CN104371838A - Cleaning agent for cleaning circuit boards and preparation method thereof - Google Patents
Cleaning agent for cleaning circuit boards and preparation method thereof Download PDFInfo
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- CN104371838A CN104371838A CN201410592353.5A CN201410592353A CN104371838A CN 104371838 A CN104371838 A CN 104371838A CN 201410592353 A CN201410592353 A CN 201410592353A CN 104371838 A CN104371838 A CN 104371838A
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- clean
- out system
- cleaning
- retort
- circuit boards
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- 238000004140 cleaning Methods 0.000 title claims abstract description 22
- 239000012459 cleaning agent Substances 0.000 title abstract description 6
- 238000002360 preparation method Methods 0.000 title description 5
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 235000019832 sodium triphosphate Nutrition 0.000 claims abstract description 9
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012964 benzotriazole Substances 0.000 claims abstract description 5
- 239000008367 deionised water Substances 0.000 claims abstract description 5
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 5
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims abstract description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 5
- 239000011591 potassium Substances 0.000 claims abstract description 5
- 239000001509 sodium citrate Substances 0.000 claims abstract description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 6
- NBUKAOOFKZFCGD-UHFFFAOYSA-N 2,2,3,3-tetrafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)F NBUKAOOFKZFCGD-UHFFFAOYSA-N 0.000 claims description 4
- 101710194948 Protein phosphatase PhpP Proteins 0.000 claims description 4
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 claims description 4
- 239000012467 final product Substances 0.000 claims description 4
- HWGNBUXHKFFFIH-UHFFFAOYSA-I pentasodium;[oxido(phosphonatooxy)phosphoryl] phosphate Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O HWGNBUXHKFFFIH-UHFFFAOYSA-I 0.000 claims description 4
- 150000003014 phosphoric acid esters Chemical class 0.000 claims description 4
- 229910052708 sodium Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- UNXRWKVEANCORM-UHFFFAOYSA-I triphosphate(5-) Chemical compound [O-]P([O-])(=O)OP([O-])(=O)OP([O-])([O-])=O UNXRWKVEANCORM-UHFFFAOYSA-I 0.000 claims description 4
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 claims description 4
- 229940038773 trisodium citrate Drugs 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 4
- 229960001484 edetic acid Drugs 0.000 abstract 2
- CSUFEOXMCRPQBB-UHFFFAOYSA-N 1,1,2,2-tetrafluoropropan-1-ol Chemical compound CC(F)(F)C(O)(F)F CSUFEOXMCRPQBB-UHFFFAOYSA-N 0.000 abstract 1
- 229910019142 PO4 Inorganic materials 0.000 abstract 1
- 150000001408 amides Chemical class 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 235000014113 dietary fatty acids Nutrition 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 239000000194 fatty acid Substances 0.000 abstract 1
- 229930195729 fatty acid Natural products 0.000 abstract 1
- 150000004665 fatty acids Chemical class 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract 1
- 239000010452 phosphate Substances 0.000 abstract 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 abstract 1
- 238000013517 stratification Methods 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000004506 ultrasonic cleaning Methods 0.000 description 2
- 230000003245 working effect Effects 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
Abstract
The invention discloses a cleaning agent for cleaning circuit boards, which is prepared by the following steps: taking coco fatty acid diethanol amide, diethylene glycol monobutyl ether, polyethenoxy ether, benzotriazole, isobutanol, tetrafluoropropanol, EDTA (ethylene diamine tetraacetic acid), sodium citrate, sodium tripolyphosphate, potassium lauryl alcohol ether phosphate and deionized water, sequentially adding into a stirrer, stirring at 200rpm for 10 minutes to obtain a mixture, discharging into a reaction tank, increasing the temperature of the reaction tank to 70 DEG C at the rate of 10 DEG C/minute, keeping the temperature to react for 10 minutes, cooling to room temperature, and stirring uniformly. The cleaning agent for circuit boards has the advantages of no stratification, high stability and favorable impurity-removal effect.
Description
Technical field
The invention belongs to electric power clean-out system field, relate to a kind of clean-out system, be specifically related to clean-out system of a kind of cleaning circuit plate and preparation method thereof.
Background technology
Circuit card can be described as printed-wiring board (PWB) or printed circuit board (PCB), and English name is (Printed Circuit Board) PCB.The words that wiring board divides by the number of plies are divided into single sided board, dual platen, and the classification that multilayer circuit board three is large.The words that wiring board divides by characteristic are divided into soft board (FPC), hardboard (PCB), Rigid Flex (FPCB).
