 4
- 231100000719 pollutant Toxicity 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 12
- 238000012360 testing method Methods 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000006378 damage Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 229910052799 carbon Inorganic materials 0.000 description 7
- 239000006071 cream Substances 0.000 description 7
- 238000011109 contamination Methods 0.000 description 6
- 230000007613 environmental effect Effects 0.000 description 5
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 4
- 238000009835 boiling Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000011086 high cleaning Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000006184 cosolvent Substances 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000011780 sodium chloride Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/835—Mixtures of non-ionic with cationic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/004—Surface-active compounds containing F
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/008—Polymeric surface-active agents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/60—Sulfonium or phosphonium compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C11D2111/22—
-
- C11D2111/46—
Abstract
The invention discloses a kind of aqueous cleaning agents and its preparation method and application.The aqueous cleaning agent includes following weight percentage components: nonionic surfactant 1-5%, fluorine-containing surfactant 0.05-0.2%, alcohol ethers solvent 15-25%, alkaline auxiliary lotion 0.5-5%, water surplus.The aqueous cleaning agent on electronic circuit board weld after remain excellent cleaning ability; to other pollutants, welding residue also good removal ability; there are good compatibility and protective effect to sensitive metal and fragile functional form material, the performance that electronic circuit board has been effectively ensured is stablized；And the aqueous cleaning agent is using water as main medium, and environmentally friendly, no flash-point, safety, dispersion are stablized.The aqueous cleaning agent preparation method can effectively ensure that the aqueous cleaning agent dispersion of preparation is stablized.
Description
Technical field
The invention belongs to electronic cleaning agent technical fields, and in particular to a kind of aqueous cleaning agent and preparation method thereof and answer
With.
Background technique
Electronic circuit board is basis and the support of modern electronics industry, is each electronic component electrical signal carrier of connection.With
Electronic product multifunction, highly integrated, high-accuracy requirement are constantly promoted, high reliability will certainly be increasingly concerned.
Conducting wire, solder joint arrangement in such as electronic circuit board is more and more intensive, and the gap after welding between electronic component is smaller and smaller, because
Cleaning requirement after this welds electronic circuit board is also higher and higher.
The welding material of electronic circuit board is mainly scaling powder and weldering, tin cream etc., there is the above-mentioned weldering in part in the welding process
It connects material residual in the circuit board, weld residue complicated component and is especially high temperature and humidity under air oxidation and moisture effect
In the environment of, harm big to the damage of electronic component is big and duration, will affect the reliability of electronic product and use the longevity
Life.In order to ensure the high reliability of electronic product, it is necessary to introduce cleaning process after assist side welding and use cleaning agent.
Cleaning agent currently used for electronic circuit board is mainly alkaline water-based cleaning agent.Wherein strong alkaline water based cleaning agent has
There is a good cleaning ability, but suitable to sensitive metals and ink character, electromagnetism carbon film etc. such as aluminium, copper, platinum, nickel on wiring board
There are different degrees of damage and incompatibility for fragile functional material；Neutral aqueous cleaning agent have good material compatibility but
Cleaning force Shortcomings.It is positive because in this way, caused by Cleaning Agent for PCB be not thorough, cleaning effect is undesirable, and causes
Electronic circuit board poor electrical performance after cleaning, poor reliability.
Summary of the invention
It is an object of the invention to overcome the above-mentioned deficiency of the prior art, a kind of aqueous cleaning agent and its preparation side are provided
Method, to overcome existing aqueous cleaning agent to metal and functional material, there are different degrees of damage and incompatibility and cleaning forces
Insufficient technical problem.
Another object of the present invention is to provide the cleaning method of a kind of application of aqueous cleaning agent and electronic circuit board, with
The technology for overcoming existing Cleaning Agent for PCB effect undesirable and unstable to electronic circuit board electrical property and poor reliability is asked
Topic.
