CN104371838B - A kind of cleaning agent of cleaning circuit plate and preparation method thereof - Google Patents
A kind of cleaning agent of cleaning circuit plate and preparation method thereof Download PDFInfo
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- CN104371838B CN104371838B CN201410592353.5A CN201410592353A CN104371838B CN 104371838 B CN104371838 B CN 104371838B CN 201410592353 A CN201410592353 A CN 201410592353A CN 104371838 B CN104371838 B CN 104371838B
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- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 239000012459 cleaning agent Substances 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- CSUFEOXMCRPQBB-UHFFFAOYSA-N 1,1,2,2-tetrafluoropropan-1-ol Chemical compound CC(F)(F)C(O)(F)F CSUFEOXMCRPQBB-UHFFFAOYSA-N 0.000 claims abstract description 5
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000008367 deionised water Substances 0.000 claims abstract description 5
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 5
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims abstract description 5
- ILRSCQWREDREME-UHFFFAOYSA-N dodecanamide Chemical compound CCCCCCCCCCCC(N)=O ILRSCQWREDREME-UHFFFAOYSA-N 0.000 claims abstract description 5
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001509 sodium citrate Substances 0.000 claims abstract description 5
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims abstract description 5
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims abstract description 5
- 235000017858 Laurus nobilis Nutrition 0.000 claims abstract description 4
- 235000005212 Terminalia tomentosa Nutrition 0.000 claims abstract description 4
- 244000125380 Terminalia tomentosa Species 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000011574 phosphorus Substances 0.000 claims description 2
- 229910052698 phosphorus Inorganic materials 0.000 claims description 2
- 238000005829 trimerization reaction Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- -1 APEO Chemical compound 0.000 abstract description 2
- 235000019832 sodium triphosphate Nutrition 0.000 abstract description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 abstract 1
- 235000011083 sodium citrates Nutrition 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 229920000388 Polyphosphate Polymers 0.000 description 1
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical class ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- FRTNIYVUDIHXPG-UHFFFAOYSA-N acetic acid;ethane-1,2-diamine Chemical group CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O.NCCN FRTNIYVUDIHXPG-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000002421 anti-septic effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000001205 polyphosphate Substances 0.000 description 1
- 235000011176 polyphosphates Nutrition 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Abstract
The invention discloses a kind of cleaning agent of cleaning circuit plate, it is prepared by the following method, take lauric acid amide of ethanol, diethylene glycol monobutyl ether, APEO, BTA, isobutanol, tetrafluoropropanol, EDTA, sodium citrate, sodium tripolyphosphate, laurel alcohol ether phosphate potassium and deionized water, put into successively in mixer, 200 turns/min stirrings obtain compound in 10 minutes, it is drained into retort, the temperature of retort is increased to 70 DEG C according to 10 DEG C/min speed, insulation reaction 10min, it is then cooled to room temperature, stir and produce.Circuit board cleaning agent prepared by the present invention is not stratified, and stability preferably, goes deimpurity effect good.
Description
Technical field
The invention belongs to electric power cleaning agent field, it is related to a kind of cleaning agent, and in particular to a kind of cleaning of cleaning circuit plate
Agent and preparation method thereof.
Background technology
Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is（Printed Circuit Board）
PCB.Wiring board is divided into single sided board, dual platen, and three big classification of multilayer circuit board if dividing by the number of plies.Wiring board is by spy
Property is divided into soft board (FPC), hardboard (PCB), Rigid Flex (FPCB) if dividing.
Circuit board is in manufacturing process if the dirt dust of the inside is not cleaned up, it is possible to can cause short circuit, corrosion
The problems such as, influence the normal operation of circuit board.The cleaning of circuit board in the fabrication process, except the Chemical cleaning using cleaning agent
Outside, in addition to electric pulse cleaning, light cleaning, Cleaning by High Pressure Water Jet and ultrasonic wave cleaning etc. cleaning way.In actual applications,
Existing various cleaning ways are constantly present the limitation in the various technological deficiencies or regulation for being difficult to overcome, it is difficult to meet modern
The requirement of industrial development.
It is in the majority with Chemical cleaning in various cleaning ways, i.e., it is right using chemical with the cleaning process of a certain setting
Circuit board is cleaned.The cleaning agent that current Chemical cleaning is used includes organic cleaning solvent, semi-aqueous cleaning agent and water
Based cleaning agent, cleaning way mainly have spray, embathe, ultrasonic wave etc., under the technical parameter of setting, circuit board is carried out clear
Wash.Organic cleaning solvent, mostly using volatile such as acetone, ethanol, petroleum ether, hexamethylene, dichloromethane, three chloroethenes
There is serious atmosphere pollution in alkene, freon etc., such cleaning agent, to ozone layer very disruptive, belong to ODS class materials,
Limited or prohibitted the use of by international related organization.Existing water base or half water-base electron cleaning agent, although avoid to big compression ring
The pollution in border, but for its using effect, feature is lacked in the cleaning of circuit board, that is, is difficult to ensure that the complete of circuit board
It is whole, there is considerable influence to haptic element, contact, sealing compound, ITO plated films, screen printing pattern etc., to photoelectric characteristic, electromagnetic property, penetrating
Property, device surface physical characteristic etc. be also likely to result in influence, cause that the qualification rate of circuit board is low, yields is low, cost increase makes
With service life reduction, it is difficult to fully meet the cleaning requirement of circuit board.Light is cleaned, although the cleanliness factor of cleaning is high, but required equipment
Costliness, mostly import, invest excessive, and the photoelectric characteristic of circuit board may be impacted.Electric pulse is cleaned, needed for cleaning
Equipment is complicated, expensive, and because electrohydraulic effect is present, the electric of circuit board, magnetic characteristic may be impacted.Chinese patent
CN201310523833 discloses a kind of circuit board welding agent cleaning agent, and the cleaning agent has certain removing function to welding agent,
But it is poor to glue trace Scavenging activity, and have certain corrosion strength.