If circuit card dirt dust of the inside in making processes does not clean up, likely can cause the problem such as short circuit, corrosion, affect the normal operation of circuit card.Circuit card cleaning in the fabrication process, except using the matting of clean-out system, also comprises the cleaning ways such as electricimpulse cleaning, light cleaning, Cleaning by High Pressure Water Jet and ultrasonic cleaning.In actual applications, existing various cleaning way always exist various be difficult to overcome technological deficiency or regulation on restriction, be difficult to the requirement meeting development of modern industry.
In various cleaning way, in the majority with matting, namely use chemical with the cleaning process of a certain setting, circuit card is cleaned.The clean-out system that current matting uses comprises organic cleaning solvent, semi-aqueous cleaning agent and aqueous cleaning agent, and cleaning way mainly contains spray, embathes, ultrasonic wave etc., under the technical parameter set, cleans circuit card.Organic cleaning solvent, the volatile such as acetone of most employing, ethanol, sherwood oil, hexanaphthene, methylene dichloride, trieline, freonll-11 etc., there is serious topsoil in such clean-out system, to ozonosphere very disruptive, belong to ODS class material, the international related organization of Yi Bei limits or prohibits the use.Existing water base or half water-base electron clean-out system, although avoid the pollution to atmospheric environment, but with regard to its result of use, lack functional in the cleaning of circuit card, namely be difficult to ensure the complete of circuit card, considerable influence is had to haptic element, contact, sealing compound, ITO plated film, screen printing pattern etc., also may impact photoelectric characteristic, electromagnetic property, permeability, device surface physical property etc., cause that the qualification rate of circuit card is low, good article rate is low, cost increases, work-ing life reduces, and is difficult to the cleaning requirement meeting circuit card completely.Light cleans, although the cleanliness factor of cleaning is high, required equipment is expensive, mostly is import, invests excessive, and may impact the photoelectric characteristic of circuit card.Electricimpulse cleans, and cleaning required equipment is complicated, expensive, and because of electrohydraulic effect existence, may impact the electricity of circuit card, magnetic properties.Chinese patent CN201310523833 discloses a kind of circuit card welding agent clean-out system, and this clean-out system has certain removing function to welding agent, but poor to glue trace Scavenging activity, and has certain corrosion strength.
Therefore, develop a kind of excellent performance, Environmental Safety, the circuit card clean-out system that can not impact circuit card performance has good market outlook.
Summary of the invention
Easily be corroded to overcome cable material in prior art, insulativity and water-repellancy poor, work-ing life is short, easily occurs the defects such as potential safety hazard, the invention provides the parameter preferably Environmental-friendanticorrosive anticorrosive paint for power transmission line such as a kind of antiseptic property and insulating property.
For achieving the above object, the technical solution adopted in the present invention is as follows:
A kind of circuit card clean-out system, it is prepared as follows and forms:
1) lauric acid amide of ethanol 10-15 part is taken according to weight part, diethylene glycol monobutyl ether 4-6 part, Soxylat A 25-7 3-5 part, benzotriazole 2-4 part, isopropylcarbinol 2-3 part, C3-Fluoroalcohol 1-2 part, EDTA 1-2 part, Trisodium Citrate 1-2 part, tripoly phosphate sodium STPP 1-2 part, lauryl alcohol phosphoric acid ester potassium 1-2 part, deionized water 50-60 part;
2) put into successively in stirrer by above-mentioned raw materials, 200 turns/min stirs and obtains compound in 10 minutes;
3) compound is drained in retort, the temperature of retort is increased to 70 DEG C according to the speed of 10 DEG C/min, insulation reaction 10min, is cooled to room temperature subsequently, stir and get final product.
Preferably, the vacuum tightness controlled in insulation reaction process in retort is 0.1-0.15Mpa.
The invention also discloses the preparation method of foregoing circuit board cleaning agent.
Clean-out system using method of the present invention can include but not limited to: manual wiping, the usual manners such as spray and ultrasonic cleaning.
Technical scheme of the present invention mainly has the following advantages:
Circuit card clean-out system compatibility of the present invention is reasonable, and preparation method is simple, to welding agent, fingerprint, and greasy dirt, organic compound has excellent dissolving power, and cleaning performance is good; And easily remove from circuit card, wash number reduces, non-corrosiveness, is applicable to high-accuracy circuit card cleaning.Circuit card stable performance of the present invention, better water-soluble, environment friendly and pollution-free.