In order to achieve the above-mentioned object of the invention, an aspect of of the present present invention provides a kind of aqueous cleaning agent.The aqueous-base cleaning
Agent.The aqueous cleaning agent includes following weight percentage components:
Another aspect of the present invention provides a kind of preparation method of aqueous cleaning agent.The preparation of the aqueous cleaning agent
Method includes the following steps:
Each component is measured according to component contained by aqueous cleaning agent of the present invention and each component content ratio；
The each component of measurement is subjected to mixed processing.
Another aspect of the invention provides the application method of aqueous cleaning agent of the present invention.Specifically, the present invention is water base clear
Application of the lotion in Cleaning Agent for PCB.
Another aspect of the present invention provides the cleaning method of electronic circuit board of the present invention.The electronic circuit board it is clear
Washing method includes the following steps:
Electronic circuit board after welding is started the cleaning processing using aqueous cleaning agent of the present invention.
Compared with prior art, aqueous cleaning agent of the present invention is by the effect between contained each component, on the one hand to energy
It is enough to remaining excellent cleaning ability after welding on electronic circuit board, to other pollutants, welding, residue is also good goes
Removing solid capacity has good compatibility and protective effect to sensitive metal and fragile functional form material；On the other hand described water base clear
Lotion is using water as main medium, environmental protection, no flash-point, safety, and dispersion is stablized.
Aqueous cleaning agent preparation method of the present invention proportionally mixes each component, and each component is uniformly dispersed, and
The aqueous cleaning agent dispersion of formation is stablized.
Aqueous cleaning agent of the present invention be applied to Cleaning Agent for PCB in and electronic circuit board of the present invention cleaning method by
In being to be cleaned using aqueous cleaning agent of the present invention to electronic circuit board, therefore, the electronics after welding can not only be made
The residual of wiring board, pollutant all have good removal ability, have to sensitive metal and fragile functional form material good simultaneous
The electrical property and high reliability of electronic circuit board has been effectively ensured in capacitive.
Specific embodiment
In order to which technical problems, technical solutions and advantageous effects to be solved by the present invention are more clearly understood, below in conjunction with
Embodiment, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used to explain
The present invention is not intended to limit the present invention.
The weight of each component noted in the disclosure of the embodiment of the present invention not only may refer to specifically containing for each component
Amount, can also indicate the proportionate relationship of weight between each component.Therefore, as long as according to specification each component of the embodiment of the present invention
Content is scaled up or is reduced within specification of embodiment of the present invention scope of disclosure.Specifically, the embodiment of the present invention
Weight described in the specification can be mass unit well known to the chemical fields such as μ g, mg, g, kg.
On the one hand, the embodiment of the invention provides a kind of aqueous cleaning agents.The aqueous cleaning agent includes following weight hundred
Divide the component of ratio:
Wherein, nonionic surfactant contained by the aqueous cleaning agent is as matrix component, in one embodiment, institute
Stating nonionic surfactant includes fatty alcohol polyoxyethylene ether, at least one in polyoxyethylene polyoxypropylene block type polyethers
Kind.In a particular embodiment, the polyoxyethylene polyoxypropylene block type polyethers includes that polyoxyethylene polyoxypropylene block type is poly-
Ether (EP), polyoxyethylene polyoxypropylene polyoxyethylene blocks type polyethers (EPE), polyoxyethylene polyoxypropylene oxypropylene block type
Polyethers (PEP), wherein the polyoxyethylene polyoxypropylene polyoxyethylene blocks type polyethers such as may include in L63, L64, P68
At least one.
