CN105039035A - Cleaning agent for integrated circuit chip and preparation method of cleaning agent - Google Patents
Cleaning agent for integrated circuit chip and preparation method of cleaning agent Download PDFInfo
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- CN105039035A CN105039035A CN201510372008.5A CN201510372008A CN105039035A CN 105039035 A CN105039035 A CN 105039035A CN 201510372008 A CN201510372008 A CN 201510372008A CN 105039035 A CN105039035 A CN 105039035A
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Abstract
The invention relates to a cleaning agent for an integrated circuit chip and a preparation method of the cleaning agent. The cleaning agent comprises the following raw materials: citric acid, glycerinum, ethyl alcohol, polyoxyethylene ether, hydrogen peroxide, ammonium hydroxide, butane and alkylolamides. The preparation method comprises: measuring raw materials according to a weight percent, placing the citric acid, ethyl alcohol, glycerol and hydrogen peroxide into a closed container, and heating to 42 to 55 DEG C at a constant speed of 2 to 5 DEG C per minute under the protection of inert gas to obtain a first mixture; placing polyoxyethylene ether, ammonium hydroxide, butane and alkylolamides into a reaction kettle, heating to 62 to 68 DEG C under a vacuum condition with vacuum degree being 0.06 to 0.12 Mpa, and then heating to 75 to 80 DEG C at a speed of 5 to 8 DEG C per minute to obtain a second mixture; and mixing and stirring the first mixture and the second mixture to obtain the cleaning agent for the integrated circuit. The cleaning agent for the integrated circuit chip is high in cleaning capacity, slight in damage on the chip, simple to prepare and suitable for being popularized.
Description
Technical field
The invention belongs to clean-out system preparation field, be specifically related to a kind of ic core chip detergent and preparation method thereof.
Background technology
Unicircuit (IC) is a kind of microelectronic device or parts.By certain processing step, by the original paper such as transistor, resistance, electric capacity, inductance, wiring required in circuit interconnection together, be produced on a fritter or a few fritter semiconductor wafer or dielectric substrate, be then encapsulated in a shell, become the microstructure with required circuit function; Wherein, all original papers structurally form a whole, make electronic original part stride forward major step towards microminiaturization, reduce power consumption, intellectuality and high reliability aspect.
Electrical equipment in use can produce certain dirt, so want routine cleaning integrated circuit (IC) chip, traditional method for separating polluted particles is cleared up by hairbrush, along with the development of science and technology, popularizing of electronic product, unicircuit is ubiquitous, so be maintained as the problem of the whole industry.How safer, efficiently clean chip be current continue solve problem.
Summary of the invention
For the deficiencies in the prior art, the object of the present invention is to provide a kind of ic core chip detergent and preparation method thereof, this cleaning agent formula is simple, and cost is low, cleaning effect, and little to chip damage, preparation method is simple simultaneously, is easy to industrialization.
For solving existing issue, the technical scheme that the present invention takes is:
A kind of ic core chip detergent, comprises the following raw material counted by weight: citric acid 5-8 part, glycerine 5-8 part, ethanol 10-15 part, Soxylat A 25-7 20-28 part, hydrogen peroxide 12-18 part, ammonium hydroxide 2-6 part, butane 15-22 part, alkylol amide 10-16 part.
As improvement, said integrated circuit chip clean-out system, comprises the following raw material counted by weight: citric acid 6 parts, 75% ethanol 12 parts, glycerol 5 parts, Soxylat A 25-7 25 parts, 16 parts, hydrogen peroxide, 4 parts, ammonium hydroxide, butane 20 parts, alkylol amide 14 parts.
As improvement, described ethanol is 75% ethanol.
The preparation method of said integrated circuit chip clean-out system, comprises the following steps:
Step 1, takes raw material by weight, and drops in encloses container by citric acid, ethanol, glycerol and hydrogen peroxide, under protection of inert gas, obtain the first mixture with 2-5 DEG C/min constant heating rates sintering to 42-55 DEG C;
Step 2, drops into Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide in reactor, the heated under vacuum in vacuum tightness being 0.06-0.12Mpa to after 62-68 DEG C, with 5-8 DEG C/min be warming up to 75-80 DEG C the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs to obtain unicircuit clean-out system.
As above-mentioned preparation method preferably, in step 1, the speed of constant heating rates sintering is 2 DEG C/min.
As above-mentioned preparation method preferably, the vacuum tightness in step 2 under vacuum condition is 0.12Mpa.