Embodiment
Technical scheme in the application is understood better in order to make those skilled in the art person, below in conjunction with the specific embodiment in the embodiment of the present application, the technical scheme of the application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Embodiment 1
A kind of circuit card clean-out system, it is prepared as follows and forms:
1) lauric acid amide of ethanol 10 parts is taken according to weight part, diethylene glycol monobutyl ether 4 parts, Soxylat A 25-7 3 parts, benzotriazole 2 parts, isopropylcarbinol 2 parts, C3-Fluoroalcohol 1 part, EDTA(ethylenediamine tetraacetic acid (EDTA)) 1 part, Trisodium Citrate 1 part, tripoly phosphate sodium STPP 1 part, 1 part, lauryl alcohol phosphoric acid ester potassium, deionized water 50 parts;
2) put into successively in stirrer by above-mentioned raw materials, 200 turns/min stirs and obtains compound in 10 minutes;
3) compound is drained in retort, the temperature of retort is increased to 70 DEG C according to the speed of 10 DEG C/min, insulation reaction 10min, is cooled to room temperature subsequently, stir and get final product; The vacuum tightness controlled in insulation reaction process in retort is 0.1Mpa.
Embodiment 2
A kind of circuit card clean-out system, it is prepared as follows and forms:
1) lauric acid amide of ethanol 15 parts is taken according to weight part, diethylene glycol monobutyl ether 6 parts, Soxylat A 25-7 5 parts, benzotriazole 4 parts, isopropylcarbinol 3 parts, C3-Fluoroalcohol 2 parts, EDTA 2 parts, Trisodium Citrate 2 parts, tripoly phosphate sodium STPP 2 parts, 2 parts, lauryl alcohol phosphoric acid ester potassium, deionized water 60 parts;
2) put into successively in stirrer by above-mentioned raw materials, 200 turns/min stirs and obtains compound in 10 minutes;
3) compound is drained in retort, the temperature of retort is increased to 70 DEG C according to the speed of 10 DEG C/min, insulation reaction 10min, is cooled to room temperature subsequently, stir and get final product; The vacuum tightness controlled in insulation reaction process in retort is 0.15Mpa.
Embodiment 3
The performance test of clean-out system prepared by the embodiment of the present invention 1 and embodiment 2, in table 1:
Table 1
| Group | High-temperature stability | Flammable | Non-corrosiveness is had to metal | Rinsability |
| Embodiment 1 | Evenly not stratified | Non-combustible | Nothing | Without visible residue |
| Embodiment 2 | Evenly not stratified | Non-combustible | Nothing | Without visible residue |
We also have detected the clean-out system of the embodiment of the present invention 1 and embodiment 2 to the removal efficiency of all kinds of material: all wipings one time, and concrete test-results is in table 2:
Table 2
| Group | Welding agent clearance | Glue trace clearance % | Natural fats and oils |
| Embodiment 1 | 99.2% | 98.1% | 97.6% |
| Embodiment 2 | 99.3% | 97.8% | 97.6% |
| National standard JB/T4323.1-1999 | Be greater than 90% | Be greater than 90% | Be greater than 90% |
Conclusion: circuit card clean-out system prepared by the present invention is not stratified, stability is better, and to metal non-corrosiveness; The effect that classes of compounds removed by clean-out system prepared by the present invention is better, meets national standard.
Finally, it is also to be noted that what enumerate above is only several specific embodiments of the present invention.Obviously, the invention is not restricted to above embodiment, many distortion can also be had.All distortion that those of ordinary skill in the art can directly derive from content disclosed by the invention or associate, all should think protection scope of the present invention.
Claims (3)
1. a clean-out system for cleaning circuit plate, is characterized in that, described clean-out system is prepared from by following raw material:
Lauric acid amide of ethanol 10-15 part is taken according to weight part, diethylene glycol monobutyl ether 4-6 part, Soxylat A 25-7 3-5 part, benzotriazole 2-4 part, isopropylcarbinol 2-3 part, C3-Fluoroalcohol 1-2 part, EDTA 1-2 part, Trisodium Citrate 1-2 part, tripoly phosphate sodium STPP 1-2 part, lauryl alcohol phosphoric acid ester potassium 1-2 part, deionized water 50-60 part.
2. clean-out system as claimed in claim 1, it is characterized in that, described clean-out system is prepared as follows and forms:
Step 1) takes each raw material for standby according to weight part;
Step 2) each raw material is put in stirrer successively, 200 turns/min stirs and obtains compound in about 10 minutes;
Compound is drained in retort by step 3), the temperature of retort is increased to 70 DEG C according to the speed of 10 DEG C/min, insulation reaction 10min, is cooled to room temperature subsequently, stirs and get final product.