The fluorine-containing surfactant contained by the aqueous cleaning agent is due to containing fluorine element, since the fluorine element is
The strongest element of electronegativity has high oxidation gesture, high ionization energy, on the one hand this characteristic forms fluoro- carbon key (F-C) bond energy height,
Thus fluorocarbon chain structure is more than hydrocarbon stable structure；Another aspect fluorine atom is very difficult to be polarized, and fluorocarbon chain polarity is made to compare carbon
Hydrogen chain is small, keeps fluorocarbon chain hydrophobic effect strong more than hydrocarbon chain.Therefore on the one hand the presence of the fluorine-containing surfactant assigns
The aqueous cleaning agent has the hydrophobic of excellent high surface, excellent heat resistance and chemical stability and brilliance, hates
Oiliness energy and anti-pollution function；On the other hand, the fluorine-containing surfactant is compounded with the nonionic surfactant, is played good
Good synergistic effect assigns the aqueous cleaning agent with performances such as excellent wetting, emulsification, infiltration, dispersions.
In one embodiment, the fluorine-containing surfactant include perfluoro alkyl sulfonyl amido alkanol containing sulfoamido, it is complete
At least one of fluoroalkyl sulfonamides aminocarboxylic acids surfactant, surfactant, it is in a particular embodiment, described to contain
The perfluoro alkyl sulfonyl amido alkanol surfactant of sulfoamido includes C8F17SO2N(C2H5)(C2H4O)nH、C8F17SO2N
(C2H4OH)2、C8F17SO2N[(C2H4O)nH]2, wherein n=6-9.Select those fluorine-containing surfactants not only have low polarity,
The C-F key of high surface, high stability contains a sulfuryl amine group in structureAlso have poly- second concurrently simultaneously
Diol type (C2H4O)nSurfactant the advantages of, the service life and cleaning force of the aqueous cleaning agent can be effectively improved.But
Fluorine-containing surfactant price is high, and dosage in formula should not be too high.
The water contained by the aqueous cleaning agent constitutes host agent, and the contained alcohol ethers solvent constitutes builder, because
This, the water and the alcohol ethers solvent complex form helping for the aqueous cleaning agent and wash solvent, assign the aqueous cleaning agent
Excellent cleaning force, environmental protection and high dissolving power, while having many advantages, such as strong cleaning force, the low smell of higher boiling, high-flash are real one
It applies in example, the alcohol ethers solvent includes propylene glycol monomethyl ether, propandiol butyl ether, dipropylene glycol methyl ether, dipropylene, and 3 third
At least one of glycol methyl ether, tripropylene glycol butyl ether.Those alcohol ethers solvents have strong solvability, strong cleaning force, high boiling
The advantages that low smell of point, high-flash, compound with water, can effectively improve solvability, cleaning energy and the higher boiling of cosolvent with
And flash-point.The water can be deionized water, naturally it is also possible to distilled water etc..
The alkaline auxiliary lotion contained by the aqueous cleaning agent enables to the aqueous cleaning agent to keep alkalescent, from
And act synergistically with alcohol ether cosolvent and main solvent etc., the high-solvency and high cleaning ability of the aqueous cleaning agent are improved,
And the aqueous cleaning agent is assigned to metal with corrosion inhibiting ability.Therefore, in one embodiment, pass through the alkaline auxiliary lotion
Type and content, control the aqueous cleaning agent pH be 7.0-8.5.In a particular embodiment, the alkaline auxiliary lotion packet
Include at least one of triethanolamine, isopropanolamine, organic amine ester TPP.
Therefore, above the aqueous cleaning agent in each embodiment by the effect between contained each component, with pair
Electronic circuit board has excellent cleaning ability and to other pollutant, the welding good removal ability of residue, while to electricity
There are good compatibility and protective effect in sensitive metal and fragile functional form material on sub- wiring board；And the aqueous-base cleaning
Agent environmental protection, no flash-point, safety, and also dispersion is stablized.
On the other hand, the embodiment of the invention also provides a kind of preparation methods of aqueous cleaning agent described above.The water
The preparation method of based cleaning agent includes the following steps:
S01: each component is measured according to component contained by aqueous cleaning agent and each component content ratio；
S02: each component of measurement is subjected to mixed processing.
