CN104293500A - Chemical agent used for cleaning printed circuit boards - Google Patents

Abstract

The invention belongs to the field of cleaning agents and discloses a chemical agent used for cleaning printed circuit boards. The chemical agent is prepared according to the following steps: step 1, weighing raw materials; step 2, stirring; step 3, preserving heat and reacting; step 4, cooling and stirring. The chemical agent prepared according to the invention does not layer, is relatively good in stability, has no corrosiveness to metal and has a relatively good effect in removing various compounds.

Description

A kind of chemicals for cleaning printed circuit board

 

Technical field

The invention belongs to clean-out system field, relating to a kind of chemicals for cleaning printed circuit board.

 

Background technology

Printed circuit board, also known as printed circuit board (PCB), printed-wiring board (PWB), be called for short and build and wiring board, normal use english abbreviation (PCBPrinted circuit board) or write PWB(Printed wire board), be base material with insulcrete, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated through-hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as " printing " circuit card.Single sided board, dual platen, four laminates, six laminates and other multilayer circuit boards can be divided into according to the wiring board number of plies.The printed circuit board (PCB) that we usually say refers to the circuit card of bare board-namely do not go up components and parts.

If printed circuit board dirt dust of the inside in making processes does not clean up, likely can cause the problem such as short circuit, corrosion, affect the normal operation of circuit card.Printed circuit board cleaning in the fabrication process, except using the matting of clean-out system, also comprises the cleaning ways such as electricimpulse cleaning, light cleaning, Cleaning by High Pressure Water Jet and ultrasonic cleaning.In actual applications, existing various cleaning way always exist various be difficult to overcome technological deficiency or regulation on restriction, be difficult to the requirement meeting development of modern industry.

In various cleaning way, in the majority with matting, namely use chemical with the cleaning process of a certain setting, circuit card is cleaned.The clean-out system that current matting uses comprises organic cleaning solvent, semi-aqueous cleaning agent and aqueous cleaning agent, and cleaning way mainly contains spray, embathes, ultrasonic wave etc., under the technical parameter set, cleans circuit card.Organic cleaning solvent, the volatile such as acetone of most employing, ethanol, sherwood oil, hexanaphthene, methylene dichloride, trieline, freonll-11 etc., there is serious topsoil in such clean-out system, to ozonosphere very disruptive, belong to ODS class material, the international related organization of Yi Bei limits or prohibits the use.Existing water base or half water-base electron clean-out system, although avoid the pollution to atmospheric environment, but with regard to its result of use, lack functional in the cleaning of circuit card, namely be difficult to ensure the complete of circuit card, considerable influence is had to haptic element, contact, sealing compound, ITO plated film, screen printing pattern etc., also may impact photoelectric characteristic, electromagnetic property, permeability, device surface physical property etc., cause that the qualification rate of circuit card is low, good article rate is low, cost increases, work-ing life reduces, and is difficult to the cleaning requirement meeting circuit card completely.Light cleans, although the cleanliness factor of cleaning is high, required equipment is expensive, mostly is import, invests excessive, and may impact the photoelectric characteristic of circuit card.Electricimpulse cleans, and cleaning required equipment is complicated, expensive, and because of electrohydraulic effect existence, may impact the electricity of circuit card, magnetic properties.Chinese patent CN201310523833 discloses a kind of circuit card welding agent clean-out system, and this clean-out system has certain removing function to welding agent, but poor to glue trace Scavenging activity, and has certain corrosion strength.

 

Summary of the invention

Complicated for the preparation method cleaning the chemicals of printed circuit board in order to overcome in prior art, the defects such as cleaning performance is poor, easy open circuit potential plate, the invention provides a kind of chemicals for cleaning printed circuit board.

For achieving the above object, the technical solution adopted in the present invention is as follows:

For cleaning a chemicals for printed circuit board, described chemicals is prepared from according to step: step 1) takes raw material, step 2) stir, step 3) insulation reaction, and step 4) cooling and stirring.

Particularly, described chemicals is prepared from according to step:

Step 1) takes raw material: take lauric acid amide of ethanol 20-25 part according to weight part, diethylene glycol monobutyl ether 10-12 part, Soxylat A 25-7 8-10 part, benzotriazole 6-8 part, isopropylcarbinol 5-6 part, C3-Fluoroalcohol 3-4 part, ethanol 2-3 part, Trisodium Citrate 1-2 part, tripoly phosphate sodium STPP 1-2 part, lauryl alcohol phosphoric acid ester potassium 1-2 part, deionized water 100-150 part is for subsequent use;

Step 2) stir: put into successively in stirrer by the raw material in step 1), 200 turns/min stirs and obtains compound in 10 minutes;

Step 3) insulation reaction: be drained into by compound in retort, is increased to 70 DEG C by the temperature of retort according to the speed of 10 DEG C/min, then insulation reaction 10min;

Step 4) cooling and stirring: step 3) gained compound is cooled to room temperature, last 100 turns/min stirs 5min and get final product.

Clean-out system using method of the present invention can include but not limited to: manual wiping, the usual manners such as spray and ultrasonic cleaning.