3. clean-out system as claimed in claim 2, is characterized in that, in described step 3), in insulation reaction process, the vacuum tightness controlled in retort is 0.1-0.15Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410592353.5A CN104371838B (en) | 2014-10-29 | 2014-10-29 | A kind of cleaning agent of cleaning circuit plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410592353.5A CN104371838B (en) | 2014-10-29 | 2014-10-29 | A kind of cleaning agent of cleaning circuit plate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104371838A true CN104371838A (en) | 2015-02-25 |
| CN104371838B CN104371838B (en) | 2017-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410592353.5A Active CN104371838B (en) | 2014-10-29 | 2014-10-29 | A kind of cleaning agent of cleaning circuit plate and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN104371838B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104293500A (en) * | 2014-11-04 | 2015-01-21 | 国家电网公司 | Chemical agent used for cleaning printed circuit boards |
| CN105039035A (en) * | 2015-06-30 | 2015-11-11 | 苏州东辰林达检测技术有限公司 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN111621369A (en) * | 2020-06-11 | 2020-09-04 | 中山翰华锡业有限公司 | Neutral environment-friendly water-based cleaning agent for high-end integrated circuit board and preparation method thereof |
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| WO2000044872A1 (en) * | 1999-01-28 | 2000-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Moulded detergent and cleaning agent articles with defined anionic detergent ratio |
| CN101434890A (en) * | 2007-11-16 | 2009-05-20 | 比亚迪股份有限公司 | Water-soluble washing agent composition |
| CN101440332A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Environment protection efficient water-based circuit board cleaning agent and preparation thereof |
| CN102976897A (en) * | 2012-12-18 | 2013-03-20 | 山东科技大学 | Method for purifying tetrafluoro propanol |
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2014
- 2014-10-29 CN CN201410592353.5A patent/CN104371838B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000044872A1 (en) * | 1999-01-28 | 2000-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Moulded detergent and cleaning agent articles with defined anionic detergent ratio |
| CN101434890A (en) * | 2007-11-16 | 2009-05-20 | 比亚迪股份有限公司 | Water-soluble washing agent composition |
| CN101440332A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Environment protection efficient water-based circuit board cleaning agent and preparation thereof |
| CN102976897A (en) * | 2012-12-18 | 2013-03-20 | 山东科技大学 | Method for purifying tetrafluoro propanol |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104293500A (en) * | 2014-11-04 | 2015-01-21 | 国家电网公司 | Chemical agent used for cleaning printed circuit boards |
| CN105039035A (en) * | 2015-06-30 | 2015-11-11 | 苏州东辰林达检测技术有限公司 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN111621369A (en) * | 2020-06-11 | 2020-09-04 | 中山翰华锡业有限公司 | Neutral environment-friendly water-based cleaning agent for high-end integrated circuit board and preparation method thereof |
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| Publication number | Publication date |
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| CN104371838B (en) | 2017-10-13 |
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Inventor after: Zhou Yangxuan Inventor after: Zhou Houkai Inventor before: Huang Zhenhua Inventor before: Sun Xuejun Inventor before: Wei Ruolin Inventor before: Liu Xingxing Inventor before: Liu Xuehao Inventor before: Xia Xiaocong Inventor before: Liu Jingran Inventor before: Sun Hanzhi Inventor before: Wang Binbin |
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Effective date of registration: 20180305 Address after: No. 32, No. 32, Central South Street, Yishui Town, Yishui County, Shandong Province, No. 1-1-302 Patentee after: Zhou Yangxuan Address before: 100761 West Chang'an Avenue, Beijing, No. 86, No. Co-patentee before: LINYI POWER SUPPLY COMPANY OF STATE GRID SHANDONG ELECTRIC POWER COMPANY Patentee before: State Grid Corporation of China Co-patentee before: JUNAN POWER SUPPLY Co.,Ltd. |
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Effective date of registration: 20190404 Address after: 226100 No. 101, Nine Groups, Banqiao Village, Zhengyu Town, Haimen City, Nantong City, Jiangsu Province Patentee after: Haimen Chuanghao Industrial Design Co.,Ltd. Address before: 276401 No. 1-1-302, 32 South Street, Yishui Town, Yishui County, Linyi City, Shandong Province Patentee before: Zhou Yangxuan |
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Effective date of registration: 20231102 Address after: Building 2, Baolong Fourth Road, Baolong Community, Baolong Street, Longgang District, Shenzhen City, Guangdong Province, 518000 Patentee after: Zhongke Micro New Materials (Shenzhen) Co.,Ltd. Address before: 226100 No. 101, Nine Groups, Banqiao Village, Zhengyu Town, Haimen City, Nantong City, Jiangsu Province Patentee before: Haimen Chuanghao Industrial Design Co.,Ltd. |
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