Wherein, the aqueous cleaning agent in the step S01 is aqueous cleaning agent described above, therefore, the step S01
Each component and each component content contained by each component and each component the content aqueous cleaning agent as described above of middle removing, in order to
Length is saved, details are not described herein.
The mixed processing of each component is in order to enable each component ingredient dissolves or dispersion, to be formed in the step S02
Stable mixed solution system.In one embodiment, each component carries out mixed processing in the following order:
Therefore, the aqueous cleaning agent preparation method proportionally mixes each component, and each component is uniformly dispersed, and
And the aqueous cleaning agent dispersion formed is stablized, so that assigning the aqueous cleaning agent of preparation has as described above excellent
It is benign can, such as there is high cleaning ability and high-solvency, on electronic circuit board sensitive metal and fragile functional form material
There are good compatibility and protective effect, and environmental protection, no flash-point, safety, and dispersion are stablized.
Another aspect has such as high cleaning ability and high-solvency just because of aqueous cleaning agent described above, to electricity
There are good compatibility and protective effect, and environmental protection, no flash-point, peace in sensitive metal and fragile functional form material on sub- wiring board
Entirely, and dispersion is stablized.Therefore, the embodiment of the invention also provides a kind of application methods of aqueous cleaning agent described above
With the cleaning method of electronic circuit board.
Wherein, the application of the aqueous cleaning agent is used in Cleaning Agent for PCB technique, can effectively be realized pair
Cleaning Agent for PCB cleaning effect after electric welding, and guarantee that the performance of the electronic circuit board is stablized, it avoids existing water base
Damage and incompatibility of the cleaning agent to electronic circuit board sensitive metal and fragile functional material.
The cleaning method of the electronic circuit board includes the following steps:
The electronic circuit board after welding is started the cleaning processing using the aqueous cleaning agent.
In one embodiment, the condition of the cleaning treatment are as follows: ultrasonic cleaning, supersonic frequency 80 or 120KHZ, temperature 45-
55℃.The aqueous cleaning agent can effectively improve the aqueous cleaning agent to the electronics after welding in conjunction with the cleaning treatment
Wiring board carries out cleaning effect, has good compatibility to sensitive metal and fragile functional form material, and guarantee the electric wire
The electrical property and high reliability of road plate.
Now in conjunction with specific example, the embodiment of the present invention is further elaborated.
1. aqueous cleaning agent and preparation method thereof
Embodiment 1
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The C8F17SO2N(C2H5)(C2H4O)nN=6 in H, the pH of aqueous cleaning agent are 7.9.
The preparation method of this aqueous cleaning agent includes the following steps:
Step S1: each component is measured respectively according to the content ratio of component contained by 1 aqueous cleaning agent of the present embodiment；
Step S2: each component will be measured and carry out mixed processing, so that each component is uniformly mixed.
Embodiment 2
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The C8F17SO2N(C2H5)(C2H4O)nN=6 in H, the pH of aqueous cleaning agent are 8.2.
Embodiment 3
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The pH of the aqueous cleaning agent is 8.0.
Embodiment 4
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The pH of the aqueous cleaning agent is 8.2.
Embodiment 5
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The C8F17SO2N[(C2H4O)nH]2In n=6, the pH of aqueous cleaning agent is 8.2.
Embodiment 6
The present embodiment provides a kind of aqueous cleaning agents and preparation method thereof.The aqueous cleaning agent includes following component:
The C8F17SO2N[(C2H4O)nH]2In n=6, the pH of aqueous cleaning agent is 8.4.
Comparative example 1
This comparative example provides a kind of aqueous cleaning agent and preparation method thereof.The aqueous cleaning agent includes following component:
The pH of the aqueous cleaning agent is 8.0.
Comparative example 2
This comparative example provides a kind of aqueous cleaning agent and preparation method thereof.The aqueous cleaning agent includes following component:
The C8F17SO2N[(C2H4O)nH]2In n=6, the pH of aqueous cleaning agent is 8.2.