Therefore, a kind of excellent performance, Environmental Safety, the circuit board cleaning agent that will not be impacted to circuit board performance are developed
With preferable market prospects.
The content of the invention
In order to overcome in the prior art cable material be easily corroded, insulating properties and water proofing property are poor, and service life is short,
Easily there are the defects such as potential safety hazard, the invention provides a kind of preferably environmental protection transmission of electricity of the parameters such as antiseptic property and insulating properties
Circuit anticorrosive paint.
To achieve the above object, the technical solution adopted in the present invention is as follows：
A kind of circuit board cleaning agent, it is prepared by the following method：
1）10-15 parts of lauric acid amide of ethanol, 4-6 parts of diethylene glycol monobutyl ether, polyoxyethylene are weighed according to parts by weight
3-5 parts of ether, 2-4 parts of BTA, 2-3 parts of isobutanol, 1-2 parts of tetrafluoropropanol, 1-2 parts of EDTA, 1-2 parts of sodium citrate, three
1-2 parts of polyphosphate sodium, 1-2 parts of laurel alcohol ether phosphate potassium, 50-60 parts of deionized water；
2）Above-mentioned raw materials are put into mixer successively, 200 turns/min stirrings obtain compound in 10 minutes；
3）Compound is drained into retort, the temperature of retort is increased to 70 DEG C according to 10 DEG C/min speed,
Insulation reaction 10min, is then cooled to room temperature, stirs and produces.
Preferably, it is 0.1-0.15Mpa that the vacuum in retort is controlled during insulation reaction.
The invention also discloses the preparation method of foregoing circuit board cleaning agent.
Cleaning agent application method of the present invention may include but be not limited to：Wipe by hand, spray and ultrasonic wave cleaning etc. are conventional
Mode.
Technical scheme mainly has the following advantages：
Rationally, preparation method is simple, to welding agent, fingerprint, greasy dirt, organic compound for the circuit board cleaning agent compatibility of the present invention
There is excellent solvability, cleaning performance is good；And easily removed from circuit board, wash number is reduced, non-corrosiveness, it is adaptable to
High-accuracy circuit board cleaning.The circuit board performance of the present invention is stable, water-soluble preferable, environment friendly and pollution-free.
Embodiment
In order that those skilled in the art more fully understand the technical scheme in the application, it is real below in conjunction with the application
The specific embodiment in example is applied, the technical scheme to the application is clearly and completely described, it is clear that described embodiment
Only some embodiments of the present application, rather than whole embodiments.Based on the embodiment in the application, the common skill in this area
The every other embodiment that art personnel are obtained under the premise of creative work is not made, should all belong to what the present invention was protected
Scope.
Embodiment 1
A kind of circuit board cleaning agent, it is prepared by the following method：
1）10 parts of lauric acid amide of ethanol is weighed according to parts by weight, 4 parts of diethylene glycol monobutyl ether, 3 parts of APEO,
2 parts of BTA, 2 parts of isobutanol, 1 part of tetrafluoropropanol, EDTA（Ethylenediamine tetra-acetic acid）1 part, 1 part of sodium citrate, trimerization phosphorus
Sour 1 part of sodium, 1 part of laurel alcohol ether phosphate potassium, 50 parts of deionized water；
2）Above-mentioned raw materials are put into mixer successively, 200 turns/min stirrings obtain compound in 10 minutes；
3）Compound is drained into retort, the temperature of retort is increased to 70 DEG C according to 10 DEG C/min speed,
Insulation reaction 10min, is then cooled to room temperature, stirs and produces；The vacuum in retort is controlled during insulation reaction
For 0.1Mpa.
Embodiment 2
A kind of circuit board cleaning agent, it is prepared by the following method：
1）15 parts of lauric acid amide of ethanol is weighed according to parts by weight, 6 parts of diethylene glycol monobutyl ether, 5 parts of APEO,
4 parts of BTA, 3 parts of isobutanol, 2 parts of tetrafluoropropanol, 2 parts of EDTA, 2 parts of sodium citrate, 2 parts of sodium tripolyphosphate, laruyl alcohol
2 parts of ether phosphate potassium, 60 parts of deionized water；
2）Above-mentioned raw materials are put into mixer successively, 200 turns/min stirrings obtain compound in 10 minutes；
3）Compound is drained into retort, the temperature of retort is increased to 70 DEG C according to 10 DEG C/min speed,
Insulation reaction 10min, is then cooled to room temperature, stirs and produces；The vacuum in retort is controlled during insulation reaction
For 0.15Mpa.