Technical scheme of the present invention mainly has the following advantages:

The present invention is reasonable for the chemicals compatibility cleaning printed circuit board, and preparation method is simple, to welding agent, fingerprint, and greasy dirt, organic compound has excellent dissolving power, and cleaning performance is good; And easily remove from circuit card, wash number reduces, non-corrosiveness, is applicable to high-accuracy circuit card cleaning; The present invention is for cleaning the chemicals stable performance of printed circuit board, better water-soluble, environment friendly and pollution-free.

 

Embodiment

Technical scheme in the application is understood better in order to make those skilled in the art person, below in conjunction with the application's specific embodiment, the technical scheme of the application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.

Embodiment 1

For cleaning a chemicals for printed circuit board, it is prepared as follows and forms:

1) raw material is taken: take lauric acid amide of ethanol 20 parts according to weight part, diethylene glycol monobutyl ether 10 parts, Soxylat A 25-7 8 parts, benzotriazole 6 parts, isopropylcarbinol 5 parts, C3-Fluoroalcohol 3 parts, ethanol 2 parts, Trisodium Citrate 1 part, tripoly phosphate sodium STPP 1 part, 1 part, lauryl alcohol phosphoric acid ester potassium, deionized water 100 parts, for subsequent use;

2) stir: put into successively in stirrer by above-mentioned raw materials, 200 turns/min stirs and obtains compound in 10 minutes;

3) insulation reaction: be drained into by compound in retort, is increased to 70 DEG C by the temperature of retort according to the speed of 10 DEG C/min, then insulation reaction 10min;

4) cooling and stirring: step 3) gained compound is cooled to room temperature, last 100 turns/min stirs 5min and get final product.

Embodiment 2

For cleaning a chemicals for printed circuit board, it is prepared as follows and forms:

1) raw material is taken: take lauric acid amide of ethanol 25 parts according to weight part, diethylene glycol monobutyl ether 12 parts, Soxylat A 25-7 10 parts, benzotriazole 8 parts, isopropylcarbinol 6 parts, C3-Fluoroalcohol 4 parts, ethanol 3 parts, Trisodium Citrate 2 parts, tripoly phosphate sodium STPP 2 parts, 2 parts, lauryl alcohol phosphoric acid ester potassium, deionized water 150 parts, for subsequent use;

2) stir: put into successively in stirrer by above-mentioned raw materials, 200 turns/min stirs and obtains compound in 10 minutes;

3) insulation reaction: be drained into by compound in retort, is increased to 70 DEG C by the temperature of retort according to the speed of 10 DEG C/min, then insulation reaction 10min;

4) cooling and stirring: the material after the insulation reaction of step 3) gained is cooled to room temperature, last 100 turns/min stirs 5min and get final product.

Embodiment 3

The performance test of chemicals prepared by the embodiment of the present invention 1 and embodiment 2, in table 1:

Table 1

Group	High-temperature stability	Flammable	Non-corrosiveness is had to metal	Rinsability
					Embodiment 1	Evenly not stratified	Non-combustible	Nothing	Without visible residual
Embodiment 2	Evenly not stratified	Non-combustible	Nothing	Without visible residual

We also have detected the chemicals of the embodiment of the present invention 1 and embodiment 2 to the removal efficiency of all kinds of material: all wipings one time, and concrete test-results is in table 2:

Table 2

Group	Welding agent clearance	Glue trace clearance %	Natural fats and oils
				Embodiment 1	99.3%	97.5%	98.1%
Embodiment 2	99.4%	97.7%	98.2%
				National standard JB/T4323.1-1999	Be greater than 90%	Be greater than 90%	Be greater than 90%

Conclusion: chemicals prepared by the present invention is not stratified, stability is better, and to metal non-corrosiveness; The effect that classes of compounds removed by chemicals prepared by the present invention is better, meets national standard.

Finally, it is also to be noted that what enumerate above is only several specific embodiments of the present invention.Obviously, the invention is not restricted to above embodiment, many distortion can also be had.All distortion that those of ordinary skill in the art can directly derive from content disclosed by the invention or associate, all should think protection scope of the present invention.

Claims (3)

1. for cleaning a chemicals for printed circuit board, it is characterized in that, described chemicals is prepared from according to step: step 1) takes raw material, step 2) stir, step 3) insulation reaction, and step 4) cooling and stirring.

2. chemicals according to claim 1, is characterized in that, described chemicals is prepared from accordance with the following steps:

Step 1) takes raw material: take lauric acid amide of ethanol 20-25 part according to weight part, diethylene glycol monobutyl ether 10-12 part, Soxylat A 25-7 8-10 part, benzotriazole 6-8 part, isopropylcarbinol 5-6 part, C3-Fluoroalcohol 3-4 part, ethanol 2-3 part, Trisodium Citrate 1-2 part, tripoly phosphate sodium STPP 1-2 part, lauryl alcohol phosphoric acid ester potassium 1-2 part, deionized water 100-150 part is for subsequent use;

Step 2) stir: put into successively in stirrer by the raw material in step 1), 200 turns/min stirs and obtains compound in 10 minutes;

Step 3) insulation reaction: be drained into by compound in retort, is increased to 70 DEG C by the temperature of retort according to the speed of 10 DEG C/min, then insulation reaction 10min;

Step 4) cooling and stirring: step 3) gained compound is cooled to room temperature, last 100 turns/min stirs 5min and get final product.

3. the application of the chemicals described in claim 1 or 2 in cleaning printed circuit board.