As above-mentioned preparation method preferably, in step 3, stirring velocity is 200-300rpm, and churning time is 20-40min.
beneficial effect
The cleaning force of ic core chip detergent of the present invention is strong, and foaming properties is at below 6mm, and viscosity is lower than 0.3mm
2s
-1, easy rinsing, does not affect chip, and preparation method is simple, easy, is applicable to industrialization.
Embodiment
Below in conjunction with embodiment, the invention will be further described.Following examples just for performance of the present invention is clearly described, and only can not be confined to the following examples.
embodiment 1
A kind of ic core chip detergent, comprises the following raw material counted by weight: citric acid 5 parts, glycerine 5 parts, 75% ethanol 10 parts, Soxylat A 25-7 20 parts, 12 parts, hydrogen peroxide, 2 parts, ammonium hydroxide, butane 15 parts, alkylol amide 10 parts.
The preparation method of said integrated circuit chip clean-out system, comprises the following steps:
Step 1, takes raw material by weight, and drops in encloses container by citric acid, ethanol, glycerol and hydrogen peroxide, under protection of inert gas, obtain the first mixture with 2 DEG C/min constant heating rates sintering to 42 DEG C;
Step 2, drops into Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide in reactor, is after the heated under vacuum to 62 DEG C of 0.06Mpa in vacuum tightness, with 5 DEG C/min be warming up to 75 DEG C the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs 20min with 200rpm and obtains unicircuit clean-out system.
embodiment 2
A kind of ic core chip detergent, comprises the following raw material counted by weight: citric acid 6 parts, 75% ethanol 12 parts, glycerol 5 parts, Soxylat A 25-7 25 parts, 16 parts, hydrogen peroxide, 4 parts, ammonium hydroxide, butane 20 parts, alkylol amide 14 parts.
The preparation method of said integrated circuit chip clean-out system, comprises the following steps:
Step 1, takes raw material by weight, and drops in encloses container by citric acid, ethanol, glycerol and hydrogen peroxide, under protection of inert gas, obtain the first mixture with 3 DEG C/min constant heating rates sintering to 50 DEG C;
Step 2, drops into Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide in reactor, is after the heated under vacuum to 65 DEG C of 0.10Mpa in vacuum tightness, with 7 DEG C/min be warming up to 78 DEG C the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs 30min with 250rpm and obtains unicircuit clean-out system.
embodiment 3
A kind of ic core chip detergent, comprises the following raw material counted by weight: citric acid 8 parts, glycerine 8 parts, 75% ethanol 15 parts, Soxylat A 25-7 28 parts, 18 parts, hydrogen peroxide, 6 parts, ammonium hydroxide, butane 22 parts, alkylol amide 16 parts.
The preparation method of said integrated circuit chip clean-out system, comprises the following steps:
Step 1, takes raw material by weight, and drops in encloses container by citric acid, ethanol, glycerol and hydrogen peroxide, under protection of inert gas, obtain the first mixture with 5 DEG C/min constant heating rates sintering to 55 DEG C;
Step 2, drops into Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide in reactor, is after the heated under vacuum to 68 DEG C of 0.12Mpa in vacuum tightness, with 8 DEG C/min be warming up to 80 DEG C the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs 40min with 300rpm and obtains unicircuit clean-out system.
comparative example 1
A kind of ic core chip detergent, comprises the following raw material counted by weight: citric acid 6 parts, 75% ethanol 12 parts, glycerol 5 parts, Soxylat A 25-7 25 parts, 16 parts, hydrogen peroxide, 4 parts, ammonium hydroxide, butane 20 parts, alkylol amide 14 parts.
The preparation method of said integrated circuit chip clean-out system, comprises the following steps:
Step 1, takes raw material by weight, and citric acid, ethanol, glycerol and hydrogen peroxide is dropped in encloses container, is warmed up to 50 DEG C and obtains the first mixture under protection of inert gas;
Step 2, drops in reactor by Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide, and the heated under vacuum to 78 DEG C being 0.10Mpa in vacuum tightness obtains the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs 30min with 250rpm and obtains unicircuit clean-out system.
performance test
Can test ic core chip detergent Progressive symmetric erythrokeratodermia prepared by above embodiment and comparative example, result is as follows:
As can be seen from upper table data, ic core chip detergent rinsing time of the present invention is short, viscosity is low, be easy to cleaning, noresidue, little to the damage of chip, from the step of embodiment 2 and comparative example 1, in preparation method, step 2 adopts the clean-out system rinsing of the method gained of constant heating rates sintering to take short, and viscosity is little, improves the performance of product.In addition, preparation method is simple, is applicable to industrialization, is worthy to be popularized.