Comparative example 3
This comparative example provides a kind of aqueous cleaning agent and preparation method thereof.The aqueous cleaning agent includes following component:
The pH of the aqueous cleaning agent is 9.4
Component and each component content contained by the aqueous cleaning agent that each embodiment of above-described embodiment 1-6 and comparative example 1-3 provides
It is as shown in table 1 below:
Table 1
2. the Application Example of aqueous cleaning agent
The cleaning process of 2.1 electronic circuit board aqueous cleaning agents is as shown in table 2 below:
Table 2
Electronic circuit board evaluation item method and rank is defined after the cleaning of 2.2 aqueous cleaning agents
A: tin cream, welding assisted agent residuals, the observation of 4*10 power microscope.
Define rank: 0 grade without tin cream, welding assisted agent residuals；
1 grade has minute quantity tin cream, welding assisted agent residuals at pad, pin or plate face edge；
2 grades have apparent tin cream, welding assisted agent residuals.
B: ink character, carbon film damage, the observation of 4*10 power microscope
Define rank: 0 grade of ink character, carbon film without discoloration, deformation, be bubbled, fall off；
1 grade of ink character, carbon film have slight discoloration, deformation, bubbling, but nothing falls off；
2 grades of ink characters, carbon film, which have, significantly to be deformed, be bubbled and fall off.
C: ion residues degree, using " ionic contamination equivalent method of testing (dynamic method) " referring in SJ20869-2003 the
6.3 regulation, ionic contamination content grade III Standard provide≤1.50 (NaCl) μ g/cm2。
Definition: to improve electronic circuit board ionic contamination content≤0.8 (NaCl) the μ g/ after reliability present invention cleaning
cm2For qualification.
D: metal erosion test
400m1 alkalescent water based cleaning agent is placed in the beaker of 500m1 respectively, and respectively by 3 copper or the metal of aluminium
Test sample is completely immersed in alkalescent water based cleaning agent and closes (same material metal is placed on same beaker), heats alkalescent
Aqueous cleaning agent is to 50 DEG C and keeps the temperature 30min.Taking-up sample sheet metal spends from water rinsed clean and sufficiently dry.According to GB/T
10125-2012 " artificial atmosphere corrosion test salt spray test " carries out salt spray test l0h, naked eye test button piece after drying
The corrosion condition on surface.
It is as shown in table 3 below to define rank:
Table 3
2.3 test results:
The above-mentioned aqueous cleaning agent respectively provided is subjected to correlated performance according to cleaning process and evaluation item method respectively
Test.Test result is as follows shown in table 4:
Table 4
All evaluation items are all satisfied by the aqueous cleaning agent for showing that embodiment 1-6 is provided with testing result in above-mentioned table 4
And standard, and comparative example 1, compared with embodiment 2-6, the aqueous cleaning agent cleaning ability especially removes deionization dirt
The ability for contaminating object enhances as alkaline auxiliary washing agent content increases.Comparative example 3 is compared with embodiment 1-2,4-6, the water
The ability that based cleaning agent cleaning ability especially removes ionic contamination reduces with the content of dampening and is enhanced.Though comparative example 1,2
Right partial test project can be up to standard, but ionic contamination comparision contents are high, and tin cream, welding assisted agent residuals degree are high, and reliability is deposited
In risk；For comparative example 3 due to the excessive concentration of alkaline auxiliary lotion, aqueous cleaning agent cleaning ability especially removes ionic soil
Although the ability of object is stronger and tin cream, welding assisted agent residuals is not present, it is to ink character, carbon film damage and sensitive metal
There are destruction, material compatibility is poor.