Embodiment 3
The performance test of cleaning agent prepared by Example 1 and Example 2 of the present invention, is shown in Table 1：
Table 1
| Group | High-temperature stability | It is flammable | There is non-corrosiveness to metal | It is rinsability |
| Embodiment 1 | It is uniform not stratified | It is non-combustible | Nothing | Without visible residue |
| Embodiment 2 | It is uniform not stratified | It is non-combustible | Nothing | Without visible residue |
We also have detected removal efficiency of the cleaning agent to all kinds of materials of Example 1 and Example 2 of the present invention：Wipe
One time, specific test result is shown in Table 2：
Table 2
| Group | Welding agent clearance | Glue trace clearance % | Natural oil |
| Embodiment 1 | 99.2% | 98.1% | 97.6% |
| Embodiment 2 | 99.3% | 97.8% | 97.6% |
| National standard JB/T4323.1-1999 | More than 90% | More than 90% | More than 90% |
Conclusion：Circuit board cleaning agent prepared by the present invention is not stratified, and stability is preferable, and to metal non-corrosiveness；This
Cleaning agent prepared by invention removes the effect of classes of compounds preferably, meets national standard.
Finally, in addition it is also necessary to it is noted that listed above is only several specific embodiments of the invention.Obviously, this hair
It is bright to be not limited to above example, there can also be many deformations.One of ordinary skill in the art can be from present disclosure
All deformations for directly exporting or associating, are considered as protection scope of the present invention.
Claims (1)
1. a kind of cleaning agent of cleaning circuit plate, it is characterised in that the cleaning agent is prepared from by following raw materials：
10-15 parts of lauric acid amide of ethanol, 4-6 parts of diethylene glycol monobutyl ether, APEO 3-5 are weighed according to parts by weight
Part, 2-4 parts of BTA, 2-3 parts of isobutanol, 1-2 parts of tetrafluoropropanol, 1-2 parts of EDTA, 1-2 parts of sodium citrate, trimerization phosphorus
Sour sodium 1-2 parts, 1-2 parts of laurel alcohol ether phosphate potassium, 50-60 parts of deionized water；
The cleaning agent is prepared by the following method：
Step 1）Each raw material for standby is weighed according to parts by weight；
Step 2）Each raw material is put into mixer successively, 200 turns/min stirrings obtain compound in 10 minutes or so；
Step 3）Compound is drained into retort, the temperature of retort is increased to 70 DEG C according to 10 DEG C/min speed,
Insulation reaction 10min, it is 0.1MPa to control the vacuum in retort, is then cooled to room temperature, stirs and produce.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410592353.5A CN104371838B (en) | 2014-10-29 | 2014-10-29 | A kind of cleaning agent of cleaning circuit plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410592353.5A CN104371838B (en) | 2014-10-29 | 2014-10-29 | A kind of cleaning agent of cleaning circuit plate and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104371838A CN104371838A (en) | 2015-02-25 |
| CN104371838B true CN104371838B (en) | 2017-10-13 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104293500A (en) * | 2014-11-04 | 2015-01-21 | 国家电网公司 | Chemical agent used for cleaning printed circuit boards |
| CN105039035A (en) * | 2015-06-30 | 2015-11-11 | 苏州东辰林达检测技术有限公司 | Cleaning agent for integrated circuit chip and preparation method of cleaning agent |
| CN108822974A (en) * | 2018-05-23 | 2018-11-16 | 昆山市线路板厂 | A kind of flexible electric circuit board conditioner |
| CN111621369A (en) * | 2020-06-11 | 2020-09-04 | 中山翰华锡业有限公司 | Neutral environment-friendly water-based cleaning agent for high-end integrated circuit board and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000044872A1 (en) * | 1999-01-28 | 2000-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Moulded detergent and cleaning agent articles with defined anionic detergent ratio |
| CN101434890A (en) * | 2007-11-16 | 2009-05-20 | 比亚迪股份有限公司 | Water-soluble washing agent composition |
| CN101440332A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Environment protection efficient water-based circuit board cleaning agent and preparation thereof |
| CN102976897A (en) * | 2012-12-18 | 2013-03-20 | 山东科技大学 | Method for purifying tetrafluoro propanol |
-
2014
- 2014-10-29 CN CN201410592353.5A patent/CN104371838B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000044872A1 (en) * | 1999-01-28 | 2000-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Moulded detergent and cleaning agent articles with defined anionic detergent ratio |
| CN101434890A (en) * | 2007-11-16 | 2009-05-20 | 比亚迪股份有限公司 | Water-soluble washing agent composition |
| CN101440332A (en) * | 2008-12-30 | 2009-05-27 | 潘惠凯 | Environment protection efficient water-based circuit board cleaning agent and preparation thereof |
| CN102976897A (en) * | 2012-12-18 | 2013-03-20 | 山东科技大学 | Method for purifying tetrafluoro propanol |
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