Claims (7)
1. an ic core chip detergent, is characterized in that, comprises the following raw material counted by weight: citric acid 5-8 part, glycerine 5-8 part, ethanol 10-15 part, Soxylat A 25-7 20-28 part, hydrogen peroxide 12-18 part, ammonium hydroxide 2-6 part, butane 15-22 part, alkylol amide 10-16 part.
2. ic core chip detergent according to claim 1, is characterized in that, comprises the following raw material counted by weight: citric acid 6 parts, 75% ethanol 12 parts, glycerol 5 parts, Soxylat A 25-7 25 parts, 16 parts, hydrogen peroxide, 4 parts, ammonium hydroxide, butane 20 parts, alkylol amide 14 parts.
3. ic core chip detergent according to claim 2, is characterized in that: described ethanol is 75% ethanol.
4. the preparation method of the ic core chip detergent described in claim 1 or 2, is characterized in that, comprise the following steps:
Step 1, takes raw material by weight, and drops in encloses container by citric acid, ethanol, glycerol and hydrogen peroxide, under protection of inert gas, obtain the first mixture with 2-5 DEG C/min constant heating rates sintering to 42-55 DEG C;
Step 2, drops into Soxylat A 25-7, ammonium hydroxide and butane and alkylol amide in reactor, the heated under vacuum in vacuum tightness being 0.06-0.12Mpa to after 62-68 DEG C, with 5-8 DEG C/min be warming up to 75-80 DEG C the second mixture;
Step 3, after the first mixture and the mixing of the second mixture, stirs to obtain unicircuit clean-out system.
5. the preparation method of ic core chip detergent according to claim 4, is characterized in that: in step 1, the speed of constant heating rates sintering is 2 DEG C/min.
6. the preparation method of ic core chip detergent according to claim 4, is characterized in that: the vacuum tightness in step 2 under vacuum condition is 0.12Mpa.
7. the preparation method of ic core chip detergent according to claim 4, is characterized in that: in step 3, stirring velocity is 200-300rpm, and churning time is 20-40min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510372008.5A CN105039035A (en) | 2015-06-30 | 2015-06-30 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510372008.5A CN105039035A (en) | 2015-06-30 | 2015-06-30 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
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| CN105039035A true CN105039035A (en) | 2015-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510372008.5A Pending CN105039035A (en) | 2015-06-30 | 2015-06-30 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085578A (en) * | 2016-06-15 | 2016-11-09 | 安徽有通玻璃有限公司 | A kind of cooling liquid for glass finishing |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335382A (en) * | 2001-07-23 | 2002-02-13 | 山东大学 | Scavenger composition for superlarge scale IC chip and its prepn |
| CN101368132A (en) * | 2007-08-16 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Low-surface tensity circuit chip detergent |
| CN103614248A (en) * | 2013-11-05 | 2014-03-05 | 昆山宏凌电子有限公司 | Cleaning agent for electronic equipment |
| CN104371838A (en) * | 2014-10-29 | 2015-02-25 | 国家电网公司 | Cleaning agent for cleaning circuit boards and preparation method thereof |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
-
2015
- 2015-06-30 CN CN201510372008.5A patent/CN105039035A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1335382A (en) * | 2001-07-23 | 2002-02-13 | 山东大学 | Scavenger composition for superlarge scale IC chip and its prepn |
| CN101368132A (en) * | 2007-08-16 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Low-surface tensity circuit chip detergent |
| CN103614248A (en) * | 2013-11-05 | 2014-03-05 | 昆山宏凌电子有限公司 | Cleaning agent for electronic equipment |
| CN104371838A (en) * | 2014-10-29 | 2015-02-25 | 国家电网公司 | Cleaning agent for cleaning circuit boards and preparation method thereof |
| CN104450332A (en) * | 2014-11-21 | 2015-03-25 | 苏州东辰林达检测技术有限公司 | Integrated circuit chip cleaning fluid and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106085578A (en) * | 2016-06-15 | 2016-11-09 | 安徽有通玻璃有限公司 | A kind of cooling liquid for glass finishing |
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Application publication date: 20151111 |