Embodiment 1, comparative example 1 compared with other embodiments, the aqueous cleaning agent remove the ability of ionic contamination with
Fluorine-containing surfactant content increase and increase.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. a kind of aqueous cleaning agent, which is characterized in that including following weight percentage components:
2. aqueous cleaning agent according to claim 1, it is characterised in that: the nonionic surfactant includes fatty alcohol
At least one of polyoxyethylene ether, polyoxyethylene polyoxypropylene block type polyethers；And/or
The fluorine-containing surfactant includes perfluoro alkyl sulfonyl amido alkanol, perfluorinated alkyl sulfonamide aminocarboxylic containing sulfoamido
At least one of acids surfactant；And/or
The alcohol ethers solvent includes propylene glycol monomethyl ether, propandiol butyl ether, dipropylene glycol methyl ether, dipropylene, and 3 the third two
At least one of alcohol methyl ether, tripropylene glycol butyl ether；And/or
The alkaline auxiliary lotion includes at least one of triethanolamine, isopropanolamine, organic amine ester TPP.
3. aqueous cleaning agent according to claim 2, it is characterised in that: the polyoxyethylene polyoxypropylene block type polyethers
It is poly- including polyoxyethylene polyoxypropylene polyoxyethylene blocks type polyethers, polyoxyethylene polyoxypropylene block type polyethers, polyoxypropylene
At least one of ethylene oxide oxypropylene block type polyethers；
The perfluorinated alkyl sulfonamide base nonionic surfactant containing sulfoamido includes C8F17SO2N(C2H5)(C2H4O)nH、C8F17SO2N(C2H4OH)2、C8F17SO2N[(C2H4O)nH]2, wherein n=6-9.
4. aqueous cleaning agent according to claim 3, it is characterised in that: the polyoxyethylene polyoxypropylene polyoxyethylene is embedding
Segment type polyethers includes at least one of L63, L64, P68.
5. aqueous cleaning agent according to claim 1-4, it is characterised in that: the pH of the aqueous cleaning agent is
7.0-8.5。
6. a kind of preparation method of aqueous cleaning agent, includes the following steps:
Each group is measured according to component contained by the described in any item aqueous cleaning agents of claim 1-5 and each component content ratio
Point；
The each component of measurement is subjected to mixed processing.
7. application of the aqueous cleaning agent according to claim 1-5 in Cleaning Agent for PCB.
8. a kind of cleaning method of electronic circuit board, includes the following steps:
The electronic circuit board after welding is started the cleaning processing using claim 1-5 described in any item aqueous cleaning agents.
9. cleaning method according to claim 8, it is characterised in that: the condition of the cleaning treatment are as follows: ultrasonic cleaning surpasses
Acoustic frequency 80 or 120KHZ, 45-55 DEG C of temperature.
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| CN111172550A (en) * | 2020-02-14 | 2020-05-19 | 福建省佑达环保材料有限公司 | OLED mask cleaning agent and cleaning process thereof |
| CN112877143A (en) * | 2021-01-22 | 2021-06-01 | 盐城市贝加尔电子材料有限公司 | Preparation method of acidic degreasing agent for PCB (printed circuit board) |
| CN114381340A (en) * | 2021-12-30 | 2022-04-22 | 深圳市合明科技有限公司 | Cleaning agent and preparation method thereof |
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| CN106118926A (en) * | 2016-06-16 | 2016-11-16 | 深圳市唯特偶新材料股份有限公司 | A kind of used in electronic industry is entirely without halogen VOC free aqueous cleaning agent |
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| CN111172550A (en) * | 2020-02-14 | 2020-05-19 | 福建省佑达环保材料有限公司 | OLED mask cleaning agent and cleaning process thereof |
| CN112877143A (en) * | 2021-01-22 | 2021-06-01 | 盐城市贝加尔电子材料有限公司 | Preparation method of acidic degreasing agent for PCB (printed circuit board) |
| CN114381340A (en) * | 2021-12-30 | 2022-04-22 | 深圳市合明科技有限公司 | Cleaning agent and preparation method thereof |
| CN114381340B (en) * | 2021-12-30 | 2023-09-22 | 深圳市合明科技有限公司 | Cleaning agent and preparation method thereof |
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Application publication date: 20190308 |